CN104109381A - Modified organic silicon resin composition - Google Patents

Modified organic silicon resin composition Download PDF

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Publication number
CN104109381A
CN104109381A CN201410100288.XA CN201410100288A CN104109381A CN 104109381 A CN104109381 A CN 104109381A CN 201410100288 A CN201410100288 A CN 201410100288A CN 104109381 A CN104109381 A CN 104109381A
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China
Prior art keywords
resin composition
transparent composite
modified organic
epoxy resin
organic silicone
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CN201410100288.XA
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Chinese (zh)
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CN104109381B (en
Inventor
汪青
刘东亮
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Shengyi Technology Co Ltd
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Shengyi Technology Co Ltd
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Priority to CN201410100288.XA priority Critical patent/CN104109381B/en
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Abstract

The invention provides a modified organic silicon resin composition. The composition comprises 30-70 parts by weight of a main resin polysilsesquioxane resin and 30-70 parts by weight of epoxy resin and/or polyallyl ester. The invention also provides a method for preparing an organic silicon resin transparent composite material by using the organic silicon resin composition, and a flexible display panel made by using the transparent composite material. The transparent composite material has a light transmittance reaching above 90% and is flexible; and compared with glass, the transparent composite material has the advantages of lightness, thinness, flexibility and portability as a display panel base material, and accords with the future development direction of electronic products.

Description

Modified organic silicone resin composition
Technical field
The present invention relates to flexible display technologies field, particularly, relate to a kind of modified organic silicone resin composition, prepare the method for silicone resin transparent composite by said composition, and the flexible display panel of preparing with this transparent composite.
Background technology
Traditional display panel is all to adopt glass as baseplate material, and glass transparent and insulation, can play a supporting role, and is the baseplate material of desirable display panel, very ripe in the application in display panel field.But glass also has its shortcoming as panel substrate material, be mainly manifested in that it is comparatively thick and heavy, easily break, can not be bending etc. aspect.
Along with social development, people are more and more higher for the requirement of electronic product, wish that electronic product is more frivolous, be easy to carry.And display screen is various electronic products, as the chief component of mobile phone, notebook computer, panel computer, e-book etc., the developing direction of display screen be more frivolous, flexible, be easy to carry.Glass because it is thick and heavy, easily break, unyielding shortcoming makes it be difficult to adapt to the requirements at the higher level of following display panel, more meet the developing direction of following electronic product as the baseplate material of display panel especially flexible display panels and there is transparent composite frivolous, bendability characteristics, have a extensive future.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of modified organic silicone resin composition, the silicone resin transparent composite that also provides this organosilicon resin composition to prepare, and the flexible display panel of preparing with this transparent composite.The transmittance of this transparent composite can reach more than 90%, and flexible, as the base material of display panel, with glassy phase ratio, has frivolously, flexible, and the characteristic such as be easy to carry, meets the developing direction of following electronic product.
Technical scheme of the present invention is as follows: a kind of modified organic silicone resin composition, it is characterized in that, and comprise each component of following weight part, main resin: polysilsesquioxane resins, 30-70 part; Solidifying agent: epoxy resin and/or polyene propyl ester 30-70 part.
Described polysilsesquioxane resins is cage structure, ladder structure and random structure.
Described epoxy resin is one or several the composition in bisphenol A epoxide resin, novolac epoxy, isocyanate modified epoxy resin, phosphorous epoxy resin, biphenyl epoxy resin, DCPD-containing epoxy resin.
The method of the organosilicon transparent composite of preparing with described modified organic silicone resin composition, comprises the steps:
(1) get the each component of described organosilicon resin composition by formula, after mixing, add and in solvent, be configured to glue;
(2) get glasscloth and flood described one-tenth glue, in baking oven 110~160 DEG C baking 30~90 minutes solidify or through 1500mJ/cm 2uV-irradiation solidify, complete solidify after obtain described transparent composite.
Described glasscloth is selected from following model: 106,1078,1080,1086,2112,2116,2119,3313,7628.
The flexible display panels of preparing with described organosilicon transparent composite.
The present invention by described polysilsesquioxane resins as main resin,
Beneficial effect of the present invention is: its main raw of transparent composite of the present invention is polysilsesquioxane resins and solidifying agent epoxy resin and/or polyene propyl ester, and its preparation method is simple.
Embodiment
Embodiment 1:
A kind of modified organic silicone resin composition, comprising: 40 parts of polysilsesquioxane resins (waste river chemistry, HBSQ105-7), 60 parts of epoxy resin (waste river chemistry, HBSQ3008).
The method of the organosilicon transparent composite of preparing with described modified organic silicone resin composition, comprises the steps:
(1) get the each component of described organosilicon resin composition by formula, after mixing, add and in solvent, be configured to glue;
(2) get glasscloth and flood described one-tenth glue, in baking oven 135 DEG C baking 60 minutes solidify, complete solidify after obtain described transparent composite.
Described glasscloth is selected from following model: 106.
Embodiment 2:
A kind of modified organic silicone resin composition, comprising: 60 parts of polysilsesquioxane resins (waste river chemistry, HBSQ105-7), 40 parts of polyene propyl ester (waste river chemistry, HBSQ2501A).
The method of the organosilicon transparent composite of preparing with described modified organic silicone resin composition, comprises the steps:
(1) get the each component of described organosilicon resin composition by formula, after mixing, add and in solvent, be configured to glue;
(2) get glasscloth and flood described one-tenth glue, through 1500mJ/cm 2uV-irradiation solidify, complete solidify after obtain described transparent composite.
Described glasscloth is selected from following model: 1080.
Embodiment 3:
A kind of modified organic silicone resin composition, comprise: 30 parts of polysilsesquioxane resins (waste river chemistry, HBSQ105-7), 40 parts of polyene propyl ester (waste river chemistry, HBSQ2501A), 30 parts of epoxy resin (waste river chemistry, HBSQ3008).
The method of the organosilicon transparent composite of preparing with described modified organic silicone resin composition, comprises the steps:
(1) get the each component of described organosilicon resin composition by formula, after mixing, add and in solvent, be configured to glue;
(2) get glasscloth and flood described one-tenth glue, in baking oven 160 DEG C baking 30 minutes solidify, complete solidify after obtain described transparent composite.
Described glasscloth is selected from following model: 1086.
Embodiment 4:
A kind of modified organic silicone resin composition, comprising: 70 parts of polysilsesquioxane resins (waste river chemistry, HBSQ105-7), 30 parts of epoxy resin (waste river chemistry, HBSQ3008).
The method of the organosilicon transparent composite of preparing with described modified organic silicone resin composition, comprises the steps:
(1) get the each component of described organosilicon resin composition by formula, after mixing, add and in solvent, be configured to glue;
(2) get glasscloth and flood described one-tenth glue, in baking oven 110 DEG C baking 90 minutes solidify, complete solidify after obtain described transparent composite.
Described glasscloth is selected from following model: 2116.
Embodiment 5:
The flexible display panel of preparing with organosilicon transparent composite described in embodiment 1.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, its framework form can be flexible and changeable, can subseries product.Just make some simple deduction or replace, all should be considered as belonging to the present invention by the definite scope of patent protection of submitted to claims.

Claims (6)

1. a modified organic silicone resin composition, is characterized in that, comprises each component of following weight part, main resin: polysilsesquioxane resins, 30-70 part; Solidifying agent: epoxy resin and/or polyene propyl ester 30-70 part.
2. modified organic silicone resin composition as claimed in claim 1, is characterized in that, described polysilsesquioxane resins is cage structure, ladder structure and random structure.
3. modified organic silicone resin composition as claimed in claim 1, it is characterized in that, described epoxy resin is one or several the composition in bisphenol A epoxide resin, novolac epoxy, isocyanate modified epoxy resin, phosphorous epoxy resin, biphenyl epoxy resin, DCPD-containing epoxy resin.
4. the method for preparing organosilicon transparent composite with modified organic silicone resin composition described in claim 1-3 any one, is characterized in that, comprises the steps:
(1) get the each component of described organosilicon resin composition by formula, after mixing, add and in solvent, be configured to glue; (2) get glasscloth and flood described one-tenth glue, in baking oven 110~160 DEG C baking 30~90 minutes solidify or through 1500mJ/cm 2uV-irradiation solidify, complete solidify after obtain described transparent composite.
5. the method for preparing organosilicon transparent composite as claimed in claim 4, is characterized in that, described glasscloth is selected from following model: 106,1078,1080,1086,2112,2116,2119,3313,7628.
6. the flexible display panels of preparing with the organosilicon transparent composite described in claim 4 or 5.
CN201410100288.XA 2014-03-18 2014-03-18 Modified organic silicone resin composition Active CN104109381B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201410100288.XA CN104109381B (en) 2014-03-18 2014-03-18 Modified organic silicone resin composition

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CN104109381A true CN104109381A (en) 2014-10-22
CN104109381B CN104109381B (en) 2019-03-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112759891A (en) * 2020-12-28 2021-05-07 广东盈骅新材料科技有限公司 Epoxy resin composition, and transparent composite material and laminate containing same

Citations (7)

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CN101014644A (en) * 2004-09-10 2007-08-08 陶氏康宁公司 Anhydride-functional silsesquioxane resins
CN101089048A (en) * 2006-06-16 2007-12-19 信越化学工业株式会社 Epoxy-organic silicon mixed resin combination and luminous semiconductor device
CN101508846A (en) * 2008-02-13 2009-08-19 东进世美肯株式会社 Organic-inorganic composite regin combination as protective film
CN101525467A (en) * 2009-04-03 2009-09-09 复旦大学 Epoxy/organosilicon hybrid material, and preparation method and application thereof
CN101955666A (en) * 2010-09-30 2011-01-26 长安大学 Preparation method of glass fiber enhanced thermosetting resin matrix composite material
JP2011190402A (en) * 2010-03-16 2011-09-29 Sekisui Chem Co Ltd Ultraviolet curable resin composition and transparent composite sheet
WO2013019040A2 (en) * 2011-08-03 2013-02-07 주식회사 동진쎄미켐 Photo-curable organic-inorganic hybrid resin composition

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
CN101014644A (en) * 2004-09-10 2007-08-08 陶氏康宁公司 Anhydride-functional silsesquioxane resins
CN101089048A (en) * 2006-06-16 2007-12-19 信越化学工业株式会社 Epoxy-organic silicon mixed resin combination and luminous semiconductor device
CN101508846A (en) * 2008-02-13 2009-08-19 东进世美肯株式会社 Organic-inorganic composite regin combination as protective film
CN101525467A (en) * 2009-04-03 2009-09-09 复旦大学 Epoxy/organosilicon hybrid material, and preparation method and application thereof
JP2011190402A (en) * 2010-03-16 2011-09-29 Sekisui Chem Co Ltd Ultraviolet curable resin composition and transparent composite sheet
CN101955666A (en) * 2010-09-30 2011-01-26 长安大学 Preparation method of glass fiber enhanced thermosetting resin matrix composite material
WO2013019040A2 (en) * 2011-08-03 2013-02-07 주식회사 동진쎄미켐 Photo-curable organic-inorganic hybrid resin composition

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112759891A (en) * 2020-12-28 2021-05-07 广东盈骅新材料科技有限公司 Epoxy resin composition, and transparent composite material and laminate containing same

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