CN104126334A - Resin composition for plating resist, multilayer printed wiring board, and method for producing multilayer printed wiring board - Google Patents
Resin composition for plating resist, multilayer printed wiring board, and method for producing multilayer printed wiring board Download PDFInfo
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- CN104126334A CN104126334A CN201280069804.6A CN201280069804A CN104126334A CN 104126334 A CN104126334 A CN 104126334A CN 201280069804 A CN201280069804 A CN 201280069804A CN 104126334 A CN104126334 A CN 104126334A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/7806—Nitrogen containing -N-C=0 groups
- C08G18/7818—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups
- C08G18/7831—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups containing biuret groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
The present invention provides a multilayer printed wiring board having a partial through hole formed by dividing a through hole, in which the partial through hole can be formed readily and accurately on the basis of an intended design. The multilayer printed wiring board comprises electrically conductive layers each having a circuit pattern formed thereon and insulating layers, wherein the electrically conductive layers and the insulating layers are laminated in an alternating sequence and the electrically conductive layers are electrically connected to each other through a through hole, said multilayer printed wiring board being characterized in that the through hole comprises a plating resist part that is arranged between one of the electrically conductive layers and one of the insulating layers both of which are exposed to an opening of a through hole and/or between the insulating layers and a plated part that is formed in an exposed region other than the plating resist part, wherein the plating resist part is formed by a cured product of a plating resist resin composition comprising an epoxy resin, an isocyanate compound and a non-electrically-conductive filler.
Description
Technical field
The present invention relates to multilayer board, particularly relate to the multilayer board with partial through holes through hole being split to form by the part resistance plating agent in through hole.
Background technology
In printed circuit board (PCB), according to circuit design, be formed on the surperficial or surperficial and inner of insulated substrate for the conductive pattern between link by printing, and then electronic unit is configured in the position of regulation and carries out soldering.In recent years, due to the miniaturization of the electronic products such as mobile phone, portable electric terminal, PC, require the densification of the printed circuit board (PCB) using in these electronic product inside.
About multilayer board, there is the insulating barrier that the resin of insulating properties forms and the alternately laminated multilayer board forming of conductor layer (wiring) that is printed with circuit pattern in order to tackle the complicated of the rising of packing density of parts and wiring, to serve as reasons.Multiple conductor layers utilize through hole to connect, and aforementioned through-hole connects interlayer and uses conductive material plating.Through hole, by stacked insulating barrier and conductor layer and implement plating after with perforates such as drill bits and form, carries out plating to through hole entirety with conductive material by this plating.
When plating through hole entirety, exist in the situation of the part of not wishing conductor layer connection, worry this part of not wishing connection also hinders signal transmission maintainability with conductive material plating.In addition,, in order to reach the more complicated circuit pattern of realization by partitioning of via, studied disconnected portion for conductor layer is set in through hole (part of undesired signal transmission) and formed resistance plating portion.
For example, a kind of multilayer board is disclosed in patent documentation 1, it is the multilayer board that possesses the inferior composite construction with the non-conductive dielectric layer clamping in conductive layer, conductive layer comprises the gap that is filled with resistance plating agent, through hole connects this resistance plating agent, at the part plating conductive material that does not hinder plating agent, thereby form divided through-hole structure.
In above-mentioned multilayer board, in a planned way make more than 1 space in through-hole structure, thereby stop the setting of conductive material, result can only be defined in the setting of the conductive material in through-hole structure the region of the transmission that needs the signal of telecommunication.In addition, according to specific execution mode, by through-hole structure being divided into physically-isolated part, thereby can significantly improve the winding performance of pattern or the wiring density of the design of tellite, the each several part via that its use is cut apart, physically-isolated, can be by the signal electrical connection of multiple layer relevant to this specific part.
In addition, the resistance plating agent using in the formation as the multilayer board of patent documentation 1, can list the hydrophobicity insulating material such as organic siliconresin, polyvinyl resin, fluorocarbon resin, polyurethane resin, acrylic resin.Utilize the hydrophobicity of such resistance plating agent to prevent the accumulation of catalyst core (crystal seed).
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Application Publication 2008-532326 communique
Summary of the invention
the problem that invention will solve
But, in patent documentation 1, record, prevented the accumulation of catalyst core (crystal seed) although utilize the hydrophobicity of resistance plating agent, cannot fully prevent from piling up, need in the time producing a small amount of accumulation, utilize post-processing operation to remove relict sediment.Therefore, the resistance plating agent in hole is required to further improvement.
The object of the present invention is to provide a kind of resistance plating agent resin combination, it is for making the multilayer board with the partial through holes that through hole is split to form, and this partial through holes can accurately form according to design.
In addition, the object of the present invention is to provide a kind of multilayer board, it is the multilayer board with the partial through holes that through hole is split to form, and this partial through holes can easily and according to design accurately form.
And then, the object of the present invention is to provide the manufacture method of above-mentioned multilayer board.
for the scheme of dealing with problems
The inventor etc. further investigate in order to address the above problem, found that and can utilize the resistance plating agent resin combination using in following multilayer board and use the multilayer board of said composition to solve the problems referred to above, thereby completed the present invention.
; the present invention is a kind of resistance plating agent resin combination; it is characterized in that; be used to form resistance plating portion; aforementioned resistance plating portion is arranged at least 1 interlayer in the middle of interlayer and the insulating barrier interlayer each other of conductor layer in the conductor layer of circuit pattern shape and the alternately laminated multilayer board forming of insulating barrier, that expose with peristome at through hole and insulating barrier, and aforementioned resistance plating agent comprises epoxy resin, isocyanate compound and non-conductive filler with resin combination; And
A kind of multilayer board, it is the conductor layer of circuit pattern shape and insulating barrier is alternately laminated and be situated between by the multilayer board of through hole lead-through conductors interlayer, it is characterized in that, through hole has: the resistance plating portion that is arranged at least 1 interlayer in the middle of interlayer and the insulating barrier interlayer each other of the conductor layer that exposes with peristome at through hole and insulating barrier; And be formed at the plating portion of exposing region beyond resistance plating portion, and resistance plating portion is formed with the solidfied material of resin combination by above-mentioned resistance plating agent.
Enumerate below the plating of the resistance for multilayer board agent resin combination of the present invention and using the optimal way of the multilayer board of said composition.
(1) isocyanate compound is blocked isocyanate compounds.Due to excellent storage stability, therefore operability improves.
(2) non-conductive filler is inorganic filler.As inorganic filler, be preferably silica (silica) and titanium dioxide.Can be used alone or in combination.Be particularly preferably ball filler.Can carry out height with filler fills.Can obtain thus the effect that thermal endurance improves.
(3) resistance plating agent is with in resin combination, contains epoxy resin and isocyanate compound taking the isocyanate equivalent number of epoxy 1 equivalent with respect to epoxy resin, isocyanate compound as 0.5～2 ratio.Resistance to plating further improves.
(4) solid constituent 100 parts by volume with resin combination with respect to resistance plating agent, the content of non-conductive filler is 15～60 parts by volume.Resistance to plating further improves.
(5), in multilayer board, plating is copper plating.
(6) in multilayer board, through hole is plated Region Segmentation.
(7), in multilayer board, the insulating barrier that is provided with the interlayer of resistance plating portion is prepreg.
And then, the invention still further relates to a kind of manufacture method of multilayer board, it is characterized in that, this manufacture method comprises:
The operation of multiple stratification, form duplexer, in aforementioned duplexer, conductor layer and the insulating barrier of circuit pattern shape are alternately laminated, at least 1 interlayer in the middle of the conductor layer exposing with peristome at through hole and the interlayer of insulating barrier and insulating barrier interlayer is each other provided with the resistance plating portion being formed with resin combination by aforementioned resistance plating agent of the present invention
Multiple layers to the aforementioned conductor layer that comprises aforementioned circuit pattern-like and the resistance plating portion being arranged between aforementioned layers carry out hot pressing, thereby carry out the operation of multiple stratification;
For the circuit board of multiple stratification, utilize drill bit or laser to form the operation of through hole peristome to connect the mode of resistance plating portion;
Through hole is carried out to the operation of desmearing processing with peristome; And
The through hole of desmearing processing is implemented to the operation of plating with peristome.
the effect of invention
About multilayer board of the present invention, at least 1 interlayer in the conductor layer (wiring) of circuit pattern shape and the interlayer of interlayer insulating film and the insulating barrier interlayer each other of through hole arranges resistance plating portion, and resistance plating portion is formed by the solidfied material of the resistance plating agent resin combination that comprises epoxy resin, isocyanate compound and non-conductive filler.For the resistance plating portion of this spline structure, it gets rid of the resistance to plating excellence of plating, therefore can easily and accurately form plating in the region (needing the region of the transmission of the signal of telecommunication) of expecting.Therefore, multilayer board of the present invention can be called the multilayer board that is accurately formed with partial through holes according to design.
In addition, by making partial through holes, thereby can suppress to be present in the harmful effect (stub effect (stub effect)) to signal of unwanted conductor part in through hole.
Brief description of the drawings
Fig. 1 is the schematic cross-section that the execution mode of the forming process of the through hole of the multilayer board that uses resistance plating agent resin combination of the present invention is shown.
Fig. 2 is the schematic cross-section that another execution mode of the forming process of the through hole of the multilayer board that uses resistance plating agent resin combination of the present invention is shown.
Fig. 3 is the schematic cross-section that another execution mode of the forming process of the through hole of the multilayer board that uses resistance plating agent resin combination of the present invention is shown.
Fig. 4 illustrates until the schematic cross-section in the way of the forming process of through hole of existing multilayer board.
Fig. 5 is the follow-up schematic cross-section that the forming process of through hole of the existing multilayer board of above-mentioned Fig. 4 is shown.
Fig. 6 is the schematic cross-section that the manufacturing process of the existing multilayer board that utilizes lamination method is shown.
Embodiment
About multilayer board of the present invention, conductor layer and the insulating barrier of circuit pattern shape are alternately laminated, be formed with through hole for lead-through conductors interlayer, and at least 1 interlayer in interlayer and the insulating barrier interlayer each other of conductor layer and insulating barrier is provided with resistance plating portion.And this resistance plating portion is formed with the solidfied material of resin combination by specific resist of the present invention.
In the present invention, conductor layer and insulating barrier are alternately laminated, and conductor layer forms with circuit pattern shape, thereby form wiring.,, for the insulating barrier of conductor layer that is provided with circuit pattern shape, exist and there is the part of conductor layer and do not there is the part that the insulating barrier of conductor layer exposes.Therefore, through hole is with in peristome, as this part of exposing, there are interlayer and these two interlayers of insulating barrier interlayer each other of conductor layer and insulating barrier, therefore, conventionally at two interlayers, resistance plating portion is set, but also can be only in the interlayer setting of conductor layer and insulating barrier, can also be only in insulating barrier interlayer setting each other.
Resistance plating agent of the present invention comprises epoxy resin, isocyanate compound and non-conductive filler with resin combination.
An example of the execution mode of resistance plating agent resin combination of the present invention is described with Fig. 1, Fig. 2 and Fig. 3.The cross section of the conductor layer of circuit pattern shape shown in these figure (being wiring portion) and the alternately laminated part forming of insulating barrier.
As shown in Fig. 1 (A), circuit board 13A and circuit board 13B are clipped to prepreg 14 and carry out hot pressing, thereby make the multilayer board 16 as shown in Fig. 1 (B), aforementioned circuit plate 13A has conductor layer 11A, the 11B of 2 circuit pattern shapes and insulating barrier 12A therebetween, aforementioned circuit plate 13B has conductor layer 11C, the 11D of 2 circuit pattern shapes and insulating barrier 12B therebetween, only on insulating barrier 12B, is provided with the resistance plating portion 15 by resistance plating agent resin combination of the present invention is for example coated with, is solidified to form.This prepreg 14 has the function of conductor layer insulation, is therefore equivalent to insulating barrier of the present invention.
Then,, as shown in Fig. 1 (C), form peristome for through hole (vestige that drill bit 17 connects) with drill bit 17.Then,, after implementing desmearing processing, implement chemical plating/electro-coppering, thereby form through hole 18 as shown in Fig. 1 (D).Now, owing to not implementing plating to resistance plating agent of the present invention is solidified to the resistance plating portion 15 forming with resin combination, therefore through hole is divided at this, can forming section through hole.Partly (plating) through hole refer to utilize the resistance plating portion in through hole of being present in by through hole physical segmentation through hole.By making partial through holes, can suppress to be present in the harmful effect (stub effect) to signal of unwanted conductor part in through hole.
In addition, as shown in Fig. 2 (A), substrate 23A and substrate 23B are clipped to prepreg 24 and carry out hot pressing, thereby make the multilayer board 26 as shown in Fig. 2 (B), aforesaid base plate 23A has conductor layer 21A, the 21B of 2 circuit pattern shapes and insulating barrier 22A therebetween, aforesaid base plate 23B has conductor layer 21C, the 21D of 2 circuit pattern shapes and insulating barrier 22B therebetween, only on conductor layer 21C, is provided with the resistance plating portion 25 by resistance plating agent resin combination of the present invention is for example coated with, is solidified to form.
Or, also can be as shown in Figure 3, on the surface of the conductor layer 21B of substrate 23A, insulating barrier 29 is further set, make this insulating barrier 29 relative with the resistance plating portion 25 on substrate 23B of being arranged at, do not use prepreg 24 ground to carry out hot pressing to 2 substrates.
Then,, as shown in Fig. 2 (C), form peristome for through hole (vestige that drill bit 27 connects) with drill bit 27.Then,, after implementing desmearing processing, implement chemical plating/electro-coppering, thereby form through hole 28 as shown in Fig. 2 (D).Now, owing to not implementing plating to resistance plating agent of the present invention is solidified to the resistance plating portion 25 forming with resin combination, therefore through hole is divided at this, can forming section through hole.Partly (plating) through hole refer to utilize the resistance plating portion in through hole of being present in by through hole physical segmentation through hole.By partial through holes is set, not only can suppress to be present in the harmful effect (stub effect) to signal of unwanted conductor part in through hole, and can easily and accurately form plating in the region (needing the region of the transmission of the signal of telecommunication) of expecting.(C) of Fig. 3 in Fig. 3, (D) of Fig. 3 also similarly implement with above-mentioned.
On the other hand, as shown in Fig. 4 (A), all the time, carry out hot pressing by uncoated resistance plating agent of the present invention is clipped to prepreg 34 each other with the substrate (have the substrate 33A of conductor layer 31A, the 31B of 2 circuit pattern shapes and insulating barrier 32A therebetween and have conductor layer 31C, the 31D of 2 circuit pattern shapes and the substrate 33B of insulating barrier 32B therebetween) of resin combination, thereby make the existing multilayer board 36 as shown in Fig. 4 (B).Then,, as shown in Fig. 4 (C), form opening for through hole (vestige that drill bit 37 connects) with drill bit 37, after implementing desmearing processing, implement chemical plating/electro-coppering, thereby as Fig. 5 (D) as shown in plating through hole peristome entirety, formation through hole 38.In such situation, wiring significantly reduces, and operation also becomes simply, therefore can make reduce man-hour, on the other hand, is difficult to the only interlayer in specific adjacency and connects.Therefore, as shown in Fig. 5 (E), to be present in the signal (inhibition of stub effect) of the unwanted conductor part in through hole in order blocking, need to use back drill 39 to remove this unwanted conductor part.(F) of Fig. 5 is for having removed the sectional view of unwanted conductor part with back drill.
In addition, as shown in Fig. 6 (A), Fig. 6 (B), can be stacked by successively repeating, " lamination method " of Drilling operation, wiring processing etc. make multilayer board.But, in such situation, can form the only connection of the interlayer of specific adjacency, on the other hand, it is complicated that operation becomes, and therefore needs a large amount of man-hours.
Below, each inscape is specifically described.
< resistance plating agent resin combination >
Resistance plating agent of the present invention is the resin combination that comprises epoxy resin, isocyanate compound and non-conductive filler with resin combination.Detailed mechanism might not be clear and definite, but can think that isocyanate compound can hinder adhering to of the catalyst core such as palladium required in plating, thus the effect of performance resistance plating agent.
Resistance plating agent must comprise epoxy resin and isocyanate compound with resin combination.The firmly cross-linked structure being formed by epoxy resin and isocyanate compound is effective to the raising of resistance to resistance plating agent.As epoxy resin, for example, can list cresols phenolic varnish type resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenol novolak type epoxy resin, alkylphenol phenolic resin varnish type epoxy resin, united phenol-type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, phenols and there is epoxides, triglycidyl isocyanurate, alicyclic epoxy resin of the condensation product of the aromatic aldehyde of phenol hydroxyl etc.
As isocyanate compound, can use have 1 NCO monoisocyanates compound, there is the known isocyanate compounds such as the polyisocyanates of more than 2 NCO.From improving the obdurability of curability and the cured film that obtains of composition, the crackle while preventing cold cycling produces, and then gives stable on heating viewpoint and set out, preferably polyisocyanate compound.In addition, in the present invention, also preferably use blocked isocyanate compounds.By the use of blocked isocyanate compounds, excellent storage stability, therefore operability improves.
As polyisocyanate compound, for example, can use aromatic polyisocyanate, aliphatic polyisocyante or ester ring type polyisocyanates.
As aromatic polyisocyanate, for example, can list 4,4 '-methyl diphenylene diisocyanate, 2,4-toluene di-isocyanate(TDI), 2,6-toluene di-isocyanate(TDI), naphthalene-1,5-vulcabond, O-phthalic support vulcabond, an xylylene diisocyanate, MDI and 2,4-toluene diisocyanate dimer.
As aliphatic polyisocyante, for example, can list tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethyl hexamethylene diisocyanate, 4,4-di-2-ethylhexylphosphine oxide (cyclohexyl isocyanate) and IPDI.
As the concrete example of ester ring type polyisocyanates, can list bicycloheptane triisocyanate.What in addition, can list the isocyanate compound that previously listed adds zoarium, biuret body (for example 24A-100, Asahi Kasei Corporation manufactures) and isocyanuric acid ester body (for example TPA-100, Asahi Kasei Corporation manufactures).Such ester ring type polyisocyanates is because the resistance to plating of eliminating plating is good, therefore preferred.
The blocked isocyanate base containing in blocked isocyanate compounds is that NCO is by the group of and temporary transient passivation protected with reacting of end-capping reagent.While being heated to set point of temperature, this end-capping reagent departs from, and generates NCO.
As blocked isocyanate compounds, use the addition reaction product of isocyanate compound and isocyanate-terminated dose.As the isocyanate compound that can react with end-capping reagent, can list above-mentioned polyisocyanate compound etc.
As isocyanate-terminated dose, for example, can list the phenol such as phenol, cresols, xylenol, chlorophenol and ethyl-phenol is end-capping reagent; The lactams such as epsilon-caprolactams, δ-valerolactam, butyrolactam and azetidinone are end-capping reagent; Ethyl acetoacetate and acetylacetone,2,4-pentanedione isoreactivity methylene base system end-capping reagent; The alcohol such as methyl alcohol, ethanol, propyl alcohol, butanols, amylalcohol, glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, benzylic ether, methyl glycollate, butyl glycolate, diacetone alcohol, methyl lactate and ethyl lactate are end-capping reagent; The oximes such as formaldoxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, DAM, hexamethylene oxime are end-capping reagent; The mercaptan such as butyl mercaptan, hexyl mercaptan, tert-butyl mercaptan, benzenethiol, methylbenzene phenyl-sulfhydrate, ethyl thiophenol are end-capping reagent; The acid amides such as acetamide, benzamide is end-capping reagent; The imide series such as succinimide and maleimide end-capping reagent; The amine such as dimethylaniline, aniline, butylamine, dibutyl amine are end-capping reagent; The imidazoles such as imidazoles, 2-ethyl imidazol(e) are end-capping reagent; The imines such as methylene imine and propylidene imines are end-capping reagent; The pyrazoles such as dimethyl pyrazole are end-capping reagent; The maleates such as diethyl maleate are end-capping reagent etc.
As the commercially available product of blocked isocyanate compounds, for example, can list Sumidule (registered trade mark) BL-3175, BL-4165, BL-1100, BL-1265, Desmodur (registered trade mark) TPLS-2957, TPLS-2062, TPLS-2078, TPLS-2117, Desmosome 2170, Desmosome 2265 (be Sumitomo Bayer Urethane Co., Ltd. manufactures), CORONATE (registered trade mark) 2512, CORONATE 2513, CORONATE 2520 (being Nippon Polyurethane Industry Co., Ltd. manufactures), B-830, B-815, B-846, B-870, B-874, B-882 (be Mitsui Takeda Chemical Co., Ltd. manufactures), TPA-B80E, 17B-60PX, E402-B80T (be Asahi Kasei Chemicals Co., Ltd. manufactures), TRIXENE BI 7982, TRIXENE BI 7950, TRIXENE BI 7951, TRIXENE BI 7960, TRIXENE BI 7961 (manufacture of Baxeneden Chemicals Limited).It should be noted that, Sumidule BL-3175, BL-4265 are the materials that uses the first and second oximes to obtain as end-capping reagent.
Such isocyanate compound can be used singly or in combination two or more.
For above-mentioned epoxy resin and isocyanate compound in resin combination for resistance plating agent, preferably contain taking the isocyanate equivalent number of epoxy 1 equivalent with respect to epoxy resin, isocyanate compound as 0.5～2 ratio.More preferably 0.8～1.5 ratio, is particularly preferably 1.0～1.2 ratio.Aforementioned proportion is prescribed a time limit lower than lower, and resistance to plating becomes insufficient, prescribes a time limit higher than upper, and it is really up to the mark that epithelium becomes, and the tack to base material and durability reduce.
In addition,, while using the heat-curing resins such as epoxy resin, isocyanate compound, preferably contain curing agent.As curing agent, can use 2-ethyl-4-methylimidazole (2E4MZ), 2-phenylimidazole (2PZ), the imidazoles such as 2 phenyl 4 methyl 5 hydroxy methylimidazole (2P4MHZ) are curing agent, diethylenetriamine, triethylene tetramine, TEPA, five ethene hexamines, m-xylene diamine, IPD, norborene diamines, 1, the two aminomethyl cyclohexanes of 3-, the amine such as N-aminoethyl piperazine are curing agent, polyamide, vinylphenol, aralkyl-type phenol resin, phenol phenyl aralkyl resin, the phenol such as phenol biphenyl aralkyl resin are curing agent, phthalic anhydride, tetrabydrophthalic anhydride, hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyl carbic anhydride, dodecyl succinic anhydride, chlorendic anhydride, PMA acid anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bis (trimellitic anhydride), the acid anhydrides such as methylcyclohexene tetracarboxylic anhydride are the known curing agent such as curing agent.But such curing agent need to consider that the reactivity of the isocyanate compound of using in the present invention and consumption use, and preferably do not use conventionally.
In addition, the content of above-mentioned curing agent is preferably 0.5～20 mass parts with respect to the above-mentioned heat-curing resin composition of 100 mass parts.During lower than 0.5 mass parts, there is the curing inadequate situation of resin combination in the compounding amount of curing agent, also exists and can not obtain and the situation of measuring corresponding effect even if compounding exceedes 20 mass parts.
Resistance plating agent of the present invention must contain non-conductive filler with resin combination.It is 10 that non-conductive filler of the present invention preferably has specific insulation (JIS K 6911)
10more than Ω cm non-conductive.
As the material of such filler, can be that inorganic matter can be also organic substance, conventionally use inorganic matter.As inorganic filler, can list silica (silica), amorphous silica, talcum, clay, mica powder, barium sulfate, calcium carbonate, magnesium carbonate, barium titanate, aluminium oxide, aluminium hydroxide, titanium dioxide etc.
As organic filler, can list organosilicon powder, nylon powder, fluororesin powder etc.
In addition, spherical filler can carry out high filling and not damage black mobility, therefore preferred.
As ball filler, preferably spherical silicon dioxide (also referred to as spherical silica), spherical alumina (also referred to as spherical alumina) or spherical titanium dioxide.By being used in combination spherical silicon dioxide and spherical titanium dioxide, thereby improve resistance to plating.
Spherical silicon dioxide is as long as just can be for any for can be used as the spherical silicon dioxide that the filler of electronic material purposes uses.Also can be the spherical silicon dioxide that processed with silane coupler on surface.
Ball filler is not as long as for spherical, be defined as perfect ball.As suitable ball filler, for example can list the sphericity of measuring is as described below more than 0.8 filler, but is not limited to this.
Sphericity is measured as described below.Take pictures with SEM, with the area and perimeter of the particle observed by it by (sphericity)={ 4 π × (area) ÷ (girth)
2the value that calculates calculates.Particularly, adopt the mean value that uses image processing apparatus to measure for 100 particles.
Manufacture method to spherical silicon dioxide particle, spherical alumina is not particularly limited, and can apply the known method of those skilled in the art.For example, can pass through VMC (gasified metal burning; Vaporized Metal Combustion) method makes Si powder or aluminium powder burn to manufacture.VMC method refers to following method: in the atmosphere that comprises oxygen, utilize burner to form chemical flame, the metal dust of a part that forms target oxide particle is put in this chemical flame with the amount of the level of formation dust cloud, cause detonation, thereby obtain the method for oxide particle.
As commercially available spherical silicon dioxide, can list SO series, the HPS series (HPS-0500, HPS-1000, HPS3500 etc.) that Toagosei Co., Ltd manufactures etc. that Admatechs Company Limited manufactures.
Above-mentioned spherical alumina is as long as just can be for any for can be used as the spherical alumina that the filler of electronic material purposes uses.
As commercially available spherical alumina, can list the AO series of Admatechs Company Limited manufacture, TC-975c, the ALUNABEADS/CB series that Showa Denko K. K manufactures etc. that Admatechs Company Limited manufactures.
The average grain diameter of filler is that 25 μ m are following, more preferably 10 μ m are following, more preferably 3 μ m are desirable below.Solid constituent 100 parts by volume with respect to resistance plating agent of the present invention with resin combination, the content of non-conductive filler is preferably 15～75 parts by volume.Be particularly preferably 15～60 parts by volume.The compounding amount of filler exceedes above-mentioned in limited time upper, and the folding resistance of curing overlay film reduces, and prescribes a time limit lower than lower, has the inadequate tendency of resistance to plating.
Above-mentioned resin combination can also contain solvent, diluent, curing accelerator, thickener, defoamer, levelling agent, coupling agent, fire retardant, Photoepolymerizationinitiater initiater etc. as required.
The thickness of resistance plating portion is generally 10～100 μ m, is preferably 50～100 μ m.
< through hole >
In multilayer board of the present invention, the mode that peristome for through hole (through hole before plating) connects the resistance plating portion forming on the conductor layer of circuit pattern shape and/or on insulating barrier forms.Therefore, resistance plating portion is formed at interlayer and/or the insulating barrier interlayer each other of conductor layer and insulating barrier.By through hole is carried out to plating with peristome, thereby form through hole.As mentioned above, partial through holes utilizes resistance plating portion that through hole physical segmentation is formed.
About the method that forms resistance plating portion on the conductor layer at circuit pattern shape, be coated with or print by utilizations and resistance of the present invention is plated on the position of agent regulation on conductor layer with resin combination form composition film, heat it is dried, thereby carry out.Situation on insulating barrier too.As rubbing method, can use rolling method, spray-on process etc., as print process, can use silk screen print method, woodburytype etc.Heating conventionally 80～200 DEG C, preferably at 100～170 DEG C, carry out 5～60 minutes, preferably carry out 10～60 minutes.
The conductor layer > of < circuit pattern shape
Conductor layer in multilayer board of the present invention is the circuit pattern that utilizes the electric conductors such as copper, nickel, tin, gold or their alloy to form.The formation method of circuit pattern can be the method for any known, for example, can list the method for residues, additive process.
< insulating barrier >
Insulating barrier between the conductor layer of the circuit pattern shape in multilayer board of the present invention, as long as just can be made up of any materials as the insulating barrier of multilayer board, is preferably resin combination is solidified to the insulating barrier forming.Resin combination can be liquid, also can be sheet.
As the example of interlayer insulating film, can list FR-4, expoxy glass, polyimides glass, ceramic hydrocarbon, polyimide film, resin impregnated glass fibre, resin film, resin impregnated cushion material, KEVLAR, paper, be dispersed with the resin bed of nanometer powder.
In addition, as previously mentioned, prepreg also has by the function of conductor layer insulation, within being therefore also included within insulating barrier of the present invention.
Prepreg normally infiltrates after the varnish such as composition epoxy resin, bismaleimide-triazine resin composition, polyimide resin composition in the base materials such as glass cloth, be heated the dry sheet that its semi-solid preparation is formed, for example, can list Panasonic Electric Works Co., GEPL-190, the GHPL-830 etc. that R-1410A, R-5670 (K), R-1650D, R-1551 etc., the Mitsubishi Gas Chemical Co., Ltd that Ltd. manufactures manufactures, MCL-E-67, the MCL-I-671 etc. that Hitachi Chemical Co., Ltd. manufactures.
(core substrate)
Multilayer board of the present invention can have core substrate.Core substrate is the substrate that conduct is used to form the conductor layer of circuit pattern shape and the base plate of interlayer insulating film in multilayer board, is the substrate of bearing as the effect of heartwood.About the material of the substrate as core substrate, can enumerate the heat-curing resins such as the epoxy resin of sening as an envoy to and be infiltrated up in glass cloth etc. and make it solidify glass epoxide material of forming, pottery, metal core substrate etc.
(plating)
For multilayer board of the present invention, cover the part of through hole beyond the resistance plating agent of peristome by plating with conductive material.Plating is undertaken by chemical plating, also can further implement to electroplate thereafter according to expectation.The catalyst core of using as chemical plating, for example, can enumerate palladium, tin, silver, gold, platinum, copper and nickel or their combination, is preferably palladium.As chemical plating, can list electroless copper, chemical nickel plating, chemical plating nickel-tungsten, chemical plating stannum, chemical gilding etc., preferably electroless copper.The thickness of chemical plating is preferably 0.1～5 μ m.
The manufacture method > of < multilayer board
The manufacture method of multilayer board of the present invention is characterised in that, possess: the operation of multiple stratification by circuit board for example being clipped to epoxy prepreg (insulating barrier) hot pressing, described circuit board is that assigned position on the insulating barrier of the conductor layer that is formed with circuit pattern shape (wiring) (also comprising substrate) (conductor layer, insulating barrier or their both layers) has resistance plating agent resin combination of the present invention is coated with and solidifies the circuit board of the resistance plating portion forming; For the circuit board of multiple stratification, to connect the operation of the mode drill bit or the laser formation through hole peristome that hinder plating portion; Carry out the operation of desmearing processing; And the operation of enforcement plating.
(hot pressing)
Hot pressing can be undertaken by known method.Pressing conditions is preferably at 150～200 DEG C, 20～60Kg/cm
2.
(desmearing processing)
Desmearing processing can be undertaken by known method.For example, can carry out with the oxidant being formed by the aqueous solution of chromic acid, permanganate etc., in addition, can utilize oxygen plasma, CF
4process with hybrid plasma, the corona discharge etc. of oxygen.
Embodiment
Below, use embodiment to illustrate in greater detail the present invention.The present invention is not limited to following embodiment.
(preparation of resin combination)
According to following table 1 and table 2, with 3 rollers mills, each composition is carried out mixingly, obtain the resin combination of embodiment 1～14, comparative example 1～2.Numeral mass parts in table.
(evaluating making of substrate)
On the FR-4 substrate of full copper, utilize silk screen printing to be about the mode embodiment 1～14 of 50 μ m with the thickness of dried film, the resin combination of comparative example 1～2 carries out pattern printing, then, with hot air circulation type drying machine at 170 DEG C dry 60 minutes, thereby it is solidified, then, the FR-4 substrate of dried substrate and full copper is clipped to epoxy prepreg (Panasonic Electric Works Co., the R-1650D that Ltd. manufactures) and at 170 DEG C, carry out 60 minutes, pressure 20kg/cm
2hot pressing, last, carry out drill bit processing, form the through hole peristome of aperture 0.7mm, the test substrate of making embodiment 1～14, comparative example 1～2.
(desmearing treatment process)
For embodiment 1～14, the test substrate of comparative example 1～2, at the CIRCUPOSIT MLB Conditioner 211 as swelling solution, (Rohm and Haas Company manufactures, 200ml/l) and CIRCUPOSIT Z (Rohm and Haas Company manufacture, in mixed liquor 100ml/l), at 80 DEG C, flood 5 minutes, then, at the CIRCUPOSIT MLB Promoter213A as coarsening solution, (Rohm and Haas Company manufactures, 100ml/l) and CIRCUPOSIT MLB Promoter 213B (Rohm and Haas Company manufacture, in mixed liquor 150ml/l), at 80 DEG C, flood 10 minutes, finally, at the CIRCUPOSIT MLB Neutralizer216-2 as neutralizer, (Rohm and Haas Company manufactures, 200ml/l), at 50 DEG C, flood 5 minutes.
(electroless copper treatment process)
After desmearing is processed, as cleaning leveling (cleaner conditioner) operation, at Cleaner Security Gantt P500, (Atotech Company manufactures, 40ml/l), at 50 DEG C, flood 5 minutes, then, as pre-preg operation, at Pre-dip Neogant B, (Atotech Company manufactures, 20ml/l) and in the mixed liquor of sulfuric acid (1ml/l) at 25 DEG C, flood 1 minute, then, give operation as catalyst, at Activator Neogant 834 Conch, (Atotech Company manufactures, 40ml/l) and NaOH (4g/l), in the mixed liquor of boric acid (5g/l), at 35 DEG C, flood 5 minutes, then, as reduction operation, at Reducer Neogant WA, (Atotech Company manufactures, 5ml/l) and in the mixed liquor of boric acid (25g/l) at 25 DEG C, flood 1 minute, finally, as electroless copper operation, at Basic Solution Printgant MSK, (Atotech Company manufactures, 80ml/l) and Copper Solution Printgant MSK (Atotech Company manufacture, 40ml/l), (Atotech Company manufactures Reducer Cu, 14ml/l), (Atotech Company manufactures Stabilizer Printgant MSK, in mixed liquor 3ml/l), at 35 DEG C, flood 10 minutes, then at 100 DEG C, be dried 30 minutes with hot air circulation type drying machine.
(electro-coppering treatment process)
After electroless copper is processed, as pickling agent operation, at pickling Cleaner FR, (Atotech Company manufactures, 100ml/l) and in the mixed liquor of sulfuric acid (100ml/l) at 30 DEG C, flood 1 minute, then, as acid dip operation, in sulfuric acid (100ml/l), at 25 DEG C, flood 1 minute, finally, as copper sulphate electroplating work procedure, at copper sulphate (II) pentahydrate (80ml/l) and sulfuric acid (200ml/l), chlorine (50mg/l), (Atotech Company manufactures addition of C upracid HL, 10ml/l), (Atotech Company manufactures correction agent Cupracid GS, in mixed liquor 0.1ml/l), at 23 DEG C, flood 60 minutes (current density 1A/dm
2), then, use hot air circulation type drying machine to be dried 60 minutes at 150 DEG C.
(evaluation method)
After processing, electro-coppering on cross section, the cross section of substrate is ground, with the cross section of microscopic examination through-hole section, confirm that copper plating has the resin combination resistance plating portion (layer) of undirected embodiment 1～14, comparative example 1～2 to adhere to, and evaluates according to following determinating reference.In result shown in following table 1 and table 2.
(determinating reference)
Zero: the resistance plating portion in through hole is by conductive material plating, the part of non-resistance plating portion is by conductive material plating.
×: the resistance plating portion in through hole is by conductive material plating.
Table 1
Table 2
Remarks)
* 1:jER828 (Mitsubishi chemical Co., Ltd's manufacture), epoxide equivalent 184～194g/eq, proportion 1.17
* carbitol acetic acid esters dilution product (solid constituent 65 quality %), the proportion 1.28 of 2:HF-1M (phenol novolac resin bright and change into Co., Ltd. manufacture)
* 3:DURANATE TPA-100 (Asahi Chemical Corp's manufacture), isocyanate equivalent 179, proportion 1.16
* 4:DURANATE 24A-100 (Asahi Chemical Corp's manufacture), isocyanate equivalent 182, proportion 1.13
* 1-methoxy-2-propanol dilution product (solid constituent 70 quality %), isocyanate equivalent 477, the proportion 1.1 of 5:BI 7982 (blocked isocyanate (isocyanates: HDI biuret, end-capping reagent: dimethyl pyrazole), Baxenden Chemicals Limited manufacture)
* 6:SO-C5 (Admatechs Company Limited manufacture), spherical, average grain diameter 1.6 μ m, proportion 2.2
* 7:HIGILITE H-42M (Showa Denko K. K's manufacture), spherical, average grain diameter 0.8～1.2 μ m, proportion 2.4
* 8:DAW3 (Deuki Kagaku Kogyo Co., Ltd's manufacture), spherical, average grain diameter 4 μ m, proportion 3.9
* 9:CR-58 (Ishihara Sangyo Kaisha, Ltd.'s manufacture), spherical, average grain diameter 0.28 μ m, proportion 3.9
* 10: μ-POWDER3N (standby northern efflorescence Industrial Co., Ltd manufacture), spherical, average grain diameter 1.2 μ m, proportion 2.7
* 11:B-30 (Sakai Chemical Industry Co., Ltd. manufacture), spherical, average grain diameter 0.3 μ m, proportion 4.5
* 12:SG-2000 (Japanese talcum Co., Ltd. manufacture), spherical, average grain diameter 1 μ m, proportion 2.7
utilizability in industry
The multilayer board that the present invention can provide partial through holes can be easily and accurately form according to design.
description of reference numerals
11A, 11B, 21A, 21B, 31A, 31B conductor layer
12A, 12B, 19,22A, 22B, 32A, 32B insulating barrier
13A, 13B, 23A, 23B, 33A, 33B substrate
14,24,34 prepregs
15,25 resistance plating portions
16,26,30,36 printed circuit board (PCB)s
17,27,37,39 drill bits
18,28,38 through hole peristomes
Claims (12)
1. a resistance plating agent resin combination, it is characterized in that, be used to form resistance plating portion, described resistance plating portion is arranged at least 1 interlayer in the middle of interlayer and the insulating barrier interlayer each other of conductor layer in the conductor layer of circuit pattern shape and the alternately laminated printed circuit board (PCB) forming of insulating barrier, that expose with peristome at through hole and insulating barrier
Described resistance plating agent comprises epoxy resin, isocyanate compound and non-conductive filler with resin combination.
2. resistance plating agent resin combination according to claim 1, wherein, described isocyanate compound is blocked isocyanate compounds.
3. resistance plating agent resin combination according to claim 1 and 2, wherein, described non-conductive filler is inorganic filler.
4. resistance plating agent resin combination according to claim 3, wherein, described inorganic filler is for being selected from least a kind in silica (silica) and titanium dioxide.
5. according to the resistance plating agent resin combination described in any one in claim 1～4, wherein, described non-conductive filler is ball filler.
6. according to the resistance plating agent resin combination described in any one in claim 1～5, wherein, with in resin combination, contain epoxy resin and isocyanate compound taking the isocyanate equivalent number of epoxy 1 equivalent with respect to epoxy resin, isocyanate compound as 0.5～2 ratio in described resistance plating agent.
7. according to the resistance plating agent resin combination described in any one in claim 1～6, wherein, use solid constituent 100 parts by volume of resin combination with respect to described resistance plating agent, the content of non-conductive filler is 15～60 parts by volume.
8. a multilayer board, it is the conductor layer of circuit pattern shape and insulating barrier is alternately laminated and be situated between by the multilayer board of through hole lead-through conductors interlayer, it is characterized in that, through hole has: the resistance plating portion that is arranged at least 1 interlayer in the middle of interlayer and the insulating barrier interlayer each other of the conductor layer that exposes with peristome at through hole and insulating barrier; And be formed at the plating portion of exposing region beyond resistance plating portion, and resistance plating portion is formed with the solidfied material of resin combination by the resistance plating agent described in any one in claim 1～7.
9. multilayer board according to claim 8, wherein, plating is copper plating.
10. multilayer board according to claim 8 or claim 9, wherein, the plating region of through hole is divided.
Multilayer board in 11. according to Claim 8～10 described in any one, wherein, the insulating barrier that is provided with the interlayer of resistance plating portion is prepreg.
The manufacture method of 12. 1 kinds of multilayer boards, is characterized in that, this manufacture method comprises:
The operation of multiple stratification, form duplexer, in described duplexer, conductor layer and the insulating barrier of circuit pattern shape are alternately laminated, at least 1 interlayer in the middle of the conductor layer exposing with peristome at through hole and the interlayer of insulating barrier and insulating barrier interlayer is each other provided with the resistance plating portion being formed with resin combination by the resistance plating agent described in any one in claim 1～7
Multiple layer to the described conductor layer that comprises described circuit pattern shape and the resistance plating portion that is arranged at described interlayer carry out hot pressing, thereby carry out multiple stratification;
For the circuit board of multiple stratification, utilize drill bit or laser to form the operation of through hole peristome to connect the mode of resistance plating portion;
Through hole is carried out to the operation of desmearing processing with peristome; And
Desmearing through hole after treatment is implemented to the operation of plating with peristome.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012029081A JP2013168395A (en) | 2012-02-14 | 2012-02-14 | Resin composition for plating resist, multilayer printed wiring board, and manufacturing method of multilayer printed wiring board |
| JP2012-029081 | 2012-02-14 | ||
| PCT/JP2012/079754 WO2013121641A1 (en) | 2012-02-14 | 2012-11-16 | Resin composition for plating resist, multilayer printed wiring board, and method for producing multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104126334A true CN104126334A (en) | 2014-10-29 |
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|---|---|---|---|
| CN201280069804.6A Pending CN104126334A (en) | 2012-02-14 | 2012-11-16 | Resin composition for plating resist, multilayer printed wiring board, and method for producing multilayer printed wiring board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013168395A (en) |
| KR (1) | KR20140125356A (en) |
| CN (1) | CN104126334A (en) |
| WO (1) | WO2013121641A1 (en) |
Cited By (1)
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|---|---|---|---|---|
| CN108291798A (en) * | 2015-12-01 | 2018-07-17 | Ｎｉｓｓｈａ株式会社 | Multimetering strain transducer and its manufacturing method |
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| CN106256175B (en) * | 2014-04-25 | 2021-01-08 | 太阳油墨制造株式会社 | Resin composition for permanent insulation film, multilayer printed wiring board, and method for producing same |
| JP6875139B2 (en) * | 2016-02-02 | 2021-05-19 | 積水化学工業株式会社 | Refractory resin composition |
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| JP2003218527A (en) * | 2002-01-18 | 2003-07-31 | Ibiden Co Ltd | Multilayered circuit board and its manufacturing method |
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| JP4017451B2 (en) * | 2002-06-19 | 2007-12-05 | イビデン株式会社 | Multi-layer circuit board and manufacturing method thereof |
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| JP2005345810A (en) * | 2004-06-03 | 2005-12-15 | Kyocera Chemical Corp | Photosetting/thermosetting resin composition |
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2012
- 2012-02-14 JP JP2012029081A patent/JP2013168395A/en active Pending
- 2012-11-16 WO PCT/JP2012/079754 patent/WO2013121641A1/en active Application Filing
- 2012-11-16 CN CN201280069804.6A patent/CN104126334A/en active Pending
- 2012-11-16 KR KR1020147019958A patent/KR20140125356A/en not_active Application Discontinuation
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| JP2003137945A (en) * | 2001-11-05 | 2003-05-14 | Nippon Shokubai Co Ltd | Radically polymerizable resin, radically polymerizable resin composition and photosensitive resin composition for forming image |
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|---|---|
| KR20140125356A (en) | 2014-10-28 |
| JP2013168395A (en) | 2013-08-29 |
| WO2013121641A1 (en) | 2013-08-22 |
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Application publication date: 20141029 |