CN104120472A - Wire plating tank - Google Patents
Wire plating tank Download PDFInfo
- Publication number
- CN104120472A CN104120472A CN201410321521.7A CN201410321521A CN104120472A CN 104120472 A CN104120472 A CN 104120472A CN 201410321521 A CN201410321521 A CN 201410321521A CN 104120472 A CN104120472 A CN 104120472A
- Authority
- CN
- China
- Prior art keywords
- titanium metal
- metal conductive
- conductive mesh
- cell body
- tank body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
A wire plating tank comprises a cuboid tank body, a laterally-arranged conductive roller with a cathode conducting device is installed at one end portion in the cuboid tank body, at least one layer of titanium metal conductive network is arranged at the bottom in the cuboid tank body, the titanium metal conductive network is connected with external power to form an electroplating anode; the titanium metal conductive network is formed by mutually splicing a plurality of pieces, parallel strip-type convex racks are arranged on at least two side walls of the bottom in the cuboid tank body, the titanium metal conductive network pieces are additionally arranged on convex racks of the inner wall of the tank body by two end sides, and are sequentially connected together, and the connection parts are mutually connected to form one anode electric net; the titanium metal conductive network is formed by mutually splicing a plurality of pieces, a bracket shaped like a Chinese character ''tian'' is arranged between at least two side walls of the bottom in the cuboid tank body, the titanium metal conductive network pieces which are mutually connected together are put on the bracket to form the anode electric net; the wire plating tank has the advantages of simple and reasonable structure and convenient and reliable use, can improve the conductive properties of the electroplating anode, prolongs the service life, is easy to clean, and can ensure the normal and safe use of the electroplating anode.
Description
Technical field
What the present invention relates to is a kind of plating tank with wire material electroplating, belongs to technical field of plating equipment.
Background technology
Existing wire material electroplating groove is mainly used in pickling and the electroplating technology of wire casing, it comprises the cell body that pickle solution or electroplate liquid can be housed in, conductive rollers is installed in cell body and is communicated with electroplate liquid as electroplating cathode, and in the bottom of cell body, be provided with bus, and on bus, add filter screen, thereby form galvanic anode after bus energising; Adopt at present bus to conduct electricity and form galvanic anode, owing to also adding filtering net above, so poor electric conductivity, the time one is long, the impurity such as dirt that are deposited on below filtering net will cover above bus, reduce result of use and the work-ing life of bus; And the bus using at present and filtering net etc. adopt conventional conductive metallic material, be immersed in for a long time in electroplate liquid and be easily corroded, reduced the work-ing life of galvanic anode.
Summary of the invention
The object of the invention is to overcome the deficiency that prior art exists, and provide a kind of rational in infrastructure, easy to use and reliable, can improve galvanic anode conductivity, extend its work-ing life, easily clean, guarantee that galvanic anode is normal, the wire material electroplating groove of safe handling.
The object of the invention is to complete by following technical solution, described wire material electroplating groove, it comprises the cell body of a rectangular parallelepiped, an end in described cell body is provided with the conductive rollers with negative electrode electric installation of lateral arrangement, described cell body inner bottom part is provided with at least one deck titanium metal conductive mesh, and this titanium metal conductive mesh connects external power formation galvanic anode.
Described titanium metal conductive mesh is spliced to form mutually by polylith, on at least dual-side wall of cell body inner bottom part, be provided with parallel bar shaped evagination frame bar, block titanium metal conductive mesh is added and is located on described cell body inwall evagination frame bar by limit, two ends, and join and form successively, joint interconnects respectively and forms an anode electrical network.
Described titanium metal conductive mesh is spliced to form mutually by polylith, between at least dual-side wall of cell body inner bottom part, is provided with matrix pattern support, is placed with the block titanium metal conductive mesh being connected together each other and forms an anode electrical network on described support.
Described titanium metal conductive mesh has two-layer up and down, and the junction between every layer of block titanium metal conductive mesh interconnects by an intermediate metal connection piece; In titanium metal conductive mesh, be provided with the power supply joint pin that at least one is communicated with external power source.
The invention belongs to a kind of improvement to prior art, it directly replaces bus with electrical network, and adopt titanium metal stable and reliable for performance as electro-conductive material, the present invention is had simple and reasonable for structure, easy to use and reliable, can improve galvanic anode conductivity, extend its work-ing life, easily clean, guarantee the features such as galvanic anode is normal, safe handling.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the present invention.
Fig. 2 is another kind of structural representation of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be described in detail: shown in Fig. 1, wire material electroplating groove of the present invention, it comprises the rectangular parallelepiped cell body 1 that can fill electroplate liquid in one, an end in described cell body 1 is provided with the conductive rollers 3 with negative electrode electric installation 2 of lateral arrangement, described cell body 1 inner bottom part is provided with at least one deck titanium metal conductive mesh 4, and this titanium metal conductive mesh 4 connects external power formation galvanic anode.
Shown in figure, titanium metal conductive mesh 4 of the present invention is spliced to form mutually by polylith, on at least dual-side wall of cell body 1 inner bottom part, be provided with parallel bar shaped evagination frame bar 5, block titanium metal conductive mesh 6 is erected on described cell body 1 inwall evagination frame bar 5 by limit, two ends, and join and form successively, joint interconnects respectively and forms an anode electrical network; Block titanium metal conductive mesh 6 shown in figure is rectangle, and the both sides minor face of two block titanium metal conductive mesh 6 is erected on described cell body 1 inwall evagination frame bar 5, and long limit contiguous concatenation together.
Shown in Fig. 2, described titanium metal conductive mesh 5 is spliced to form mutually by polylith, between at least dual-side wall of cell body 1 inner bottom part, be provided with matrix pattern support 7, on described support 7, be placed with the block titanium metal conductive mesh 6 being connected together each other and form an anode electrical network; Block titanium metal conductive mesh 6 shown in figure is square, comprises rectangle and square, and at least both sides of every block titanium metal conductive mesh 6 and adjacent block titanium metal conductive mesh 6 interconnect.
The further embodiment of the present invention is: described titanium metal conductive mesh 4 has two-layer up and down, and the junction between each the block titanium metal conductive mesh 6 in every layer interconnects by an intermediate metal connection piece 8; In titanium metal conductive mesh 4, be provided with the power supply joint pin 9 that at least one is communicated with external power source; Shown in Fig. 1: be provided with a power-line terminal of arranging vertically upward in titanium metal conductive mesh 4; Shown in Fig. 2: be provided with about two power-line terminals of arranging vertically upward that distribute in titanium metal conductive mesh 4.
Because described titanium metal conductive mesh 4 is joined and formed by Pork-pieces block titanium metal conductive mesh 6, so easy accessibility, easy access maintenance, be convenient to clean and can keep cell body bottom to remain clean, avoided, because throw out accumulates the generation that cell body bottom affects galvanic anode, affecting the effect of wire material electroplating.
Claims (4)
1. a wire material electroplating groove, it comprises the cell body of a rectangular parallelepiped, an end in described cell body is provided with the conductive rollers with negative electrode electric installation of lateral arrangement, it is characterized in that described cell body inner bottom part is provided with at least one deck titanium metal conductive mesh, and this titanium metal conductive mesh connects external power formation galvanic anode.
2. wire material electroplating groove according to claim 1, it is characterized in that described titanium metal conductive mesh is spliced to form mutually by polylith, on at least dual-side wall of cell body inner bottom part, be provided with parallel bar shaped evagination frame bar, block titanium metal conductive mesh is added and is located on described cell body inwall evagination frame bar by limit, two ends, and join and form successively, joint interconnects respectively and forms an anode electrical network.
3. wire material electroplating groove according to claim 1, it is characterized in that described titanium metal conductive mesh is spliced to form mutually by polylith, between at least dual-side wall of cell body inner bottom part, be provided with matrix pattern support, on described support, be placed with the block titanium metal conductive mesh being connected together each other and form an anode electrical network.
4. according to the wire material electroplating groove described in claim 2 or 3, it is characterized in that described titanium metal conductive mesh has up and down two-layer, the junction between every layer of block titanium metal conductive mesh interconnects by an intermediate metal connection piece; In titanium metal conductive mesh, be provided with the power supply joint pin that at least one is communicated with external power source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410321521.7A CN104120472A (en) | 2014-07-08 | 2014-07-08 | Wire plating tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410321521.7A CN104120472A (en) | 2014-07-08 | 2014-07-08 | Wire plating tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104120472A true CN104120472A (en) | 2014-10-29 |
Family
ID=51766093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410321521.7A Pending CN104120472A (en) | 2014-07-08 | 2014-07-08 | Wire plating tank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104120472A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2293570Y (en) * | 1996-08-20 | 1998-10-07 | 武汉风帆电镀技术有限公司 | Wire rod continuous electroplating apparatus with meshed anode |
| CN2787685Y (en) * | 2005-04-28 | 2006-06-14 | 江苏华达涂层有限公司 | Reticular anode arrangement of electroplating tank |
| CN201574206U (en) * | 2009-12-23 | 2010-09-08 | 上海元豪表面处理有限公司 | Electroplating bath with shielding plate |
| CN202626338U (en) * | 2012-05-16 | 2012-12-26 | 广州明毅电子机械有限公司 | Nonsoluble anode |
| CN203976960U (en) * | 2014-07-08 | 2014-12-03 | 德清县浙北通讯器材有限公司 | Wire material electroplating groove |
-
2014
- 2014-07-08 CN CN201410321521.7A patent/CN104120472A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2293570Y (en) * | 1996-08-20 | 1998-10-07 | 武汉风帆电镀技术有限公司 | Wire rod continuous electroplating apparatus with meshed anode |
| CN2787685Y (en) * | 2005-04-28 | 2006-06-14 | 江苏华达涂层有限公司 | Reticular anode arrangement of electroplating tank |
| CN201574206U (en) * | 2009-12-23 | 2010-09-08 | 上海元豪表面处理有限公司 | Electroplating bath with shielding plate |
| CN202626338U (en) * | 2012-05-16 | 2012-12-26 | 广州明毅电子机械有限公司 | Nonsoluble anode |
| CN203976960U (en) * | 2014-07-08 | 2014-12-03 | 德清县浙北通讯器材有限公司 | Wire material electroplating groove |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EA201170621A1 (en) | ELECTRODES FOR USE IN BACTERIAL FUEL ELEMENTS AND BACTERIAL ELECTROLYSIS ELEMENTS | |
| CN203976960U (en) | Wire material electroplating groove | |
| CN205241797U (en) | Combined electrode structure | |
| CN204118479U (en) | DC power distribution cabinet | |
| CN104120472A (en) | Wire plating tank | |
| CN204385304U (en) | Dipolar four-contact electric conduction device between embedded electrodeposition electrolyzer | |
| CN206143329U (en) | Foil forming machine power integral structure and copper foil production facility | |
| CN205429197U (en) | Power equipment expanding unit of working a telephone switchboard | |
| CN104562091A (en) | Embedded type electrodeposition two-pole and four-contact conducting device in electrolytic cell | |
| CN202931178U (en) | Low stray inductance power module adopting rigid insulating plate for convergence | |
| CN207752800U (en) | A kind of copper aluminium bus-bar | |
| CN102776553B (en) | Electrolytic cleaning electrode for cold-rolled band steel | |
| CN202148356U (en) | Electrolysis and electrodeposition process current short circuit device | |
| CN216737685U (en) | Anode structure for electrochemical water treatment equipment | |
| CN207143355U (en) | A kind of device for repairing minus plate Conductive beam hangers | |
| CN104831342A (en) | Electrode device for cleaning galvanized cold rolled sheet steel | |
| CN203270065U (en) | Aluminium electrolysis cell bus structure of horizontal power feed | |
| CN208776867U (en) | A kind of sunk type anode rod | |
| CN209722325U (en) | A kind of electrolyzer assembly for electrolytic antimony | |
| CN104342742A (en) | Electrode configuration structure of galvanization electroplating bath | |
| CN203794999U (en) | Conducting bar device for electrolytic copper powder anode plate | |
| CN211183359U (en) | Tapping box | |
| CN211045755U (en) | Ground wire connection structure for transformer substation | |
| CN202268445U (en) | Diagonally-tensioned grid | |
| CN202047150U (en) | Bus belt washing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141029 |