US20130130417A1 - Manufacturing method of a light-emitting device - Google Patents
Manufacturing method of a light-emitting device Download PDFInfo
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- US20130130417A1 US20130130417A1 US13/302,462 US201113302462A US2013130417A1 US 20130130417 A1 US20130130417 A1 US 20130130417A1 US 201113302462 A US201113302462 A US 201113302462A US 2013130417 A1 US2013130417 A1 US 2013130417A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D31/00—Materials specially adapted for outerwear
- A41D31/04—Materials specially adapted for outerwear characterised by special function or use
- A41D31/08—Heat resistant; Fire retardant
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D31/00—Materials specially adapted for outerwear
- A41D31/04—Materials specially adapted for outerwear characterised by special function or use
- A41D31/08—Heat resistant; Fire retardant
- A41D31/085—Heat resistant; Fire retardant using layered materials
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- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62B—DEVICES, APPARATUS OR METHODS FOR LIFE-SAVING
- A62B17/00—Protective clothing affording protection against heat or harmful chemical agents or for use at high altitudes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0253—Polyolefin fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2437/00—Clothing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2571/00—Protective equipment
- B32B2571/02—Protective equipment defensive, e.g. armour plates, anti-ballistic clothing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
Definitions
- the application relates to a manufacturing method of a light-emitting device.
- the light radiation theory of light emitting diode is to generate light from the energy released by the electron moving between an n-type semiconductor and a p-type semiconductor. Because the light radiation theory of LED is different from the incandescent light which heats the filament, the LED is called a “cold” light source. Moreover, the LED is more sustainable, longevous, light and handy, and less power-consumption, therefore it is considered as another option of the light source for the illumination markets. The LED applies to various applications like the traffic signal, backlight module, street light, and medical instruments, and is gradually replacing the traditional lighting sources.
- FIG. 1 illustrates the structure of a conventional light emitting device 100 which includes a transparent substrate 10 , a semiconductor stack 12 formed above the transparent substrate 10 , and an electrode 14 formed above the semiconductor stack 12 , wherein the semiconductor stack 12 comprises, from the top, a first conductive-type semiconductor layer 120 , an active layer 122 , and a second conductive-type semiconductor layer 124 .
- FIG. 2 illustrates a conventional light emitting apparatus including a sub-mount 20 carrying an electrical circuit 202 , a solder 22 formed above the sub-mount 20 ; wherein the light emitting device 100 is bonded to the sub-mount 20 and is electrically connected with the electrical circuit 202 on the sub-mount 20 by the solder 22 , and an electric connection structure 24 that electrically connects the electrode 14 of the light emitting device 100 to the electrical circuit 202 on the sub-mount 20 .
- the sub-mount 20 may be a lead frame or a large size mounting substrate in order to facilitate circuit design and enhance heat dissipation.
- the surface of the transparent substrate 10 of the conventional light emitting device 100 as shown in FIG. 1 is substantially flat and the refractive index of the transparent substrate 10 is different from the refractive index of the external environment, the total internal reflection (TIR) occurs when a light A emitted from the active layer 122 . Therefore the light extraction efficiency from the light emitting device 100 is reduced drastically.
- a method for manufacturing a light-emitting device includes steps of: providing a substrate comprising an upper surface and a lower surface opposite to the upper surface; processing the upper surface to be an uneven surface; forming a light-emitting structure on the upper surface of the substrate; and forming a hole through the substrate by radiating a coherent laser beam to the lower surface of the substrate for a predetermined time; wherein the band gap energy of the coherent laser beam is higher than the band gap energy of the substrate thereby the substrate is etched away by the laser beam.
- FIG. 1 illustrates the structure of a conventional light emitting device.
- FIG. 2 illustrates the structure of a conventional light emitting apparatus.
- FIGS. 3A to 3E show a method for manufacturing a light-emitting device of a first embodiment of the present application.
- FIG. 4 is a cross-sectional view of a light-emitting device of a second embodiment of the present application.
- a method for manufacturing a light-emitting device of a first embodiment of the present application is disclosed.
- a substrate 302 having an upper surface 302 a and a lower surface 302 b opposite to the upper surface 302 a is provided, and then the upper surface 302 a is patterned by such as ICP process to be an uneven surface.
- the uneven surface can include a periodic pattern having a plurality of pattern units 303 having a pitch p and a raised portion 303 a.
- the width w of the raised portions 303 a is about 2 ⁇ m, and the height h of the raised portion 303 a is about 1.5 ⁇ m.
- the material of the substrate 302 includes conductive material such as Si, SiC, GaAs, or GaP, or insulating material such as sapphire, glass, or diamond.
- the substrate 302 is preferably insulative and has a monocrystalline structure, such as sapphire.
- a light-emitting structure 312 is formed by sequentially forming a buffer layer 304 , a first semiconductor layer 306 , an active layer 308 , and a second semiconductor layer 310 on the upper surface 302 a of the substrate 302 .
- Each of the first semiconductor layer 306 , active layer 308 , and second semiconductor layer 310 can be formed in an MOCVD chamber and composed of materials such as the series of aluminum gallium indium phosphide (AlGaInP), the series of aluminum gallium indium nitride (AlGaInN), and/or the series of zinc oxide (ZnO).
- the active layer 308 can be configured to be a single heterostructure (SH), a double heterostructure (DH), a double-side double heterostructure (DDH), or a multi-quantum well (MQW) structure.
- first coherent laser beam L 1 radiating a first coherent laser beam L 1 to the lower surface 302 b of the substrate 302 for a predetermined time to form a hole 314 through the substrate 302 .
- the band gap energy of the first coherent laser beam L 1 is higher than the band gap energy of the substrate 302 thereby a portion of the substrate 302 is removed away by the coherent laser beam L 1 .
- a portion of the substrate 302 is etched by the first coherent laser beam L 1 until the first coherent laser beam L 1 reaches the upper surface 302 a.
- a part of the first coherent laser beam L 1 becomes a non-coherent laser light L 1 ′ by being deflected from the direction of the first coherent laser beam L 1 during a predetermined time, and a photo-detector 4 can detect the intensity of the non-coherent laser light L 1 ′ to communicate to a controller (not shown) to stop radiating the coherent laser beam L 1 when the intensity of the non-coherent laser light L 1 ′ is detected.
- the intensity of the non-coherent laser light can be detected when the first coherent laser beam reaches the uneven surface.
- the pitch p of each of the pattern units 303 can be equal to the wavelength of the coherent laser beam L 1 , or the pitch p is smaller than the wavelength of the coherent laser beam L 1 .
- the distance d between two adjacent pattern units 303 is smaller than the wavelength of the laser beam L 1 .
- a conductive structure 318 is formed in the hole 314 and electrically connected to the light-emitting structure 312
- a first contact 316 is formed on the lower surface 302 b and electrically connected to the conductive structure 318 .
- the conductive structure 318 and the first contact 316 can also form a monolithic structure by deposition, electrical plating, or chemical plating.
- the conductive structure 318 can fill the hole 314 for better electrical contact between the light-emitting structure 312 and the first contact 316 .
- a second contact 320 can be formed on the second semiconductor layer 310 of the light-emitting structure 312 .
- the first contact 316 and the second contact 320 are for electrically connecting to an external device such as a submount or a package unit.
- a light-emitting device 300 of a second embodiment of the present application is shown.
- the primary difference between the present embodiment and the first embodiment is that a reflective layer 322 is formed between the lower surface 302 b and the contact 316 to reflect the emitted-light L from the active layer 308 to enhance the light extraction of the light-emitting device 300 .
- Most of the emitted-light L passes through the upper surface 302 a of the substrate 302 to reach the reflective layer 322 .
Abstract
A method for manufacturing a light-emitting device includes steps of: providing a substrate comprising an upper surface and a lower surface opposite to the upper surface; processing the upper surface to be an uneven surface; forming a light-emitting structure on the upper surface of the substrate; and forming a hole through the substrate by radiating a coherent laser beam to the lower surface of the substrate for a predetermined time; wherein the band gap energy of the coherent laser beam is higher than the band gap energy of the substrate thereby the substrate is etched away by the laser beam.
Description
- The application relates to a manufacturing method of a light-emitting device.
- The light radiation theory of light emitting diode (LED) is to generate light from the energy released by the electron moving between an n-type semiconductor and a p-type semiconductor. Because the light radiation theory of LED is different from the incandescent light which heats the filament, the LED is called a “cold” light source. Moreover, the LED is more sustainable, longevous, light and handy, and less power-consumption, therefore it is considered as another option of the light source for the illumination markets. The LED applies to various applications like the traffic signal, backlight module, street light, and medical instruments, and is gradually replacing the traditional lighting sources.
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FIG. 1 illustrates the structure of a conventionallight emitting device 100 which includes atransparent substrate 10, asemiconductor stack 12 formed above thetransparent substrate 10, and anelectrode 14 formed above thesemiconductor stack 12, wherein thesemiconductor stack 12 comprises, from the top, a first conductive-type semiconductor layer 120, anactive layer 122, and a second conductive-type semiconductor layer 124. - In addition, the
light emitting device 100 can be further connected to other components in order to form a light emitting apparatus.FIG. 2 illustrates a conventional light emitting apparatus including asub-mount 20 carrying anelectrical circuit 202, asolder 22 formed above thesub-mount 20; wherein thelight emitting device 100 is bonded to thesub-mount 20 and is electrically connected with theelectrical circuit 202 on thesub-mount 20 by thesolder 22, and anelectric connection structure 24 that electrically connects theelectrode 14 of thelight emitting device 100 to theelectrical circuit 202 on thesub-mount 20. Thesub-mount 20 may be a lead frame or a large size mounting substrate in order to facilitate circuit design and enhance heat dissipation. - Nevertheless, because the surface of the
transparent substrate 10 of the conventionallight emitting device 100 as shown inFIG. 1 is substantially flat and the refractive index of thetransparent substrate 10 is different from the refractive index of the external environment, the total internal reflection (TIR) occurs when a light A emitted from theactive layer 122. Therefore the light extraction efficiency from thelight emitting device 100 is reduced drastically. - A method for manufacturing a light-emitting device includes steps of: providing a substrate comprising an upper surface and a lower surface opposite to the upper surface; processing the upper surface to be an uneven surface; forming a light-emitting structure on the upper surface of the substrate; and forming a hole through the substrate by radiating a coherent laser beam to the lower surface of the substrate for a predetermined time; wherein the band gap energy of the coherent laser beam is higher than the band gap energy of the substrate thereby the substrate is etched away by the laser beam.
-
FIG. 1 illustrates the structure of a conventional light emitting device. -
FIG. 2 illustrates the structure of a conventional light emitting apparatus. -
FIGS. 3A to 3E show a method for manufacturing a light-emitting device of a first embodiment of the present application. -
FIG. 4 is a cross-sectional view of a light-emitting device of a second embodiment of the present application. - As shown in
FIGS. 3A to 3E , a method for manufacturing a light-emitting device of a first embodiment of the present application is disclosed. Referring toFIG. 3A , asubstrate 302 having anupper surface 302 a and alower surface 302 b opposite to theupper surface 302 a is provided, and then theupper surface 302 a is patterned by such as ICP process to be an uneven surface. The uneven surface can include a periodic pattern having a plurality ofpattern units 303 having a pitch p and a raised portion 303 a. The width w of the raised portions 303 a is about 2 μm, and the height h of the raised portion 303 a is about 1.5 μm. The material of thesubstrate 302 includes conductive material such as Si, SiC, GaAs, or GaP, or insulating material such as sapphire, glass, or diamond. In the embodiment, thesubstrate 302 is preferably insulative and has a monocrystalline structure, such as sapphire. - Referring to
FIG. 3B , a light-emitting structure 312 is formed by sequentially forming abuffer layer 304, afirst semiconductor layer 306, anactive layer 308, and asecond semiconductor layer 310 on theupper surface 302 a of thesubstrate 302. Each of thefirst semiconductor layer 306,active layer 308, andsecond semiconductor layer 310 can be formed in an MOCVD chamber and composed of materials such as the series of aluminum gallium indium phosphide (AlGaInP), the series of aluminum gallium indium nitride (AlGaInN), and/or the series of zinc oxide (ZnO). Theactive layer 308 can be configured to be a single heterostructure (SH), a double heterostructure (DH), a double-side double heterostructure (DDH), or a multi-quantum well (MQW) structure. - Referring to
FIG. 3C , radiating a first coherent laser beam L1 to thelower surface 302 b of thesubstrate 302 for a predetermined time to form ahole 314 through thesubstrate 302. The band gap energy of the first coherent laser beam L1 is higher than the band gap energy of thesubstrate 302 thereby a portion of thesubstrate 302 is removed away by the coherent laser beam L1. A portion of thesubstrate 302 is etched by the first coherent laser beam L1 until the first coherent laser beam L1 reaches theupper surface 302 a. A part of the first coherent laser beam L1 becomes a non-coherent laser light L1′ by being deflected from the direction of the first coherent laser beam L1 during a predetermined time, and a photo-detector 4 can detect the intensity of the non-coherent laser light L1′ to communicate to a controller (not shown) to stop radiating the coherent laser beam L1 when the intensity of the non-coherent laser light L1′ is detected. Mostly, the intensity of the non-coherent laser light can be detected when the first coherent laser beam reaches the uneven surface. The pitch p of each of thepattern units 303 can be equal to the wavelength of the coherent laser beam L1, or the pitch p is smaller than the wavelength of the coherent laser beam L1. The distance d between twoadjacent pattern units 303 is smaller than the wavelength of the laser beam L1. - Referring to
FIG. 3D , radiating a second coherent laser beam L2 for cleaning the byproducts (not shown) inside thehole 314. - Referring to
FIG. 3E , a conductive structure 318 is formed in thehole 314 and electrically connected to the light-emitting structure 312, and afirst contact 316 is formed on thelower surface 302 b and electrically connected to the conductive structure 318. In another embodiment, the conductive structure 318 and thefirst contact 316 can also form a monolithic structure by deposition, electrical plating, or chemical plating. The conductive structure 318 can fill thehole 314 for better electrical contact between the light-emitting structure 312 and thefirst contact 316. Further, asecond contact 320 can be formed on thesecond semiconductor layer 310 of the light-emitting structure 312. Thefirst contact 316 and thesecond contact 320 are for electrically connecting to an external device such as a submount or a package unit. - As shown in
FIG. 4 , a light-emitting device 300 of a second embodiment of the present application is shown. The primary difference between the present embodiment and the first embodiment is that areflective layer 322 is formed between thelower surface 302 b and thecontact 316 to reflect the emitted-light L from theactive layer 308 to enhance the light extraction of the light-emitting device 300. Most of the emitted-light L passes through theupper surface 302 a of thesubstrate 302 to reach thereflective layer 322. - Although the present application has been explained above, it is not the limitation of the range, the sequence in practice, the material in practice, or the method in practice. Any modification or decoration for present application is not detached from the spirit and the range of such.
Claims (14)
1. A method for manufacturing a light-emitting device comprising steps of:
providing a substrate comprising an upper surface and a lower surface opposite to the upper surface;
processing the upper surface to be an uneven surface;
forming a light-emitting structure on the upper surface of the substrate; and
forming a hole through the substrate by radiating a first coherent laser beam to the lower surface of the substrate for a predetermined time;
wherein the band gap energy of the coherent laser beam is higher than the band gap energy of the substrate thereby a portion of the substrate is etched away by the first coherent laser beam.
2. The method according to claim 1 , further comprising forming a conductive structure in the hole and electrically connected to the light-emitting structure, and forming a first contact on the lower surface of the substrate and electrically connected to the conductive structure after forming the hole.
3. The method according to claim 1 , wherein a part of the first coherent laser beam becomes a non-coherent laser light during the predetermined time by being deflected from the direction of the first coherent laser beam.
4. The method according to claim 1 , further comprising detecting the intensity of the non-coherent laser light by a photo-detector.
5. The method according to claim 4 , further comprising stopping radiating the first coherent laser beam when the intensity of the non-coherent laser light is detected.
6. The method according to claim 5 , wherein the intensity of the non-coherent laser light is detected when the first coherent laser beam reaches the uneven surface.
7. The method according to claim 1 , wherein the uneven surface comprises a periodic pattern having plurality of pattern units having a pitch.
8. The method according to claim 7 , wherein the pitch is the same as the wavelength of the coherent laser beam.
9. The method according to claim 7 , wherein the pitch is smaller than the wavelength of the coherent laser beam.
10. The method according to claim 7 , wherein the distance between two adjacent pattern units is smaller than the wavelength of the laser beam.
11. The method according to claim 5 , further comprising cleaning the hole by a second coherent laser beam after stopping radiating the coherent laser beam.
12. The method according to claim 1 , wherein the step of forming the light-emitting structure comprising steps of forming a buffer layer on the uneven surface of the substrate, forming a first semiconductor layer on the buffer layer, forming an active layer on the first semiconductor layer, and forming a second semiconductor layer on the active layer.
13. The method according to claim 1 , further comprising forming a reflective layer on the lower surface of the substrate.
14. The method according to claim 1 , wherein the method is performed in an MOCVD chamber.
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US13/302,462 US20130130417A1 (en) | 2011-11-22 | 2011-11-22 | Manufacturing method of a light-emitting device |
US15/000,757 US10183465B1 (en) | 2010-11-22 | 2016-01-19 | Fabric product having flame resistant properties |
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US13/302,462 US20130130417A1 (en) | 2011-11-22 | 2011-11-22 | Manufacturing method of a light-emitting device |
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US15/000,757 Active 2032-04-25 US10183465B1 (en) | 2010-11-22 | 2016-01-19 | Fabric product having flame resistant properties |
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WO2015109135A2 (en) * | 2014-01-17 | 2015-07-23 | Qed Labs Llc | Articles with improved flame retardancy and/or melt dripping properties |
EP3263793A1 (en) * | 2016-06-28 | 2018-01-03 | HILTI Aktiengesellschaft | Fire protection element comprising a backing web |
CA3171137A1 (en) | 2019-03-28 | 2020-10-01 | Southern Mills, Inc. | Flame resistant fabrics |
CN111521637B (en) * | 2020-06-07 | 2022-06-17 | 苏州大学 | Method for evaluating thermal protection time of fabric |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
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