CN104128714A - Non-boron brazing filler metal for high temperature alloy brazing and welding technology thereof - Google Patents
Non-boron brazing filler metal for high temperature alloy brazing and welding technology thereof Download PDFInfo
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- CN104128714A CN104128714A CN201410337590.7A CN201410337590A CN104128714A CN 104128714 A CN104128714 A CN 104128714A CN 201410337590 A CN201410337590 A CN 201410337590A CN 104128714 A CN104128714 A CN 104128714A
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- high temperature
- temperature alloy
- boron
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- soldering high
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Abstract
The invention discloses non-boron brazing filler metal for high temperature alloy brazing. The non-boron brazing filler metal comprises Mn, Ni, Co and Cu. The weight of Mn is 11%-16% of the total weight of the non-boron brazing filler metal for high temperature alloy brazing. The weight of Ni is 20%-25% of the total weight of the non-boron brazing filler metal for high temperature alloy brazing. The weight of Co is 4.5%-5.5% of the total weight of the non-boron brazing filler metal for high temperature alloy brazing. The balance is Cu. The invention further discloses a welding technology of the non-boron brazing filler metal for high temperature alloy brazing. The brazing filler metal is subjected to brazing connecting to form a connector which is high in intensity value, what is more important, the connector has great plastic deformation capacity, and the problem that currently, commonly-existing deformation high-temperature alloy brazing connector is poor in plasticity is solved. The whole welding process is carried out in an argon atmosphere protecting environment, and Mn is prevented from being oxidized.
Description
Technical field
The present invention relates to a kind of solder, particularly a kind of soldering high temperature alloy is used without boron solder, the invention still further relates to the welding procedure of a kind of soldering high temperature alloy without boron solder.
Background technology
Traditional high-temperature nickel-based, cobalt-based solder generally contain Si, B etc. and fall molten element, especially B, in the process of actual brazing deformation high temperature alloy, be easy to separate out in joint fragility phase, cause joint to become fragile, having under the environment that impacts and shake, joint is easy to lose efficacy because of cracking.Therefore, exploitation is the important channel that solves this situation without boron solder.At present existing Ni-Hf, Ni-Zr, Ni-Pd system solder.With Hf, Zr, Pd, when falling molten element, the fusing point of this system solder is higher, all higher than 1200 ℃ of the solid solution temperatures of wrought superalloy GH3128, causes brazing temperature too high and be difficult to use in brazing deformation high temperature alloy.
Summary of the invention
An object of the present invention is to have proposed a kind of soldering high temperature alloy and use without boron solder, solved the poor difficult problem of wrought superalloy soldered fitting plasticity.
An object of the present invention is to propose the welding procedure of a kind of soldering high temperature alloy without boron solder, solved the difficult problem that in welding process, manganese is very easily oxidized.
Technical scheme of the present invention is achieved in that a kind of soldering high temperature alloy uses without boron solder, comprise: Mn, Ni, Co, Cu, wherein Mn accounts for the 11%-16% of described soldering high temperature alloy without boron solder gross weight, Ni accounts for the 20%-25% of described soldering high temperature alloy without boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 4.5%-5.5% of boron solder gross weight, and surplus is Cu.
Wherein Mn can reduce the fusing point of solder, and Ni, Co can increase the intensity of solder, plays the effect of solution strengthening.
Preferably, described soldering high temperature alloy is used without boron solder, comprise: Mn, Ni, Co, Cu, wherein Mn accounts for the 13%-15% of described soldering high temperature alloy without boron solder gross weight, Ni accounts for the 24%-25% of described soldering high temperature alloy without boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 4.5%-5.5% of boron solder gross weight, and surplus is Cu.
Preferably, described soldering high temperature alloy is used without boron solder, comprise: Mn, Ni, Co, Cu, wherein Mn accounts for described soldering high temperature alloy and uses without 15% of boron solder gross weight, Ni accounts for described soldering high temperature alloy and uses without 25% of boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 5% of boron solder gross weight, and surplus is Cu.
Preferably, described soldering high temperature alloy is used without boron solder, comprise: Mn, Ni, Co, Cu, wherein Mn accounts for described soldering high temperature alloy and uses without 11% of boron solder gross weight, Ni accounts for described soldering high temperature alloy and uses without 20% of boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 5% of boron solder gross weight, and surplus is Cu.
Preferably, described soldering high temperature alloy is used without boron solder, comprise: Mn, Ni, Co, Cu, wherein Mn accounts for described soldering high temperature alloy and uses without 11% of boron solder gross weight, Ni accounts for described soldering high temperature alloy and uses without 23% of boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 4.5% of boron solder gross weight, and surplus is Cu.
Preferably, described soldering high temperature alloy is used without boron solder, comprise: Mn, Ni, Co, Cu, wherein Mn accounts for described soldering high temperature alloy and uses without 16% of boron solder gross weight, Ni accounts for described soldering high temperature alloy and uses without 25% of boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 5.5% of boron solder gross weight, and surplus is Cu.
The welding procedure of described soldering high temperature alloy without boron solder, brazing temperature is 1180 ℃, during welding, at welded part plating nickel on surface, whole welding process is carried out under argon gas atmosphere protection of the environment.
Described soldering high temperature alloy is used without boron solder when welding, and adopting brazing temperature is 1180 ℃.In order to improve solder in the lip-deep wettability of mother metal, need to be at welded part plating nickel on surface.Because the manganese in solder is very easily oxidized, therefore whole welding process need be carried out under argon gas atmosphere protection of the environment.
Beneficial effect of the present invention is: by the described soldering high temperature alloy joint being connected to form without boron solder brazing, not only strength of joint value is higher, the more important thing is that joint has showed good plastic deformation ability.And whole welding process is carried out under argon gas atmosphere protection of the environment, prevented that manganese is oxidized.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is tissue topography's schematic diagram that a kind of soldering high temperature alloy of the present invention is used the soldered fitting forming without boron solder welding welded part.
Fig. 2 is the test result schematic diagram that a kind of soldering high temperature alloy of the present invention is used the maximum deflection angle that the soldered fitting that forms without boron solder welding welded part can bear.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1
According to content provided by the invention, inventor makes soldering high temperature alloy and uses without boron solder 1, and wherein the proportioning of each component is as follows:
Wherein Mn accounts for described soldering high temperature alloy and uses without 15% of boron solder gross weight, and Ni accounts for described soldering high temperature alloy and uses without 25% of boron solder gross weight, and Co accounts for described soldering high temperature alloy and uses without 5% of boron solder gross weight, and surplus is Cu.
Embodiment 2
According to content provided by the invention, inventor makes soldering high temperature alloy and uses without boron solder 2, and wherein the proportioning of each component is as follows:
Mn accounts for described soldering high temperature alloy and uses without 11% of boron solder gross weight, and Ni accounts for described soldering high temperature alloy and uses without 20% of boron solder gross weight, and Co accounts for described soldering high temperature alloy and uses without 5% of boron solder gross weight, and surplus is Cu.
Embodiment 3
According to content provided by the invention, inventor makes soldering high temperature alloy and uses without boron solder 3, and wherein the proportioning of each component is as follows:
Mn accounts for described soldering high temperature alloy and uses without 11% of boron solder gross weight, and Ni accounts for described soldering high temperature alloy and uses without 23% of boron solder gross weight, and Co accounts for described soldering high temperature alloy and uses without 4.5% of boron solder gross weight, and surplus is Cu.
Embodiment 4
According to content provided by the invention, inventor makes soldering high temperature alloy and uses without boron solder 4, and wherein the proportioning of each component is as follows:
Mn accounts for described soldering high temperature alloy and uses without 16% of boron solder gross weight, and Ni accounts for described soldering high temperature alloy and uses without 25% of boron solder gross weight, and Co accounts for described soldering high temperature alloy and uses without 5.5% of boron solder gross weight, and surplus is Cu.
Inventor uses without boron solder 1 and has done following test the soldering high temperature alloy obtaining:
Block soldering high temperature alloy is used without boron solder 1 and is placed in welded part (wrought superalloy GH3128) side, by the wetability with raising solder at welded part plating nickel on surface.Welding process is carried out in being full of the soldering oven of argon gas.Joint clearance of brazing is 100 μ m, and brazing temperature is 1180 ℃, and temperature retention time 20min is then cooling with stove.
Observe the joint microstructure that above soldering processes form, SEM photo as shown in Figure 1, shows that joint microstructure is the copper based solid solution tissue of continuous uniform, has no fragility and separates out mutually.
The soldered fitting that above soldering processes are formed is done performance test, is mainly hot strength test and bend test.Joint tensile strength is as shown in table 1, and when test temperature is during at 900 ℃, strength of joint can reach the more than 80% of strength of parent.In bend test, adopt the mode of three-point bending, record the maximum deflection angle that joint can bear and be greater than 150 °, joint has embodied good plastic deformation ability, as shown in Figure 2.
Table 1 soldered fitting hot strength
As can be seen here, soldering high temperature alloy provided by the present invention is used without boron solder can be used for brazing deformation high temperature alloy GH3128, and strength of joint and plasticity all can reach instructions for use.
Inventor uses without boron solder 2, soldering high temperature alloy and uses without boron solder 3, soldering high temperature alloy and use without boron solder 4 brazing deformation high temperature alloy GH3128 with same method of testing proof soldering high temperature alloy, and strength of joint and plasticity all can reach instructions for use.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. a soldering high temperature alloy is used without boron solder, it is characterized in that comprising: Mn, Ni, Co, Cu, wherein Mn accounts for the 11%-16% of described soldering high temperature alloy without boron solder gross weight, Ni accounts for the 20%-25% of described soldering high temperature alloy without boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 4.5%-5.5% of boron solder gross weight, and surplus is Cu.
2. soldering high temperature alloy is used without boron solder as claimed in claim 1, it is characterized in that comprising: Mn, Ni, Co, Cu, wherein Mn accounts for the 13%-15% of described soldering high temperature alloy without boron solder gross weight, Ni accounts for the 24%-25% of described soldering high temperature alloy without boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 4.5%-5.5% of boron solder gross weight, and surplus is Cu.
3. soldering high temperature alloy is used without boron solder as claimed in claim 1, it is characterized in that comprising: Mn, Ni, Co, Cu, wherein Mn accounts for described soldering high temperature alloy and uses without 15% of boron solder gross weight, Ni accounts for described soldering high temperature alloy and uses without 25% of boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 5% of boron solder gross weight, and surplus is Cu.
4. soldering high temperature alloy is used without boron solder as claimed in claim 1, it is characterized in that comprising: Mn, Ni, Co, Cu, wherein Mn accounts for described soldering high temperature alloy and uses without 11% of boron solder gross weight, Ni accounts for described soldering high temperature alloy and uses without 20% of boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 5% of boron solder gross weight, and surplus is Cu.
5. soldering high temperature alloy is used without boron solder as claimed in claim 1, it is characterized in that comprising: Mn, Ni, Co, Cu, wherein Mn accounts for described soldering high temperature alloy and uses without 11% of boron solder gross weight, Ni accounts for described soldering high temperature alloy and uses without 23% of boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 4.5% of boron solder gross weight, and surplus is Cu.
6. soldering high temperature alloy is used without boron solder as claimed in claim 1, it is characterized in that comprising: Mn, Ni, Co, Cu, wherein Mn accounts for described soldering high temperature alloy and uses without 16% of boron solder gross weight, Ni accounts for described soldering high temperature alloy and uses without 25% of boron solder gross weight, Co accounts for described soldering high temperature alloy and uses without 5.5% of boron solder gross weight, and surplus is Cu.
7. the welding procedure of soldering high temperature alloy without boron solder as claimed in claim 1, is characterized in that: brazing temperature is 1180 ℃, and during welding, at welded part plating nickel on surface, whole welding process is carried out under argon gas atmosphere protection of the environment.
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| CN201410337590.7A CN104128714B (en) | 2014-07-15 | 2014-07-15 | A kind of soldering high temperature alloy is used without boron solder |
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| CN201410337590.7A CN104128714B (en) | 2014-07-15 | 2014-07-15 | A kind of soldering high temperature alloy is used without boron solder |
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| CN104128714B CN104128714B (en) | 2016-04-06 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106041365A (en) * | 2016-08-19 | 2016-10-26 | 江苏科技大学 | Brazing filler metal and process for brazing molybdenum-rhenium alloy |
| CN107716933A (en) * | 2017-10-23 | 2018-02-23 | 江西瑞曼增材科技有限公司 | A kind of interface purification method of the wear-resisting antioxidant coating of single crystal super alloy |
| CN109594073A (en) * | 2018-12-12 | 2019-04-09 | 江苏阳明船舶装备制造技术有限公司 | Copper alloy surface wear-resistant coating and preparation method are prepared with CuMnCo |
| CN110732801A (en) * | 2019-11-05 | 2020-01-31 | 西北有色金属研究院 | Cu-Ni-Mn alloy solder powder and its preparing process |
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| US3197859A (en) * | 1965-02-09 | 1965-08-03 | Coast Metals Inc | Methods of brazing |
| JPS548139A (en) * | 1977-06-21 | 1979-01-22 | Mitsubishi Metal Corp | Soldering material |
| JP2627090B2 (en) * | 1989-12-12 | 1997-07-02 | 株式会社小松製作所 | Bonded body of boride ceramics and metal-based structural member and bonding method |
| CN1799760A (en) * | 2005-01-05 | 2006-07-12 | 罗成林 | Copper based brazing alloy |
| CN101954551A (en) * | 2010-11-02 | 2011-01-26 | 山东大学 | Brazing filler metal and process for welding molybdenum-copper alloy and Austenitic stainless steel |
| CN102069253A (en) * | 2010-12-29 | 2011-05-25 | 哈尔滨电机厂有限责任公司 | Water joint and connecting block brazing process for water circulation system of water-cooling steam turbine generator |
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2014
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Patent Citations (6)
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| US3197859A (en) * | 1965-02-09 | 1965-08-03 | Coast Metals Inc | Methods of brazing |
| JPS548139A (en) * | 1977-06-21 | 1979-01-22 | Mitsubishi Metal Corp | Soldering material |
| JP2627090B2 (en) * | 1989-12-12 | 1997-07-02 | 株式会社小松製作所 | Bonded body of boride ceramics and metal-based structural member and bonding method |
| CN1799760A (en) * | 2005-01-05 | 2006-07-12 | 罗成林 | Copper based brazing alloy |
| CN101954551A (en) * | 2010-11-02 | 2011-01-26 | 山东大学 | Brazing filler metal and process for welding molybdenum-copper alloy and Austenitic stainless steel |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106041365A (en) * | 2016-08-19 | 2016-10-26 | 江苏科技大学 | Brazing filler metal and process for brazing molybdenum-rhenium alloy |
| CN107716933A (en) * | 2017-10-23 | 2018-02-23 | 江西瑞曼增材科技有限公司 | A kind of interface purification method of the wear-resisting antioxidant coating of single crystal super alloy |
| CN107716933B (en) * | 2017-10-23 | 2019-05-03 | 江西瑞曼增材科技有限公司 | A kind of interface purification method of the wear-resisting antioxidant coating of single crystal super alloy |
| CN109594073A (en) * | 2018-12-12 | 2019-04-09 | 江苏阳明船舶装备制造技术有限公司 | Copper alloy surface wear-resistant coating and preparation method are prepared with CuMnCo |
| CN110732801A (en) * | 2019-11-05 | 2020-01-31 | 西北有色金属研究院 | Cu-Ni-Mn alloy solder powder and its preparing process |
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| CN104128714B (en) | 2016-04-06 |
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