CN104133322B - Oriented film solidification and cooling device and oriented film solidification and cooling method - Google Patents
Oriented film solidification and cooling device and oriented film solidification and cooling method Download PDFInfo
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- CN104133322B CN104133322B CN201310158853.3A CN201310158853A CN104133322B CN 104133322 B CN104133322 B CN 104133322B CN 201310158853 A CN201310158853 A CN 201310158853A CN 104133322 B CN104133322 B CN 104133322B
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- alignment films
- agent set
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- cooling
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
The invention discloses an oriented film solidification and cooling device. The oriented film solidification and cooling device comprises a heating device, an air flow device connected with the heating device and a main device capable of solidifying and cooling the oriented film. One end of the main device is connected with the heating device through a pipeline; the other end of the main device is provided with an air outlet, a substrate entry and a substrate exit. A substrate on which the oriented film is formed enters the main device through the substrate entry and leaves the main body through the substrate exit. The invention further discloses an oriented film solidification and cooling method. By the use of the oriented film solidification and cooling device and the oriented film solidification and cooling method, the problem that separation of a solidification phase and a cooling phase causes high energy consumption and high cost can be solved; thermal and mechanical properties of the oriented film can be improved.
Description
Technical field
The present invention relates to the manufacturing technology field of liquid crystal panel, more particularly, to a kind of solidification of alignment films and cooling device and
The solidification of alignment films and cooling means.
Background technology
Liquid crystal display plays the role of very important in the modern life, and liquid crystal panel is main group of liquid crystal display
Become part.The manufacturing process of liquid crystal panel has following step：Array base palte preparation technology, molding process, and cutting work
Skill etc..Wherein, described molding process includes again：Printing direction-orienting films, friction orientation then on a substrate be coated with sealed plastic box,
On another substrate, dropping liquid is brilliant, and by two substrates to box.The successful orientation of liquid crystal molecule is realized by alignment films, alignment films
Solidification quality directly affect the orientation effect of liquid crystal molecule, and then decide the display effect of liquid crystal panel.Above-mentioned one-tenth box
In technique, the solidification of alignment films and the process that cools have significant impact to the performance of alignment films.
In prior art, the solidification of alignment films and the process that cools are separated, and realize alignment films in cure stage and exist
Being fully cured under high temperature, then enters back into cooling device and completes temperature-fall period of drying.Described solidification process adopts Fig. 1 institute
Showing device, the process that cools adopts Fig. 2 shown device.
There is certain defect in above-mentioned implementation method：
Firstly, since solidify and cool being divided into two stages individually to carry out, during solidification, required temperature is higher, leads to
Often it is 230 degree；And need when cooling to blow a cold wind over, therefore consume energy larger, relatively costly；
Secondly, for solidification equipment, because solidification temperature is up to 230 degree, substrate 1 is directly entered height from the temperature of precuring
Warm environment, the mutation of temperature can affect the performances such as alignment films calorifics, mechanics, the final solidification quality affecting alignment films；
Furthermore, in the cure stage of alignment films, thermal current is to be blown into (Fig. 1 shown in arrow) from the side of substrate 1, because
This, curing efficiency is low, and also needs to side's setting infrared auxiliary heating device 2 on substrate 1, to accelerate the solidification of alignment films
Process；
Finally, for the existing process that cools, substrate 1 enters room temperature environment from the cure stage of high temperature, but also
Need pressure to blow the fast cooling that cold air (in Fig. 2 shown in arrow) realizes alignment films, lead to the inside of substrate and alignment films
Surface temperature difference changes greatly, and can produce harmful effect to performances such as the calorifics of alignment films, mechanics.
Content of the invention
In view of this, present invention is primarily targeted at providing a kind of solidification of alignment films and cooling device and alignment films
Solidification and cooling means, it is possible to resolve existing solidification and the stage that cools separate the big, problem of high cost that consumes energy leading to, and
Calorifics, the mechanical property of alignment films can be improved.
For reaching above-mentioned purpose, the technical scheme is that and be achieved in that：
The invention provides a kind of solidification of alignment films and cooling device, including：Heater and pass through pipeline and heating
The airflow apparatus that device is connected；Described alignment films can be solidified and the process that cooled agent set；
One end of described agent set is connected with heater by pipeline, and the other end is provided with air stream outlet, substrate enters
Mouth and substrate outlet, the substrate being formed with alignment films enters agent set by substrate import, and the substrate being formed with alignment films is logical
Cross substrate outlet and leave agent set.
Wherein, first chamber and second chamber are included inside described agent set, described first chamber and second chamber are led to
Cross a dividing plate to separate.
Wherein, one end of described dividing plate is connected with the bottom of agent set, the top shape of the other end and described agent set
One-tenth can accommodate the gap that substrate level passes through.
In such scheme, the top and bottom of described agent set is respectively arranged with ventilating board, and described ventilating board is arranged
There are multiple apertures.
Wherein, the top of described agent set, bottom and centre position are each provided with least one temperature sensing device.
In such scheme, described device also includes the drier being arranged between the bottom of agent set and airflow apparatus,
To remove the vapor discharging in the solidification process of alignment films；Described drier passes through the bottom phase of pipeline and agent set
Even.
Wherein, described device also includes adsorbent equipment, with the organic solvent containing in adsorption flow gas；Described absorption dress
The one end put is connected with drier by pipeline, and the other end is connected with described airflow apparatus by pipeline.
Wherein, described device also includes filter element, is carried out with the impurity that the solidification to alignment films is produced with cooling stage
Filter；Described filter element is connected between airflow apparatus and described adsorbent equipment by pipeline.
Preferably, it is additionally provided with gas supplementary device between described airflow apparatus and heater.
Present invention also offers a kind of solidification of alignment films and cooling means, using alignment films mentioned above solidification with
Cooling device, the method includes：
By thermal current in the incoming agent set in one end of described agent set, pass from the other end of described agent set
Go out；
The cure stage of alignment films, be formed with alignment films substrate enter agent set after, in agent set along with
The direction movement that the flow direction of thermal current is contrary makes described alignment films progressively solidify；
Alignment films cool the stage, are formed with the substrate of alignment films in agent set along the flowing side with thermal current
Move to identical direction.
Wherein, the cure stage of described alignment films and cool the stage respectively described agent set second chamber and
First chamber is carried out.
The solidification of alignment films and cooling device that the present invention provides, including：Heater and pass through pipeline and heater
Connected airflow apparatus；Described device also includes：The solidification of alignment films and the agent set of the process that cools can be carried out；Described
One end of agent set is connected with heater by pipeline, and the other end is provided with air stream outlet, starts for alignment films solidification
When, the substrate being formed with alignment films enters the import of agent set, and at the end of cooling for alignment films, is formed with and takes
Leave the outlet of agent set to the substrate of film.Substrate of the present invention constantly rises in a chamber, and the rising with temperature is real
Existing continous way solidification, is laterally into another chamber after reaching tower top and constantly declines, this process temperature constantly reduces reality
Existing gradual cooling.Therefore, the present invention not only achieves the solidification continuous operation integrated with the stage of cooling of alignment films, no
Need to individually blow a cold wind over, realize cooling in the air-flow that temperature is gradually lowered, heat energy is fully used, and has saved cost；
And, present invention achieves the consecutive variations of the solidification of alignment films and the phase temperature that cools, that is,：Achieve the company of alignment films
Continuous solidification and progressive cooling, therefore can prevent the difference between pre-cure phase temperature and solidification temperature excessive, effectively improve and take
Calorifics, mechanical property to film.
Brief description
Fig. 1 is the structural representation of the solidification equipment of existing alignment films；
Fig. 2 is the structural representation of the cooling device of existing alignment films；
Fig. 3 is the structural representation with cooling device embodiment for the solidification of alignment films of the present invention；
Fig. 4 is the right view with cooling device embodiment for the solidification of alignment films of the present invention；
Fig. 5 is the front view with cooling device embodiment for the solidification of alignment films of the present invention.
Description of reference numerals：
1 substrate；2 infrared auxiliary heating devices；3 agent sets；4 heaters；5 airflow apparatus；6 first chambers；7 second
Chamber；8 dividing plates；9 temperature sensing devices；10 gas supplementary devices；11 ventilating boards；12 substrate imports；13 substrate outlets；14 are dried
Device；15 adsorbent equipments；16 filter elements；17 air stream outlets.
Specific embodiment
The present invention provide a kind of by solidification and the stage integrated design that cools device, it is possible to resolve existing solidification with
The stage that cools separates the big, problem of high cost that consumes energy leading to；Meanwhile, in described device, the continuity of gas flow temperature becomes
Change, calorifics, the mechanical property of alignment films can be improved；Basic thought is：
It is provided at its inner portion the agent set of the solidification that can carry out alignment films and the process that cools, heater passes through pipe
Road is connected with agent set and airflow apparatus respectively；One end of described agent set is connected with heater by pipeline, another
End is provided with air stream outlet, substrate import and substrate outlet, and the substrate being formed with alignment films enters main body dress by substrate import
Put, the substrate being formed with alignment films leaves agent set by substrate outlet.
Wherein, described airflow apparatus can achieve blowing function, by hot gas from the incoming described main body in one end of agent set
Device, also can achieve air extracting function, and gas is suctioned out from the other end of described agent set.
It should be noted that thermal current carrys out self-heating apparatus in the embodiment of the present invention, incoming from the top of agent set
In agent set.
Below in conjunction with the accompanying drawings and specific embodiment is described in further detail to the present invention.
Fig. 3 is the structural representation with cooling device embodiment for the solidification of alignment films of the present invention, as shown in figure 3, bag
Include：The airflow apparatus 5 of agent set 3, the heater 4 of hot gas and guiding gas flowing, described heater 4 passes through pipe
Road is connected with agent set 3 and airflow apparatus 5 (such as airflow apparatus can be blower fan) respectively, and the other end of agent set 3 sets
There is air stream outlet 17, under the collective effect of airflow apparatus 5 and heater 4, thermal current is passed through the incoming agent set of pipeline 3
Interior.
In embodiments of the present invention, the one end being connected agent set with heater is defined as the top of agent set
Portion, agent set is defined as the bottom of agent set near the region of air stream outlet.
Wherein, the thermal current direction in described agent set 3 is (in Fig. 3 shown in dotted line) from top to bottom, that is,：By hot gas
Stream, in the incoming agent set in the top of agent set, spreads out of from air stream outlet 17, and the flowing with thermal current is so that main body fills
Put the temperature highest at 3 tops, the temperature of bottom minimum it is achieved that the continuity graded of gas flow temperature.Due to alignment films
Solidification temperature is usually 230 degree, here, can be by adjusting the power of heater 4, by the temperature control at agent set 3 top
At 230 degree～250 degree, temperature is too low, does not reach solidification effect, and temperature is too high, then can destroy the characteristic of alignment films.Described main body
The bottom setting substrate import 12 of device 3 and substrate outlet 13, the substrate scribbling alignment films enters agent set 3 from import 12,
Leave agent set 3 from outlet 13.
Further, it is each provided with least one temperature sensing device in the top of agent set 3, bottom and centre position
9, carry out real-time monitoring and control agent set 3 by the temperature control system (not shown in Fig. 3) being connected with temperature sensing device 9
Interior Temperature Distribution, and by adjust the factors such as the operating rate of heater 4, the power of airflow apparatus 5 and substrate 10 Lai
Adjust the temperature in agent set 3.For example：By improving the power of heater 4, airflow apparatus 5, improve in agent set 3
Temperature；Conversely, then reducing.By accelerating the operating rate of substrate 10, be then equivalent to and the alignment films being formed are reduced on substrate
Solidification temperature；Conversely, then improving.Here, it is additionally provided with gripper shoe (not shown in Fig. 3), to support in described agent set 3
State substrate 1 to move in agent set 3, realize adjusting the operating rate of substrate 10 by adjusting the movement rate of gripper shoe.
Further, described agent set 3 is made up of first chamber 6 and second chamber 7 two chambers, specifically, orientation
The cure stage of film is carried out in first chamber 6, and the stage that cools of alignment films is carried out in second chamber 7；Or, orientation
The cure stage of film is carried out in second chamber 7, and the stage that cools of alignment films is carried out in first chamber 6.The present embodiment
In, the cure stage of alignment films is carried out in second chamber 7, and the stage that cools of alignment films is carried out in first chamber 6.Two
The dividing plate 8 that individual chamber passes through the internal setting of agent set 3 is kept apart.Further, one end of described dividing plate 8 and agent set 3
Bottom be connected, the top of the other end and described agent set 3 forms and can accommodate the gap that substrate level passes through.Specifically, exist
In the present embodiment, one end of dividing plate 8 is to be connected with the ventilating board of agent set bottom setting.The purpose of described dividing plate 8 setting exists
In：A certain amount of vapor and solvent gas can be discharged in the cure stage of alignment films, the presence of dividing plate 8 can make to evaporate
The gas coming can quickly be extracted out from bottom of towe, prevent it to be diffused into another chamber, affect alignment films and cool the effect in stage
Really；Preferably, the preferred Heat Conduction Material of dividing plate 8, such dividing plate 8 can make the heat of two within the chambers mutually transmit so that heat obtains
Significantly more efficient utilization, the too fast reduction of temperature during can preventing from cooling, the performance such as the calorifics of impact alignment films, mechanics.
Preferably, the top and bottom of described agent set 3 is respectively arranged with ventilating board 11, and described ventilating board 11 is arranged
There are multiple apertures, to control the type of flow in tower for the hot blast.Preferably, above-mentioned multiple aperture is equally distributed.Top
The ventilating board 11 of setting prevents air-flow from excessively concentrating in incoming agent set 3, thus avoiding producing impact to alignment films.Bottom sets
The air-flow that the ventilating board 11 put is easy in agent set 3 is uniformly smoothly derived, and keeps bottom temp uniformly, otherwise, if gas
Body flowing velocity can lead to very much agent set 3 bottom temp uneven it is impossible to ensure the graded of temperature soon.
Preferably, the solidification of described alignment films and cooling device also include：It is arranged at the bottom of agent set and air-flow fills
Drier 14 between putting, as shown in figure 3, described drier 14 is connected with the bottom of agent set 3 by pipeline.Described drying
Device 14, for removing the part vapor that alignment films in solidification process discharge, to ensure the height of heat in each cyclic process
Effect utilizes；Meanwhile, the life-span of extension device is also capable of in the timely removing of aqueous vapor.
Further, the solidification of alignment films of the present invention and cooling device also include：Adsorbent equipment 15, for example, specifically may be used
For surface-active adsorption tank, described adsorbent equipment 15 is connected with drier 14 by pipeline, and the other end is passed through pipeline and filled with air-flow
Put 5 to be connected.Adsorbent equipment 15 by the material of Large ratio surface activity by the organic solvent containing in flowing gas Adsorption, only
Gas after change will be again introduced into heater 4 by airflow apparatus 5 and heat again, reciprocation cycle.
Preferably, it is additionally provided with filter element 16 between described adsorbent equipment 15 and described airflow apparatus 5, for example, specifically may be used
For filter membrane, described filter element 16 is connected between airflow apparatus 5 and adsorbent equipment 15 by pipeline.Described filter element 16
On the basis of drier 14 and adsorbent equipment 15 remove vapor and organic solvent, to the mistake further of the gas in device
Filter, to prevent the impurity pollution alignment films producing in different phase, the gas of flowing in purifier.
Further, be additionally provided with gas supplementary device 10 between described airflow apparatus 5 and heater 4, for and
When supplementary device in source of the gas it is ensured that gas flow in device.Described gas can be nitrogen or other inert gases etc., in case
Only gas is reacted with the alignment films on substrate 1.
In order to ensure that the heat in agent set 3 can make full use of, substrate 1 can efficiently be subject in agent set 3
Heat, then, position arrangement in agent set 3 for the substrate 1 is set to part overlapping type, as shown in Figure 4.
In actual application, the substrate 1 being formed with alignment films enters in agent set 3 from substrate import 12, such as Fig. 3
With shown in Fig. 5, solid arrow direction is the direction of motion that substrate 1 enters in agent set 3, and dotted arrow is the air-flow side in tower
To.Move to top from bottom, period substrate local environment temperature constantly raises, and alignment films gradually solidify, reach agent set 3
Behind top, environment temperature reaches the maximum temperature of solidifying requirements, and substrate moves laterally to the opposite side of agent set 3, for example：From
One chamber moves to another chamber.Afterwards, substrate 1 begins to cool down temperature-fall period, moves to bottom from the top of agent set 3
Dynamic, period substrate local environment temperature constantly declines, and the temperature of substrate 1 slowly reduces, and temperature comes back to entrance agent set 3
When temperature, finally 13 leave agent set 3 from substrate outlet, the solidification of alignment films and the stage of cooling complete.
In actual moving process, operation that can be according to the change real-time regulation substrate 1 of temperature in tower in agent set 3
Speed and mutual spacing, to ensure the high efficiency of whole solidification process.For example：Temperature is too high, then accelerate substrate 1 and exist
Operating rate in agent set 3, also can reduce the spacing between substrate 1, to reduce the received heat of substrate 1.
With said apparatus, present invention also offers a kind of solidification of alignment films and cooling means, the method includes：
By thermal current in the incoming agent set in one end of described agent set, pass from the other end of described agent set
Go out；
The cure stage of alignment films, be formed with alignment films substrate enter agent set after, in agent set along with
The direction movement that the flow direction of thermal current is contrary makes described alignment films progressively solidify；
Alignment films cool the stage, are formed with the substrate of alignment films in agent set along the flowing side with thermal current
Move to identical direction；
Further, the cure stage of above-mentioned alignment films and cool the stage respectively in the second chamber of described agent set
Room and first chamber are carried out.
Specifically, as shown in figure 3, the thermal current direction in agent set 3 is (in Fig. 3 shown in dotted line) from top to bottom,
I.e.：By thermal current in the incoming agent set in the top of agent set, spread out of so that agent set 3 top from air stream outlet 17
Temperature highest, the temperature of bottom minimum it is achieved that the continuity graded of gas flow temperature.
The substrate being formed with alignment films is entered inside agent set from substrate import, particularly enters agent set
Second chamber, substrate moves to top from bottom, and period substrate local environment temperature constantly raises, and alignment films gradually solidify, and arrive
After reaching agent set 3 top, environment temperature reaches the maximum temperature of solidifying requirements.
Then substrate is sent to first chamber from second chamber, and specifically, the stage that cools of described alignment films is in Fig. 3
Carry out in described first chamber 6, the substrate that the formation completing to solidify has alignment films moves to bottom from the top of agent set 3
Dynamic, period substrate local environment temperature constantly declines, and the temperature of substrate 1 slowly reduces, and temperature comes back to entrance agent set 3
When temperature, finally 13 leave agent set 3 from outlet, the solidification of alignment films and the stage of cooling complete.
The above, only presently preferred embodiments of the present invention, it is not intended to limit protection scope of the present invention.
Claims (9)
1. a kind of solidification of alignment films and cooling device are it is characterised in that include：Heater and pass through pipeline and heater
Connected airflow apparatus；Described alignment films can be solidified and the process that cooled agent set；
The top of described agent set is connected with heater by pipeline, and bottom is provided with air stream outlet, substrate import and base
Plate exit, the substrate being formed with alignment films enters agent set by substrate import, and the substrate being formed with alignment films passes through substrate
Agent set is left in outlet；
Include first chamber and second chamber inside described agent set, described first chamber and second chamber pass through a dividing plate every
Open；
One end of described dividing plate is connected with the bottom of agent set, and the other end can accommodate base with the top formation of described agent set
The gap that plate level passes through；
Described substrate import and substrate outlet are respectively arranged at described first chamber and second chamber.
2. the solidification of alignment films according to claim 1 and cooling device are it is characterised in that the top of described agent set
It is respectively arranged with ventilating board with bottom, described ventilating board is provided with multiple apertures.
3. the solidification of alignment films according to claim 1 and 2 and cooling device are it is characterised in that described agent set
Top, bottom and centre position are each provided with least one temperature sensing device.
4. the solidification of alignment films according to claim 1 and 2 with cooling device it is characterised in that described device also includes
It is arranged at the drier between the bottom of agent set and airflow apparatus, to remove the water discharging in the solidification process of alignment films
Steam；Described drier is connected with the bottom of agent set by pipeline.
5. the solidification of alignment films according to claim 4 and cooling device are it is characterised in that described device also includes adsorbing
Device, with the organic solvent containing in adsorption flow gas；One end of described adsorbent equipment is connected with drier by pipeline, separately
One end is connected with described airflow apparatus by pipeline.
6. the solidification of alignment films according to claim 5 and cooling device are it is characterised in that described device also includes filtering
Part, is filtered with the impurity that the solidification of alignment films is produced with cooling stage；Described filter element is connected to by pipeline
Between airflow apparatus and described adsorbent equipment.
7. the solidification of alignment films according to claim 1 and 2 and cooling device it is characterised in that described airflow apparatus and
It is additionally provided with gas supplementary device between heater.
8. a kind of solidification of alignment films and cooling means are it is characterised in that adopt the orientation any one of claim 1-7
The solidification of film and cooling device, the method includes：
By thermal current in the incoming agent set in one end of described agent set, spread out of from the other end of described agent set；
The cure stage of alignment films, be formed with alignment films substrate enter agent set after, in agent set along with hot gas
The direction movement that the flow direction of stream is contrary makes described alignment films progressively solidify；
Alignment films cool the stage, are formed with the substrate of alignment films in agent set along the flow direction phase with thermal current
Same direction is moved.
9. method according to claim 8 it is characterised in that the cure stage of described alignment films and the stage of cooling divide
Not do not carry out in the second chamber of described agent set and first chamber.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310158853.3A CN104133322B (en) | 2013-05-02 | 2013-05-02 | Oriented film solidification and cooling device and oriented film solidification and cooling method |
| PCT/CN2013/089466 WO2014176911A1 (en) | 2013-05-02 | 2013-12-16 | Alignment film curing and cooling device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310158853.3A CN104133322B (en) | 2013-05-02 | 2013-05-02 | Oriented film solidification and cooling device and oriented film solidification and cooling method |
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| Publication Number | Publication Date |
|---|---|
| CN104133322A CN104133322A (en) | 2014-11-05 |
| CN104133322B true CN104133322B (en) | 2017-02-08 |
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| CN201310158853.3A Active CN104133322B (en) | 2013-05-02 | 2013-05-02 | Oriented film solidification and cooling device and oriented film solidification and cooling method |
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| Country | Link |
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| CN (1) | CN104133322B (en) |
| WO (1) | WO2014176911A1 (en) |
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|---|---|---|---|---|
| CN105137660A (en) * | 2015-09-25 | 2015-12-09 | 京东方科技集团股份有限公司 | Device and method for removing impurities in optical alignment film |
Citations (4)
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|---|---|---|---|---|
| CN101109073A (en) * | 2006-06-26 | 2008-01-23 | 应用材料股份有限公司 | Nitrogen enriched cooling air module for uv curing system |
| CN202033557U (en) * | 2011-05-04 | 2011-11-09 | 京东方科技集团股份有限公司 | Thermocuring equipment |
| CN202166807U (en) * | 2011-08-01 | 2012-03-14 | 京东方科技集团股份有限公司 | Pre-solidifying equipment for directional film |
| CN102645789A (en) * | 2011-09-27 | 2012-08-22 | 北京京东方光电科技有限公司 | Solidifying system and solidifying method of orientation film |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002255578A (en) * | 2001-02-27 | 2002-09-11 | Toppan Printing Co Ltd | Method for cooling large sized glass substrate and device for the same |
| JP2012215675A (en) * | 2011-03-31 | 2012-11-08 | Sanyo Electric Co Ltd | Image display device |
-
2013
- 2013-05-02 CN CN201310158853.3A patent/CN104133322B/en active Active
- 2013-12-16 WO PCT/CN2013/089466 patent/WO2014176911A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101109073A (en) * | 2006-06-26 | 2008-01-23 | 应用材料股份有限公司 | Nitrogen enriched cooling air module for uv curing system |
| CN202033557U (en) * | 2011-05-04 | 2011-11-09 | 京东方科技集团股份有限公司 | Thermocuring equipment |
| CN202166807U (en) * | 2011-08-01 | 2012-03-14 | 京东方科技集团股份有限公司 | Pre-solidifying equipment for directional film |
| CN102645789A (en) * | 2011-09-27 | 2012-08-22 | 北京京东方光电科技有限公司 | Solidifying system and solidifying method of orientation film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104133322A (en) | 2014-11-05 |
| WO2014176911A1 (en) | 2014-11-06 |
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