CN104125315A - Time sequence control system and method - Google Patents
Time sequence control system and method Download PDFInfo
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- CN104125315A CN104125315A CN201310141836.9A CN201310141836A CN104125315A CN 104125315 A CN104125315 A CN 104125315A CN 201310141836 A CN201310141836 A CN 201310141836A CN 104125315 A CN104125315 A CN 104125315A
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Abstract
The invention provides a time sequence control system used for controlling a configuration time sequence of pins of a main mode chip and a minor mode chip of a dual-mode handset. Before the minor mode chip is powered on, the system sets an output pin of the main mode chip to be of low level and configures an input pin of the main mode chip according to a dual-mode interaction protocol and after input pin and out pin configuration of the minor mode chip is completed according to the dual-mode interaction protocol, the main mode chip is controlled to configure the output pin of the main mode chip according to the dual-mode interaction protocol. The invention also provides a corresponding time sequence control method. The time sequence control system and method are capable of preventing happening of a situation, in which a CPU of the minor mode chip leaks electricity, through adjustment of pin configuration so that a situation in which the dual-mode handset is incapable of normal start because the CPU of the minor mode chip leaks electricity is prevented from happening.
Description
Technical field
The present invention relates to a kind of control system and method for communication equipment, particularly about a kind of sequential control system and method for dual-mode handset.
Background technology
Dual-mode handset need to be comprised of master mold chip and vice-mode chip, between two chips, in order to realize the mutual of information, needs some fixing connection pins that master mold chip is connected with vice-mode chip.The pin connecting can be summed up by two classes, i.e. output pin and input pin.During handset starting, need to this output and input pin, be configured according to bimodulus interaction protocol, such as being high level output or low level output etc. according to bimodulus interaction protocol by certain pin configuration in master mold chip.
In existing pin configuration method, master mold chip, when powering on, directly configures the output in master mold chip and input pin, and then start vice-mode chip by master mold chip according to bimodulus interaction protocol.Under this pin configuration method, secondary mode chip is before powering on, and the CPU of this vice-mode chip may be configured to high level output and state in electric leakage because of the output pin in master mold chip, and then causes the phenomenon that dual-mode handset cannot start to occur.
Summary of the invention
Mirror, in above content, is necessary to provide a kind of sequential control system and method, can avoid the situation of the CPU electric leakage of vice-mode chip to occur by adjusting pin configuration sequential.
Described sequential control system, for controlling master mold chip and the configuration sequential of vice-mode chip to pin of dual-mode handset, this system comprises: module is set, for the level state of the output pin of this master mold chip after master mold chip powers on, be set to low level, the output pin of described master mold chip is connected to the input pin of described vice-mode chip; The first configuration module, for configure the input pin of described master mold chip according to bimodulus interaction protocol, the input pin of this master mold chip is connected to the output pin of described vice-mode chip; Start module, for controlling vice-mode chip, power on to control this vice-mode chip and according to bimodulus interaction protocol, the input of this vice-mode chip and output pin are configured; Receiver module, has completed the signal of pin configuration for receiving this vice-mode chip of described vice-mode chip transmission according to bimodulus interaction protocol; And second configuration module, for when receiving described vice-mode chip and complete the signal of pin configuration, according to bimodulus interaction protocol, configure the output pin of this master mold chip.
Described sequential control method, for controlling master mold chip and the configuration sequential of vice-mode chip to pin of dual-mode handset, the method comprises: setting steps, after master mold chip powers on, the level state of the output pin of this master mold chip is set to low level, and the output pin of described master mold chip is connected to the input pin of described vice-mode chip; The first configuration step, configures the input pin of described master mold chip according to bimodulus interaction protocol, the input pin of this master mold chip is connected to the output pin of described vice-mode chip; Setting up procedure, control vice-mode chip powers on to control this vice-mode chip and according to bimodulus interaction protocol, the input of this vice-mode chip and output pin is configured; Receiving step, this vice-mode chip that receives described vice-mode chip transmission has completed the signal of pin configuration according to bimodulus interaction protocol; And second configuration step, when receiving described vice-mode chip and complete the signal of pin configuration, according to bimodulus interaction protocol, configure the output pin of this master mold chip.
Compared to prior art, sequential control system of the present invention and method, can avoid the situation of the CPU electric leakage of vice-mode chip to occur by adjusting pin configuration sequential, and then avoid dual-mode handset because the CPU of vice-mode chip electric leakage and situation that cannot normal boot-strap occurs.
Accompanying drawing explanation
Fig. 1 is the running environment figure of sequential control system preferred embodiment of the present invention.
Fig. 2 is the functional block diagram of sequential control system preferred embodiment of the present invention.
Fig. 3 is the flow chart of sequential control method preferred embodiment of the present invention.
Main element symbol description
| Dual-mode handset | 100 |
| Master mold chip | 1 |
| Vice-mode chip | 2 |
| Control system | 10 |
| Output pin | 11、22 |
| Input pin | 12、21 |
| Module is set | 101 |
| The first configuration module | 102 |
| Start module | 103 |
| Receiver module | 104 |
| The second configuration module | 105 |
Embodiment
As shown in Figure 1, be the Organization Chart of sequential control system of the present invention (hereinafter to be referred as control system) preferred embodiment.In the present embodiment, the output pin 11 of the master mold chip 1 of dual-mode handset 100 is connected to the input pin 21 of described vice-mode chip 2, and the input pin 12 of this master mold chip 1 is connected to the output pin 22 of described vice-mode chip 2.In the master mold chip 1 of the described dual-mode handset 100 of control system 10 operation, for when described dual-mode handset 100 starting up, control the master mold chip 1 of this dual-mode handset 100 and the sequential that vice-mode chip 2 is configured pin (being described output pin 11,22 and input pin 12,21) according to bimodulus interaction protocol.
It should be noted that, bimodulus interaction protocol described in the present embodiment can be based on GSM(global system for mobile communications, global system for mobile communications) and CDMA(Code Division Multiple Access, the code division multiple access) interaction protocol under network schemer.
In the present embodiment, described control system 10 comprises that module 101, the first configuration module 102, startup module 103, receiver module 104 and the second configuration module 105(are set to be consulted shown in Fig. 2).The described module of this enforcement is the program segment that can complete certain function, will be in following specific descriptions about the function of each module.
As shown in Figure 3, be the flow chart of sequential control method preferred embodiment of the present invention.
Step S1, the level state that the output pin 11 of module 101 this master mold chip 1 after master mold chip 1 powers on is set is set to low level.
In general, the output pin 11 of described master mold chip 1 at least comprises for transmitting data or order to the TX pin of vice-mode chip 2, for waking the interrupt pin of vice-mode chip 2 up, for starting the pin of vice-mode chip 2 and for controlling the pin of the power supply of vice-mode chip 2.Describedly the level state that module 101 is about to these pins is set is all set to low level.
Step S2, the first configuration module 102 configures the input pin 12 of this master mold chip 1 according to bimodulus interaction protocol.
Take described input pin 12 as being example for receiving data that vice-mode chip 2 transmitted or the RX pin of order, if the mode of operation of this RX pin of described bimodulus interaction protocol definition master mold chip 1 need be configured to drop-down input, the mode of operation of this RX pin of described the first configuration module 102 configuration master mold chips 1 is drop-down input.
Step S3, startup module 103 control vice-mode chips 2 power on to control this vice-mode chip 2 and according to bimodulus interaction protocol, the input pin 21 of this vice-mode chip 2 and output pin 22 are configured.
Particularly, vice-mode chip 2 powers on, and this vice-mode chip 2, according to the pin configuration method of prior art, is configured the input pin of this vice-mode chip 2 21 and output pin 22 according to bimodulus interaction protocol.In general, the output pin 22 of described vice-mode chip 2 at least comprise for by data or command transfer to the TX pin of described master mold chip 1 and for waking the interrupt pin of master mold chip 1 up.Take the output pin 22 of described vice-mode chip 2 as for being example by data or command transfer to the TX pin of described master mold chip 1, if described bimodulus interaction protocol defines the TX pin of described vice-mode chip 2, need be configured to meet UART(Universal Asynchronous Receiver/Transmitter ' Universal Asynchronous Receiver & dispensing device) pin of communications protocol, the TX pin configuration that described vice-mode chip 2 is about to this vice-mode chip 2 is the pin that meets described UART communications protocol.
Vice-mode chip 2 complete after pin configuration, be sent completely pin configuration signal to master mold chip 1.Particularly, described vice-mode chip 2 can utilize the output pin 22 in this vice-mode chip 2 to send this signal to described master mold chip 1.Take in this vice-mode chip 2 is example for waking the interrupt pin of master mold chip 1 up, suppose that this is set up for low level state according to bimodulus interaction protocol for waking the interrupt pin of master mold chip 1 up, 2 of described vice-mode chips can be pulled out the high pulse signal of height and notify described master mold chip 1 for waking the interrupt pin of master mold chip 1 up by being controlled this.And for example, described in supposing, for waking the interrupt pin of master mold chip 1 up, according to bimodulus interaction protocol, arrange for high level state, 2 of described vice-mode chips can be controlled this pulse signal of pulling out low height for waking the interrupt pin of master mold chip 1 up and notify described master mold chip 1.
In other embodiment, described vice-mode chip 2 can also carry out to be sent completely the signal of pin configuration to described master mold chip 1 in other way, for example, by for transmitting data or order to the signal that completes pin configuration described in the TX pin transmission of master mold chip 1.
Step S4, this vice-mode chip 2 that receiver module 104 reception vice-mode chips 2 send has completed the signal of pin configuration according to bimodulus interaction protocol.
Step S5, the second configuration module 105 configures the output pin 11 of this master mold chip 1 according to bimodulus interaction protocol.
Particularly, take in described master mold chip 1 is example for waking the interrupt pin of described vice-mode chip 2 up, suppose that this interrupt pin that described bimodulus interaction protocol defines described master mold chip 1 need wake described vice-mode chip 2 up in low level mode, described the second configuration module 105 is drawn high the level of this interrupt pin in described master mold chip 1.
From process step of the present invention, can find out, the present invention is before described vice-mode chip 2 powers on, first the output pin of described master mold chip 1 11 is controlled as low level state, according to bimodulus interaction protocol, the input pin of described master mold chip 1 12 is first configured simultaneously, after completing the configuration of its input pin 21 and output pin 22 etc. vice-mode chip 2 according to bimodulus interaction protocol, then control described master mold chip 1 and according to bimodulus interaction protocol, the output pin 11 of this master mold chip 1 is configured.Also before vice-mode chip 2 powers on, can avoid the situation of being drawn high the CPU electric leakage that causes vice-mode chip 2 because of the level of the output pin 11 of master mold chip 1 to occur, and then avoid dual-mode handset 100 because the CPU of vice-mode chip 2 electric leakage and situation that cannot normal boot-strap occurs.
Above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although the present invention is had been described in detail with reference to above preferred embodiment, those of ordinary skill in the art should be appreciated that and can modify or person is equal to replacement and should not departs from the spirit and scope of technical solution of the present invention to technical scheme of the present invention.
Claims (10)
1. a sequential control system, for controlling master mold chip and the configuration sequential of vice-mode chip to pin of dual-mode handset, is characterized in that, this system comprises:
Module is set, for the level state of the output pin of this master mold chip after powering in master mold chip, is set to low level, the output pin of described master mold chip is connected to the input pin of described vice-mode chip;
The first configuration module, for configure the input pin of described master mold chip according to bimodulus interaction protocol, the input pin of this master mold chip is connected to the output pin of described vice-mode chip;
Start module, for controlling vice-mode chip, power on to control this vice-mode chip and according to bimodulus interaction protocol, the input of this vice-mode chip and output pin are configured;
Receiver module, has completed the signal of pin configuration for receiving this vice-mode chip of described vice-mode chip transmission according to bimodulus interaction protocol; And
The second configuration module, for when receiving described vice-mode chip and complete the signal of pin configuration, configures the output pin of this master mold chip according to bimodulus interaction protocol.
2. sequential control system as claimed in claim 1, it is characterized in that, the output pin of described master mold chip comprises for transmitting data or order to the TX pin of vice-mode chip, for waking the interrupt pin of vice-mode chip up, for starting the pin of vice-mode chip and for controlling the pin of the power supply of vice-mode chip.
3. sequential control system as claimed in claim 1, is characterized in that, described the first configuration module is set to drop-down input according to the mode of operation of the input pin of the described master mold chip of bimodulus interaction protocol.
4. sequential control system as claimed in claim 1, is characterized in that, the output pin of described vice-mode chip comprise for by data or command transfer to the TX pin of described master mold chip and for waking the interrupt pin of described master mold chip up.
5. sequential control system as claimed in claim 4, it is characterized in that, described in described vice-mode chip utilization, described in data or command transfer to the TX pin of described master mold chip is sent, complete the signal of pin configuration, or utilize the described signal that completes pin configuration for waking the interrupt pin of master mold chip up described in sending.
6. a sequential control method, for controlling master mold chip and the configuration sequential of vice-mode chip to pin of dual-mode handset, is characterized in that, the method comprises:
Setting steps, after master mold chip powers on, the level state of the output pin of this master mold chip is set to low level, and the output pin of described master mold chip is connected to the input pin of described vice-mode chip;
The first configuration step, configures the input pin of described master mold chip according to bimodulus interaction protocol, the input pin of this master mold chip is connected to the output pin of described vice-mode chip;
Setting up procedure, control vice-mode chip powers on to control this vice-mode chip and according to bimodulus interaction protocol, the input of this vice-mode chip and output pin is configured;
Receiving step, this vice-mode chip that receives described vice-mode chip transmission has completed the signal of pin configuration according to bimodulus interaction protocol; And
The second configuration step, when receiving described vice-mode chip and complete the signal of pin configuration, configures the output pin of this master mold chip according to bimodulus interaction protocol.
7. sequential control method as claimed in claim 6, it is characterized in that, the output pin of described master mold chip comprises for transmitting data or order to the TX pin of vice-mode chip, for waking the interrupt pin of vice-mode chip up, for starting the pin of vice-mode chip and for controlling the pin of the power supply of vice-mode chip.
8. sequential control method as claimed in claim 6, is characterized in that, in described the first configuration step, according to the mode of operation of the input pin of the described master mold chip of bimodulus interaction protocol, is set to drop-down input.
9. sequential control method as claimed in claim 6, is characterized in that, the output pin of described vice-mode chip comprise for by data or command transfer to the TX pin of described master mold chip and for waking the interrupt pin of described master mold chip up.
10. sequential control method as claimed in claim 9, it is characterized in that, described in described vice-mode chip utilization, described in data or command transfer to the TX pin of described master mold chip is sent, complete the signal of pin configuration, or utilize the described signal that completes pin configuration for waking the interrupt pin of master mold chip up described in sending.
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| CN201310141836.9A CN104125315B (en) | 2013-04-23 | 2013-04-23 | Sequential control system and method |
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| CN201310141836.9A CN104125315B (en) | 2013-04-23 | 2013-04-23 | Sequential control system and method |
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| CN104125315B CN104125315B (en) | 2019-04-19 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017024610A1 (en) * | 2015-08-10 | 2017-02-16 | 深圳市华星光电技术有限公司 | Drive circuit |
| CN110896349A (en) * | 2018-09-13 | 2020-03-20 | 深圳市文鼎创数据科技有限公司 | Secret key safety device |
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| CN1893696A (en) * | 2005-07-04 | 2007-01-10 | 中兴通讯股份有限公司 | Method for controlling double-mode terminal and between its internal chips |
| CN101022630A (en) * | 2007-04-02 | 2007-08-22 | 上海闻泰电子科技有限公司 | Double-module cellphone communication control method |
| US20120021782A1 (en) * | 2010-07-26 | 2012-01-26 | Juno Jung | Method and apparatus for receiving short message service (sms) in dual mode terminal |
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2013
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Patent Citations (4)
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| CN1874561A (en) * | 2005-06-03 | 2006-12-06 | 中兴通讯股份有限公司 | Handset in GSM/PHS dual modes, and method for sending data between two modules |
| CN1893696A (en) * | 2005-07-04 | 2007-01-10 | 中兴通讯股份有限公司 | Method for controlling double-mode terminal and between its internal chips |
| CN101022630A (en) * | 2007-04-02 | 2007-08-22 | 上海闻泰电子科技有限公司 | Double-module cellphone communication control method |
| US20120021782A1 (en) * | 2010-07-26 | 2012-01-26 | Juno Jung | Method and apparatus for receiving short message service (sms) in dual mode terminal |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2017024610A1 (en) * | 2015-08-10 | 2017-02-16 | 深圳市华星光电技术有限公司 | Drive circuit |
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| CN110896349B (en) * | 2018-09-13 | 2023-01-13 | 深圳市文鼎创数据科技有限公司 | Secret key safety device |
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| CN104125315B (en) | 2019-04-19 |
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Address after: A, F3 District, Foxconn science and Technology Industrial Park, Longhua Town, Shenzhen, Guangdong, Baoan District Applicant after: Shenzhen Futaihong Precision Industry Co., Ltd. Applicant after: Qun Mai communication limited company Address before: 518109 A building, F3 District, Foxconn science and Technology Industrial Park, Longhua Town, Shenzhen, Guangdong, Baoan District Applicant before: Shenzhen Futaihong Precision Industry Co., Ltd. Applicant before: Chi Mei Communication Systems, Inc. |
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