CN104091991B - A kind of multichannel chip integrated waveguide power distributor - Google Patents
A kind of multichannel chip integrated waveguide power distributor Download PDFInfo
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- CN104091991B CN104091991B CN201410340506.7A CN201410340506A CN104091991B CN 104091991 B CN104091991 B CN 104091991B CN 201410340506 A CN201410340506 A CN 201410340506A CN 104091991 B CN104091991 B CN 104091991B
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Abstract
The invention discloses a kind of multichannel chip integrated waveguide power distributor, comprise three layers of medium substrate and lay respectively at the superiors' upper surface of base plate, four layers of metal between orlop base lower surface and substrate and substrate.Two-layer intermetallic metal between rectangular metal via-hole array and substrate and substrate constitutes rectangular cavity.Being input port on the left of rectangular cavity, right side is output port.Can be with double homophases that flexible design is one point four and double anti-phase power splitters；And the homophase of one-to-two or anti-phase power splitter.The present invention has broadband, low insertion loss, good standing wave ratio of input voltage, and each road amplitude output signal concordance is good, and the advantage such as low amplitude disequilibrium.Present invention could apply to microwave and millimeter wave antenna feeding network etc., have wide practical use in communication, the microwave and millimeter wave system such as radar.
Description
Technical field
The present invention relates to a kind of multilamellar filter with low insertion loss, broad-band chip integrated waveguide power divider, belong to microwave passive component
Field.
Background technology
Power splitter is power synthesis amplifier and the critical component of aerial array feed system, decision systems performance.Along with
Developing rapidly of communication system, grows with each passing day to broadband, filter with low insertion loss, the demand of efficient power splitter.Traditional probe feed substrate
Integrated waveguide power splitter is difficult to integrated with planar circuit, and T/Y-type joint chip integrated waveguide power distributor Insertion Loss is excessive, and along with defeated
Going out the increase of port number, the size of power splitter sharply increases.Therefore, broadband, filter with low insertion loss, multi-path power divider be in the urgent need to
's.
Summary of the invention
Goal of the invention: for problems of the prior art with not enough, the present invention provides a kind of integrated ripple of multichannel substrate
Leading power splitter, it has the good characteristics such as broadband, filter with low insertion loss.Four tunnel constant amplitudes outputs or two-way constant amplitude homophase/anti-can be realized
Exporting mutually, output amplitude concordance is good, amplitude imbalance is little.It is applicable to that planar circuit is integrated and multiplex output circuit.
Technical scheme: a kind of multichannel chip integrated waveguide power distributor, including three layers of medium substrate with lay respectively at the superiors
Upper surface of base plate, four layers of metal level between orlop base lower surface and substrate and substrate；Three layers of medium substrate and four layers of gold
Belong to stacking to force together, form power splitter body；Plated-through hole array, the plated-through hole at four edges it is provided with at body edges
Form rectangular metal via-hole array；Two metal layers composition between described rectangular metal via-hole array and substrate and substrate
Rectangular cavity；Described power divider is made up of substrate integration wave-guide, uses novel rectangular cavity, with realize broadband and
Filter with low insertion loss.
Further, the described the superiors and the cabling that undermost metal level is microstrip line or co-planar waveguide, by feedback
Electric probe switching microstrip line or coplanar waveguide structure realize the integrated of power divider and other planar circuits.
It is possible to further be placed in above rectangular cavity by two-way output port, it is humorous that two-way output port is placed in rectangle
Shake below chamber, it is achieved four tunnel constant amplitudes outputs；The wherein output of two-way homophase, the anti-phase output of two-way.And one-to-two merit can be divided
Device two-way output port may be contained within the up/down face of rectangular cavity and realizes the output of constant amplitude homophase, or it is humorous to be respectively placed in rectangle
Shake different face, chamber to realize the anti-phase output of constant amplitude.
Beneficial effect: the chip integrated waveguide power distributor of the present invention, uses traditional PCB technology, it is easy to design and process.
Compared with existing chip integrated waveguide power distributor, present invention have the advantage that
1) owing to using cavity resonator structure, this power splitter insertion loss is little.
2) compared to existing probe feed chamber power divider, it is easy to Planar integration and wideband operation can be realized.
3) save one-to-two chip integrated waveguide power distributor compared to existing T/Y-type, one point of four power splitter can improve with
Output port number to increase, the shortcoming that power division network size sharply increases.
Accompanying drawing explanation
Fig. 1 is the one-to-two anti-phase power splitter perspective view of the embodiment of the present invention；
Fig. 2 is the top view of Fig. 1；
Fig. 3 is one point of four power splitter perspective view of the embodiment of the present invention；
Fig. 4 is the S parameter of anti-phase one-to-two power splitter；
Fig. 5 is anti-phase one-to-two power splitter output port phase contrast；
Fig. 6 is the S parameter of one point of four power splitter；
Fig. 7 is the output port phase contrast of one point of four power splitter.
Detailed description of the invention
Below in conjunction with specific embodiment, it is further elucidated with the present invention, it should be understood that these embodiments are merely to illustrate the present invention
Rather than restriction the scope of the present invention, after having read the present invention, the those skilled in the art's various equivalences to the present invention
The amendment of form all falls within the application claims limited range.
As it is shown in figure 1, multichannel chip integrated waveguide power distributor, including three layers of medium substrate, four layers of metal level, rectangular metal
Change via-hole array, microstrip line and feed probes；Three layers of medium substrate and four layers of metal interlevel are every laminating formation power splitter body, institute
State three layers of medium substrate and be respectively ground floor substrate 4, second layer substrate 5 and third layer substrate 6；Described four layers of metal level are followed successively by
The first metal layer, the second metal level the 7, the 3rd metal level 8 and the 4th metal level；The first metal layer is located at table on ground floor substrate 4
Face, the second metal level 7 is located between ground floor substrate 4 and second layer substrate 5, and the 3rd metal level 8 is located at second layer substrate 5 and
Between three laminar substrates 6, the lower surface of the 3rd substrate 6 is provided with the 4th metal level；Three layers of medium substrate are rectangle, the length and width of substrate
Equal with the length and width of metal level 7,8 respectively.
The plated-through hole at power splitter body four edge forms rectangular metal via-hole array 1；Rectangular metal through hole battle array
Row 1 and the second metal level 7 and the 3rd metal level 8 form rectangular cavity.
As shown in Figure 1-Figure 3, the second metal level 7 is provided with the first via 15, and the 3rd metal level 8 is provided with the second via 16.
The first metal layer and the 4th metal level are the cabling of microstrip line 2, and feed probes 3 is transferred microstrip line 2, input port feed probes
3 encourage rectangular cavity by the first via 15, and each feed probes of output port 3 is by the first via 15 or the second via
16 realize one-to-two output；The each feed probes of output port 3 by the first via 15 and the second via 16 realize one point four defeated
Go out.
Fig. 4 and Fig. 5 is S parameter and the output port phase contrast of anti-phase one-to-two rectangular cavity.This one-to-two power splitter
Having good stationary wave characteristic, insertion loss is little, wideband operation, and amplitude coincidence is good.
Fig. 6 and Fig. 7 is S parameter and the output port phase contrast of one point of four rectangular cavity.Microstrip line is positioned at rectangle resonance
The output port of chamber the same face is homophase output, and the output port being positioned at rectangular cavity not coplanar is anti-phase output.This point
Four power splitters have good stationary wave characteristic, and insertion loss is little, wideband operation, and amplitude coincidence is good.Can effectively solve one
Two power splitters are divided to increase along with output port number, the defect that size sharply increases.
Claims (1)
1. a multichannel chip integrated waveguide power distributor, it is characterised in that: include three layers of Rectangular Enclosure with Participating Media substrate and lay respectively at
Top substrate layer upper surface, four layers of metal level between orlop base lower surface and substrate and substrate；Three layers of medium substrate and four
Layer metal stacking forces together, and forms power splitter body；Described four layers of metal level be followed successively by the first metal layer, the second metal level,
3rd metal level and the 4th metal level；Being provided with plated-through hole array at body edges, the plated-through hole at four edges forms square
Shape plated-through hole array；Two metal layers composition rectangle between described rectangular metal via-hole array and substrate and substrate is humorous
Shake chamber；The metal level being positioned at the superiors' upper surface of base plate and the metal level being positioned at orlop base lower surface are microstrip line or are total to
The cabling of face waveguide；
The integrated of power splitter and other planar circuits is realized by feed probes switching microstrip line or coplanar waveguide structure；
Being input port on the left of rectangular cavity, right side is output port；Described multichannel chip integrated waveguide power distributor is one point
Two power splitters or one point of four power splitter, when described multichannel chip integrated waveguide power distributor is one point of four power splitter, can be by two
Road output port is placed in above rectangular cavity, and two-way output port is placed in below rectangular cavity, it is achieved four tunnel constant amplitudes
Output, including the output of two-way homophase and the anti-phase output of two-way；When described multichannel chip integrated waveguide power distributor is that one-to-two merit is divided
During device, one-to-two power splitter two-way output port can be may be contained within rectangular cavity up/down face and realize the output of constant amplitude homophase,
Or it is respectively placed in the different face of rectangular cavity to realize the anti-phase output of constant amplitude；
Second metal level is provided with the first via, and the 3rd metal level is provided with the second via；Input port feed probes passes through first
Via excitation rectangular cavity, when described multichannel chip integrated waveguide power distributor is one-to-two power splitter, output port is each
Feed probes realizes constant amplitude one-to-two in the same direction by the first via or the second via and exports；When described multichannel substrate integration wave-guide
When power splitter is one point of four power splitter, each feed probes of output port is realized by two the first vias and two the second vias
One point of four output.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410340506.7A CN104091991B (en) | 2014-07-16 | 2014-07-16 | A kind of multichannel chip integrated waveguide power distributor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410340506.7A CN104091991B (en) | 2014-07-16 | 2014-07-16 | A kind of multichannel chip integrated waveguide power distributor |
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| Publication Number | Publication Date |
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| CN104091991A CN104091991A (en) | 2014-10-08 |
| CN104091991B true CN104091991B (en) | 2016-11-02 |
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| CN201410340506.7A Active CN104091991B (en) | 2014-07-16 | 2014-07-16 | A kind of multichannel chip integrated waveguide power distributor |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209183755U (en) * | 2016-08-09 | 2019-07-30 | 广东通宇通讯股份有限公司 | Feeding network |
| CN106953152B (en) * | 2017-04-13 | 2020-05-05 | 南京邮电大学 | Substrate integrated non-radiative dielectric waveguide stepped power divider |
| CN107154784B (en) * | 2017-05-12 | 2019-10-15 | 北京邮电大学 | A kind of differential low noise amplifier based on medium integrated waveguide |
| CN111830093A (en) * | 2020-07-10 | 2020-10-27 | 成都信息工程大学 | Real-time detection method and device for micro dielectric change of material based on radio frequency technology |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102496763A (en) * | 2011-12-09 | 2012-06-13 | 电子科技大学 | Wideband multi-channel substrate integrated waveguide power divider adopting novel high-isolation technology |
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|---|---|---|---|---|
| CA2629035A1 (en) * | 2008-03-27 | 2009-09-27 | Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Industry, Through The Communications Research Centre Canada | Waveguide filter with broad stopband based on sugstrate integrated waveguide scheme |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102496763A (en) * | 2011-12-09 | 2012-06-13 | 电子科技大学 | Wideband multi-channel substrate integrated waveguide power divider adopting novel high-isolation technology |
Non-Patent Citations (3)
| Title |
|---|
| Multilayer Substrate Integrated Waveguide Four-Way Out-of-Phase Power Divider;Hai-Young Lee;《IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES》;20091231;第3469-3476页，图1-17 * |
| 基于基片集成波导的LTCC电路研究;古健;《中国优秀博士学位论文全文数据库》;20110730;第31页第3.4节-第35页第3.5节，图3-11-3-14 * |
| 无线通信中多层结构滤波器研究;陆惠;《中国优秀硕士学位论文全文数据库》;20120430;第30页第5.1.1-第37页第5.1.4，图5.1-5.10 * |
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