CN104073847A - Diversion method for improving concentration polarization in microwave straight metal waveguide gold-electroplating process - Google Patents
Diversion method for improving concentration polarization in microwave straight metal waveguide gold-electroplating process Download PDFInfo
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- CN104073847A CN104073847A CN201410330672.9A CN201410330672A CN104073847A CN 104073847 A CN104073847 A CN 104073847A CN 201410330672 A CN201410330672 A CN 201410330672A CN 104073847 A CN104073847 A CN 104073847A
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Abstract
The invention provides a diversion method for improving concentration polarization in a microwave straight metal waveguide gold-electroplating process, which comprises the following steps: providing a microwave straight metal waveguide with a pictographic anode in the microwave cavity, and an gold-electroplating solution diversion device; fixing the microwave straight metal waveguide to an electroplating hanger; fixing the small-caliber part of the diversion device and the microwave straight metal waveguide chamber to the electroplating hanger in the same axial direction with a certain distance to form an electroplating integral body; after carrying out gold-electroplating pretreatment steps, immersing the electroplating integral body in the gold-electroplating solution; and enabling the electroplating integral body and the gold-electroplating solution to move relatively. The method achieves the goal of improving the concentration polarization in the microwave straight metal waveguide gold-electroplating process, increases the deposition rate of the gold-electroplating layer in the microwave straight metal waveguide gold-electroplating process, enhances the production efficiency, and improves the quality of the microwave straight metal waveguide gold-electroplating layer.
Description
Technical field
The present invention relates to waveguide manufacture field, particularly a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding.
Background technology
Microwave rule metal wave-guide has that loss is little, power capacity is large, radiationless loss, simple in structure, be easy to the advantages such as manufacture, be widely used in micro-wave communication, radar, particularly superpower, high-frequency Precision Test System.In the process of waveguide machine-shaping, the loss while transmission for reducing microwave signal, specific conductivity, erosion resistance and the weldability of raising waveguide inwall, generally take craft of gilding, at microwave rule metal wave-guide electroplating surface layer of gold.For ensureing thickness and the quality of electrogilding layer in waveguide cavity, need in waveguide cavity, insert a conformal anode and anode jacket.Simultaneously because high frequency microwave waveguide dimensions is very little, the size of millimeter waveguide has reached grade, inserting after conformal anode and anode jacket, further reduce the space of waveguide cavity, cause gold-plating solution flow blockage in narrow and small waveguide cavity, in inner chamber, electrogilding liquid can not effectively be supplemented after being consumed, and has aggravated the concentration polarization in electroplating process, is difficult to ensure thickness and the quality of inner chamber electrogilding layer.
Be that while improving microwave rule metal wave-guide electrogilding, the technological method of concentration polarization has mechanical mixing method and moving electrode method at present:
Mechanical mixing method: when mechanical mixing method is microwave rule metal wave-guide electrogilding, in gold-plating solution, put into a mechanical arm, mechanical arm can be by motor or magnetic force driving rotation, the convection current of electrogilding liquid is forced in the rotation of mechanical arm, realize electrogilding liquid bulk concentration even, the thickness of interfacial layer when simultaneously gold-plating solution mobile reduced microwave rule metal wave-guide electrogilding, the concentration polarization while having improved microwave rule metal wave-guide electrogilding, has improved the quality of electrogilding layer.
Moving electrode method: when moving electrode method is microwave rule metal wave-guide electrogilding, microwave rule metal wave-guide is hung on above transportable electrode, in the time that electrode moves, the also motion together of microwave rule metal wave-guide, by changing the position of microwave rule metal wave-guide in gold-plating solution, while realizing electrogilding, the concentration of solution body is substantially even, the thickness of interfacial layer when simultaneously gold-plating solution mobile reduced microwave rule metal wave-guide electrogilding, concentration polarization while having improved microwave rule metal wave-guide electrogilding, has improved the quality of electrogilding layer.
But the disadvantage of prior art is cannot effectively improve concentration polarization in the time of microwave rule metal wave-guide electrogilding, the microwave obtaining rule metal wave-guide electrogilding layer is of poor quality, and qualification rate is low, causes that production cost is high, electroplating efficiency is low.
Because microwave rule metal wave guide cavity is small-sized, the size of millimeter waveguide has reached grade, inserting after conformal anode and anode jacket, further reduce the space of waveguide cavity, cause gold-plating solution flow blockage in narrow and small waveguide cavity, the method of use stirring or traveling electrode cannot realize the effective of electrogilding liquid in inner chamber and flow, while causing inner chamber to electroplate, interfacial layer thickness thickens, in inner chamber, electrogilding liquid can not effectively be supplemented after being consumed simultaneously, has reduced the concentration of solution body in inner chamber.The supplementary dependence diffusion of inner chamber interfacial layer electrogilding liquid realizes, interfacial layer and the poor power that provides of solution bulk concentration are provided in diffusion, after being consumed, can not effectively be supplemented electrogilding liquid in inner chamber, after in inner chamber, the concentration of gold-plating solution body reduces, the power of interfacial layer diffusion reduces, velocity of diffusion reduces, cause the poor further expansion of velocity of diffusion and golden speed of separating out, aggravate the concentration polarization in electroplating process, be difficult to ensure thickness and the quality of inner chamber electrogilding layer, the qualification rate that has reduced product, has increased production cost.
Therefore, be badly in need of a kind of low cost of exploitation, the high efficiency method of improving concentration polarization during for microwave rule metal wave-guide electrogilding, while solving existing microwave rule metal wave-guide electrogilding, because concentration polarization is large, cause the problem that microwave rule metal wave-guide electrogilding layer is of poor quality, accepted product percentage is low and electroplating efficiency is low.
Summary of the invention
The object of this invention is to provide a kind of low cost, the high efficiency method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding, while solving existing microwave rule metal wave-guide electrogilding, because concentration polarization is large, cause the problem that microwave rule metal wave-guide electrogilding layer is of poor quality, accepted product percentage is low and electroplating efficiency is low.
Technical scheme of the present invention is achieved in that
During for microwave rule metal wave-guide electrogilding, improve a method of river diversion for concentration polarization, comprise the following steps:
Step 101, provides and in a microwave cavity, has the microwave of conformal anode rule metal wave-guide, a gold-plating solution guiding device;
Step 102, is fixed on Electropolating hangers by described microwave rule metal wave-guide;
Step 103, makes the small-bore part of described guiding device and microwave rule metal wave guide cavity be in same axial direction due, in a distance and be fixed on Electropolating hangers and form and electroplate entirety;
Step 104, after electrogilding pre-treatment step, will electroplate in overall immersion plating gold solution;
Step 105, makes to electroplate entirety and gold-plating solution relatively moves.
Alternatively, in step 101, microwave rule metal wave guide cavity be shaped as any one in circle, rectangle, ridged or ellipse.
Alternatively, in described step 101, microwave rule metal wave-guide material is copper alloy or aluminium alloy.
Alternatively, in described step 101, the flow-guiding mouth of described gold-plating solution guiding device is shaped as any one in circle, rectangle, ridged or ellipse.
Alternatively, in described step 101, the material of described gold-plating solution guiding device is insulating material.
Alternatively, in described step 101, the one-piece construction of described gold-plating solution guiding device is cone, is the ever-reduced splayed of bore or class splayed structure along medullary ray section, and the small-bore part of gold-plating solution guiding device contains telescopic structure.
The adjusting of all angles such as alternatively,, in described step 101, the small-bore part of described gold-plating solution guiding device can be up and down, left and right.
Alternatively, in described step 102 and step 103, the fixing means of microwave rule metal wave-guide and guiding device can be wire binding method.
Alternatively, in described step 103, the small-bore part of described guiding device and microwave rule metal wave guide cavity distance are apart 2mm-10cm.
Alternatively, in described step 105, the described travel direction of plating entirety or the flow direction of gold-plating solution are the axial direction due of the heavy caliber part of gold-plating solution guiding device.
The invention has the beneficial effects as follows:
(1) effectively reduce concentration polarization, while improving electrogilding, the sedimentation rate of electrogilding layer, has improved plating production efficiency;
(2) improve the quality of microwave rule metal wave-guide electrogilding layer, improved the qualification rate of product, reduced production cost;
(3) current efficiency while improving microwave rule metal wave-guide electrogilding, power while having reduced microwave rule metal wave-guide electrogilding, has reduced production cost.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is a kind of schema that improves the method for river diversion of concentration polarization during for microwave rule metal wave-guide electrogilding provided by the invention;
Fig. 2 is a kind of process flow sheet that improves the method for river diversion of concentration polarization during for microwave rule metal wave-guide electrogilding provided by the invention;
Fig. 3 is a kind of schematic diagram that improves the method for river diversion of concentration polarization during for microwave rule metal wave-guide electrogilding provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
As shown in Figure 1, a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding of the present invention, comprises the following steps:
Step 101: provide and have the microwave of conformal anode rule metal wave-guide, a gold-plating solution guiding device in a microwave cavity;
Step 102: described microwave rule metal wave-guide is fixed on to Electropolating hangers;
Step 103: make described guiding device and microwave rule metal wave guide cavity be in same axial direction due, in a distance and be fixed on Electropolating hangers and form and electroplate entirety;
Step 104: after electrogilding pre-treatment step, will electroplate in overall immersion plating gold solution;
Step 105: plating entirety and gold-plating solution are relatively moved, improve the object of concentration polarization while realizing microwave rule metal wave-guide electrogilding.
In above-mentioned steps 101, microwave rule metal wave guide cavity be shaped as any one in circle, rectangle, ridged or ellipse, microwave rule metal wave-guide material is copper alloy, aluminium alloy or other metal alloys.Described gold-plating solution guiding device be shaped as any one in circle, rectangle, ridged or ellipse, the material of gold-plating solution guiding device is insulating material, for example pvc, pp or other insulating material.
In above-mentioned steps 101, the one-piece construction of described gold-plating solution guiding device is cone, is the ever-reduced splayed of bore or class splayed structure along medullary ray section.The small-bore part of gold-plating solution guiding device is telescopic structure, the adjusting of all angles such as preferably, the small-bore part of gold-plating solution guiding device can be up and down, left and right.
In above-mentioned steps 102 and step 103, the fixing means of microwave rule metal wave-guide and guiding device can be wire binding method.
In above-mentioned steps 103, described guiding device and microwave rule metal wave guide cavity distance are 2mm-10cm.
In above-mentioned steps 104, described electrogilding pre-treatment step includes but not limited to oil removing, washing, activation, electronickelling, washing, activation, and concrete electrogilding pre-treatment step is determined according to concrete electroplating technology flow process.
In above-mentioned steps 105, the described travel direction of plating entirety or the flow direction of gold-plating solution are the axial direction due of the heavy caliber part of gold-plating solution guiding device.
The method of river diversion schema that improves concentration polarization based on of the present invention a kind of described in Fig. 1 during for microwave rule metal wave-guide electrogilding, is described in further detail the present invention below in conjunction with specific embodiment.
In the present embodiment, use binding method to be fixed on Electropolating hangers microwave rule metal wave-guide, gold-plating solution guiding device and form a plating entirety, then after oil removing, washing, activation, electronickelling, washing, activation step in immersion plating gold solution, plating entirety and gold-plating solution are relatively moved, realize the object that microwave rule metal wave-guide improves concentration polarization in the time of electrogilding, further illustrate detailed process method of the present invention and step below in conjunction with concrete process schematic representation 2.
As shown in Figure 2 a, choose the rule metal wave-guide 2 of the microwave with conformal anode 1 and a gold-plating solution guiding device 3.The waveguide cavity of microwave rule metal wave-guide 2 is shaped as rectangle, is of a size of 0.8 × 1.6mm, and material is H59 copper; The flow-guiding mouth 4 of gold-plating solution guiding device 3 be shaped as rectangle, be of a size of 1 × 2mm, the material of gold-plating solution guiding device 3 is pp, the one-piece construction of gold-plating solution guiding device is cone, the diameter of heavy caliber part is 80mm, be the ever-reduced splayed structure of bore along medullary ray section, the small-bore part of gold-plating solution guiding device 3 contains telescopic structure 5, by Collapsible structure 5, the adjusting of all angles such as the small-bore part of gold-plating solution guiding device can be up and down, left and right.
As shown in Figure 2 b, use wire 6 that microwave rule metal wave-guide 2 bolts with conformal anode 1 are hung on to Electropolating hangers 7.The material of wire 6 is the copper wire of outer wrap insulate material, and the diameter of wire 6 is 0.8mm.
As shown in Figure 2 c, gold-plating solution guiding device is fixed on to Electropolating hangers, form and electroplate entirety, concrete grammar is: use wire 6 that gold-plating solution guiding device 3 is tied in Electropolating hangers 7, while being tied, the waveguide cavity of flow-guiding mouth 4 and microwave rule metal wave-guide 2 is in same axial direction due above for gold-plating solution guiding device 3, and the gold-plating solution guiding device 3 above distance of the waveguide cavity face of flow-guiding mouth 4 and microwave rule metal wave-guide 2 is 5mm.
As shown in Figure 2 d, electroplate entirety after oil removing, washing, activation, electronickelling, washing, activation step, will electroplate in overall immersion plating gold solution 8.
As shown in Figure 2 d, make to electroplate entirety in gold-plating solution 8 along direction 9 moving left and right repeatedly, while realizing microwave rule metal wave-guide electrogilding, improve the object of concentration polarization.
The principle of improving concentration polarization below in conjunction with concrete principle schematic Fig. 3 during to the rule of microwave as shown in Figure 2 d metal wave-guide electrogilding further describes.
As shown in Figure 3 a, gold-plating solution guiding device 3 is when along direction 9 to left movement, the heavy caliber part of gold-plating solution guiding device 3 is constantly collected gold-plating solution 8, along with collecting with the bore of gold-plating solution guiding device 3 of gold-plating solution 8 constantly reduces, the flow velocity of gold-plating solution 8 in gold-plating solution guiding device 3 constantly accelerated, in the time that gold-plating solution 8 passes through the flow-guiding mouth 4 of gold-plating solution guiding device 3 bore minimums, gold-plating solution 8 velocity of flow are the fastest and spray to microwave rule metal wave guide cavity along direction 10.
As shown in Figure 3 b, in the time that the gold-plating solution 8 coming along direction 10 spray by guiding device runs into microwave rule metal wave-guide 2, gold-plating solution 8 is rapid flow in the space between microwave rule metal wave guide cavity and conformal anode 1 along direction 11.Gold-plating solution in the microwave rule metal wave guide cavity that the gold-plating solution of rapid flow has been consumed while having supplemented electrogilding, in electrogilding process, in microwave rule metal wave guide cavity, the concentration of gold-plating solution body does not reduce because be consumed in electrogilding process, ensure the concentration difference of the interior gold-plating solution bulk concentration of microwave rule metal wave guide cavity and microwave rule metal wave guide cavity surface interface layer 12, ensure the velocity of diffusion of microwave rule metal wave guide cavity surface interface layer 12 interior ion, concentration polarization while effectively having improved microwave rule metal wave-guide electrogilding, gold-plating solution is along direction 11 rapid flow in microwave rule metal wave guide cavity in addition, attenuate the thickness of microwave rule metal wave guide cavity surface interface circle 12, shorten the diffusion length of ion in microwave rule metal wave guide cavity surface interface layer 12, therefore can improve the ionic concn of microwave rule metal wave guide cavity surface interface layer 12, the concentration polarization while effectively having improved microwave rule metal wave-guide electrogilding.
In sum, a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding of the present invention, by by microwave rule metal wave-guide, the binding method that uses gold-plating solution guiding device is fixed on Electropolating hangers and forms a plating entirety, then through oil removing, washing, activation, electronickelling, washing, after activation step in immersion plating gold solution, plating entirety and gold-plating solution are relatively moved, can realize microwave rule metal wave-guide electrogilding time, improve the object of concentration polarization, and then the sedimentation velocity of electrogilding layer while having improved microwave rule metal wave-guide electrogilding, improve production efficiency, improved the quality of microwave rule metal wave-guide electrogilding layer simultaneously, improve the qualification rate of product, reduce production cost.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. during for microwave rule metal wave-guide electrogilding, improve a method of river diversion for concentration polarization, it is characterized in that, comprise the following steps:
Step (101), provides and in a microwave cavity, has the microwave of conformal anode rule metal wave-guide, a gold-plating solution guiding device;
Step (102), is fixed on Electropolating hangers by described microwave rule metal wave-guide;
Step (103), makes the small-bore part of described guiding device and microwave rule metal wave guide cavity be in same axial direction due, in a distance and be fixed on Electropolating hangers and form and electroplate entirety;
Step (104), after electrogilding pre-treatment step, by overall described plating immersion plating gold solution;
Step (105), makes to electroplate entirety and gold-plating solution relatively moves.
2. a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding as claimed in claim 1, it is characterized in that, in described step (101), microwave rule metal wave guide cavity be shaped as any one in circle, rectangle, ridged or ellipse.
3. a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding as claimed in claim 1, is characterized in that, in described step (101), microwave rule metal wave-guide material is copper alloy or aluminium alloy.
4. a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding as claimed in claim 1, it is characterized in that, in described step (101), the flow-guiding mouth of described gold-plating solution guiding device is shaped as any one in circle, rectangle, ridged or ellipse.
5. a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding as claimed in claim 1, is characterized in that, in described step (101), the material of described gold-plating solution guiding device is insulating material.
6. a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding as claimed in claim 1, it is characterized in that, in described step (101), the one-piece construction of described gold-plating solution guiding device is cone, be the ever-reduced splayed of bore or class splayed structure along medullary ray section, the small-bore part of gold-plating solution guiding device contains telescopic structure.
7. a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding as claimed in claim 1, it is characterized in that, in described step (101), the small-bore part of described gold-plating solution guiding device can be up and down, left and right all angles regulate.
8. a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding as claimed in claim 1, it is characterized in that, in described step (102) and step (103), the fixing means of microwave rule metal wave-guide and guiding device is wire binding method.
9. a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding as claimed in claim 1, it is characterized in that, in described step (103), the length of the small-bore part of described guiding device and microwave rule metal wave guide cavity distance is apart 2mm-10cm.
10. a kind of method of river diversion that improves concentration polarization during for microwave rule metal wave-guide electrogilding as claimed in claim 1, it is characterized in that, in described step (105), the described travel direction of plating entirety or the flow direction of gold-plating solution are the axial direction due of the heavy caliber part of gold-plating solution guiding device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410330672.9A CN104073847B (en) | 2014-07-08 | 2014-07-08 | Diversion method for improving concentration polarization in microwave straight metal waveguide gold-electroplating process |
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| CN201410330672.9A CN104073847B (en) | 2014-07-08 | 2014-07-08 | Diversion method for improving concentration polarization in microwave straight metal waveguide gold-electroplating process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110438537A (en) * | 2019-08-09 | 2019-11-12 | 常州大学 | A kind of novel high flux heat exchanger tube and preparation method thereof |
| CN111354626A (en) * | 2018-12-21 | 2020-06-30 | 瑞萨电子株式会社 | Semiconductor device and method for manufacturing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201793874U (en) * | 2010-09-01 | 2011-04-13 | 常州市郑陆特种纺机专件有限公司 | Knitting machine for plain dimensional multilayer cylinder-shaped or cylindrical special-shaped braided fabric |
| CN202465932U (en) * | 2011-12-27 | 2012-10-03 | 中国航空工业第六○七研究所 | Flexible auxiliary anode for electroplating inner cavity of multi-bend waveguide |
| CN103305885B (en) * | 2013-06-01 | 2016-06-22 | 北京工业大学 | A kind of flow-guiding type for hollow plating piece inner surface plating assists plating device and plating method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111354626A (en) * | 2018-12-21 | 2020-06-30 | 瑞萨电子株式会社 | Semiconductor device and method for manufacturing the same |
| CN111354626B (en) * | 2018-12-21 | 2023-09-01 | 瑞萨电子株式会社 | Semiconductor device and method for manufacturing the same |
| CN110438537A (en) * | 2019-08-09 | 2019-11-12 | 常州大学 | A kind of novel high flux heat exchanger tube and preparation method thereof |
| CN110438537B (en) * | 2019-08-09 | 2021-10-01 | 常州大学 | High-flux heat exchange tube and preparation method and application thereof |
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