CN202310424U - Radiating air flue - Google Patents

Radiating air flue Download PDF

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Publication number
CN202310424U
CN202310424U CN2011203950046U CN201120395004U CN202310424U CN 202310424 U CN202310424 U CN 202310424U CN 2011203950046 U CN2011203950046 U CN 2011203950046U CN 201120395004 U CN201120395004 U CN 201120395004U CN 202310424 U CN202310424 U CN 202310424U
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chamber
heat dissipation
wind channel
dissipation wind
channel according
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陶高周
周杰
乐文璞
万汝斌
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Sungrow Power Supply Co Ltd
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Sungrow Power Supply Co Ltd
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Abstract

本实用新型具体涉及一种散热风道,所述散热风道包括由隔板隔开的第一腔室和第二腔室,二者均用于放置电子元器件,所述第一腔室和第二腔室中的一个设置进风口,另一个设置出风口和风机,所述隔板上开设有若干通孔。通过在隔板上开设若干通孔,形成了贯穿第一腔室和第二腔室的若干风道,同时对第一腔室和第二腔室进行散热,散热效果好、结构简单,而且只需设置一个出风口和风机,降低了成本。

Figure 201120395004

The utility model specifically relates to a heat dissipation air duct, which includes a first chamber and a second chamber separated by a partition, both of which are used to place electronic components, the first chamber and the second chamber One of the second chambers is provided with an air inlet, the other is provided with an air outlet and a fan, and several through holes are opened on the partition plate. By opening a number of through holes on the partition plate, a number of air ducts passing through the first chamber and the second chamber are formed, and the first chamber and the second chamber are dissipated at the same time, the heat dissipation effect is good, the structure is simple, and only An air outlet and fan need to be set, which reduces the cost.

Figure 201120395004

Description

一种散热风道a cooling duct

技术领域 technical field

本实用新型涉及散热技术领域,具体涉及一种散热风道。The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation air duct.

背景技术 Background technique

现有的大功率电力电子装置,出于小型化或者将功率模块和其他元件分别散热的需要,常常将电子元器件分别放置在两个腔室内,例如专利申请号为“20101010041.7”的中国专利,其设置了第一风道和第二风道分别对两个腔室进行散热,第一腔室和第二腔室均设置有风机和出风口,这种设计虽能起到较好的散热效果,但是风道设计相对复杂,且每个腔室内都要设置风机、出风口,成本也比较高。Existing high-power power electronic devices often place electronic components in two chambers for miniaturization or separate heat dissipation of power modules and other components, such as the Chinese patent application number "20101010041.7", It is equipped with the first air duct and the second air duct to dissipate heat from the two chambers respectively. The first chamber and the second chamber are both equipped with fans and air outlets. Although this design can achieve a better heat dissipation effect , but the air duct design is relatively complicated, and fans and air outlets must be installed in each chamber, and the cost is relatively high.

实用新型内容 Utility model content

本实用新型的目的是提供一种结构简单、成本低的散热风道,实现对两个腔室的散热。The purpose of the utility model is to provide a heat dissipation air channel with simple structure and low cost, so as to realize the heat dissipation of two chambers.

为实现上述目的,本实用新型采用了以下技术方案:本实用新型包括由隔板隔开的第一腔室和第二腔室,二者均用于放置电子元器件,所述第一腔室和第二腔室中的一个设置进风口,另一个设置出风口和风机,所述隔板上开设有若干通孔。In order to achieve the above object, the utility model adopts the following technical solutions: the utility model includes a first chamber and a second chamber separated by a partition, both of which are used to place electronic components, and the first chamber One of the two chambers and the second chamber is provided with an air inlet, and the other is provided with an air outlet and a fan, and several through holes are opened on the partition plate.

由上述技术方案可知,通过在隔板上开设若干通孔,形成了贯穿第一腔室和第二腔室的若干风道,同时对第一腔室和第二腔室进行散热,散热效果好、结构简单,而且只需设置一个出风口和风机,降低了成本。It can be seen from the above technical solution that by opening a number of through holes on the partition plate, a number of air ducts passing through the first chamber and the second chamber are formed, and at the same time, the first chamber and the second chamber are dissipated, and the heat dissipation effect is good. , The structure is simple, and only one air outlet and fan are needed, which reduces the cost.

进一步的,所述第一腔室用于放置主要发热器件,所述第二腔室用于放置次要发热器件。Further, the first chamber is used to place the main heat generating device, and the second chamber is used to place the secondary heat generating device.

进一步的,所述通孔设置于所述主要发热器件的关键发热点附近。Further, the through hole is set near the key heat-generating point of the main heat-generating device.

进一步的,所述进风口设置于所述第一腔室的左下角。Further, the air inlet is arranged at the lower left corner of the first chamber.

进一步的,所述出风口设置于所述第二腔室的右上角。Further, the air outlet is arranged at the upper right corner of the second chamber.

进一步的,所述第二腔室内部还设有第二风机。Further, a second fan is also provided inside the second chamber.

进一步的,所述第一腔室内的元器件安装于隔板上,所述第二腔室内的元器件的大部分安装于隔板上。Further, the components in the first chamber are mounted on the partition, and most of the components in the second chamber are mounted on the partition.

进一步的,所述风机为抽风风机。Further, the fan is an exhaust fan.

进一步的,所述风机设置于出风口上。Further, the fan is arranged on the air outlet.

进一步的,所述第二风机为吹风风机。Further, the second blower is a blower.

本实用新型散热效果好,结构简单、紧凑,利于装置的小型化。The utility model has good heat dissipation effect, simple and compact structure, and is beneficial to miniaturization of the device.

附图说明 Description of drawings

图1是现有技术的结构示意图;Fig. 1 is the structural representation of prior art;

图2是本实用新型的一个实施例的结构示意图。Fig. 2 is a schematic structural view of an embodiment of the utility model.

具体实施方式 Detailed ways

如图2所示,本实用新型包括由隔板16隔开的第一腔室11和第二腔室12,二者均用于放置电子元器件,所述第一腔室11和第二腔室12中的一个设置进风口14,另一个设置出风口17和风机13,所述隔板16上开设有若干通孔15。As shown in Figure 2, the utility model comprises a first chamber 11 and a second chamber 12 separated by a partition 16, both of which are used to place electronic components, and the first chamber 11 and the second chamber One of the chambers 12 is provided with an air inlet 14 , and the other is provided with an air outlet 17 and a fan 13 , and a plurality of through holes 15 are opened on the partition 16 .

通过在隔板16上开设若干通孔15,形成了贯穿第一腔室11和第二腔室12的若干风道,同时对第一腔室11和第二腔室12进行散热,散热效果好、结构简单,而且只需设置一个出风口17和风机13,降低了成本。通孔15的大小可以根据散热需要调大调小,方便不同场合的需要。By opening a number of through holes 15 on the partition plate 16, a number of air passages passing through the first chamber 11 and the second chamber 12 are formed, and at the same time, the first chamber 11 and the second chamber 12 are dissipated, and the heat dissipation effect is good , The structure is simple, and only one air outlet 17 and fan 13 need to be set, which reduces the cost. The size of the through hole 15 can be adjusted up or down according to heat dissipation requirements, which is convenient for different occasions.

进一步的,所述第一腔室11用于放置主要发热器件,所述第二腔室12用于放置次要发热器件。所述进风口14设置于所述第一腔室11的左下角。所述出风口17设置于所述第二腔室12的右上角。Further, the first chamber 11 is used to place the main heat generating device, and the second chamber 12 is used to place the secondary heat generating device. The air inlet 14 is located at the lower left corner of the first chamber 11 . The air outlet 17 is located at the upper right corner of the second chamber 12 .

气流首先由进风口14进入第一腔室11,在风机13的作用下沿着器件间隙流动,穿过隔板16上开设的通孔15,气流随后进入第二腔室12,并被排出柜体外。风道整体形成一个腔室下部进风,另一个腔室上部出风的方式。由于气流先进入第一腔室11,因此第一腔室11的散热效果要好于第二腔室12的散热效果,因此将主要发热器件放置于第一腔室11内。将进风口14设置于左下角,能增加风道的辐射范围。The airflow first enters the first chamber 11 from the air inlet 14, flows along the device gap under the action of the fan 13, passes through the through hole 15 opened on the partition 16, and then enters the second chamber 12, and is discharged out of the cabinet. in vitro. The whole air duct forms the way that the lower part of one chamber enters the air, and the upper part of the other chamber discharges the air. Since the air flow first enters the first chamber 11 , the heat dissipation effect of the first chamber 11 is better than that of the second chamber 12 , so the main heat-generating components are placed in the first chamber 11 . Setting the air inlet 14 at the lower left corner can increase the radiation range of the air duct.

进一步的,所述通孔15设置于所述主要发热器件的关键发热点附近。Further, the through hole 15 is arranged near the key heat-generating point of the main heat-generating device.

当气流到达隔板16的通孔15附近区域时,流道截面变小,气流被加速,这时发热器件的关键点附近表面掠过较高速度的气流,使热量被迅速带走,实现冷却。When the airflow reaches the area near the through hole 15 of the partition 16, the cross section of the flow channel becomes smaller and the airflow is accelerated. At this time, the surface near the key point of the heat generating device passes over the airflow at a higher speed, so that the heat is quickly taken away to realize cooling. .

进一步的,所述第一腔室11内的元器件安装于隔板16上,所述第二腔室12内的元器件的大部分安装于隔板16上。Further, the components in the first chamber 11 are mounted on the partition 16 , and most of the components in the second chamber 12 are mounted on the partition 16 .

当气流快速经过通孔15表面时,使隔板16也获得了冷却,因此放置于隔板16上的器件也能在一定程度上获得冷却。When the air flow quickly passes through the surface of the through hole 15, the partition 16 is also cooled, so the devices placed on the partition 16 can also be cooled to a certain extent.

进一步的,所述风机13设置于出风口17上,所述风机13为抽风风机。Further, the fan 13 is arranged on the air outlet 17, and the fan 13 is an exhaust fan.

这样的设置,能加快气流的流动速度,使气流尽快的从出风口17排出,从而进一步增强散热效果。Such a setting can speed up the flow speed of the airflow, so that the airflow can be discharged from the air outlet 17 as soon as possible, thereby further enhancing the heat dissipation effect.

进一步的,所述第二腔室12内部还设有第二风机,所述第二风机为吹风风机。第二风机的设置是为了加快第二腔室12内的气流的流动速度,使其迅速的从出风口17排出,从而进一步增强散热效果。Further, a second fan is provided inside the second chamber 12, and the second fan is a blower. The setting of the second fan is to speed up the flow velocity of the airflow in the second chamber 12, so that it can be quickly discharged from the air outlet 17, thereby further enhancing the heat dissipation effect.

本实用新型在主要发热器件的关键发热点附近开设通孔15,利用开孔形成的较强气流进行集中冷却,采用抽风方式,以从下至上的风道形式,将热量排出柜体外。整个风道设置结构紧凑,在实现柜内器件冷却的同时,也实现了装置的小型化。The utility model provides a through hole 15 near the key heating point of the main heating device, uses the strong air flow formed by the opening to carry out centralized cooling, adopts the air extraction method, and discharges the heat outside the cabinet in the form of an air duct from bottom to top. The structure of the whole air duct is compact, which realizes the miniaturization of the device while realizing the cooling of the components in the cabinet.

Claims (10)

1. heat dissipation wind channel; It is characterized in that: comprise first chamber (11) and second chamber (12) that separate by dividing plate (16); The two all is used to place electronic devices and components; One in said first chamber (11) and second chamber (12) is provided with air inlet (14), and another sets out air port (17) and blower fan (13), offers some through holes (15) on the said dividing plate (16).
2. heat dissipation wind channel according to claim 1 is characterized in that: said first chamber (11) is used to place the main heating device, and said second chamber (12) is used to place less important heater members.
3. heat dissipation wind channel according to claim 2 is characterized in that: said through hole (15) is arranged near the crucial heat generating spot of said main heating device.
4. heat dissipation wind channel according to claim 2 is characterized in that: said air inlet (14) is arranged at the lower left corner of said first chamber (11).
5. heat dissipation wind channel according to claim 2 is characterized in that: said air outlet (17) is arranged at the upper right corner of said second chamber (12).
6. heat dissipation wind channel according to claim 2 is characterized in that: said second chamber (12) inside also is provided with second blower fan.
7. heat dissipation wind channel according to claim 2 is characterized in that: the components and parts in said first chamber (11) are installed on the dividing plate (16), and the major part of the components and parts in said second chamber (12) is installed on the dividing plate (16).
8. heat dissipation wind channel according to claim 1 is characterized in that: said blower fan (13) is the exhausting blower fan.
9. heat dissipation wind channel according to claim 8 is characterized in that: said blower fan (13) is arranged on the air outlet (17).
10. heat dissipation wind channel according to claim 6 is characterized in that: said second blower fan is the blowing blower fan.
CN2011203950046U 2011-10-17 2011-10-17 Radiating air flue Expired - Lifetime CN202310424U (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016041145A1 (en) * 2014-09-16 2016-03-24 深圳市大疆创新科技有限公司 Heat dissipation apparatus and uav using heat dissipation apparatus
CN110996635A (en) * 2020-01-06 2020-04-10 阳光电源股份有限公司 Chassis heat dissipation structure
CN113576274A (en) * 2021-07-23 2021-11-02 广东美的厨房电器制造有限公司 Door body and cooking device
CN115614974A (en) * 2022-10-13 2023-01-17 珠海格力电器股份有限公司 Electrical box and air conditioning unit
CN120692825A (en) * 2025-08-21 2025-09-23 深圳市德兰明海新能源股份有限公司 Heat dissipation system and electrical equipment

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016041145A1 (en) * 2014-09-16 2016-03-24 深圳市大疆创新科技有限公司 Heat dissipation apparatus and uav using heat dissipation apparatus
CN105684565A (en) * 2014-09-16 2016-06-15 深圳市大疆创新科技有限公司 Heat dissipation device and UAV adopting the heat dissipation device
US10178812B2 (en) 2014-09-16 2019-01-08 SZ DJI Technology Co., Ltd. Heat dissipation device and UAV using the same
US10681849B2 (en) 2014-09-16 2020-06-09 SZ DJI Technology Co., Ltd. Heat dissipation device and UAV using the same
CN110996635A (en) * 2020-01-06 2020-04-10 阳光电源股份有限公司 Chassis heat dissipation structure
CN110996635B (en) * 2020-01-06 2021-12-31 阳光电源股份有限公司 Case heat radiation structure
US11452235B2 (en) 2020-01-06 2022-09-20 Sungrow Power Supply Co., Ltd. Case heat dissipation structure
CN113576274A (en) * 2021-07-23 2021-11-02 广东美的厨房电器制造有限公司 Door body and cooking device
CN113576274B (en) * 2021-07-23 2023-08-18 广东美的厨房电器制造有限公司 Door and cooking device
CN115614974A (en) * 2022-10-13 2023-01-17 珠海格力电器股份有限公司 Electrical box and air conditioning unit
CN120692825A (en) * 2025-08-21 2025-09-23 深圳市德兰明海新能源股份有限公司 Heat dissipation system and electrical equipment

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Address after: 230088 Anhui city of Hefei province high tech Zone Xiyou Road No. 1699

Patentee after: Sun Grow Power Co., Ltd.

Address before: High tech Zone of Hefei city of Anhui Province in 230088 Lake Road No. 2

Patentee before: Sun Grow Power Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20120704

CX01 Expiry of patent term