CN104069985A - Coating device - Google Patents

Coating device Download PDF

Info

Publication number
CN104069985A
CN104069985A CN201410118126.9A CN201410118126A CN104069985A CN 104069985 A CN104069985 A CN 104069985A CN 201410118126 A CN201410118126 A CN 201410118126A CN 104069985 A CN104069985 A CN 104069985A
Authority
CN
China
Prior art keywords
mentioned
varnish
manifold
injection
along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410118126.9A
Other languages
Chinese (zh)
Inventor
塚原大祐
杉浦绅介
鹈饲贵司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN104069985A publication Critical patent/CN104069985A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254Coating heads with slot-shaped outlet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves

Landscapes

  • Coating Apparatus (AREA)

Abstract

The invention provides a coating device for applying a varnish which includes particles and a resin. The coating device is equipped with a manifold for spreading the varnish in a first direction which is perpendicular to the discharge direction, and a discharge unit for discharging the varnish spread in the first direction by the manifold. The manifold is provided with an expanding section in which the first direction length thereof gradually becomes longer toward the downstream side in the discharge direction. The discharge unit is provided with discharge restricting sections for relatively restricting the discharge of the varnish at the first direction ends of the discharge unit.

Description

Applying device
Technical field
The present invention relates to a kind of applying device, specifically relate to a kind of for applying the applying device of the varnish that contains particle and resin.
Background technology
In the past, be known to various for applying the applying device of the varnish that contains resin.
In addition, in the situation that varnish is non-newtonian fluid, or in the situation that varnish and the compatibility that will apply between the base material of varnish are lower, the both ends of sometimes filming produce than the jut of central portion projection.So above-mentioned flatness of filming of jut branch infringement.
For example, such slit die head coating (Japanese: ス ロ ッ ト ダ イ Tu cloth) device (is for example proposed, with reference to following patent documentation 1): it has the slit die head being formed with for the slit to coated substrate supply coating liquid, slit is relative with coated substrate, and the cross section of the slit relative with coated substrate forms and can relatively suppress at the both ends of slit the shape of the supply of coating liquid.
Patent documentation 1: TOHKEMY 2004-305955 communique
Yet, when the slit die head applying device coating that utilizes patent documentation 1 to record also contains the varnish of particle, varnish reduces in the jet flow at the both ends of slit, therefore, expulsion pressure at the both ends of the manifold of slit die head also reduces, and flowing of varnish obviously becomes slow thus.Therefore, varnish is easily detained.And if the proportion of particle is relatively large, the particle in the delay part of such varnish can precipitate.Therefore the distribution that, has a particle in being detained part easily becomes inhomogeneous and then makes the distribution of the particle in the manifold inhomogeneous such unfavorable condition that easily becomes.Its result, the inhomogeneous such unfavorable condition that becomes of the distribution with the particle in filming.
Summary of the invention
The object of the present invention is to provide a kind of can guarantee the flatness of filming and guarantee to film in the inhomogeneity applying device of particle.
To achieve these goals, the invention provides a kind of applying device, it,, for applying the varnish that contains particle and resin, is characterized in that, this applying device comprises: manifold, and it is for making varnish along the 1st Directional Extension with injection direction quadrature; And injection portion, it is for spraying due to above-mentioned manifold along the varnish after above-mentioned the 1st Directional Extension, in above-mentioned manifold, be provided with length in above-mentioned the 1st direction along with going towards above-mentioned injection direction downstream elongated expansion section gradually, in above-mentioned injection portion, be provided with for relatively suppressing the injection suppressing portion of injection of the end in above-mentioned the 1st direction in above-mentioned injection portion of above-mentioned varnish.
In this device, can utilize and spray the injection that suppressing portion relatively suppresses the end in the 1st direction in injection portion of varnish.Therefore, the projection of the end in the 1st direction that can suppress to film, thus can guarantee the flatness of filming.
On the other hand, in this applying device, when the jet flow of varnish in the end in the 1st direction of injection portion reduces, varnish by manifold in expansion section along with going and expand to the outside of the 1st direction gradually towards injection direction downstream, therefore, can prevent from becoming slowly because varnish contains the jet flow that particle causes varnish, thereby can prevent the delay of varnish.Its result, can eliminate the inhomogeneities of the particle in varnish in manifold.Thereby, can guarantee the obtained flatness of filming and guarantee fully to film in the uniformity of particle.
In addition, in applying device of the present invention, preferably, above-mentioned manifold comprises: inflow portion, it is for flowing into for varnish, and the opening section extending along the orthogonal direction with above-mentioned injection direction quadrature of this inflow portion is long-pending along with going and expand towards above-mentioned injection direction downstream; And outflow portion, it is arranged on the above-mentioned injection direction downstream of above-mentioned inflow portion, for flowing out from above-mentioned inflow portion for varnish, the opening section of the extension along above-mentioned orthogonal direction of this outflow portion is long-pending along with going and dwindle towards above-mentioned injection direction, and above-mentioned inflow portion is located in above-mentioned expansion section.
In manifold, the long-pending outflow portion dwindling along with going towards injection direction compares with the opening section extending along orthogonal direction, in the long-pending inflow portion expanding along with going towards injection direction downstream of the opening section extending along orthogonal direction, the jet flow of above-mentioned varnish easily becomes slowly, the delay of the varnish that easily generation causes thus.
But, in this applying device, owing to being provided with expansion section in inflow portion, therefore can prevent that the jet flow of above-mentioned varnish from becoming slowly, thereby can prevent the delay of varnish.
In addition, in applying device of the present invention, preferably, for dividing Accessory Members above-mentioned expansion section, that can load and unload with respect to above-mentioned manifold, be located at the end in above-mentioned the 1st direction of the above-mentioned injection direction upstream side of being positioned at of above-mentioned manifold.
Adopt this applying device, because Accessory Members can load and unload with respect to manifold, therefore can be replaced by according to the characteristic of varnish the Accessory Members of intended shape.
In addition, applying device of the present invention has the transparent component of the varnish can visualization passing through in above-mentioned expansion section.
Adopt this applying device, due to the varnish that can pass through via transparent component visualization, therefore can check simply the state of the particle in varnish in expansion section.
Adopt applying device of the present invention, can guarantee fully the uniformity of the particle in obtained filming.
Accompanying drawing explanation
Fig. 1 represents the stereogram of an embodiment of applying device of the present invention.
The top view of the nozzle of the applying device of Fig. 2 presentation graphs 1.
The upward view of the nozzle of Fig. 3 presentation graphs 2.
The side view of the nozzle of Fig. 4 presentation graphs 2.
The A-A sectional view of the nozzle of Fig. 5 presentation graphs 2.
The B-B sectional view of the nozzle of Fig. 6 presentation graphs 2.
The master of the nozzle of Fig. 7 A, Fig. 7 B presentation graphs 2 looks cutaway view, and Fig. 7 A represents that for omitting the 2nd pad ground the master of the 1st pad looks cutaway view, and Fig. 7 B represents that the master of the 2nd pad looks cutaway view.
The exploded perspective view of the nozzle of Fig. 8 presentation graphs 2.
The exploded side sectional view of the nozzle of Fig. 9 presentation graphs 2.
Figure 10 represents to utilize the state of the nozzle coating varnish shown in Fig. 5.
Figure 11 represents the upward view of nozzle of other embodiments of applying device of the present invention.
Figure 12 represents the upward view of nozzle of other embodiments of applying device of the present invention.
Figure 13 represents the upward view of nozzle of other embodiments of applying device of the present invention.
Figure 14 represents that the master of nozzle of other embodiments of applying device of the present invention looks cutaway view.
Figure 15 represents the image processing figure of the photo of the varnish in the nozzle of applying device of embodiment 1.
Figure 16 represents the image processing figure of the photo of the varnish in the nozzle of applying device of comparative example 1.
The specific embodiment
One embodiment of applying device of the present invention is described with reference to Fig. 1~Figure 10.
In Fig. 2, the left and right directions of paper of take is " left and right directions " (the 1st direction or width), the above-below direction of paper of take is " fore-and-aft direction " (the 2nd direction or thickness direction), the thick direction of the paper of take is " above-below direction " (the 3rd direction or injection direction), particularly, take the direction arrow that Fig. 2 was recorded is benchmark.For the accompanying drawing beyond Fig. 2, the direction of Fig. 2 of also take is benchmark.
In addition, in Fig. 7 A and Fig. 7 B, in order to conclusively show manifold 21(aftermentioned), pad 13(aftermentioned) and Accessory Members 25(aftermentioned) relative configuration relation, omitted the 2nd 12(aftermentioned).And, in Fig. 8, in order to conclusively show pad 13, the relative configuration relation of the 1st 11 and the 2nd 12, omitted Accessory Members 25.In Fig. 7 B, in order to conclusively show the 2nd pad 15(aftermentioned) shape, omitted the 1st pad 14(aftermentioned).
In Fig. 1, this applying device 1 is for applying the applying device of the varnish (describing in detail) that contains particle and resin below.Applying device 1 comprises tank 2, pump 3 and nozzle 5.The mode towards downstream configures successively with the injection direction upstream side from varnish for tank 2, pump 3 and nozzle 5.
Tank 2 is that it is arranged on the upper portion of applying device 1 for storing the reservoir vessel of varnish.
Pump 3 is connected with tank 2 via the 1st pipe arrangement 61, and particularly, it is configured in the front side of tank 2.Pump 3 is so long as can apply authorized pressure and spray the pump that is stored in the varnish in tank 2 to nozzle 5, do not limit especially, can list single-screw (single screw) pump (Japanese: モ ー ノ Port Application プ) for example (particularly, the such pump of commercially available ヘ イ シ ン モ ー ノ Port Application プ (Japanese soldiers god equipment company manufactures) etc.) etc.
As shown in Figure 1, nozzle 5 is for example configured in the downside of slit die head coating machine, particularly, is configured in the downside of pump 3 and is connected with pump 3 via the 2nd pipe arrangement 69.Nozzle 5 forms along the vertical direction the thicker writing board shape extending with left and right directions.Nozzle 5 comprises the 1st 11, to be configured in the 2nd 12 and the pad 13 between the 1st 11 and the 2nd 12 of the front side of the 1st 11 with the 1st 11 relative modes.
The 1st 11 such as being formed by resins such as the metals such as stainless steel or acrylic resins.From the viewpoint of durability, consider, the 1st 11 is preferably formed by metal.
As shown in Figure 2 and Figure 8, be along the vertical direction the thicker writing board shape extending with left and right directions for the 1st 11, particularly, form for the 1st 11 and overlook and main apparent time shape in the form of a substantially rectangular, when side-looking, the upper portion of the 1st 11 is essentially rectangular shape, and lower portion is the general triangular shape along with go the length on fore-and-aft direction to shorten gradually towards downside.In addition, the central portion that forms front surface for the 1st 11 to rear side recessed have a underframe shape.Comprise upper wall 46a, lower wall 46b and 1 oppose side wall 46c for the 1st 11, this upper wall 46a, lower wall 46b and 1 oppose side wall 46c become one.
Upper wall 46a forms overlooking essentially rectangular shape and forming the main essentially rectangular shape of looking of extending along left and right directions.In addition, as shown in Figure 5 and Figure 6, when side-looking, the upper portion of upper wall 46a is shape in the form of a substantially rectangular, and the lower surface 47 of lower portion forms to become the mode of flexure plane.Particularly, the lower surface 47 of upper wall 46a forms along with going towards rear gradually the circular shape of lateral bend downwards.
Lower wall 46b arranges in the mode of the bottom adjacency with upper wall 46a.As shown in Fig. 3 and Fig. 7 A, Fig. 7 B, lower wall 46b forms looking up essentially rectangular shape and forming the main essentially rectangular shape of looking of extending along left and right directions.In addition, as shown in Figure 5 and Figure 6, when side-looking, the lower surface of lower wall 46b forms along with going and the inclined plane of linearly inclination downwards towards front side, and the upper surface 48 of lower wall 46b forms along with going and the inclined plane of linearly inclination downwards towards front side.The upper ora terminalis of the upper surface 48 of lower wall 46b forms in the consecutive mode of lower ora terminalis of the lower surface 47 with upper wall 46a.
As shown in Fig. 7 A, Fig. 7 B and Fig. 8,1 oppose side wall 46c is mutually continuous with the both ends on left and right directions of upper wall 46a, and 1 oppose side wall 46c is mutually continuous with the both ends on left and right directions of lower wall 46b, and form along the vertical direction extend overlook essentially rectangular shape.In addition, when side-looking, the upper portion of sidewall 46c is shape in the form of a substantially rectangular, and lower portion forms the general triangular shape that the length on fore-and-aft direction shortens gradually along with going towards downside.
And in the 1st 11, the front surface of upper wall 46a, lower wall 46b and 1 oppose side wall 46c forms concordant master and looks essentially rectangular frame shape.In addition, as shown in Fig. 5 and Fig. 7 A, Fig. 7 B, in the 1st 11, by the inner surface (medial surface) of the lower surface 47 of upper wall 46a, the upper surface 48 of lower wall 46b and 1 oppose side wall 46c, form manifold (Japanese: マ ニ ホ ー Le De) 21.Manifold 21 for make from supply hole described later 20 supply with the varnish of coming to the left and right Directional Extension arrange.
Particularly, manifold 21 comprises inflow portion 50 and outflow portion 51.
Inflow portion 50 is formed by the lower surface 47 of upper wall 46a and the inner surface (medial surface) of 1 oppose side wall 46c.The opening section extending along left and right directions and fore-and-aft direction (with the orthogonal direction of injection direction quadrature) of inflow portion 50 is long-pending to be formed along with downward (injection direction downstream) and goes and expand gradually.Utilize this inflow portion 50 to divide inflow space 52.
Outflow portion 51 is formed by the upper surface 48 of lower wall 46b and the inner surface (medial surface) of 1 oppose side wall 46c.Long-pending the forming along with going towards injection direction and dwindling gradually of opening section along left and right directions and fore-and-aft direction (with the orthogonal direction of injection direction quadrature) extension of outflow portion 51.So that the mode that outflow space 53 is connected with inflow space 52 utilizes this outflow portion 51 to divide outflow space 53.
Utilize this manifold 21 to divide manifold space.
Manifold space is formed by inflow space 52 and outflow space 53.
In addition, on upper wall 46a, be formed with the supply hole 20 that runs through along the vertical direction upper wall 46a.Supply hole 20 for self-pumping 3 via the 2nd pipe arrangement 69 to chamber 49(aftermentioned) supply with varnish and be formed on upper wall 46a, and form substantial cylindrical shape.In addition, as shown in Figure 2, when overlooking, supply hole 20 is arranged on the substantial middle portion on left and right directions of upper wall 46a.In addition, as shown in Figure 5, the bottom of supply hole 20 is in the bending of the oblique the place ahead of lower side direction and at lower surface 47 openings of upper wall 46a.
In addition, as shown in Figure 7 A, 7 B, on upper wall 46a and 1 oppose side wall 46c, be formed with the 1st fixing hole 28 that the front surface from upper wall 46a and 1 oppose side wall 46c goes to bore a hole towards rear and forms.The 1st fixing hole 28 is provided with a plurality of in the mode at spaced-apart interval.Particularly, the 1st fixing hole 28 is to separate the front surface that equally spaced mode is formed at upper wall 46a along left and right directions.In addition, the 1st fixing hole 28 is formed at the front surface of 1 oppose side wall 46c to separate along the vertical direction equally spaced mode.
And, as shown in Fig. 4 and Fig. 7 A, Fig. 7 B, on 1 oppose side wall 46c, be formed with the 2nd the fixing hole 29 that runs through 1 oppose side wall 46c along left and right directions.The 2nd fixing hole 29 be arranged in sidewall 46c with inflow space 52(with reference to Fig. 5) position that is connected.
And, as shown in Fig. 6 and Fig. 7 A, Fig. 7 B, Accessory Members 25 is installed on manifold 21.
Accessory Members 25 is provided with two in the mode along the spaced-apart interval of left and right directions in upside (injection direction upstream side) part of manifold 21.
As shown in the dotted line of Fig. 2 and Fig. 6, each Accessory Members 25 be along left and right directions, extend overlook essentially rectangular shape, the lateral surface on left and right directions of each Accessory Members 25 forms the flat condition of extending along the vertical direction.In addition, Accessory Members 25 is side-looking fan-shaped, and its lower surface forms tabular surface, and upper surface forms along with going towards rear gradually the circular shape of lateral bend downwards.As shown in Fig. 7 A, the thick line of Fig. 7 B and the shade of fine rule, it is general triangular shape (particularly, right angle trigonometry shape) that Accessory Members 25 forms main apparent time.In addition, the lower surface of two Accessory Members 25 forms in main apparent time along with going towards left and right directions outside and rolling oblique inclined plane downwards, and the lower surface of two Accessory Members 25 configures in mode relative to each other on left and right directions.
In addition, as shown in Figure 6, on Accessory Members 25, be formed with when carrying out projection with left and right directions along the vertical direction than the 1st 11 side-prominent ledge slightly forward.
As shown in Fig. 6 and Fig. 7 A, Fig. 7 B, two external end edges on left and right directions of the lower surface of Accessory Members 25 with when carrying out projection along fore-and-aft direction and the overlapping mode of the lower ora terminalis of the lower surface 47 of upper wall 46a configure.In addition, the interior ora terminalis on left and right directions of the lower surface of Accessory Members 25 mode adjacent with the both ends on left and right directions with supply hole 20 and that supply hole 20 is exposed is configured in left and right directions two outsides of the bottom of supply hole 20 adjacently.
By this Accessory Members 25 is installed on to manifold 21, thus in the inflow space 52 in chamber 49, be formed with length on left and right directions along with going towards downside elongated expansion section 33 gradually.
Expansion section 33 form centered by supply hole 20 and its length on left and right directions along with downward going elongated roughly inverted v-shaped shape gradually.
The 2nd 12 is the transparent components that formed by such transparent materials such as the transparent resins such as for example glass, acrylic resin (particularly, polymethyl methacrylate), silicone resin.
As shown in Figure 8, the 2nd 12 is the writing board shape extending along left and right directions, and its bottom forms the general triangular shape that the length on fore-and-aft direction shortens gradually along with going towards downside.In addition, the 2nd 12 with when carrying out projection along fore-and-aft direction and the 1st 11 overlapping modes form.It is concordant with two sides with the upper surface of the 1st 11 that the upper surface of the 2nd 12 and two sides form, in addition, the bottom of the 2nd 12 be configured to when carrying out projection along fore-and-aft direction and the lower end of the 1st 11 in same position.
In addition,, though not shown, a plurality of the 1st fixing hole 28(that to be formed with in main apparent time on the 2nd 12 be identical configuration and formed objects with the 1st 11 are with reference to Fig. 7 A, Fig. 7 B).
Pad 13 is for example by forming with the 1st block of 11 identical materials.Pad 13 comprises the 1st pad 14 and is configured in the 2nd pad 15 of the front side of the 1st pad 14.
The 1st pad 14 is the downside main apparent times of opening wide is the thin plate of reverse U shape shape roughly.The 1st pad 14 with when carrying out projection along fore-and-aft direction and the front surface of upper wall 46a of the 1st 11 and the overlapping mode of the front surface of 1 oppose side wall 46c configure.
The shade representing with reference to fine rule as Fig. 7 B() and as shown in Fig. 8, the 2nd pad 15 forms main apparent time that downside opens wide for the thin plate of reverse U shape shape roughly.In addition, the 2nd pad 15 forms in main apparent time and bloats to the inside than the 1st pad 14.Particularly, the overlapping portion 17 that the 2nd pad 15 has while carrying out projection on fore-and-aft direction and the 1st pad 14 is overlapping and from the 1st pad 14 bellying 16 that direction inner side exposes and bloats to the inside from lap 17 to the left and right, overlapping portion 17 and bellying 16 form as one.
Bellying 16 with the relative 17c of portion of sidewall from relative with 1 oppose side wall 46c in the 2nd pad 15 to the left and right the direction inner side mode that shape bloats in the form of a substantially rectangular form.As shown in Figure 7 B, take bellying 16 be not cut into main apparent time as essentially rectangular shape with the overlapping mode of Accessory Members 25 when carrying out projection along fore-and-aft direction in the upper part of bellying 16.Specifically, the part towards left and right directions two lateral resection bellyings 16 from the interior ora terminalis of upper end.
In addition, a plurality of the 1st fixing hole 28(that to be formed with respectively in main apparent time on the 1st pad 14 and the 2nd pad 15 be identical configuration and formed objects with the 1st 11 are with reference to Fig. 7 A, Fig. 7 B).
Next, the assembling of nozzle 5 is described with reference to Fig. 8 and Fig. 9.
First, prepare respectively the 1st 11, Accessory Members 25, the 1st pad the 14, the 2nd pad 15 and the 2nd 12.
Then, Accessory Members 25 is installed on to the manifold 21 of the 1st 11, and by pad 13(the 1st pad 14 and the 2nd pad 15) be disposed at the front surface of upper wall 46a and the front surface of lower wall 46b (with reference to Fig. 7 A, Fig. 7 B).
Particularly, after Accessory Members 25 is embedded to manifolds 21, not shown fixed component is inserted to the 2nd fixing hole 29(with reference to Fig. 4 and Fig. 7 A, Fig. 7 B) in and make this fixed component arrive Accessory Members 25, thus, Accessory Members 25 is fixed on to manifold 21.
In addition, the 1st pad 14 is contacted with the front surface of top 46a and the front surface of lower wall 46b.
Then, the lap 17 of the 2nd pad 15 is contacted with the front surface of the 1st pad 14.Now, so that bellying 16 is disposed at the 1st pad 14 from the 1st pad 14 mode that direction inner side exposes to the left and right by the 2nd pad 15.In addition, make Accessory Members 25 by the cut-out of the bellying 16 of the 2nd pad 15.
Then, the rear surface of the 2nd 12 is contacted respectively with the front surface of the 2nd pad 15 and the front surface of Accessory Members 25.Then the 1st fixing hole 28(that, not shown fixed component is inserted to the 1st 11, pad 13 and the 2nd 12 is with reference to Fig. 7 A, Fig. 7 B) in and be fixed.Thus, utilize the 1st 11 and the 2nd 12 holding shim 13(the 1st pads 14 and the 2nd pads 15) and be assembled into nozzle 5.
Thus, as shown in Figure 5, in nozzle 5, be formed with the chamber 49 that the rear surface by the medial surface of the manifold 21 of the 1st 11, pad 13 and the 2nd 12 marks off.
And, be formed with by the front surface of lower wall 46b of the 1st 11, the seam portion 56 that the medial surface of pad 13 (with reference to Fig. 7 A, Fig. 7 B and Fig. 8) and the 2nd 12 rear surface marks off.Essentially rectangular shape opening is overlooked with what extend along left and right directions by seam portion 56, in addition, and the side-looking essentially rectangular shape opening of seam portion 56 to extend along the vertical direction.
In addition, as shown in Figure 3 and Figure 5, the bottom of seam portion 56 (jet) opening has slit 57.Slit 57 forms the jet slenderly extending on left and right directions when looking up.
In addition, as shown in Figure 3, the leading section bellying 16 that slit 57 forms the end on its left and right directions bloats such jet.Specifically, bellying 16 bloats and correspondingly makes the opening section of the end on left and right directions of slit 57 amass long-pending minimizing of opening section with respect to (central portion) midway on left and right directions of slit 57 from the 1st pad 14.Particularly, being provided with bellying 16 of the both ends on left and right directions of slit 57 and correspondingly the length of the both ends on left and right directions of slit 57 on fore-and-aft direction be (central portion) in the way on left and right directions of slit 57 the length on fore-and-aft direction about 1/2nd.
Therefore, in the jet flow of the varnish at the both ends on left and right directions of slit 57, be subject to the inhibition of bellying 16.
Therefore, with maintaining of slit 57 the long-pending portion of the central authorities on left and right directions (in way) of opening section compare, at the both ends on left and right directions of slit 57, the long-pending minimizing of the jet flow of varnish and opening section reduces accordingly.
In addition, will be called injection portion 23 for dividing the lower wall 46b, pad 13 of seam portion 56 and the 2nd 12.
The size of nozzle 5 can be according to the physical property of varnish (comprising viscosity), the 60(that films with reference to Figure 10) shape and/or thickness and suitably setting, be not particularly limited.The width of nozzle 5 (length on left and right directions) is for example more than 30mm, more than being preferably 50mm, and is for example, below 500mm, to be preferably below 200mm.In addition, the internal diameter of supply hole 20 is for example more than 2mm, more than being preferably 5mm, and is for example, below 30mm, to be preferably below 15mm.In addition, the width of chamber 49, seam portion 56 and slit 57 (length on left and right directions) is for example more than 10mm, more than being preferably 30mm, and is for example, below 450mm, to be preferably below 150mm.In addition, the length on above-below direction of inflow space 52 is for example more than 3mm, more than being preferably 5mm, and be for example below 80mm, be preferably below 50mm, the length on fore-and-aft direction of inflow space 52 is for example more than 3mm, more than being preferably 5mm, and be for example, below 50mm, to be preferably below 30mm.The length on above-below direction of outflow space 53 is for example more than 3mm, more than being preferably 5mm, and is for example, below 80mm, to be preferably below 50mm.
In addition, the width of Accessory Members 25 (length on left and right directions) is for example more than 5mm, more than being preferably 15mm, and is for example, below 200mm, to be preferably below 70mm.In addition, the length on above-below direction of Accessory Members 25 is for example more than 3mm, more than being preferably 5mm, and is for example, below 80mm, to be preferably below 50mm.In addition, the length on fore-and-aft direction of Accessory Members 25 is for example more than 3mm, more than being preferably 5mm, and is for example, below 50mm, to be preferably below 30mm.
The length on fore-and-aft direction of seam portion 56 and slit 57(jet) the length on fore-and-aft direction in fact all identical with the length on fore-and-aft direction of pad 13, be for example more than 0.1mm, more than being preferably 0.5mm, and be for example, below 3mm, to be preferably below 2mm.
In addition, the thickness of the 1st pad 14 is for example more than 0.05mm, more than being preferably 0.2mm, and is for example, below 3mm, to be preferably below 1.5mm.In addition, the thickness of the 2nd pad 15 is for example identical with the thickness of the 1st pad 14, particularly, for example, is more than 0.05mm, more than being preferably 0.2mm, and is for example, below 3mm, to be preferably below 1.5mm.
In addition, the length (length on left and right directions) that bloats of bellying 16 is for example more than 0.2mm, more than being preferably 1mm, and to be for example below 6mm, is preferably below 3mm.
In addition, as shown in Figure 1, in this applying device 1, in the mode of the upside adjacency with pump 3, be provided with the mobile device 55 for nozzle 5 can be moved along fore-and-aft direction, left and right directions and/or above-below direction.
Then, with reference to Fig. 1 and Figure 10, the method for using this applying device 1 coating varnish is described.
In the method, first, prepare varnish.
Varnish contains as the particle of essential component and resin.
As particle, can suitably set according to the purposes of filming and object, can list for example fluorophor, filler.
Fluorophor has wavelength translation function, can list such as the yellow fluorophor that blue light can be converted to sodium yellow, blue light can be converted to the red-emitting phosphors of red light etc.
As yellow fluorophor, for example can list (Ba, Sr, Ca) 2siO 4: Eu, (Sr, Ba) 2siO 4: Eu(barium orthosilicate (BOS)) silicate phosphor, for example Y such as 3al 5o 12: Ce(YAG(yttrium-aluminium-garnet): Ce), Tb 3al 3o 12: Ce(TAG(terbium aluminium garnet): Ce) etc. there is the carbuncle type fluorophor of carbuncle type crystal structure, such as nitrogen oxide fluorophor such as Ca-α-SiAlON etc.
As red-emitting phosphors, can list for example CaAlSiN 3: Eu, CaSiN 2: the nitride phosphors such as Eu etc.
As the shape of fluorophor, can list such as spherical, tabular, needle-like etc.From the viewpoint of mobility, consider, be preferably spherical.
The mean value of the maximum length of fluorophor (being its average grain diameter in the situation that being spherical) is for example more than 0.1 μ m, more than being preferably 1 μ m, and is for example below 200 μ m, is preferably below 100 μ m.
The proportion of fluorophor is for example more than 2.0, and is for example below 9.0.
Fluorophor can be used singly or in combination.
With respect to 100 mass parts resins, the mixing ratio of fluorophor is for example more than 0.1 mass parts, more than being preferably 0.5 mass parts, for example, is, below 80 mass parts, to be preferably below 60 mass parts.
Filler is to be engaged in varnish in order to improve the toughness of filming, and can list such as the organic fine particles such as silicon grain, inorganic particles such as silica, talcum, aluminium oxide, aluminium nitride, silicon nitride.
The proportion of filler is for example more than 0.5, and is for example below 7.0.
The mean value of the maximum length of filler (being its average grain diameter in the situation that being spherical) is for example more than 0.1 μ m, more than being preferably 0.5 μ m, and is for example below 200 μ m, is also preferably below 100 μ m.
Filler can be used singly or in combination.
With respect to 100 mass parts resins, the mixing ratio of filler is for example more than 0.1 mass parts, more than being preferably 0.5 mass parts, for example, is, below 70 mass parts, to be preferably below 50 mass parts.
Mixing ratio when being used in combination fluorophor and filler is as follows: with respect to 100 mass parts resins, the total amount of fluorophor and filler is for example more than 0.1 mass parts, more than being preferably 0.5 mass parts, and be for example, below 80 mass parts, to be preferably below 60 mass parts.
As resin, can list curable resins such as silicone resin, epoxy resin, polyimide resin, phenolic resins, urea resin, melmac and unsaturated polyester resin.
In addition, as resin, also can list for example polyolefin (for example, polyethylene, polypropylene, ethylene-propylene copolymer etc.), acrylic resin (for example, polymethyl methacrylate etc.), polyvinyl acetate, vinyl-vinyl acetate copolymer, polyvinyl chloride, polystyrene, polyacrylonitrile, polyamide, Merlon, polyacetals, PETG, polyphenylene oxide (poly(phenylene oxide)), polyphenylene sulfide (polyphenylene sulfide), polysulfones, polyether sulfone, polyether-ether-ketone (polyetheretherketone), polyarylsulfone (PAS) (polyarylsulfone), TPI, TPU, polyamine base BMI (polyamino-bis-mieimide), polyamide-imides, PEI (polyetherimide), Bismaleimide Triazine (bismaleimide-triazine) resin, polymethylpentene (polymethylpentene), fluoride resin, liquid crystal polymer, alkene-ethenol copolymer, ionomer resin, polyarylate (polyarylate), acrylonitrile ethylene styrene copolymer, the thermoplastic resin such as acrylonitrile-butadiene-styrene copolymer and acrylonitritrile-styrene resin.
As resin, preferred consolidation resin, more preferably curability silicone resin.
As curability silicone resin, can list such as 2 stage solidification type silicone resins, 1 stage solidification type silicone resin etc.
2 stage solidification type silicone resins have the reaction mechanism in 2 stages, be in the reaction in the 1st stage the B stage (semi-solid preparation) and in the reaction in the 2nd stage the curability silicone resin in C stage (completely curing).
In addition, the B stage be 2 stage solidification type silicone resins in dissolving in A stage and the state of completely crued C between the stage of solvent, be to solidify and gelation is only carried out little by little, swelling but do not dissolve completely, can soften but the state of not melting by heating in solvent.
1 stage solidification type silicone resin has the reaction mechanism in 1 stage, is completely crued curability silicone resin in the reaction in the 1st stage.
In addition, as curability silicone resin, for example can list the Thermocurable silicone resin curing by heating, for example, by irradiating active energy ray (, ultraviolet ray, electron beam etc.) curing active energy ray-curable silicone resin etc. for example.Preferably list Thermocurable silicone resin.
The proportion of resin, for example than the light specific gravity of fluorophor and/or filler, particularly, for example, is more than 0.5, and is for example below 2.0.
With respect to varnish, the mixing ratio of resin is for example more than 0.1 quality %, more than being preferably 0.5 quality %, and for example for being less than 100 quality %, is preferably below 99.5 quality %.
In addition, in varnish, can coordinate in the proper ratio as required the composition arbitrarily such as solvent, additive.As solvent, can list such as the aliphatic hydrocarbons such as hexane, such as the aromatic hydrocarbon such as dimethylbenzene, siloxanes such as vinyl cyclic dimethylsiloxane siloxanes, two terminal ethylenyl groups dimethyl silicone polymers etc.
As additive, can list surface conditioners such as dispersant, silane coupler and levelling agent etc.
By by above-mentioned each components matching and be uniformly mixed to prepare varnish.
The viscosity of varnish under 25 ℃ and an atmospheric condition is for example more than 1000mPas, more than being preferably 4000mPas, and is for example, below 1000000mPas, to be preferably below 100000mPas.In addition, viscosity is by the temperature of varnish being adjusted to 25 ℃ and use E type cone and plate viscometer to turn mensuration with per second 99.
Then, the varnish preparing is dropped in tank 2.
Prepare in addition base material 54.
Base material 54 forms sheet, but the not restriction especially of its outer shape for example, forms as shown in Figure 1 and overlooks essentially rectangular shape (comprising rectangular strip, strip) etc.In addition, base material 54 configures along horizontal direction.
Base material 54 is by such as mylar such as PETGs (PET), become sheet such as resin-shaped such as vistanex such as polypropylene.In addition, also can make base material 54 be formed by for example metal.Also can apply lift-off processing etc. to the surface of base material 54.
Then, as with reference to Figure 10, make the 23(of the injection portion slit 57 of nozzle 5) relative with base material 54, and make injection portion 23 approach base material 54.
Now, by the length setting on above-below direction between scraper 26 and base material 54 for for example filming 60(with reference to Figure 10) the thickness of expectation more than or for example with the thickness same thickness of 60 the expectation of filming, particularly, for example, more than being set as 10 μ m, more than being preferably set to 30 μ m, and be for example set as, below 3000 μ m, being preferably set to below 2800 μ m.
Then, pump 3 is driven, and utilize mobile device 55 that nozzle 5 is forwards moved horizontally.
Now, by the driving of pump 3, varnish is guided to supply hole 20(with reference to Fig. 5 from tank 2 via the 1st pipe arrangement 61, pump 3 and the 2nd pipe arrangement 69).
So, make varnish flow into inflow space 52, in expansion section 33, as with reference to Fig. 7 A, Fig. 7 B, varnish is expanded gradually along left and right directions, and to outflow space 53, flows out under the driving of pump 3 and/or the effect of gravity.Then,, in outflow space 53, as shown in Figure 6, varnish is constriction on fore-and-aft direction on one side, Yi Bian flow, arrives seam portion 56 downwards.
Afterwards, varnish is suppressed by bellying 16 the flowing of the both ends on left and right directions (both ends in the 1st direction) of seam portion 56, and, varnish is also suppressed by bellying 16 in the injection at the both ends on left and right directions of injection portion 23, in this case, varnish sprays towards base material 54 from slit 57.
The thickness that is ejected into the varnish on base material 54 can be adjusted by the scraper 26 of the 1st 11 of forwards mobile nozzle 5.
Afterwards, make as required varnish-drying, thereby form, film 60.
In addition, by varnish is coated on base material 54 intermittently, can form and film 60 with one chip, or can be also, by varnish is sprayed to base material 54 continuously, can form and film 60 with continous way.In addition, afterwards, that also can utilize that the sharp processing of cutting etc. makes continous way films 60 for one chip.
Afterwards, as required, in the situation that resin contains curable resin, utilize heat, active energy ray etc. to apply and solidify processing.Thus, formation curing rear (or after semi-solid preparation) films 60.
In addition, in the situation that resin contains thermoplastic resin, on applying device 1, heater is set, Yi Bian heat, makes resin melting or softening, Yi Bian implement above-mentioned processing.
And, in this applying device 1, can utilize bellying 16 relatively to suppress the injection at the both ends on left and right directions in injection portion 23 of varnish.That is to say, the injection with respect to the middle part on left and right directions in injection portion 23 of varnish, can suppress the injection at the both ends on left and right directions in injection portion 23 of varnish.Therefore, the projection on thickness direction at 60 the both ends on left and right directions of can suppressing to film, thus can guarantee to film 60 flatness.
On the other hand, in this applying device 1, even if the jet flow at the both ends on left and right directions in injection portion 23 of varnish becomes slow, also can be due to the both sides of direction (the 1st direction outside) expansion to the left and right gradually along with going towards downside (injection direction downstream) in expansion section 33 of the varnish by manifold 21, and can prevent that varnish from becoming slowly because of the jet flow that causes varnish that contains particle, thereby can prevent the delay of varnish.Its result can be eliminated the inhomogeneities of the particle in varnish in manifold 21.Thereby, can guarantee obtained 60 the flatness of filming, and the uniformity of the particle in 60 of guaranteeing fully to film.
In addition, the long-pending opening section that is greater than supply hole 20 of the opening section extending along the direction with injection direction quadrature in inflow space 52 amasss, and, in inflow space 52, because opening section is long-pending, expand along with downward going, therefore, can make varnish promptly along left and right directions, expand.On the other hand, because the opening section of outflow space 53 is long-pending, dwindle along with downward going, therefore can to varnish, exert pressure and varnish be sent into seam portion 56 on one side on one side.
But, in manifold 21, to compare with outflow portion 51, the jet flow of the above-mentioned varnish in inflow portion 50 easily becomes slowly, the delay of the varnish that easily generation causes thus.
But, in this applying device 1, owing to being provided with expansion section 33 in inflow portion 50, therefore can prevent that the jet flow of above-mentioned varnish from becoming slowly, thereby can prevent the delay of varnish.
In the explanation of Fig. 7 A, Fig. 7 B, Accessory Members 25 is configured to and can be loaded and unloaded with respect to manifold 21, though not shown, can be also for example, Accessory Members 25 and manifold 21 to be configured to one.Preferably Accessory Members 25 being configured to can be with respect to manifold 21 handling.Adopt such applying device 1, can correspondingly be replaced by according to the characteristic of varnish the Accessory Members 25 of intended shape.Particularly, according to the viscosity of varnish, correspondingly change the inclination angle of the lower surface (inclined plane) of Accessory Members 25.Specifically, according to the kind of the kind of particle, mixing ratio, shape, average grain diameter, resin, mixing ratio and viscosity etc., that is to say the inclination angle that changes (inclined plane) of above-mentioned Accessory Members 25 according to the formula of varnish, thereby can prevent simply the delay of above-mentioned varnish.
In addition, be set as transparent component by the 2nd 12, but can be also for example, by the 2nd 12, to be set as the opaque member being formed by metal.Preferably make the 2nd 12 for transparent component.Adopt such applying device 1, can, via the 2nd block of varnish that 12 visualizations are passed through in comprising the chamber 49 of expansion section 33 as transparent component, therefore can check simply the state of the particle in varnish.
In addition, in order to confirm varnish delay of 33 in expansion section, be not limited to be formed by above-mentioned transparent material the 2nd 12, also can be, for example, in the 2nd 12, (for example make the part relative with expansion section 33, window portion) by transparent material, formed, making this part part is in addition opaque member.
In addition, in the embodiment of Fig. 1, nozzle 5 is moved with respect to base material 54, as long as for example make to relatively move between base material 54 and nozzle 5, though not shown, but can be also that base material 54 is moved with respect to nozzle 5.
In the above description, so that slit 57 mode is downward provided with nozzle 5, but for example also can make slit 57 towards for example side or top.
In addition, in the embodiment of Fig. 3, bellying 16 is located to the 2nd pad 15, but can is also, for example, as shown in Figure 11 bellying 16 is located to the 1st pad 14.
And, in the embodiment of Fig. 3, two bellyings 16 are all located to the 2nd pad 15, but can be also, for example, as shown in figure 12, a bellying 16 is located to the 2nd pad 15 of right side part, and another bellying 16 is located to the 1st pad 14 of left part.
In addition, in the embodiment of Fig. 3, bellying 16 is formed and looks up essentially rectangular shape, but can be also, what for example, as shown in Figure 13 bellying 16 is formed to its length on left and right directions shortens gradually along with going towards rear side looks up general triangular shape.
In addition, in the embodiment of Fig. 7 B, bellying 16 is formed to the part corresponding with chamber 49 and seam portion 56, but can is also, for example, as shown in figure 15, bellying 16 is only formed to the part corresponding with seam portion 56.
In addition, in the embodiment of Fig. 1, nozzle 5 is forwards moved, but moving direction being not limited thereto, can be also for example to make nozzle 5 rearward move.In this case, as with reference to Figure 10, utilize the scraper 26 of the 2nd 12 to adjust to film 60 thickness.
In addition, in the respective embodiments described above, also can implement the processing such as chamfer machining to each part in nozzle 5 and process.
embodiment
Can be by the numerical value in embodiment shown below and comparative example instead of the corresponding numerical value of recording in above-mentioned embodiment (that is, higher limit or lower limit).
Embodiment 1
the preparation of varnish
In the aqueous silicone resin of 80 mass parts (the A liquid of LR7665,1 stage solidification type silicone resin, proportion 1.0, chemical industrial company of Japanese SHIN-ETSU HANTOTAI manufacture), add 20 mass parts silicon grains (ト ス パ ー Le (Tospearl) 2000B, proportion 1.32, モ メ Application テ ィ Block パ Off ォ ー マ Application ス マ テ リ ア ルズ ジャパン company manufacture), and add 15 mass parts YAG:Ce(Y-468, proportion 4.5, yellow fluorophor, ネ モ ト Le ミマ テリアル company and manufacture), above-mentioned substance is uniformly mixed and prepares varnish.
The viscosity of varnish under 25 ℃ and an atmospheric condition is 40000mPas.
the coating of carrying out to base material
As shown in Fig. 1~Figure 10, prepared to comprise the applying device of tank, pump, nozzle (thering is Accessory Members and bellying) and mobile device.The size of nozzle is shown below.
nozzle
Then, the varnish preparing is dropped in tank, prepared in addition the base material being formed by PET.
Then, utilize mobile device, so that scraper makes the slit of nozzle relative with base material with the mode that the length on above-below direction between base material reaches 400 μ m.
Then, pump is driven, and utilize mobile device to make nozzle forwards move horizontally 140mm.
Thus, to have manufactured length on left and right directions be 54mm, the length on fore-and-aft direction is that to be 0.4mm film for 140mm, thickness.
Comparative example 1
Accessory Members is not installed in nozzle, in addition, is processed similarly to Example 1 and manufactured and filmed.
evaluate
From the 2nd side visualization the varnish in the nozzle during coating in embodiment 1 and comparative example 1.Its photo is illustrated in Figure 15 and Figure 16.
In nozzle, do not installing in the comparative example 1 of Accessory Members, in the bight at the upper end in upside space and the both ends on left and right directions, can see there is YAG:Ce(yellow fluorophor) the thin part that thins out, in bight, can see the delay that has varnish.
Compare with comparative example 1, in embodiment 1, do not see the YAG:Ce(yellow fluorophor of varnish) thin part, known YAG:Ce(yellow fluorophor) be even.
In addition,, although provide above-mentioned explanation as illustrated embodiment of the present invention, this is only illustration, should not do limited explanation.Apparent variation of the present invention is to be included in claims of the present invention for a person skilled in the art.
utilizability in industry
The manufacture that applying device is applicable to film.
description of reference numerals
1, applying device; 5, nozzle; 12, the 2nd (transparent component); 16, bellying; 21, manifold; 23, injection portion; 33, expansion section.

Claims (4)

1. an applying device, it,, for applying the varnish that contains particle and resin, is characterized in that,
This applying device comprises: manifold, and it is for making varnish along the 1st Directional Extension with injection direction quadrature; And
Injection portion, it is for spraying due to above-mentioned manifold along the varnish after above-mentioned the 1st Directional Extension,
In above-mentioned manifold, be provided with length in above-mentioned the 1st direction along with going towards above-mentioned injection direction downstream elongated expansion section gradually,
In above-mentioned injection portion, be provided with for relatively suppressing the injection suppressing portion of injection of the end in above-mentioned the 1st direction in above-mentioned injection portion of above-mentioned varnish.
2. applying device according to claim 1, is characterized in that,
Above-mentioned manifold comprises:
Inflow portion, it is for flowing into for varnish, and the opening section extending along the orthogonal direction with above-mentioned injection direction quadrature of this inflow portion is long-pending along with going and expand towards above-mentioned injection direction downstream; And
Outflow portion, it is arranged on the above-mentioned injection direction downstream of above-mentioned inflow portion, and for flowing out from above-mentioned inflow portion for varnish, the opening section of the extension along above-mentioned orthogonal direction of this outflow portion is long-pending along with going and dwindle towards above-mentioned injection direction,
Above-mentioned inflow portion is located in above-mentioned expansion section.
3. applying device according to claim 1, is characterized in that,
For dividing Accessory Members above-mentioned expansion section, that can load and unload with respect to above-mentioned manifold, be located at the end in above-mentioned the 1st direction of the above-mentioned injection direction upstream side of being positioned at of above-mentioned manifold.
4. applying device according to claim 1, is characterized in that,
This applying device has the transparent component of the varnish can visualization passing through in above-mentioned expansion section.
CN201410118126.9A 2013-03-27 2014-03-27 Coating device Pending CN104069985A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013066023A JP2014188435A (en) 2013-03-27 2013-03-27 Coating apparatus
JP2013-066023 2013-03-27

Publications (1)

Publication Number Publication Date
CN104069985A true CN104069985A (en) 2014-10-01

Family

ID=51591818

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201410118126.9A Pending CN104069985A (en) 2013-03-27 2014-03-27 Coating device
CN201420142405.4U Expired - Fee Related CN203862491U (en) 2013-03-27 2014-03-27 Coating device

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201420142405.4U Expired - Fee Related CN203862491U (en) 2013-03-27 2014-03-27 Coating device

Country Status (5)

Country Link
JP (1) JP2014188435A (en)
KR (1) KR20150133206A (en)
CN (2) CN104069985A (en)
TW (1) TW201436883A (en)
WO (1) WO2014156404A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111744722A (en) * 2019-06-06 2020-10-09 株式会社欧利生 Manufacturing device and manufacturing method for joint member
WO2021132992A1 (en) * 2019-12-27 2021-07-01 주식회사 엘지에너지솔루션 Electrode slurry-discharging shim allowing even coating, and coating die comprising same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014188435A (en) * 2013-03-27 2014-10-06 Nitto Denko Corp Coating apparatus
TWI558574B (en) * 2014-12-05 2016-11-21 Metal Ind Res & Dev Ct Slit Scraper Structure
KR101762813B1 (en) * 2015-01-14 2017-07-28 주식회사 엘지화학 Slot Die Having Two Shims and Coating Device Comprising the Same
CN108421678A (en) * 2018-05-14 2018-08-21 苏建贵 The coating head of slit extrusion coating machine
JP7331300B2 (en) * 2019-08-20 2023-08-23 株式会社ヒラノテクシード die
KR20210147306A (en) 2020-05-28 2021-12-07 주식회사 엘지에너지솔루션 Slot die coating device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003071354A (en) * 2001-08-31 2003-03-11 Dainippon Printing Co Ltd Coating apparatus
JP2006102598A (en) * 2004-10-01 2006-04-20 Matsushita Electric Ind Co Ltd Coating nozzle
CN101041153A (en) * 2006-03-24 2007-09-26 日东电工株式会社 Method for coating with coating liquid, coating apparatuses for use therein, and method for designing the same
CN203862491U (en) * 2013-03-27 2014-10-08 日东电工株式会社 Coating device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004305955A (en) * 2003-04-09 2004-11-04 Lintec Corp Slot die and slot die coater
JP2008140825A (en) * 2006-11-30 2008-06-19 Toppan Printing Co Ltd Skeleton spinless nozzle and resist coating apparatus with the same
JP2009273997A (en) * 2008-05-14 2009-11-26 Panasonic Corp Coating device and coating method
JP2010051953A (en) * 2008-07-30 2010-03-11 Hitachi Chem Co Ltd Method of coating, coating machine, method of rolling up coated film, and coated film roll
JP5395391B2 (en) * 2008-09-30 2014-01-22 株式会社東芝 Coating apparatus, coating method and electrode plate
JP5912762B2 (en) * 2012-03-29 2016-04-27 日東電工株式会社 Die coater and coating film manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003071354A (en) * 2001-08-31 2003-03-11 Dainippon Printing Co Ltd Coating apparatus
JP2006102598A (en) * 2004-10-01 2006-04-20 Matsushita Electric Ind Co Ltd Coating nozzle
CN101041153A (en) * 2006-03-24 2007-09-26 日东电工株式会社 Method for coating with coating liquid, coating apparatuses for use therein, and method for designing the same
CN203862491U (en) * 2013-03-27 2014-10-08 日东电工株式会社 Coating device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111744722A (en) * 2019-06-06 2020-10-09 株式会社欧利生 Manufacturing device and manufacturing method for joint member
CN111744722B (en) * 2019-06-06 2022-01-04 株式会社欧利生 Manufacturing device and manufacturing method for joint member
WO2021132992A1 (en) * 2019-12-27 2021-07-01 주식회사 엘지에너지솔루션 Electrode slurry-discharging shim allowing even coating, and coating die comprising same
CN113543896A (en) * 2019-12-27 2021-10-22 株式会社Lg新能源 Coating pad for electrode paste discharge allowing uniform coating and coating die including the same
US11951508B2 (en) 2019-12-27 2024-04-09 Lg Energy Solution, Ltd. Electrode slurry-discharging shim allowing even coating, and coating die comprising same

Also Published As

Publication number Publication date
KR20150133206A (en) 2015-11-27
JP2014188435A (en) 2014-10-06
WO2014156404A1 (en) 2014-10-02
CN203862491U (en) 2014-10-08
TW201436883A (en) 2014-10-01

Similar Documents

Publication Publication Date Title
CN203862491U (en) Coating device
CN203853230U (en) Coating device
TWI687312B (en) Polishing pads produced by an additive manufacturing process
CN104169010B (en) Coating method and device
CN106463828B (en) Method and apparatus for conductive element deposition and formation
Waasdorp et al. Accessing individual 75-micron diameter nozzles of a desktop inkjet printer to dispense picoliter droplets on demand
US20160243765A1 (en) Stereoscopic modeling apparatus and stereoscopic modeling method
CN101808826A (en) Mems printhead based compressed fluid printing system
JP2004216298A (en) Coating method and slit die nozzle
KR20180105684A (en) Method for applying ultraviolet curable coating material and method for producing ultraviolet cured film
KR20190131189A (en) Method for forming micro line pattern using inkjet printing
CN111801168B (en) Coating nozzle, method for coating adhesive material using same, and shaped strip
JP5220667B2 (en) Method for coating microcapsule-containing paint, coating apparatus, and coating sheet produced by the coating method
CN105983511A (en) A coating device and a coating method
KR100974925B1 (en) SUSPENSION DISPENSING APPARATUS AND METHOD FOR MANUFACTURING LEDs
CN115943050A (en) Method for additive manufacturing of a component
JP6732566B2 (en) Coating die head and coating equipment
US20160082718A1 (en) Methods with Inkjet Processes and Their Application
JP2008279418A (en) Method for producing three-dimensional structure body by free molding technique for three-dimensional shape
JP2013052379A (en) Coating device
JP6828642B2 (en) Application method
JP2019142213A (en) Ink-jet recording head and method for manufacturing the same
WO2021075329A1 (en) Liquid ejecting device
WO2021132689A1 (en) Brazing material applying method and method for manufacturing brazing metal member
JP7271391B2 (en) Liquid ejector

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141001

WD01 Invention patent application deemed withdrawn after publication