CN104133322A - Oriented film solidification and cooling device and oriented film solidification and cooling method - Google Patents

Oriented film solidification and cooling device and oriented film solidification and cooling method Download PDF

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Publication number
CN104133322A
CN104133322A CN201310158853.3A CN201310158853A CN104133322A CN 104133322 A CN104133322 A CN 104133322A CN 201310158853 A CN201310158853 A CN 201310158853A CN 104133322 A CN104133322 A CN 104133322A
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Prior art keywords
alignment films
agent set
substrate
cooling device
solidifying
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CN201310158853.3A
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CN104133322B (en
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周永山
覃一锋
张飞飞
孟维欣
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Beijing BOE Optoelectronics Technology Co Ltd
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Beijing BOE Optoelectronics Technology Co Ltd
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Priority to CN201310158853.3A priority Critical patent/CN104133322B/en
Priority to PCT/CN2013/089466 priority patent/WO2014176911A1/en
Publication of CN104133322A publication Critical patent/CN104133322A/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulding By Coating Moulds (AREA)
  • Liquid Crystal (AREA)

Abstract

The invention discloses an oriented film solidification and cooling device. The oriented film solidification and cooling device comprises a heating device, an air flow device connected with the heating device and a main device capable of solidifying and cooling the oriented film. One end of the main device is connected with the heating device through a pipeline; the other end of the main device is provided with an air outlet, a substrate entry and a substrate exit. A substrate on which the oriented film is formed enters the main device through the substrate entry and leaves the main body through the substrate exit. The invention further discloses an oriented film solidification and cooling method. By the use of the oriented film solidification and cooling device and the oriented film solidification and cooling method, the problem that separation of a solidification phase and a cooling phase causes high energy consumption and high cost can be solved; thermal and mechanical properties of the oriented film can be improved.

Description

Solidifying of alignment films and solidifying and cooling means of cooling device, alignment films
Technical field
The present invention relates to the manufacturing technology field of liquid crystal panel, relate in particular to solidifying of a kind of alignment films and solidifying and cooling means of cooling device and alignment films.
Background technology
Liquid crystal display has very important effect in the modern life, and liquid crystal panel is the chief component of liquid crystal display.The manufacturing process of liquid crystal panel has following step: array base palte preparation technology, molding process, and cutting technique etc.Wherein, described molding process comprises again: printing direction-orienting films, friction orientation, then on a substrate, be coated with sealed plastic box, on another substrate, dropping liquid is brilliant, and by two substrates to box.The successful orientation of liquid crystal molecule realizes by alignment films, and the curing quality of alignment films directly affects the orientation effect of liquid crystal molecule, and then is determining the display effect of liquid crystal panel.In above-mentioned molding process, the curing and process that cools of alignment films has significant impact to the performance of alignment films.
In prior art, alignment films solidify and the process of cooling is separated, in cure stage, realize at high temperature completely curing of alignment films, and then enter cooling device and complete blowing temperature-fall period.Described solidification process adopts Fig. 1 shown device, and the process that cools adopts Fig. 2 shown device.
There is certain defect in above-mentioned implementation method:
First, owing to solidifying and cooling, be divided into two stages and carry out separately, temperature required while solidifying is higher, is generally 230 degree; And need to blow a cold wind over while cooling, therefore power consumption is large, cost is higher;
Secondly, for solidification equipment, because solidification temperature is up to 230 degree, substrate 1 directly enters hot environment from the temperature of precuring, and the sudden change of temperature can affect the performances such as alignment films calorifics, mechanics, finally affects the curing quality of alignment films;
Moreover in the cure stage of alignment films, thermal current is to be blown into (Fig. 1 shown in arrow) from the side of substrate 1, therefore, curing efficiency is on the low side, and also infrared auxiliary heating device 2 need to be set above substrate 1, to accelerate the solidification process of alignment films;
Finally, for the existing process that cools, substrate 1 enters room temperature environment from the cure stage of high temperature, but also need to force blast-cold gas (in Fig. 2 shown in arrow) to realize the fast cooling of alignment films, cause the inside of substrate and the surface temperature difference of alignment films to change greatly, to performances such as the calorifics of alignment films, mechanics, can produce harmful effect.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide solidifying of a kind of alignment films and solidifying and cooling means of cooling device and alignment films, existing solidifying and the problem that power consumption is large, cost is high that the stage separation of cooling causes can be solved, and calorifics, the mechanical property of alignment films can be improved.
For achieving the above object, technical scheme of the present invention is achieved in that
The invention provides solidifying and cooling device of a kind of alignment films, comprising: heating arrangement and the airflow apparatus being connected with heating arrangement by pipeline; The agent set that can be cured and cool and process described alignment films;
One end of described agent set is connected with heating arrangement by pipeline, the other end is provided with air stream outlet, substrate import and substrate outlet, the substrate that is formed with alignment films enters agent set by substrate import, and the substrate that is formed with alignment films is exported and left agent set by substrate.
Wherein, described agent set inside comprises the first chamber and the second chamber, and described the first chamber and the second chamber separate by a dividing plate.
Wherein, one end of described dividing plate is connected with the bottom of agent set, and the top of the other end and described agent set forms can hold the gap that substrate level is passed through.
In such scheme, the top and bottom of described agent set is respectively arranged with ventilating board, is provided with a plurality of apertures on described ventilating board.
Wherein, the top of described agent set, bottom and centre position are respectively provided with at least one temperature sensing device.
In such scheme, described device also comprises and is arranged at the bottom of agent set and the exsiccator between airflow apparatus, to remove the water vapor discharging in the solidification process of alignment films; Described exsiccator is connected with the bottom of agent set by pipeline.
Wherein, described device also comprises adsorbent equipment, to adsorb the organic solvent containing in flowing gas; One end of described adsorbent equipment is connected with exsiccator by pipeline, and the other end is connected with described airflow apparatus by pipeline.
Wherein, described device also comprises filter element, with the impurity producing with cooling stage that solidifies to alignment films, filters; Described filter element is connected between airflow apparatus and described adsorbent equipment by pipeline.
Preferably, between described airflow apparatus and heating arrangement, be also provided with gas make-up device.
The present invention also provides solidifying and cooling means of a kind of alignment films, adopts solidifying and cooling device of alignment films mentioned above, and the method comprises:
Thermal current is imported in agent set from one end of described agent set, from the other end of described agent set, spread out of;
The cure stage of alignment films, the substrate that is formed with alignment films enters after agent set, in agent set, along the contrary direction of the flow direction with thermal current, moves described alignment films is progressively solidified;
Alignment films cools the stage, and the substrate that is formed with alignment films moves along the identical direction of the flow direction with thermal current in agent set.
Wherein, the cure stage of described alignment films and the stage that cools carry out at the second chamber of described agent set and the first chamber respectively.
Solidifying and cooling device of alignment films provided by the invention, comprising: heating arrangement and the airflow apparatus being connected with heating arrangement by pipeline; Described device also comprises: can carry out solidifying and the agent set that cools and process of alignment films; One end of described agent set is connected with heating arrangement by pipeline, the other end is provided with air stream outlet, while solidify starting for alignment films, the substrate that is formed with alignment films enters the import of agent set, and cool while finishing for alignment films, the substrate that is formed with alignment films leaves the outlet of agent set.Substrate of the present invention constantly rises in a chamber, along with the rising of temperature realizes continous way, solidifies, and after arriving tower top, transverse movement enters another chamber and constantly declines, and this process temperature constantly reduces and realizes gradual cooling.Therefore, the present invention has not only realized solidifying of alignment films and has cooled integrated continued operation of stage, does not need to blow a cold wind over separately, in the air-flow reducing gradually, realizes and cooling in temperature, and heat energy is fully used, and has saved cost; And, the present invention has realized the continuous variation of solidifying of alignment films and the phase temperature that cools, that is: realize the curing and progressive cooling continuously of alignment films, therefore can prevent that the difference between pre-cure phase temperature and solidification temperature is excessive, effectively improved calorifics, the mechanical property of alignment films.
Accompanying drawing explanation
Fig. 1 is the structural representation of the solidification equipment of existing alignment films;
Fig. 2 is the structural representation of the cooling device of existing alignment films;
Fig. 3 is the structural representation of solidifying of alignment films of the present invention and cooling device embodiment;
Fig. 4 is the right view of solidifying of alignment films of the present invention and cooling device embodiment;
Fig. 5 is the front elevation of solidifying of alignment films of the present invention and cooling device embodiment.
Description of reference numerals:
1 substrate; 2 infrared auxiliary heating devices; 3 agent sets; 4 heating arrangements; 5 airflow apparatus; 6 first chambers; 7 second chambers; 8 dividing plates; 9 temperature sensing devices; 10 gas make-up devices; 11 ventilating boards; 12 substrate imports; 13 substrate outlets; 14 exsiccators; 15 adsorbent equipments; 16 filter elements; 17 air stream outlets.
Embodiment
The invention provides a kind ofly by solidifying and the device of the stage integrated design that cools, can solve the existing problem that the power consumption that cause separated with the stage of cooling is large, cost is high of solidifying; Meanwhile, in described device, the continuity of gas flow temperature changes, and can improve calorifics, the mechanical property of alignment films; Basic thought is:
The portion of setting within it can carry out solidifying and the agent set that cools and process of alignment films, and heating arrangement is connected with airflow apparatus with agent set respectively by pipeline; One end of described agent set is connected with heating arrangement by pipeline, the other end is provided with air stream outlet, substrate import and substrate outlet, the substrate that is formed with alignment films enters agent set by substrate import, and the substrate that is formed with alignment films is exported and left agent set by substrate.
Wherein, described airflow apparatus can be realized blowing function, imports hot gas into described agent set from one end of agent set, also can realize air extracting function, the other end sucking-off by gas from described agent set.
It should be noted that, in the embodiment of the present invention, thermal current carrys out self-heating apparatus, from the top of agent set, imports in agent set.
Below in conjunction with drawings and the specific embodiments, the present invention is described in further detail.
Fig. 3 is the structural representation of solidifying of alignment films of the present invention and cooling device embodiment, as shown in Figure 3, comprise: the airflow apparatus 5 of the heating arrangement 4 of agent set 3, heated air and guiding gas flow, described heating arrangement 4 for example, is connected with airflow apparatus 5 (airflow apparatus can be blower fan) with agent set 3 respectively by pipeline, the other end of agent set 3 is provided with air stream outlet 17, under the acting in conjunction of airflow apparatus 5 and heating arrangement 4, thermal current is imported in agent set 3 by pipeline.
In embodiments of the present invention, the one end that agent set can be connected with heating arrangement is defined as the top of agent set, the bottom that is agent set near the zone definitions of air stream outlet by agent set.
Wherein, thermal current direction in described agent set 3 is (in Fig. 3 shown in dotted line) from top to bottom, that is: thermal current is imported in agent set from the top of agent set, from air stream outlet 17, spread out of, along with flowing of thermal current, make the temperature at agent set 3 tops the highest, the temperature of bottom is minimum, has realized the continuity graded of gas flow temperature.Because the solidification temperature of alignment films is generally 230 degree,, can the temperature at agent set 3 tops be controlled to 230 degree~250 degree by regulating the power of heating arrangement 4 here, temperature is too low, does not reach solidification effect, and excess Temperature can destroy the characteristic of alignment films.The bottom of described agent set 3 arranges substrate import 12 and substrate outlet 13, and the substrate that scribbles alignment films enters agent set 3 from import 12, from exporting 13, leaves agent set 3.
Further, in top, bottom and the centre position of agent set 3, be respectively provided with at least one temperature sensing device 9, by the temperature control system (not shown in Fig. 3) being connected with temperature sensing device 9, carry out the Temperature Distribution in Real-Time Monitoring control subject device 3, and by regulating heating arrangement 4, the power of airflow apparatus 5 and the operating rate of substrate 10 etc. because usually regulating the temperature in agent set 3.For example: by improving the power of heating arrangement 4, airflow apparatus 5, improve the temperature in agent set 3; Otherwise, reduce.By accelerating the operating rate of substrate 10, be equivalent to reduce the solidification temperature of the alignment films forming on substrate; Otherwise, improve.Here, in described agent set 3, be also provided with back up pad (not shown in Fig. 3), to support described substrate 1 in the interior movement of agent set 3, by adjusting the movement rate of back up pad, with realization, adjust the operating rate of substrate 10.
Further, described agent set 3 is comprised of the first chamber 6 and 7 two chambers of the second chamber, and particularly, the cure stage of alignment films is carried out in the first chamber 6, and the stage that cools of alignment films carries out in the second chamber 7; Or the cure stage of alignment films is carried out in the second chamber 7, the stage that cools of alignment films carries out in the first chamber 6.In the present embodiment, the cure stage of alignment films is carried out in the second chamber 7, and the stage that cools of alignment films carries out in the first chamber 6.Two chambers are kept apart by the inner dividing plate 8 arranging of agent set 3.Further, one end of described dividing plate 8 is connected with the bottom of agent set 3, and the top of the other end and described agent set 3 forms can hold the gap that substrate level is passed through.Concrete, in the present embodiment, one end of dividing plate 8 is that the ventilating board arranging with agent set bottom is connected.The object that described dividing plate 8 arranges is: the cure stage in alignment films can discharge a certain amount of water vapor and solvent gas, the existence of dividing plate 8 can make the gas being evaporated at the bottom of tower, extract out fast, prevent that it is diffused into another chamber, affect the cool effect in stage of alignment films; Preferably, the preferred Heat Conduction Material of dividing plate 8, dividing plate 8 can make the heat in two chambers mutually transmit like this, makes heat obtain more effectively utilizing, and can prevent the too fast reduction of temperature in the process of cooling, and affects the performance such as calorifics, mechanics of alignment films.
Preferably, the top and bottom of described agent set 3 is respectively arranged with ventilating board 11, on described ventilating board 11, is provided with a plurality of apertures, to control the type of flow of hot blast in tower.Preferably, above-mentioned a plurality of aperture is equally distributed.The ventilating board 11 that top arranges prevents too concentrated importing in agent set 3 of air-flow, thereby avoids alignment films to produce and impact.The air-flow that the ventilating board 11 that bottom arranges is convenient in agent set 3 is evenly derived smoothly, and keeps bottom temp even, otherwise, if gas flow rates can cause agent set 3 bottom temps inhomogeneous too soon, cannot guarantee the graded of temperature.
Preferably, the curing and cooling device of described alignment films also comprises: be arranged at bottom and the exsiccator between airflow apparatus 14 of agent set, as shown in Figure 3, described exsiccator 14 is connected with the bottom of agent set 3 by pipeline.Described exsiccator 14, the part water vapor discharging for removing solidification process alignment films, to guarantee the efficient utilization of heat in each cyclic process; Meanwhile, aqueous vapor remove in time also can extension device life-span.
Further, solidifying with cooling device of alignment films of the present invention also comprises: adsorbent equipment 15, for example specifically can be surfactivity adsorption tank, and described adsorbent equipment 15 is connected with exsiccator 14 by pipeline, and the other end is connected with airflow apparatus 5 by pipeline.The material of adsorbent equipment 15 by Large ratio surface activity is by the organic solvent Adsorption containing in flowing gas, and purified gas will again enter heating arrangement 4 by airflow apparatus 5 and again heat, reciprocation cycle.
Preferably, between described adsorbent equipment 15 and described airflow apparatus 5, be also provided with filter element 16, for example, specifically can be filtering membrane, described filter element 16 is connected between airflow apparatus 5 and adsorbent equipment 15 by pipeline.Described filter element 16 is removed on the basis of water vapor and organic solvent at exsiccator 14 and adsorbent equipment 15, the gas in device further filtered, and with the contaminating impurity alignment films that prevents from producing in different phase, mobile gas in purification plant.
Further, between described airflow apparatus 5 and heating arrangement 4, be also provided with gas make-up device 10, for the source of the gas of timely supplementary device, the gas flow in assurance device.Described gas can be nitrogen or other inert gases etc., to prevent that the alignment films on gas and substrate 1 from reacting.
In order to guarantee that the heat in agent set 3 can make full use of, substrate 1 can be heated efficiently in agent set 3, and so, arrange and be set to part overlapping type in the position of substrate 1 in agent set 3, as shown in Figure 4.
In actual application, the substrate 1 that is formed with alignment films enters in agent set 3 from substrate import 12, and as shown in Figure 3 and Figure 5, solid arrow direction is that substrate 1 enters the direction of motion in agent set 3, and dotted arrow is the airflow direction in tower.From bottom, to top, move, during substrate environment temperature of living in constantly raise, alignment films is solidified gradually, arrive behind agent set 3 tops, environment temperature reaches the maximum temperature of solidifying requirements, and substrate moves laterally to the opposite side of agent set 3, for example: from a chamber, move to another chamber.Afterwards, substrate 1 begins to cool down temperature-fall period, from the top of agent set 3, to bottom, move, substrate environment temperature of living in constantly declines during this time, the temperature of substrate 1 slowly reduces, temperature comes back to the temperature while entering agent set 3, finally from substrate outlet 13, leaves agent set 3, and solidifying with the stage of cooling of alignment films completes.
In actual moving process, can regulate in real time the operating rate of substrate 1 in agent set 3 and mutual spacing according to the variation of temperature in tower, to guarantee the high efficiency of whole solidification process.For example: excess Temperature, accelerate the operating rate of substrate 1 in agent set 3, also can reduce the spacing of 1 of substrate, to reduce the received heat of substrate 1.
Use said apparatus, the present invention also provides solidifying and cooling means of a kind of alignment films, and the method comprises:
Thermal current is imported in agent set from one end of described agent set, from the other end of described agent set, spread out of;
The cure stage of alignment films, the substrate that is formed with alignment films enters after agent set, in agent set, along the contrary direction of the flow direction with thermal current, moves described alignment films is progressively solidified;
Alignment films cools the stage, and the substrate that is formed with alignment films moves along the identical direction of the flow direction with thermal current in agent set;
Further, the cure stage of above-mentioned alignment films and the stage that cools carry out at the second chamber of described agent set and the first chamber respectively.
Concrete, as shown in Figure 3, thermal current direction in agent set 3 is (in Fig. 3 shown in dotted line) from top to bottom, that is: thermal current is imported in agent set from the top of agent set, from air stream outlet 17, spread out of, make the temperature at agent set 3 tops the highest, the temperature of bottom is minimum, has realized the continuity graded of gas flow temperature.
The substrate that is formed with alignment films is entered to agent set inside from substrate import, concrete is the second chamber that enters agent set, substrate moves to top from bottom, substrate environment temperature of living in constantly raises during this time, alignment films is solidified gradually, arrive behind agent set 3 tops, environment temperature reaches the maximum temperature of solidifying requirements.
Then substrate is sent to the first chamber from the second chamber, concrete, the stage that cools of described alignment films carries out in the first chamber 6 described in Fig. 3, completing the curing substrate that is formed with alignment films moves to bottom from the top of agent set 3, substrate environment temperature of living in constantly declines during this time, and the temperature of substrate 1 slowly reduces, and temperature comes back to the temperature while entering agent set 3, finally from exporting 13, leave agent set 3, solidifying with the stage of cooling of alignment films completes.
The above, be only preferred embodiment of the present invention, is not intended to limit protection scope of the present invention.

Claims (11)

1. solidifying and a cooling device of alignment films, is characterized in that, comprising: heating arrangement and the airflow apparatus being connected with heating arrangement by pipeline; The agent set that can be cured and cool and process described alignment films;
One end of described agent set is connected with heating arrangement by pipeline, the other end is provided with air stream outlet, substrate import and substrate outlet, the substrate that is formed with alignment films enters agent set by substrate import, and the substrate that is formed with alignment films is exported and left agent set by substrate.
2. solidifying and cooling device of alignment films according to claim 1, is characterized in that, described agent set inside comprises the first chamber and the second chamber, and described the first chamber and the second chamber separate by a dividing plate.
3. solidifying and cooling device of alignment films according to claim 2, is characterized in that, one end of described dividing plate is connected with the bottom of agent set, and the top of the other end and described agent set forms can hold the gap that substrate level is passed through.
4. according to the curing and cooling device of the alignment films described in claim 1-3 any one, it is characterized in that, the top and bottom of described agent set is respectively arranged with ventilating board, is provided with a plurality of apertures on described ventilating board.
5. according to the curing and cooling device of the alignment films described in claim 1-3 any one, it is characterized in that, the top of described agent set, bottom and centre position are respectively provided with at least one temperature sensing device.
6. according to the curing and cooling device of the alignment films described in claim 1-3 any one, it is characterized in that, described device also comprises and is arranged at the bottom of agent set and the exsiccator between airflow apparatus, to remove the water vapor discharging in the solidification process of alignment films; Described exsiccator is connected with the bottom of agent set by pipeline.
7. solidifying and cooling device of alignment films according to claim 6, is characterized in that, described device also comprises adsorbent equipment, to adsorb the organic solvent containing in flowing gas; One end of described adsorbent equipment is connected with exsiccator by pipeline, and the other end is connected with described airflow apparatus by pipeline.
8. solidifying and cooling device of alignment films according to claim 7, is characterized in that, described device also comprises filter element, with the impurity producing with cooling stage that solidifies to alignment films, filters; Described filter element is connected between airflow apparatus and described adsorbent equipment by pipeline.
9. according to the curing and cooling device of the alignment films described in any one in claim 1-3, it is characterized in that, between described airflow apparatus and heating arrangement, be also provided with gas make-up device.
10. solidifying and a cooling means of alignment films, is characterized in that, adopts the curing and cooling device of the alignment films described in any one in claim 1-9, and the method comprises:
Thermal current is imported in agent set from one end of described agent set, from the other end of described agent set, spread out of;
The cure stage of alignment films, the substrate that is formed with alignment films enters after agent set, in agent set, along the contrary direction of the flow direction with thermal current, moves described alignment films is progressively solidified;
Alignment films cools the stage, and the substrate that is formed with alignment films moves along the identical direction of the flow direction with thermal current in agent set.
11. methods according to claim 10, is characterized in that, the cure stage of described alignment films and the stage that cools carry out at the second chamber of described agent set and the first chamber respectively.
CN201310158853.3A 2013-05-02 2013-05-02 Oriented film solidification and cooling device and oriented film solidification and cooling method Expired - Fee Related CN104133322B (en)

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CN201310158853.3A CN104133322B (en) 2013-05-02 2013-05-02 Oriented film solidification and cooling device and oriented film solidification and cooling method
PCT/CN2013/089466 WO2014176911A1 (en) 2013-05-02 2013-12-16 Alignment film curing and cooling device and method

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