CN101168807B - High heat conductivity copper-base composite material and preparation method thereof - Google Patents
High heat conductivity copper-base composite material and preparation method thereof Download PDFInfo
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- CN101168807B CN101168807B CN2007101788445A CN200710178844A CN101168807B CN 101168807 B CN101168807 B CN 101168807B CN 2007101788445 A CN2007101788445 A CN 2007101788445A CN 200710178844 A CN200710178844 A CN 200710178844A CN 101168807 B CN101168807 B CN 101168807B
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Abstract
The invention belongs to the technical field for the electronic packaging material preparation; in particular, the invention designs a high heat conducting copper-based compound material and the preparation method thereof. The copper-based compound material is made into an enforced body fabricated part through the spraying and forming technology fabricated by an enforced body and binding agent, wherein, the size of the grain of the enforced body is 7 to 60 micrometers, and the grain is composed of one or two of silicon carbide grain, diamond grain, or aluminum nitride grain; the copper base body is directly arranged on the enforced body fabricated part, wherein, the copper base body is electrolytic copper or oxygen-free copper, and the volume ratio of the enforced body and the copper base body is 50 to 75 percent:25 to 50 percent, as well as the enforced body and the copper base body are made by a pressure infiltration technology. The preparation method adopts the injection forming technology of the fabricated part and the pressure infiltration technology to produce the high heat conducting copper-based compound material. The heat conducting rate of the copper-based compound material of the invention is higher than that of the aluminum-based compound material of an identical enforced system, the density of the material is low, the expansion coefficient is small, and the invention satisfies the request of light mass of the packaging material.
Description
Technical field
The invention belongs to the electronic package material technical field, design a kind of high heat-conducting copper-based composite material and preparation method thereof especially.
Background technology
Electronic Packaging is tending towards miniaturization and chip integration is increased sharply, and causes thermal value to improve, and the circuit working temperature constantly rises.The thermal conductivity of fine copper is 401W/mK, and thermal expansivity is up to 16.5 * 10
-6/ K, therefore in order to utilize so high thermal conductivity of copper, avoid the thermal stresses that excessive thermal expansivity causes in application process again, a kind of method is to add less W, Mo and the low expansion alloy powder such as (as the FeNi alloys) of thermal expansivity usually in copper, is present electronic package material field W/Cu, Mo/Cu and Invar/Cu material commonly used.This type of Cu-base composites have high conduction, a thermal conductivity, have the low bulk performance of W, Mo simultaneously, but in today of Electronic Packaging miniaturization day by day, lighting, the density of this type of material is too big, increased package quality, and poor air-tightness, encapsulation performance influenced.
Another kind method is that Cu-base composites can adopt the inorganic materials of low density, high thermal conductance, low bulk as strengthening body.This type of Cu-base composites had both had the distinctive good ductility of metal and conduction, thermal conductivity, the low bulk, the properties of low density that have pottery again, be used for shell, the heat sink or heat-radiating substrate of base, the IC encapsulation of power device encapsulation and LED is heat sink or heat-radiating substrate etc., the demand of this type of material is rather huge, and market outlook are wide.The subject matter that this type of Cu-base composites exists in application is exactly difficult processing, difficulty is prepared thin-walled, complex structure device, and prior preparation method mainly contains powder metallurgic method or in strengthening the body particle direct infiltrated metal method, these preparation methods inevitably face above problem.Therefore, applied for the Cu-base composites that makes this excellent performance, take all factors into consideration the following process problem, seek and a kind ofly can realize near-net-shape, the preparation method who reduces following process seems excellent in important.
Summary of the invention
The present invention has proposed a kind of high heat-conducting copper-based composite material and preparation method thereof especially in order to solve deficiency of the prior art.
Technical solution of the present invention is as follows:
A kind of high heat-conducting copper-based composite material, this matrix material is by strengthening body and the binding agent injection molding process through prefabricated component, make and strengthen the body prefabricated component, wherein strengthen the body particulate and be of a size of 7～60 μ m, form by in silicon-carbide particle, diamond particles or the aluminum nitride particle one or both; The copper matrix is placed directly on this enhancing body prefabricated component, and wherein the copper matrix is electrolytic copper or oxygen free copper, and the volume ratio that strengthens body and copper matrix is 50-75%:25-50%, makes through the pressure Infiltration Technics.
Described binding agent is the paraffinic base binding agent, and the volume ratio of enhancing body and paraffinic base binding agent is 50-75%:25-50%.
Described diamond particles is the metal level particle of plating particle or titanizing, copper, tungsten or molybdenum not.
A kind of preparation method of high heat-conducting copper-based composite material, this preparation method comprises the steps:
(1) injection molding process of prefabricated component:
A, will strengthen the body particle and the paraffinic base binding agent is 50-75% according to volume ratio: 25-50% prepares, and on 120-150 ℃ of following mixing roll batch mixing 0.5-1 hour, be broken into powder after the cooling, wherein strengthening the body particle size is 7～60 μ m, be made up of in silicon-carbide particle, diamond particles or the aluminum nitride particle one or both, described diamond particles is the metal level particle of plating particle or titanizing, copper, tungsten or molybdenum not;
B, this powder is prepared the prefabricated component base substrate on injection machine;
C, this prefabricated component base substrate soaked at least 24 hours in gasoline after, carry out the extraction degreasing of binding agent, natural air drying;
D, the prefabricated component base after air-dry is carried out hot degreasing and presintering under 900-1200 ℃ hydrogen atmosphere;
(2) pressure Infiltration Technics:
A, prefabricated component is put into graphite jig, the copper matrix is placed directly in and strengthens on the body prefabricated component, and wherein the copper matrix is electrolytic copper or oxygen free copper, and the volume ratio that strengthens body and copper matrix is 50-75%: 25-50%;
B, put into vacuum pressure infiltration stove, vacuumize, heat up simultaneously;
C, vacuum pressure stove vacuum tightness reach 0.01-1Pa, and temperature begins when rising to 1100-1200 ℃ to press oozes gold
Belong to the copper matrix;
D, stove are cold, move back mould.
Beneficial effect of the present invention:
(1) among the present invention the thermal conductivity of Cu-base composites all than the aluminum matrix composite height of identical enhancing body system, the density of material own is low in addition, thermal expansivity is little, satisfied the requirement of packaged material lightweight, reduced in the encapsulation process because the thermal stresses that thermal expansivity causes more greatly, this type of Cu-base composites will be widely used in shell, the heat sink or heat-radiating substrate of base, the IC encapsulation of power device encapsulation and LED is heat sink or heat-radiating substrate etc.
(2) injection molding process has been adopted in the preparation of prefabricated component of the present invention, the advantage that adopts this technology is because particle enhanced Cu-base composites is difficult in following process, for Cu-base composites is used on the device, adopt near-net-shape technology can prepare the device of thin-walled and complex construction.
(3) the present invention's infiltrated metal copper in the prefabricated component in the vacuum pressure stove; vacuum environment has protected the copper metal not oxidized on the one hand; on the other hand by pressure can be by force with metallic infiltration in the hole of prefabricated component; overcome the problem of wettability difference between copper alloy and the reinforced particulate, to guarantee to prepare the Cu-base composites of excellent performance.
Description of drawings:
Preparation technology's schema of Fig. 1 Cu-base composites
Embodiment
Below by embodiment and accompanying drawing the present invention is described in further details.
Embodiment 1:
Raw material: particle diameter is the SiC particle of 14 μ m, electrolytic copper.
With the SiC particle of 14 μ m and binding agent (50: 50) batch mixing 1 hour on 130 ℃ of following mixing rolls by volume, be broken into powder after the cooling, on injection machine, prepare the prefabricated component base substrate then.The prefabricated component base substrate is soaked the extraction degreasing of carrying out binding agent in 24 hours in gasoline, behind the natural air drying, under hydrogen atmosphere, carry out hot degreasing and 1200 ℃ of presintering 1 hour again, make prefabricated component, then it is packed in the graphite mo(u)ld, and with the electrolysis copper billet by volume (50: 50) be placed on the prefabricated component, put into pressure infiltration stove then, when vacuum is evacuated to 0.1Pa, temperature rises to 1200 ℃ of following copper billet metals and melts, press and ooze, stove is cold, moves back mould.The density of the matrix material that makes is 6.24g/cm
3, thermal conductivity is 300W/mK, thermal expansivity is 10.9 * 10
-6/ K.
Embodiment 2:
Raw material: particle diameter is the SiC particle of 28 μ m, oxygen free copper.
With the SiC particle of 28 μ m and binding agent (75: 25) batch mixing 1 hour on 130 ℃ of following mixing rolls by volume, be broken into powder after the cooling, on injection machine, prepare the prefabricated component base substrate then.The prefabricated component base substrate is soaked the extraction degreasing of carrying out binding agent in 24 hours in gasoline, behind the natural air drying, under hydrogen atmosphere, carry out hot degreasing and presintering again, make prefabricated component, then it is packed in the graphite mo(u)ld, and with the electrolysis copper billet by volume (75: 25) be placed on the prefabricated component, put into pressure infiltration stove then, when vacuum is evacuated to 0.1Pa, temperature rises to 1200 ℃ of following copper billet metals and melts, press and ooze, stove is cold, moves back mould.The density of the matrix material that makes is 4.88g/cm
3, thermal conductivity is 250W/mK, thermal expansivity is 8.2 * 10
-6/ K.
Embodiment 3:
Raw material: particle diameter is the diamond particles of the plating coating copper of 28 μ m, electrolytic copper.
With the diamond particles of the plating coating copper of 28 μ m and binding agent (75: 25) batch mixing 1 hour on 130 ℃ of following mixing rolls by volume, be broken into powder after the cooling, on injection machine, prepare the prefabricated component base substrate then.The prefabricated component base substrate is soaked the extraction degreasing of carrying out binding agent in 24 hours in gasoline, behind the natural air drying, under hydrogen atmosphere, carry out hot degreasing and presintering again, make prefabricated component, then it is packed in the graphite mo(u)ld, and with the electrolysis copper billet by volume (75: 25) be placed on the prefabricated component, put into pressure infiltration stove then, when vacuum is evacuated to 0.1Pa, temperature rises to 1100 ℃ of following copper billet metals and melts, press and ooze, stove is cold, moves back mould.The density of the matrix material that makes is 4.84g/cm
3, thermal conductivity is 800W/mK, thermal expansivity is 4.5 * 10
-6/ K.
Embodiment 4:
Raw material: particle diameter is the SiC particle of 40 μ m and the diamond particles volume ratio of plating not is (70: 30), electrolytic copper.
Get the mixed enhancing body particle of said ratio and binding agent (50: 50) batch mixing 1 hour on 140 ℃ of following mixing rolls by volume, be broken into powder after the cooling, on injection machine, prepare the prefabricated component base substrate then.The prefabricated component base substrate is soaked the extraction degreasing of carrying out binding agent in 24 hours in gasoline, behind the natural air drying, under hydrogen atmosphere, carry out hot degreasing and presintering again, make prefabricated component, then it is packed in the graphite mo(u)ld, and the electrolysis copper billet is placed on the prefabricated component for (70: 30) by volume, put into pressure infiltration stove then, when vacuum is evacuated to 0.5Pa, temperature rises to 1200 ℃ of following copper billet metals and melts, press and ooze, stove is cold, moves back mould.The density of the matrix material that makes is 6.13g/cm
3, thermal conductivity is 370W/mK, thermal expansivity is 10 * 10
-6/ K.
Embodiment 5:
Raw material: particle diameter is that the SiC particle of 40 μ m is (60: 40), electrolytic copper with titanium-gold-plating hard rock particle volume ratio.
Get the mixed enhancing body particle of said ratio and binding agent (60: 40) batch mixing 1 hour on 130 ℃ of following mixing rolls by volume, be broken into powder after the cooling, on injection machine, prepare the prefabricated component base substrate then.The prefabricated component base substrate is soaked the extraction degreasing of carrying out binding agent in 24 hours in gasoline, behind the natural air drying, under hydrogen atmosphere, carry out hot degreasing and presintering again, make prefabricated component, then it is packed in the graphite mo(u)ld, and the electrolysis copper billet is placed on the prefabricated component for (60: 40) by volume, put into pressure infiltration stove then, when vacuum is evacuated to 0.1Pa, temperature rises to 1200 ℃ of following copper billet metals and melts, press and ooze, stove is cold, moves back mould.The density of the matrix material that makes is 5.58g/cm
3, thermal conductivity is 360W/mK, thermal expansivity is 9 * 10
-6/ K.
Claims (1)
1. the preparation method of a high heat-conducting copper-based composite material, it is characterized in that, get particle diameter and be the SiC particle of 40 μ m and the diamond particles volume ratio of plating not and be and mix at 70: 30, again by mixing enhancing body particle and binding agent 50: 50 by volume, batch mixing is 1 hour on 140 ℃ of following mixing rolls, be broken into powder after the cooling, on injection machine, prepare the prefabricated component base substrate then; The prefabricated component base substrate is soaked the extraction degreasing of carrying out binding agent in 24 hours in gasoline, behind the natural air drying, under hydrogen atmosphere, carry out hot degreasing and presintering again, make prefabricated component, then it is packed in the graphite mo(u)ld, and be to be placed on prefabricated component at 70: 30 by volume, put into pressure infiltration stove then the electrolysis copper billet, when vacuum is evacuated to 0.5Pa, the copper billet metal melted when temperature rose to 1200 ℃, pressed and oozed, and stove is cold, move back mould, the density of the matrix material that makes is 6.13g/cm
3, thermal conductivity is 370W/mK, thermal expansivity is 10 * 10
-6/ K.
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| CN2007101788445A CN101168807B (en) | 2007-12-06 | 2007-12-06 | High heat conductivity copper-base composite material and preparation method thereof |
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| CN101168807B true CN101168807B (en) | 2010-06-30 |
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| CN103008669B (en) * | 2012-11-29 | 2014-10-22 | 中国航空工业集团公司北京航空材料研究院 | Preparation method of diamond/aluminum composite material |
| CN104707975A (en) * | 2013-12-12 | 2015-06-17 | 北京有色金属研究总院 | High-thermal-conductivity lamellar graphite/aluminum composite material and preparation method thereof |
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Effective date of registration: 20190410 Address after: 101407 No. 11 Xingke East Street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee after: Research Institute of engineering and Technology Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Patentee before: General Research Institute for Nonferrous Metals |