CN104125315B - Sequential control system and method - Google Patents
Sequential control system and method Download PDFInfo
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- CN104125315B CN104125315B CN201310141836.9A CN201310141836A CN104125315B CN 104125315 B CN104125315 B CN 104125315B CN 201310141836 A CN201310141836 A CN 201310141836A CN 104125315 B CN104125315 B CN 104125315B
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Abstract
The present invention provides a kind of sequential control system, master mold chip and vice-mode chip for controlling dual-mode handset is to the modularization design of pin, the system is before the vice-mode chip powers on, the output pin that the master mold chip is arranged is low level, and the input pin of the master mold chip is configured according to bimodulus interaction protocol, its input pin is completed according to the bimodulus interaction protocol to vice-mode chip and matching for output pin postpones, and is controlled the master mold chip and is configured according to output pin of the bimodulus interaction protocol to the master mold chip.The present invention also provides a kind of corresponding sequential control methods.The present invention can by adjusting pin configuration timing come the case where avoiding the CPU of vice-mode chip from leaking electricity, and then avoid dual-mode handset because the CPU electric leakage of vice-mode chip and can not normal boot-strap the case where generation.
Description
Technical field
The present invention relates to a kind of control system of communication equipment and methods, especially with regard to a kind of timing control of dual-mode handset
System and method processed.
Background technique
Dual-mode handset needs are made of master mold chip and vice-mode chip, and the interaction of information is realized between two chips,
The connection pin of some fixations is needed to connect master mold chip with vice-mode chip.The pin of connection can be summarized with two classes, i.e.,
Output pin and input pin.It needs to configure the output and input pin according to bimodulus interaction protocol when mobile phone starts,
It such as according to bimodulus interaction protocol by some pin configuration in master mold chip is high level output or low level output etc..
In existing pin configuration method, master mold chip when powering on, directly by master mold chip output and input draw
Foot is configured according to bimodulus interaction protocol, then starts vice-mode chip by master mold chip again.Under the pin configuration method,
For secondary mode chip before powering on, the CPU of the vice-mode chip may be configured to height because of the output pin in master mold chip
Level exports and the state in electric leakage, in turn results in the phenomenon that dual-mode handset can not start.
Summary of the invention
Mirror is in the above content, it is necessary to a kind of sequential control system and method is provided, when can be by adjusting pin configuration
Sequence is come the case where avoiding the CPU of vice-mode chip from leaking electricity.
The sequential control system, when master mold chip and vice-mode chip for controlling dual-mode handset are to the configuration of pin
Sequence, the system include: setup module, for setting the level state of the output pin of the master mold chip after master mold chip powers on
It is set to low level, the output pin of the master mold chip is connected to the input pin of the vice-mode chip；First configuration module is used
In the input pin for configuring the master mold chip according to bimodulus interaction protocol, the input pin of the master mold chip is connected to the pair
The output pin of mold core piece；Starting module is powered on for controlling vice-mode chip to control the vice-mode chip according to bimodulus interaction and assist
View configures the input of the vice-mode chip and output pin；Receiving module, for receiving being somebody's turn to do for the vice-mode chip transmission
Vice-mode chip has completed the signal of pin configuration according to bimodulus interaction protocol；And second configuration module, for described when receive
When vice-mode chip completes the signal of pin configuration, the output pin of the master mold chip is configured according to bimodulus interaction protocol.
The sequential control method, when master mold chip and vice-mode chip for controlling dual-mode handset are to the configuration of pin
Sequence, this method comprises: setting steps, set the level state of the output pin of the master mold chip to after master mold chip powers on
Low level, the output pin of the master mold chip are connected to the input pin of the vice-mode chip；First configuration step, according to double
Mould interaction protocol configures the input pin of the master mold chip, and the input pin of the master mold chip is connected to the vice-mode chip
Output pin；Starting step, control vice-mode chip are powered on to control the vice-mode chip according to bimodulus interaction protocol to the pair mold core
The input of piece and output pin are configured；Receiving step receives the vice-mode chip of the vice-mode chip transmission according to double
The signal of mould interaction protocol completion pin configuration；And second configuration step, pin configuration is completed when receiving the vice-mode chip
Signal when, the output pin of the master mold chip is configured according to bimodulus interaction protocol.
Compared to the prior art, sequential control system of the present invention and method, when can be by adjusting pin configuration
Sequence come the case where avoiding the CPU of vice-mode chip from leaking electricity, and then avoid dual-mode handset because vice-mode chip CPU electric leakage and nothing
The case where method normal boot-strap, occurs.
Detailed description of the invention
Fig. 1 is the running environment figure of sequential control system preferred embodiment of the present invention.
Fig. 2 is the functional block diagram of sequential control system preferred embodiment of the present invention.
Fig. 3 is the flow chart of sequential control method preferred embodiment of the present invention.
Main element symbol description
| Dual-mode handset | 100 |
| Master mold chip | 1 |
| Vice-mode chip | 2 |
| Control system | 10 |
| Output pin | 11、22 |
| Input pin | 12、21 |
| Setup module | 101 |
| First configuration module | 102 |
| Starting module | 103 |
| Receiving module | 104 |
| Second configuration module | 105 |
Specific embodiment
As shown in Figure 1, being the architecture diagram of sequential control system of the present invention (hereinafter referred to as control system) preferred embodiment.This
In embodiment, the output pin 11 of the master mold chip 1 of dual-mode handset 100 is connected to the input pin 21 of the vice-mode chip 2, should
The input pin 12 of master mold chip 1 is connected to the output pin 22 of the vice-mode chip 2.Control system 10 runs the bimodulus hand
In the master mold chip 1 of machine 100, for controlling the main mould core of the dual-mode handset 100 in 100 starting up of dual-mode handset
Piece 1 and vice-mode chip 2 carry out pin (the i.e. described output pin 11,22 and input pin 12,21) according to bimodulus interaction protocol
The timing of configuration.
It should be noted that bimodulus interaction protocol described in the present embodiment can be based on GSM(global system
For mobile communications, global system for mobile communications) and CDMA(Code Division Multiple
Access, CDMA) interaction protocol under network mode.
In the present embodiment, the control system 10 include setup module 101, the first configuration module 102, starting module 103,
Receiving module 104 and the second configuration module 105(are refering to shown in Fig. 2).This implementation module is that can complete certain function
Program segment, the function about each module will specifically describe as follows.
As shown in figure 3, being the flow chart of sequential control method preferred embodiment of the present invention.
Step S1, setup module 101 is after master mold chip 1 powers on by the level shape of the output pin 11 of the master mold chip 1
State is set as low level.
In general, the output pin 11 of the master mold chip 1, which includes at least, is used for transmission data or order to secondary mold core
The TX pin of piece 2, for waking up the interrupt pin of vice-mode chip 2, for starting the pin of vice-mode chip 2 and for controlling secondary mould
The pin of the power supply of chip 2.The level state of these pins is both configured to low level by the setup module 101.
Step S2, the first configuration module 102 configure the input pin 12 of the master mold chip 1 according to bimodulus interaction protocol.
By taking the input pin 12 is the RX pin for receiving data or order that vice-mode chip 2 is transmitted as an example, if
The operating mode that the bimodulus interaction protocol defines the RX pin of master mold chip 1 need to be configured to drop-down input, then and described first
The operating mode that configuration module 102 configures the RX pin of master mold chip 1 is drop-down input.
Step S3, starting module 103 control vice-mode chip 2 and power on to control the vice-mode chip 2 according to bimodulus interaction protocol
The input pin 21 and output pin 22 of the vice-mode chip 2 are configured.
Specifically, vice-mode chip 2 powers on, then the vice-mode chip 2 according to the prior art pin configuration method, by the pair mould
The input pin 21 and output pin 22 of chip 2 are configured according to bimodulus interaction protocol.In general, the vice-mode chip 2
Output pin 22 include at least for by data or order be transmitted to the master mold chip 1 TX pin and be used to wake up main mould
The interrupt pin of chip 1.It is for data or order to be transmitted to the main mould core with the output pin 22 of the vice-mode chip 2
For the TX pin of piece 1, if the TX pin that the bimodulus interaction protocol defines the vice-mode chip 2 need to be configured to meet UART
(Universal Asynchronous Receiver/Transmitter ' Universal Asynchronous Receive/sending device) communications protocol
Pin, then the vice-mode chip 2 will the TX pin configuration of the vice-mode chip 2 be the pin for meeting the UART communications protocol.
Vice-mode chip 2 is sent completely the signal of pin configuration to master mold chip 1 after completing pin configuration.Specifically, described
Vice-mode chip 2 can use the output pin 22 in the vice-mode chip 2 and send the signal to the master mold chip 1.With the pair mould
On chip 2 for for waking up the interrupt pin of master mold chip 1, it is assumed that this has been used to wake up the interrupt pin of master mold chip 1
It is set according to bimodulus interaction protocol for low level state, the vice-mode chip 2 then can be used to wake up master by controlling this
The interrupt pin of mold core piece 1 pulls out the high pulse signal of height to notify the master mold chip 1.For another example, it is assumed that described for calling out
The interrupt pin for master mold chip 1 of waking up is arranged according to bimodulus interaction protocol for high level state, and the vice-mode chip 2 can then be controlled
It makes this and pulls out the pulse signal of low height for waking up the interrupt pin of master mold chip 1 to notify the master mold chip 1.
In other embodiments, the vice-mode chip 2 can also have been sent to the master mold chip 1 in other way
At the signal of pin configuration, such as the TX pin by being used for transmission data or order to master mold chip 1 sends the completion and draws
The signal of foot configuration.
Step S4, receiving module 104 receive the vice-mode chip 2 transmitted by vice-mode chip 2 according to bimodulus interaction protocol
Complete the signal of pin configuration.
Step S5, the second configuration module 105 configure the output pin 11 of the master mold chip 1 according to bimodulus interaction protocol.
Specifically, for being used to wake up the interrupt pin of the vice-mode chip 2 in the master mold chip 1, it is assumed that described
The interrupt pin that bimodulus interaction protocol defines the master mold chip 1 need to wake up the vice-mode chip 2 in a manner of low level, then institute
The second configuration module 105 is stated to draw high the level of the interrupt pin in the master mold chip 1.
It can be seen that the present invention before the vice-mode chip 2 powers on from process step of the invention, first by the main mould
The control of output pin 11 of chip 1 is low level state, while drawing the input of the master mold chip 1 according to bimodulus interaction protocol
Foot 12 first configures, etc. vice-mode chips 2 according to bimodulus interaction protocol complete its input pin 21 and output pin 22 configuration it
Afterwards, it then controls the master mold chip 1 and is configured according to output pin 11 of the bimodulus interaction protocol to the master mold chip 1.Namely
Before vice-mode chip 2 powers on, it can avoid causing vice-mode chip 2 due to the level of the output pin 11 of master mold chip 1 is raised
CPU the case where leaking electricity, and then avoid dual-mode handset 100 because the CPU electric leakage of vice-mode chip 2 and can not normal boot-strap
It happens.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although referring to the above preferred embodiment pair
The present invention is described in detail, those skilled in the art should understand that, technical solution of the present invention can be carried out
Modification or person's equivalent replacement should not all be detached from the spirit and scope of technical solution of the present invention.
Claims (10)
1. a kind of sequential control system, the master mold chip and vice-mode chip for controlling dual-mode handset to the modularization design of pin,
It is characterized in that, the system includes:
Setup module, for setting low electricity for the level state of the output pin of the master mold chip after master mold chip powers on
Flat, the output pin of the master mold chip is connected to the input pin of the vice-mode chip；
First configuration module, for configuring the input pin of the master mold chip according to bimodulus interaction protocol, the master mold chip
Input pin is connected to the output pin of the vice-mode chip；
Starting module is powered on for controlling vice-mode chip to control the vice-mode chip according to bimodulus interaction protocol to the vice-mode chip
Input and output pin configured；
Receiving module has been matched according to bimodulus interaction protocol completion pin for receiving the vice-mode chip that the vice-mode chip is sent
The signal set；And
Second configuration module, for being assisted according to bimodulus interaction when receiving the signal of the vice-mode chip completion pin configuration
View configures the output pin of the master mold chip.
2. sequential control system as described in claim 1, which is characterized in that the output pin of the master mold chip includes being used for
It transmits data or the TX pin of vice-mode chip is arrived in order, for waking up the interrupt pin of vice-mode chip, for starting vice-mode chip
Pin and the power supply for controlling vice-mode chip pin.
3. sequential control system as described in claim 1, which is characterized in that first configuration module is assisted according to bimodulus interaction
The operating mode of the input pin of the master mold chip is set drop-down input by view.
4. sequential control system as described in claim 1, which is characterized in that the output pin of the vice-mode chip includes being used for
Data or order are transmitted to the TX pin of the master mold chip and are used to wake up the interrupt pin of the master mold chip.
5. sequential control system as claimed in claim 4, which is characterized in that the vice-mode chip utilizes described be used for data
Or the TX pin for being transmitted to the master mold chip is ordered to issue the signal for completing pin configuration, or utilize described for waking up
The interrupt pin of master mold chip issues the signal for completing pin configuration.
6. a kind of sequential control method, the master mold chip and vice-mode chip for controlling dual-mode handset to the modularization design of pin,
It is characterized in that, this method comprises:
Setting steps set low level for the level state of the output pin of the master mold chip after master mold chip powers on, institute
The output pin for stating master mold chip is connected to the input pin of the vice-mode chip；
First configuration step configures the input pin of the master mold chip, the input of the master mold chip according to bimodulus interaction protocol
Pin is connected to the output pin of the vice-mode chip；
Starting step, control vice-mode chip are powered on to control the vice-mode chip according to bimodulus interaction protocol to the defeated of the vice-mode chip
Enter and output pin is configured；
Receiving step receives the vice-mode chip that the vice-mode chip is sent and completes pin configuration according to bimodulus interaction protocol
Signal；And
Second configuration step is matched when receiving the signal of the vice-mode chip completion pin configuration according to bimodulus interaction protocol
Set the output pin of the master mold chip.
7. sequential control method as claimed in claim 6, which is characterized in that the output pin of the master mold chip includes being used for
It transmits data or the TX pin of vice-mode chip is arrived in order, for waking up the interrupt pin of vice-mode chip, for starting vice-mode chip
Pin and the power supply for controlling vice-mode chip pin.
8. sequential control method as claimed in claim 6, which is characterized in that in first configuration step, handed over according to bimodulus
The operating mode of the input pin of the master mold chip is set drop-down input by mutual agreement.
9. sequential control method as claimed in claim 6, which is characterized in that the output pin of the vice-mode chip includes being used for
Data or order are transmitted to the TX pin of the master mold chip and are used to wake up the interrupt pin of the master mold chip.
10. sequential control method as claimed in claim 9, which is characterized in that the vice-mode chip utilizes described for that will count
According to or order be transmitted to the TX pin of the master mold chip and issue the signal for completing pin configuration, or utilize and described is used to call out
The interrupt pin for master mold chip of waking up issues the signal for completing pin configuration.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310141836.9A CN104125315B (en) | 2013-04-23 | 2013-04-23 | Sequential control system and method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310141836.9A CN104125315B (en) | 2013-04-23 | 2013-04-23 | Sequential control system and method |
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| CN104125315A CN104125315A (en) | 2014-10-29 |
| CN104125315B true CN104125315B (en) | 2019-04-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105096868B (en) * | 2015-08-10 | 2018-12-21 | 深圳市华星光电技术有限公司 | A kind of driving circuit |
| CN110896349B (en) * | 2018-09-13 | 2023-01-13 | 深圳市文鼎创数据科技有限公司 | Secret key safety device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1874561A (en) * | 2005-06-03 | 2006-12-06 | 中兴通讯股份有限公司 | Handset in GSM/PHS dual modes, and method for sending data between two modules |
| CN1893696A (en) * | 2005-07-04 | 2007-01-10 | 中兴通讯股份有限公司 | Method for controlling double-mode terminal and between its internal chips |
| CN101022630A (en) * | 2007-04-02 | 2007-08-22 | 上海闻泰电子科技有限公司 | Double-module cellphone communication control method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5102383B2 (en) * | 2010-07-26 | 2012-12-19 | エルジー エレクトロニクス インコーポレイティド | SMS receiving method in dual mode terminal and dual mode terminal therefor |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1874561A (en) * | 2005-06-03 | 2006-12-06 | 中兴通讯股份有限公司 | Handset in GSM/PHS dual modes, and method for sending data between two modules |
| CN1893696A (en) * | 2005-07-04 | 2007-01-10 | 中兴通讯股份有限公司 | Method for controlling double-mode terminal and between its internal chips |
| CN101022630A (en) * | 2007-04-02 | 2007-08-22 | 上海闻泰电子科技有限公司 | Double-module cellphone communication control method |
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Address after: A, F3 District, Foxconn science and Technology Industrial Park, Longhua Town, Shenzhen, Guangdong, Baoan District Applicant after: Shenzhen Futaihong Precision Industry Co., Ltd. Applicant after: Qun Mai communication limited company Address before: 518109 A building, F3 District, Foxconn science and Technology Industrial Park, Longhua Town, Shenzhen, Guangdong, Baoan District Applicant before: Shenzhen Futaihong Precision Industry Co., Ltd. Applicant before: Chi Mei Communication Systems, Inc. |
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