CN104073847B - Diversion method for improving concentration polarization in microwave straight metal waveguide gold-electroplating process - Google Patents
Diversion method for improving concentration polarization in microwave straight metal waveguide gold-electroplating process Download PDFInfo
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- CN104073847B CN104073847B CN201410330672.9A CN201410330672A CN104073847B CN 104073847 B CN104073847 B CN 104073847B CN 201410330672 A CN201410330672 A CN 201410330672A CN 104073847 B CN104073847 B CN 104073847B
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- metal waveguide
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Abstract
The invention provides a diversion method for improving concentration polarization in a microwave straight metal waveguide gold-electroplating process, which comprises the following steps: providing a microwave straight metal waveguide with a pictographic anode in the microwave cavity, and an gold-electroplating solution diversion device; fixing the microwave straight metal waveguide to an electroplating hanger; fixing the small-caliber part of the diversion device and the microwave straight metal waveguide chamber to the electroplating hanger in the same axial direction with a certain distance to form an electroplating integral body; after carrying out gold-electroplating pretreatment steps, immersing the electroplating integral body in the gold-electroplating solution; and enabling the electroplating integral body and the gold-electroplating solution to move relatively. The method achieves the goal of improving the concentration polarization in the microwave straight metal waveguide gold-electroplating process, increases the deposition rate of the gold-electroplating layer in the microwave straight metal waveguide gold-electroplating process, enhances the production efficiency, and improves the quality of the microwave straight metal waveguide gold-electroplating layer.
Description
Technical field
The present invention relates to waveguide manufacture field, improve dense during particularly to one kind for microwave regular metal waveguide electrogilding
The method of river diversion of difference polarization.
Background technology
Microwave regular metal waveguide has loss is little, power capacity is big, radiationless loss, structure are simple, easily fabricated etc.
Advantage, is widely used in microwave communication, radar, particularly high power, in high-frequency Precision Test System.It is processed in waveguide
During type, for reducing loss during microwave signal transmission, improve electrical conductivity, corrosion resistance and the weldability of waveguide inwall,
Typically take craft of gilding, electroplate one layer of gold in microwave regular metal waveguide surface.For ensureing the thickness of waveguide intracavity electrogilding layer
Degree and quality, need to be inserted into a conformal anode and anode jacket in waveguide cavity.Simultaneously because high-frequency microwave waveguide dimensions very little,
The size of millimeter waveguide has reached grade, after insertion conformal anode and anode jacket, reduce further the sky of waveguide cavity
Between, cause gold-plating solution in narrow and small waveguide intracavity flow blockage, can not obtain after electrogilding liquid is consumed in inner chamber effectively
Supplement, exacerbate concentration polarization in electroplating process it is difficult to ensure that inner chamber electroplates thickness and the quality of layer gold.
There are mechanical mixing method and shifting for the technical method of concentration polarization when improving microwave regular metal waveguide electrogilding at present
Moving electrode method:
Mechanical mixing method: when mechanical mixing method is microwave regular metal waveguide electrogilding, put into one in gold-plating solution
Mechanical arm, mechanical arm can force the convection current of electrogilding liquid by motor or magnetically-actuated rotation, the rotation of mechanical arm, realizes
Electrogilding liquid bulk concentration is uniform, the boundary layer when flowing of gold-plating solution simultaneously reduces microwave regular metal waveguide electrogilding
Thickness, improve concentration polarization during microwave regular metal waveguide electrogilding, improve plating layer gold quality.
Moving electrode method: when moving electrode method is microwave regular metal waveguide electrogilding, microwave regular metal waveguide is hanged
It is hung on above transportable electrode, when electrode is mobile, microwave regular metal waveguide is also moved together, by changing microwave rule
Then position in gold-plating solution for the metal waveguide, the concentration realizing solution bulk during electrogilding is substantially uniform, electrogilding simultaneously
The thickness of boundary layer when the flowing of solution reduces microwave regular metal waveguide electrogilding, improves microwave regular metal waveguide electricity
Concentration polarization when gold-plated, improves the quality of plating layer gold.
But the disadvantage of prior art is cannot to be effectively improved concentration polarization in microwave regular metal waveguide electrogilding
Change, the microwave regular metal waveguide plating layer gold obtaining is of poor quality, and qualification rate is low, causes production cost height, electroplating efficiency low.
Because microwave regular metal waveguide cavity is small-sized, the size of millimeter waveguide has reached grade, insertion as
After shape anode and anode jacket, reduce further the space of waveguide cavity, cause gold-plating solution to flow in narrow and small waveguide intracavity
Retardance, cannot realize the effective flowing of electrogilding liquid in inner chamber using the method for stirring or traveling electrode, cause inner chamber to electroplate
When interfacial layer thickness thicken, can not effectively be supplemented after electrogilding liquid is consumed in inner chamber simultaneously, be reduced molten in inner chamber
The concentration of liquid body.Supplementing of inner chamber boundary layer electrogilding liquid relies on diffusion to realize, and diffusion relies on boundary layer and solution bulk dense
Degree difference provides power, can not effectively be supplemented, gold-plating solution body in inner chamber after in inner chamber, electrogilding liquid is consumed
Concentration reduce after, the power of boundary layer diffusion reduces, and diffusion velocity reduces, and leads to diffusion velocity and golden speed of separating out difference to enter one
Step expands, and exacerbates the concentration polarization in electroplating process it is difficult to ensure that inner chamber electroplates thickness and the quality of layer gold, reduces product
Qualification rate, increased production cost.
Therefore, it is badly in need of improving concentration difference during a kind of inexpensive, efficient regular metal waveguide electrogilding for microwave of exploitation
The method of polarization, solves during existing microwave regular metal waveguide electrogilding because concentration polarization is big, causes microwave regular metal ripple
The problem that conductive Gold plated Layer is of poor quality, accepted product percentage is low and electroplating efficiency is low.
Content of the invention
It is an object of the invention to provide improving during a kind of inexpensive, efficient regular metal waveguide electrogilding for microwave
The method of river diversion of concentration polarization, solves during existing microwave regular metal waveguide electrogilding because concentration polarization is big, causes microwave to advise
Then metal waveguide electroplates the problem that layer gold is of poor quality, accepted product percentage is low and electroplating efficiency is low.
The technical scheme is that and be achieved in that:
Improve the method for river diversion of concentration polarization during a kind of regular metal waveguide electrogilding for microwave, comprise the following steps:
Step 101, provides the microwave regular metal waveguide that a microwave intracavity has conformal anode, a gold-plating solution water conservancy diversion dress
Put；
Step 102, Electropolating hangers are fixed in described microwave regular metal waveguide；
Step 103, make described guiding device osculum path portion and microwave regular metal waveguide cavity be in same axial direction,
In a distance and be fixed on Electropolating hangers to form a plating overall；
Step 104, after electrogilding pre-treatment step, will electroplate in overall immersion gold-plating solution；
Step 105, makes plating overall and gold-plating solution relative movement.
Alternatively, in step 101, in generally circular in shape, rectangle, the ridged of microwave regular metal waveguide cavity or ellipse
Any one.
Alternatively, in described step 101, microwave regular metal waveguide material is copper alloy or aluminium alloy.
Alternatively, in described step 101, the flow-guiding mouth of described gold-plating solution guiding device is generally circular in shape, rectangle, ridge
Any one in shape or ellipse.
Alternatively, in described step 101, the material of described gold-plating solution guiding device is insulant.
Alternatively, in described step 101, the overall structure of described gold-plating solution guiding device is cone, along centrage
Section is the ever-reduced splayed of bore or class splayed structure, and the osculum path portion of gold-plating solution guiding device contains can
Flexible structure.
Alternatively, in described step 101, the osculum path portion of described gold-plating solution guiding device can up and down, left and right etc.
The regulation of all angles.
Alternatively, in described step 102 and step 103, the fixing meanss of microwave regular metal waveguide and guiding device can
Bundle method for tinsel.
Alternatively, in described step 103, described guiding device osculum path portion and microwave regular metal waveguide cavity are apart
Distance is 2mm-10cm.
Alternatively, in described step 105, the flow direction of the overall moving direction of described plating or gold-plating solution
Axial direction for the heavy caliber part of gold-plating solution guiding device.
The invention has the beneficial effects as follows:
(1) effectively reduce concentration polarization, when improving electrogilding, the sedimentation rate of plating layer gold, improve plating and produce
Efficiency；
(2) improve the quality that layer gold is electroplated in microwave regular metal waveguide, improve the qualification rate of product, reduce and produce into
This；
(3) current efficiency when improving microwave regular metal waveguide electrogilding, reduces microwave regular metal waveguide electrogilding
When power, reduce production cost.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description be only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, acceptable
Other accompanying drawings are obtained according to these accompanying drawings.
Improve the water conservancy diversion side of concentration polarization for the present invention during a kind of regular metal waveguide electrogilding for microwave that Fig. 1 provides
The flow chart of method；
Improve the water conservancy diversion side of concentration polarization for the present invention during a kind of regular metal waveguide electrogilding for microwave that Fig. 2 provides
The process chart of method；
Improve the water conservancy diversion side of concentration polarization for the present invention during a kind of regular metal waveguide electrogilding for microwave that Fig. 3 provides
The schematic diagram of method.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation description is it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of not making creative work
Embodiment, broadly falls into the scope of protection of the invention.
As shown in figure 1, improving the water conservancy diversion of concentration polarization during a kind of regular metal waveguide electrogilding for microwave of the present invention
Method, comprises the following steps:
Step 101: provide a microwave intracavity to have the microwave regular metal waveguide of conformal anode, a gold-plating solution water conservancy diversion dress
Put；
Step 102: Electropolating hangers are fixed in described microwave regular metal waveguide；
Step 103: make described guiding device and microwave regular metal waveguide cavity be in same axial direction, at a distance of a spacing
From and be fixed on Electropolating hangers to form a plating overall；
Step 104: after electrogilding pre-treatment step, will electroplate in overall immersion gold-plating solution；
Step 105: make plating overall and gold-plating solution relative movement, realize changing during microwave regular metal waveguide electrogilding
The purpose of kind concentration polarization.
In above-mentioned steps 101, appointing in generally circular in shape, rectangle, the ridged of microwave regular metal waveguide cavity or ellipse
Meaning is a kind of, and microwave regular metal waveguide material is copper alloy, aluminium alloy or other metal alloys.Described gold-plating solution water conservancy diversion
Any one in generally circular in shape, rectangle, the ridged of device or ellipse, the material of gold-plating solution guiding device is insulation
Material, such as pvc, pp or other insulant.
In above-mentioned steps 101, the overall structure of described gold-plating solution guiding device is cone, is mouth along centrage section
The ever-reduced splayed in footpath or class splayed structure.The osculum path portion of gold-plating solution guiding device is telescopic knot
Structure it is preferable that gold-plating solution guiding device osculum path portion can up and down, the regulation of all angles such as left and right.
In above-mentioned steps 102 and step 103, the fixing meanss of microwave regular metal waveguide and guiding device can be tinsel
Binding method.
In above-mentioned steps 103, described guiding device and microwave regular metal waveguide cavity distance are 2mm-10cm.
In above-mentioned steps 104, described electrogilding pre-treatment step includes but is not limited to oil removing, washing, activation, plating
Nickel, washing, activation, specific electrogilding pre-treatment step determines according to concrete electroplating technology flow process.
In above-mentioned steps 105, the flow direction of the overall moving direction of described plating or gold-plating solution is plating
The axial direction of the heavy caliber part of gold solution guiding device.
Improve leading of concentration polarization during a kind of regular metal waveguide electrogilding for microwave based on the present invention described in Fig. 1
Stream method flow diagram, is described in further detail to the present invention below in conjunction with specific embodiment.
In the present embodiment, microwave regular metal waveguide, gold-plating solution guiding device are fixed on electricity using binding method
Plating hanger forms a plating entirety, and then after oil removing, washing, activation, electronickelling, washing, activation step, immersion electrogilding is molten
In liquid, make plating overall and gold-plating solution relative movement, realize microwave regular metal waveguide and improve concentration polarization in electrogilding
The purpose changed, further illustrates the detailed process method and steps of the present invention with reference to specific process schematic representation 2.
As shown in Figure 2 a, a microwave regular metal waveguide 2 carrying conformal anode 1 and gold-plating solution water conservancy diversion dress are chosen
Put 3.The waveguide cavity of microwave regular metal waveguide 2 is shaped as rectangle, a size of 0.8 × 1.6mm, and material is h59 copper；Electrogilding is molten
The flow-guiding mouth 4 of liquid guiding device 3 be shaped as rectangle, a size of 1 × 2mm, the material of gold-plating solution guiding device 3 is pp,
The overall structure of gold-plating solution guiding device is cone, a diameter of 80mm of heavy caliber part, is mouth along centrage section
The ever-reduced splayed structure in footpath, the osculum path portion of gold-plating solution guiding device 3 contains telescopic structure 5, passes through
Collapsible structure 5, the osculum path portion of gold-plating solution guiding device can up and down, the regulation of all angles such as left and right.
As shown in Figure 2 b, using tinsel 6, microwave regular metal waveguide 2 bolt with conformal anode 1 is hung on plating to hang
Tool 7.The material of tinsel 6 is the copper wire of outer layer covers insulant, a diameter of 0.8mm of tinsel 6.
As shown in Figure 2 c, gold-plating solution guiding device is fixed on Electropolating hangers, forms plating entirety, concrete grammar
For: using tinsel 6, gold-plating solution guiding device 3 is tied in Electropolating hangers 7, gold-plating solution guiding device 3 when being tied
The waveguide cavity of flow-guiding mouth 4 and microwave regular metal waveguide 2 is in same axial direction above, on gold-plating solution guiding device 3
The distance of the waveguide Cavity surface of face flow-guiding mouth 4 and microwave regular metal waveguide 2 is 5mm.
As shown in Figure 2 d, electroplate entirety after oil removing, washing, activation, electronickelling, washing, activation step, will electroplate whole
In body immersion gold-plating solution 8.
As shown in Figure 2 d, along direction 9, carrying out repeatedly moves left and right in gold-plating solution 8 to make plating entirety, realizes micro-
Improve the purpose of concentration polarization during ripple regular metal waveguide electrogilding.
Improve dense during with reference to specific principle schematic Fig. 3 to microwave regular metal waveguide electrogilding as shown in Figure 2 d
The principle of difference polarization further describes.
As shown in Figure 3 a, gold-plating solution guiding device 3 is when along direction 9 to left movement, gold-plating solution guiding device 3
Heavy caliber partly constantly collect gold-plating solution 8, collecting and gold-plating solution guiding device 3 with gold-plating solution 8
Bore constantly reduce, flow velocity in gold-plating solution guiding device 3 for the gold-plating solution 8 is constantly accelerated, when gold-plating solution 8
During by the minimum flow-guiding mouth 4 of gold-plating solution guiding device 3 bore, gold-plating solution 8 flowing velocity is the soonest and along direction 10
Spray to microwave regular metal waveguide cavity.
As shown in Figure 3 b, when the gold-plating solution 8 being come along direction 10 spray by guiding device runs into microwave regular metal ripple
When leading 2, gold-plating solution 8 quickly flows in the space between microwave regular metal waveguide cavity and conformal anode 1 along direction 11
Dynamic.The electrogilding that the gold-plating solution of quick flowing supplements the microwave regular metal waveguide intracavity being consumed during electrogilding is molten
Liquid, during electrogilding, the concentration of microwave regular metal waveguide intracavity gold-plating solution body is not because electrogilding process
In be consumed and reduce it is ensured that microwave regular metal waveguide intracavity gold-plating solution bulk concentration and microwave regular metal waveguide
The concentration difference of chamber surface interface layer 12 it is ensured that in microwave regular metal waveguide cavity surface interface layer 12 ion diffusion velocity,
Effectively improve concentration polarization during microwave regular metal waveguide electrogilding；Other gold-plating solution is along direction 11 in microwave
Regular metal waveguide intracavity quickly flows, and is thinned the thickness of microwave regular metal waveguide cavity surface interface circle 12, shorten from
Diffusion length in microwave regular metal waveguide cavity surface interface layer 12 for the son, therefore can improve microwave regular metal waveguide cavity table
The ion concentration of face boundary layer 12, effectively improves concentration polarization during microwave regular metal waveguide electrogilding.
In sum, improve the water conservancy diversion side of concentration polarization during a kind of regular metal waveguide electrogilding for microwave of the present invention
Method, by being fixed on Electropolating hangers using binding method and forming an electricity microwave regular metal waveguide, gold-plating solution guiding device
Plating is overall, then in immersion gold-plating solution after oil removing, washing, activation, electronickelling, washing, activation step, makes plating overall
With gold-plating solution relative movement, it is possible to achieve improve the purpose of concentration polarization during microwave regular metal waveguide electrogilding, and then
Improve the deposition velocity electroplating layer gold during microwave regular metal waveguide electrogilding, improve production efficiency, improve micro- simultaneously
The quality of layer gold is electroplated in ripple regular metal waveguide, improves the qualification rate of product, reduces production cost.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Within god and principle, any modification, equivalent substitution and improvement made etc., should be included within the scope of the present invention.
Claims (9)
1. improve the method for river diversion of concentration polarization during a kind of regular metal waveguide electrogilding for microwave it is characterised in that including
Following steps:
Step (101), provides the microwave regular metal waveguide that a microwave intracavity has conformal anode, a gold-plating solution water conservancy diversion dress
Put；
Step (102), Electropolating hangers are fixed in described microwave regular metal waveguide；
Step (103), makes described guiding device osculum path portion and microwave regular metal waveguide cavity be in same axial direction, phase
Away from certain distance and be fixed on Electropolating hangers to form a plating overall；Described guiding device osculum path portion and microwave regular metal
The length of waveguide cavity distance is 2mm-10cm；
Step (104), after plating step, immerses overall for described plating in gold-plating solution；
Step (105), makes plating overall and gold-plating solution relative movement.
2. as claimed in claim 1 a kind of regular metal waveguide electrogilding for microwave when improve the water conservancy diversion side of concentration polarization
Method it is characterised in that in described step (101), generally circular in shape, rectangle, the ridged of microwave regular metal waveguide cavity or ellipse
Any one in shape.
3. as claimed in claim 1 a kind of regular metal waveguide electrogilding for microwave when improve the water conservancy diversion side of concentration polarization
Method is it is characterised in that in described step (101), microwave regular metal waveguide material is copper alloy or aluminium alloy.
4. as claimed in claim 1 a kind of regular metal waveguide electrogilding for microwave when improve the water conservancy diversion side of concentration polarization
Method it is characterised in that in described step (101), the flow-guiding mouth of described gold-plating solution guiding device is generally circular in shape, rectangle,
Any one in ridged or ellipse.
5. as claimed in claim 1 a kind of regular metal waveguide electrogilding for microwave when improve the water conservancy diversion side of concentration polarization
Method is it is characterised in that in described step (101), the material of described gold-plating solution guiding device is insulant.
6. as claimed in claim 1 a kind of regular metal waveguide electrogilding for microwave when improve the water conservancy diversion side of concentration polarization
Method is it is characterised in that in described step (101), the overall structure of described gold-plating solution guiding device is cone, along centrage
Section is the ever-reduced splayed of bore or class splayed structure, and the osculum path portion of gold-plating solution guiding device contains can
Flexible structure.
7. as claimed in claim 1 a kind of regular metal waveguide electrogilding for microwave when improve the water conservancy diversion side of concentration polarization
Method it is characterised in that in described step (101), the osculum path portion of described gold-plating solution guiding device can up and down, left and right each
Individual angular adjustment.
8. as claimed in claim 1 a kind of regular metal waveguide electrogilding for microwave when improve the water conservancy diversion side of concentration polarization
Method it is characterised in that in described step (102) and step (103), the fixing meanss of microwave regular metal waveguide and guiding device
Bundle method for tinsel.
9. as claimed in claim 1 a kind of regular metal waveguide electrogilding for microwave when improve the water conservancy diversion side of concentration polarization
Method is it is characterised in that in described step (105), described electroplates the moving direction of entirety or the flowing side of gold-plating solution
Axial direction to the heavy caliber part for gold-plating solution guiding device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410330672.9A CN104073847B (en) | 2014-07-08 | 2014-07-08 | Diversion method for improving concentration polarization in microwave straight metal waveguide gold-electroplating process |
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|---|---|---|---|
| CN201410330672.9A CN104073847B (en) | 2014-07-08 | 2014-07-08 | Diversion method for improving concentration polarization in microwave straight metal waveguide gold-electroplating process |
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| CN104073847B true CN104073847B (en) | 2017-02-01 |
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| JP7101608B2 (en) * | 2018-12-21 | 2022-07-15 | ルネサスエレクトロニクス株式会社 | Semiconductor devices and their manufacturing methods |
| CN110438537B (en) * | 2019-08-09 | 2021-10-01 | 常州大学 | High-flux heat exchange tube and preparation method and application thereof |
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| CN201793874U (en) * | 2010-09-01 | 2011-04-13 | 常州市郑陆特种纺机专件有限公司 | Knitting machine for plain dimensional multilayer cylinder-shaped or cylindrical special-shaped braided fabric |
| CN202465932U (en) * | 2011-12-27 | 2012-10-03 | 中国航空工业第六○七研究所 | Flexible auxiliary anode for electroplating inner cavity of multi-bend waveguide |
| CN103305885A (en) * | 2013-06-01 | 2013-09-18 | 北京工业大学 | Diversion type auxiliary plating device and plating method aiming at plating inner surface of hollow plated part |
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2014
- 2014-07-08 CN CN201410330672.9A patent/CN104073847B/en not_active Expired - Fee Related
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| CN201793874U (en) * | 2010-09-01 | 2011-04-13 | 常州市郑陆特种纺机专件有限公司 | Knitting machine for plain dimensional multilayer cylinder-shaped or cylindrical special-shaped braided fabric |
| CN202465932U (en) * | 2011-12-27 | 2012-10-03 | 中国航空工业第六○七研究所 | Flexible auxiliary anode for electroplating inner cavity of multi-bend waveguide |
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