CN104091876A - Novel transparent substrate LED packaging structure - Google Patents
Novel transparent substrate LED packaging structure Download PDFInfo
- Publication number
- CN104091876A CN104091876A CN201410364715.5A CN201410364715A CN104091876A CN 104091876 A CN104091876 A CN 104091876A CN 201410364715 A CN201410364715 A CN 201410364715A CN 104091876 A CN104091876 A CN 104091876A
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- China
- Prior art keywords
- led chip
- transparent substrate
- transparency carrier
- encapsulating structure
- led
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Abstract
The invention discloses a novel transparent substrate LED packaging structure which comprises a transparent substrate and one or more LED chips. One or more transparent platform-shaped protruding portions are distributed on the first face of the transparent substrate. The upper end face of each protruding portion is directly provided with one LED chip. Electrode areas at the two ends of at least one LED chip are respectively and electrically connected with a conductor, wherein the conductor penetrates through the transparent substrate in the direction perpendicular to the first face. Preferentially, the first face of the transparent substrate is further provided with a light reflection mechanism. The light reflection mechanism is at least used for reflecting light which is produced at the two ends of the LED chip and possibly transmitted into the transparent substrate out of the packaging structure. Due to the design, on the one hand, the LED packaging structure is more concise and firmer, the manufacturing procedure is shortened, the device yield is improved, and device working stability is optimized; on the other hand, the LED packaging structure can achieve approximate 4*pi light emitting, and light emitting efficiency of the LED packaging structure is greatly improved.
Description
Technical field
The present invention relates to a kind of light emitting semiconductor device, particularly relate to a kind of novel transparent substrate LED encapsulating structure.
Background technology
Due to the continuous maturation of LED technology, there is large quantities of semiconductor light-emitting elements to be applied to illumination, demonstration field at present.For protection LED chip and make it and the object such as other element coordinates comparatively easily, in the time of manufacture LED device, generally need to carry out encapsulation process to LED chip.
Referring to shown in Fig. 1 is current common a kind of LED chip encapsulating structure, wherein on base material 2 ', generally need to offer groove, and the electric conductor 31,32 that setting coordinates with two electrode zones of LED chip 1 in groove, LED chip is installed again, and the encapsulating material 7 that utilizes epoxy resin and fluorescent material etc. to form encapsulates LED chip.For example, but there is many defects in such mode: one, the requirement on machining accuracy of electric conductor 31,32 is higher, if careless slightly in the course of processing, may cause electric conductor 31,32 to contact and cause device short circuit; Its two, because leaving space between electric conductor 31,32, make the sizable a part of region on LED chip to form effective connection with base material, need in this space, fill the materials such as heat-conducting glue, but heat-conducting glue is easy to react with encapsulating material for this reason; Its three, quite a few in the light of LED chip both ends transmittings can incident base material, and is stranded in base material, thereby causes the decline of light extraction efficiency.
Summary of the invention
Main purpose of the present invention is to provide a kind of novel transparent substrate LED encapsulating structure, to solve the problems of the prior art.
For achieving the above object, the invention provides following technical scheme:
A kind of novel transparent substrate LED encapsulating structure, comprise transparency carrier and more than one LED chip, wherein, on the first surface of described transparency carrier, be distributed with more than one transparent platform shape lug boss, each lug boss upper surface is all directly provided with a LED chip, wherein the electrode district at least one LED chip both ends is electrically connected with a conductor respectively, and described conductor passes described transparency carrier along the direction perpendicular to first surface.
As one of comparatively preferred embodiment, at least one LED chip both ends all convexedly stretch in outside described lug boss, run through described transparency carrier and the conductor coordinating with described LED chip is vertical, and in electrical contact with the electrode district of described LED chip.
As one of comparatively preferred embodiment, on described transparency carrier first surface, be also provided with at least in order to being reflected the reflection organization of described encapsulating structure by described LED chip both ends light generation and that may inject transparency carrier.
Further, described reflection organization comprises the protuberance being arranged on at least one LED chip both ends close position, and described protuberance outer wall is provided with at least in order to being reflected the reflector layer of described encapsulating structure by described LED chip both ends light generation and that may inject transparency carrier.
Wherein, described protuberance can be selected taper or frustum type structure, but is not limited to this.
Comparatively preferred, the cone angle of described pyramidal structure or frustum structure is more than 45 °.
Comparatively preferred, described protuberance and described transparency carrier are wholely set.
Comparatively preferred, described lug boss and described transparency carrier are wholely set.
Further, the LED chip that a plurality of series connection is installed and/or is arranged in parallel on described transparency carrier.
As one of comparatively preferred embodiment, wherein a LED chip electrode district is directly electrically connected through an electrode district of a linear conductor extending continuously and another LED chip.
Compared with prior art, advantage of the present invention comprises:
(1) by LED chip is combined with transparency carrier, the significantly light extraction efficiency of boost device, and by adopting aforementioned transparent platform shape lug boss, also can make LED chip better engage with substrate;
(2) further, by adopting the aforementioned conductor design that runs through transparency carrier, can effectively simplify device circuit structure and processing procedure, improve yield of devices, the job stability of optimised devices, and also can reduce to the blocking of device bright dipping part the further light extraction efficiency of boost device;
(3) further, by adopting aforementioned reflection organization, the light that the light that also can make LED chip produce, particularly both ends produce is close to 100% outgoing, makes device reach the approximate luminous function of 4 π.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, the accompanying drawing the following describes is only some embodiment that record in the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Figure 1 shows that the encapsulating structure schematic diagram of existing LED device;
Figure 2 shows that the encapsulating structure schematic diagram of a kind of LED device in one embodiment of the invention;
Figure 3 shows that the local structure for amplifying schematic diagram of A part in Fig. 2;
Figure 4 shows that the upward view of a kind of LED device in one embodiment of the invention.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below the specific embodiment of the present invention is elaborated.The example of these preferred implementations illustrates in the accompanying drawings.The embodiments of the present invention of describing shown in accompanying drawing and are with reference to the accompanying drawings only exemplary, and the present invention is not limited to these execution modes.
At this, also it should be noted that, for fear of the details because of unnecessary fuzzy the present invention, only show in the accompanying drawings with according to the closely-related structure of the solution of the present invention and/or treatment step, and omitted other details little with relation of the present invention.
In view of the deficiency of existing LED device encapsulation structure, this case inventor, after a large amount of research and practices, is proposed design of the present invention first, and effective lifting of having reached by this optimization of LED device architecture and having gone out optical property etc.
Novel transparent substrate LED encapsulating structure provided by the invention comprises transparency carrier and more than one LED chip, wherein, more than one transparent platform shape lug boss can be set on the first surface of described transparency carrier, and each LED chip is directly installed on to each lug boss upper surface, make LED chip and transparency carrier be able to directly engage, particularly, can make can contact as much as possible with transparency carrier with the remainder except electrode zone on an end face of LED chip, promote the reliability of LED encapsulating structure, further, also can make the electrode district at least one LED chip both ends be electrically connected with a conductor respectively, and described conductor passes described transparency carrier along the direction perpendicular to first surface.
Wherein, " first surface " mean transparency carrier in order to a side surface of LED chip to be installed, it also can be regarded as the front of transparency carrier, is mainly for the back side (the second face) with respect to transparency carrier.
In the present invention, can be by form the mode of through hole in modes such as machining, laser ablation, chemical etchings on transparency carrier, by by electric conducting materials such as metals directly filling, the mode such as physics or chemical deposition adds described through hole to form described conductor, and makes it to run through described transparency carrier.
Further, for reducing damage to transparency carrier, save conductor material and conductor to the blocking of light, preferably make conductor vertically run through described transparency carrier as far as possible.And, also can make described conductor extend on second of transparency carrier.
As one of comparatively preferred embodiment, at least one LED chip both ends all convexedly stretch in outside described lug boss, run through described transparency carrier and the conductor coordinating with described LED chip is vertical, and in electrical contact with the electrode district of described LED chip, so, can further reduce conductor blocking LED chip exiting surface.
Wherein, as one of comparatively preferred scheme, described lug boss can be one-body molded with described transparency carrier.
Wherein, described LED chip can comprise transparent substrates and be formed at epitaxial loayer in transparent substrates etc.
Wherein, the material of described transparency carrier at least can be selected from any in glass, sapphire, carborundum, organic transparent body, but is not limited to this, and wherein, organic transparent body comprises PC(Merlon), PMMA(polymethyl methacrylate) etc.
As one of comparatively preferred embodiment, on described transparency carrier first surface, be also provided with at least in order to being reflected the reflection organization of described encapsulating structure by described LED chip both ends light generation and that may inject transparency carrier.
Further, described reflection organization comprises the protuberance being arranged on at least one LED chip both ends close position, and described protuberance outer wall is provided with at least in order to being reflected the reflector layer of described encapsulating structure by described LED chip both ends light generation and that may inject transparency carrier.
Aforementioned reflector layer can have minute surface reflective structure, can also adopt the reflective structure with diffuse effect, and its material can be metal, pottery, organic material etc.
Wherein, described protuberance can be selected taper or frustum type structure, but is not limited to this, for example, also can adopt and have curved face type reflective structure etc.
Comparatively preferred, the cone angle of described pyramidal structure or frustum structure is more than 45 °.
Comparatively preferred, described protuberance and described transparency carrier are wholely set.
Further, the LED chip that a plurality of series connection is installed and/or is arranged in parallel on described transparency carrier.And that its implementation can have is multiple, for example, can, by the directly electrode district electric connection with another LED chip through a linear conductor extending continuously of an electrode district of a LED chip wherein, so can further simplify device circuit structure, shorten its processing procedure, improve yield of devices.
Postscript, the conductor in the present invention preferably adopts linear conductor, further to reduce its blocking light in LED device encapsulation structure.
Below in conjunction with drawings and Examples, technical scheme of the present invention is further explained to explanation.
Refer to Fig. 2, a kind of novel transparent substrate LED encapsulating structure that the present embodiment relates to comprises transparency carrier 2 and some LED chips 1, wherein, the front of described transparency carrier 2 is distributed with some transparent platform shape lug bosses, each lug boss upper surface is all directly provided with a LED chip 1, each LED chip both ends all convexedly stretches in outside described lug boss, runs through described transparency carrier and the conductor 3 ' coordinating with described LED chip is vertical, and in electrical contact with the electrode district of described LED chip.
Further, described transparency carrier front is also provided with some reflection organizations, and described reflection organization comprises the taper protuberance 5 being arranged on arbitrary LED chip both ends close position, comparatively preferred, and the cone angle of described taper protuberance is more than 45 °.And, referring to Fig. 2 and Fig. 3, described protuberance outer wall is provided with at least in order to being reflected the reflector layer 6 of described encapsulating structure by described LED chip both ends light generation and that may inject transparency carrier.
Comparatively preferred, described lug boss and protuberance and described transparency carrier are one-body molded.
Further, refer to Fig. 2 and Fig. 4, in the device of the present embodiment, can be by the directly electrode district electric connection with another LED chip through a linear conductor extending continuously of of each a LED chip electrode district, thus make some LED chips in this device form the structure of parallel connection and/or series connection.
In the present embodiment, by previous designs, can make LED device encapsulation structure more succinct firm, shorten its processing procedure, improve yield of devices, the job stability of optimised devices also can make device realize approximate 4 π luminous simultaneously, has greatly promoted its light extraction efficiency.
Finally also it should be noted that, in specification of the present invention, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thereby the process, method, article or the equipment that make to comprise a series of key elements not only comprise those key elements, but also comprise other key elements of clearly not listing, or be also included as the intrinsic key element of this process, method, article or equipment.
Claims (10)
1. a novel transparent substrate LED encapsulating structure, it is characterized in that comprising transparency carrier and more than one LED chip, on the first surface of described transparency carrier, be distributed with more than one transparent platform shape lug boss, each lug boss upper surface is all directly provided with a LED chip, wherein the electrode district at least one LED chip both ends is electrically connected with a conductor respectively, and described conductor passes described transparency carrier along the direction perpendicular to first surface.
2. novel transparent substrate LED encapsulating structure according to claim 1, it is characterized in that at least one LED chip both ends all convexedly stretch in outside described lug boss, run through described transparency carrier and the conductor coordinating with described LED chip is vertical, and in electrical contact with the electrode district of described LED chip.
3. novel transparent substrate LED encapsulating structure according to claim 1, is characterized in that being also provided with at least in order to being reflected the reflection organization of described encapsulating structure by described LED chip both ends light generation and that may inject transparency carrier on described transparency carrier first surface.
4. novel transparent substrate LED encapsulating structure according to claim 1, it is characterized in that described reflection organization comprises the protuberance being arranged on at least one LED chip both ends close position, described protuberance outer wall is provided with at least in order to being reflected the reflector layer of described encapsulating structure by described LED chip both ends light generation and that may inject transparency carrier.
5. novel transparent substrate LED encapsulating structure according to claim 4, is characterized in that described protuberance has taper or frustum type structure.
6. novel transparent substrate LED encapsulating structure according to claim 5, is characterized in that the cone angle of described pyramidal structure or frustum structure is preferably more than 45 °.
7. according to the novel transparent substrate LED encapsulating structure described in any one in claim 4-6, it is characterized in that described protuberance and described transparency carrier are wholely set.
8. according to the novel transparent substrate LED encapsulating structure described in any one in claim 1-6, it is characterized in that described lug boss and described transparency carrier are wholely set.
9. according to the novel transparent substrate LED encapsulating structure described in any one in claim 1-6, it is characterized in that the LED chip that a plurality of series connection is installed and/or is arranged in parallel on described transparency carrier.
10. novel transparent substrate LED encapsulating structure according to claim 9, is characterized in that wherein an electrode district of a LED chip is directly electrically connected through an electrode district of a linear conductor extending continuously and another LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410364715.5A CN104091876B (en) | 2014-07-29 | 2014-07-29 | Transparency carrier LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410364715.5A CN104091876B (en) | 2014-07-29 | 2014-07-29 | Transparency carrier LED encapsulation structure |
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| Publication Number | Publication Date |
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| CN104091876A true CN104091876A (en) | 2014-10-08 |
| CN104091876B CN104091876B (en) | 2016-11-23 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110943151A (en) * | 2015-02-25 | 2020-03-31 | 京瓷株式会社 | Package for mounting light-emitting element, light-emitting device, and light-emitting module |
| CN113450671A (en) * | 2021-07-28 | 2021-09-28 | 江西华创触控科技有限公司 | Transparent display screen |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252157A (en) * | 2007-11-30 | 2008-08-27 | 和谐光电科技（泉州）有限公司 | Encapsulation structure of LED light source |
| CN102117801B (en) * | 2009-12-31 | 2012-10-10 | 钰桥半导体股份有限公司 | Manufacturing method of high-power light-emitting diode module structure |
| US8299488B2 (en) * | 2010-12-16 | 2012-10-30 | King Dragon International Inc. | LED chip |
| CN202678403U (en) * | 2012-06-25 | 2013-01-16 | 歌尔声学股份有限公司 | Light emitting diode (LED) device |
| CN103236489A (en) * | 2013-04-18 | 2013-08-07 | 浙江深度照明有限公司 | LED (light emitting diode) packaging structure |
| CN204118115U (en) * | 2014-07-29 | 2015-01-21 | 中国科学院苏州纳米技术与纳米仿生研究所 | Novel transparent substrate LED encapsulation structure |
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2014
- 2014-07-29 CN CN201410364715.5A patent/CN104091876B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110943151A (en) * | 2015-02-25 | 2020-03-31 | 京瓷株式会社 | Package for mounting light-emitting element, light-emitting device, and light-emitting module |
| CN113450671A (en) * | 2021-07-28 | 2021-09-28 | 江西华创触控科技有限公司 | Transparent display screen |
| CN113450671B (en) * | 2021-07-28 | 2023-06-13 | 江西华创触控科技有限公司 | Transparent display screen |
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| CN104091876B (en) | 2016-11-23 |
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