CN104069955B - The detection of centrifuge MEMS static friction and screening system and method - Google Patents
The detection of centrifuge MEMS static friction and screening system and method Download PDFInfo
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Abstract
A kind of centrifuge screening system and the method using the system testing MEMS device.Wafer scale centrifuge system may include basic centrifuge system and install hub part with the joining box of the basis centrifuge system.This method may include that static state and/or smooth and continuous accelerating curve is applied to one or more MEMS components by basic centrifuge system.The system may include rotating control assembly, may be coupled to centrifuge.The rotating control assembly can be configured to rotate rotating member in response to controlled per period revolution.The system may also include analytical equipment, be used to monitor one or more signals from equipment and in response to the gravity that changes over time and from DUT(measurement equipment) one or more signals determine stiction associated with DUT.
Description
Cross reference to related applications
The application requires the priority of following patent application for all purposes and following patent application is by quoting simultaneously
Enter the application: in No. 61/805,445 U.S. Provisional Application (the attorney docket 92580- that on March 26th, 2013 submits
010500US-871209)；In No. 61/829,034 U.S. Provisional Application (attorney docket that on May 30th, 2013 submits
92580-010600US-871209)；In No. 61/820,123 U.S. Provisional Application (agent that on May 6th, 2013 submits
Reference Number 92580-011600US-871209)；And in No. 14/222,575 United States Patent (USP) Shen that on March 21st, 2014 submits
Please (attorney docket 92580-010510US-903808).No. 14/222,575 above-mentioned U.S. Patent application is for all
Purpose requires above-mentioned temporary patent application, i.e., the 61/805th, the 445 U.S. Provisional Application (generation submitted on May 26th, 2013
Manage people Reference Number 92580-010500US-871209)；In the interim Shen in No. 61/829,034 U.S. that on May 30th, 2013 submits
Please (attorney docket 92580-010600US-871209)；And No. 61/820,123 beauty submitted on May 6th, 2013
State's provisional application (attorney docket 92580-011600US-871209), priority and these U.S. Provisional Patent Applications
It is incorporated by reference into No. 14/222,575 above-mentioned U.S. Patent application.
Background technique
The research and development of integrated microelectronics continues to obtain breakthrough in terms of CMOS and MEMS.CMOS technology is
Main manufacturing technology as integrated circuit (IC).Sensor based on microelectromechanical systems (MEMS) can join with IC technology
System, to implement the sensor application of multiple evolution.It is reliable to guarantee product due to integrated MEMS-CMOS device application growth
For property, the method and system for testing these integrated equipments has become essential.
Summary of the invention
The present invention relates to MEMS(microelectromechanical systems).
Embodiment of the present invention may include wafer scale centrifuge (WLC) system and the side using the system testing MEMS device
Method.Wafer scale centrifuge (WLC) system may include basic centrifuge system and pacify with the joining box of the basis centrifuge system
Fill hub part.This method may include that smooth and continuous accelerating curve is applied to two or more by basic centrifuge system
A MEMS wafer.In a specific embodiment, accelerating curve may include the constant DC acceleration of long duration.Two or more
Each of multiple MEMS wafers can have the one or more MEMS devices being formed thereon.Two or more MEMS
Wafer can be set in two or more wafer keeping box, and wherein wafer keeping box configuration is on boxlike installation hub part.The party
Method may also include the one or more target MEMS wafers of identification, this may include one that identification is located in one or more MEMS wafers
The static friction of a or multiple MEMS devices.
Other embodiments of the invention be may include pallet grade centrifuge (TLC) system and be set using system testing MEMS
Standby method.Pallet grade centrifuge (TLC) system may also include basic centrifuge system and be connected with the basis centrifuge system
The boxlike installation hub part connect.This method may include being applied to smooth and continuous accelerating curve by basic centrifuge system
Two or more MEMS components.Equally, the constant DC acceleration of long duration can also be applied.These components may include by scribing
Part, packed part or processed part etc. pallet, configure in tray box or carrier etc..These pallets
Box or carrier are configurable on box installation hub part.This method may also include the one or more target MEMS components of identification or portion
Point, this may include identifying these MEMS by the static friction of one or more of scribing or part processed.
Wafer scale centrifuge (WLC) and pallet grade centrifuge (TLC) are provided which continuous, lossless method with by silicon in pallet
All MEMS devices on wafer or packed part are exposed to g power (g-force), and wherein the g power is sufficiently high, to cause to move
Contact between part.If any given bare die (die) on wafer is still detained after g power is removed, then
It can be detected by chip and detect the bare die and remove the bare die from product population.Similarly, if being set to tray box or carrier
In any given packed MEMS portion be still detained after g power is removed, then then can detect inspection by chip
It surveys these parts and removes these parts from product group.
Embodiment of the present invention may include a kind of system and the method using the system testing MEMS device.In embodiment
In, the present invention provides a kind of systems of test equipment under high gravitational conditions, and wherein the system includes having rotating member
Centrifuge.Operation power can be applied to equipment, and wherein the equipment may be coupled to rotating member.The system may include rotation control
Device may be coupled to centrifuge.The rotating control assembly can be configured to make to rotate structure in response to controlled per period revolution
Part rotation.The system may also include analytical equipment, be used to monitor related with controlled per period revolution from equipment
One or more signals.Those of ordinary skill in the art will appreciate that other variations, modification and substitution.
In a specific embodiment, rotating member may also include and the joining power source of equipment.The power source can be
Battery, capacitor etc., and can be configured to provide operation power to equipment.Rotating member may also include and the joining communication of equipment
Source.The communication source can be configured to the signal from equipment being supplied to analytical equipment.Communication source may include such source such as Wi-
Fi, wireless, optical, bluetooth, near-field communication, microwave, laser etc. and combinations thereof.In addition, analytical equipment may include being configured to
The communication sink of signal is received from the communication source.
In a specific embodiment, equipment includes the accelerometer based on MEMS, is configurable on and equipment shown in Fig. 9
On similar installation unit.Installation unit can spatially be configured to for the accelerometer based on MEMS being oriented to give birth to by centrifuge
At centripetal force at predetermined angle.Cube is installed by rotation, all axis of mounted accelerometer can be tested.Controlled is every
Period rotation may include the controlled per period revolution changed over time.In this case, analytical equipment can be configured to
The gravity changed over time for being applied to equipment is determined in response to the controlled per period revolution changed over time.Analytical equipment
It may be additionally configured to the gravity in response to changing over time and one or more signals from the accelerometer based on MEMS determine
Stiction associated with the accelerometer based on MEMS.In a specific embodiment, the one or more signal can with it is multiple
Former power is associated, and wherein the recuperability is associated with the accelerometer based on MEMS.
In embodiments, the present invention provides the methods for determining defect equipment under the gravitational conditions.This method
It may include that equipment is attached to the rotating member of centrifuge and operation power is applied to equipment.When being applied with operating work in equipment
When rate, the rotating member of centrifuge can have controlled rotation speed.The rotation speed can be associated with gravity.In embodiment
In, this method may include relative to gravity slewing, to apply gravity with specified angle.By with different orientation arrangements
Equipment, equipment can be tested on six all axis.Then, when being applied with operation power in equipment and by gravity
When, one or more signals from equipment, which can be received in, to be calculated in equipment.By using equipment is calculated, in response to this
Or multiple signals and gravity, equipment can be determined as defect or be not defect.
In a specific embodiment, this method may include connection power source to rotating member and equipment, to mention to equipment
For operation power.The power source can be selected from battery, capacitor etc..
In a specific embodiment, this method may include applying adjustment factor when being applied with operation power in equipment to setting
It is standby, and output response is believed in the one or more of adjustment factor when being applied with operation power in equipment and by gravity
Number.In addition, the one or more signal can be exported from the joining communication source of centrifuge.The one or more signal can be from logical
Believe mechanism output, wherein the communication agency is selected from Wi-Fi device, wireless device, Optical devices, blue-tooth device, near-field communication dress
It sets, microwave device, laser aid etc..
In a specific embodiment, equipment may include the accelerometer based on MEMS, and the method for controlling rotation speed
Step may include the timely rotation speed for changing rotating member.In response to one or more signals and rotation speed and and acceleration
Counting associated static friction source can determine in calculating equipment.In addition, the one or more signal can be associated with recuperability,
In the recuperability it is associated with the accelerometer based on MEMS.
Other embodiments of the invention can be related to test the various equipment based on MEMS with detection quality.
With reference to specific embodiment and attached drawing, each other purpose of the invention, feature and excellent can be more fully understood
Point.
Detailed description of the invention
Fig. 1 shows conventional centrifuge；
Fig. 2 shows traditional wafer keeping box with wafer；
Fig. 3 shows conventional wedge tenon center hub part；
Fig. 4 shows wafer scale centrifuge (WLC) system of embodiment according to the present invention；
Fig. 5 is to show the schematic diagram of the method that manufacture MEMS device is tested using WLC of embodiment according to the present invention；
Fig. 6 is the schematic diagram for showing the power on the wafer for acting on and being located in the centrifuge of embodiment according to the present invention；
Fig. 7 is to show rotary centrifugal force (RCF)-angular speed relationship schematic diagram of embodiment according to the present invention；
Fig. 8 is to show the simplification for the method that embodiment according to the present invention is used for using WLC system manufacture MEMS device
Flow chart；
Fig. 9 shows the installation of embodiment according to the present invention to the customization 8DUT(measurement equipment of multi-axial cord test block) from
Scheming plate；
Figure 10 shows the centrifuge measuring system with custom-modification of embodiment according to the present invention；
Figure 11 shows equipment under test (DUT) system of embodiment according to the present invention；
Figure 12 is to show the schematic diagram of the method for operation centrifuge measuring system of embodiment according to the present invention；
Figure 13 is to show the schematic diagram of the method for explanation DUT of embodiment according to the present invention；
Figure 14 is to show the schematic diagram of the conservation of energy of the DUT of embodiment according to the present invention；
Figure 15 is the schematic diagram for showing the static friction of the DUT of embodiment according to the present invention and restoring to consider；
Figure 16 and Figure 17 is that the energy variation estimation that is used for of embodiment according to the present invention is calculated with static friction surplus
Simplifying indicates；And
Figure 18 is to show the schematic diagram of the graphic user interface of the analytical equipment of embodiment according to the present invention.
Specific embodiment
The present invention relates to MEMS(Micro-Electro-Mechanical-Systems, microelectromechanical systems).More
Body, embodiments of the present invention provide the method and knot for improving the integrated MEMS device including inertial sensor etc.
Structure.
Embodiments of the present invention, which are provided, to be contacted for stimulation MEMS in a controlled manner to be detected for static friction
And possibly screen the solution of the MEMS device of wafer form.This method can be applied to from wafer to complete packing device
MEMS device in any development phase.
In many MEMS devices, silicon structure is designed to move due to given accelerate, or moves as side effect,
And it is contacted when reaching end of travel with another surface.Problem is, stimulates MEMS device to reach the usual side of contact point
Method includes mechanically percussion mechanism.Under wafer form, these methods are unavailable, and these methods are moved in view of complicated
It is not reproducible in the case where state shock-testing.
Wafer scale centrifuge (Wafer Level Centrifuge, WLC) and pallet grade centrifuge (Tray Level
Centrifuge, TLC) continuous, non-destructive mode is provided which to expose all Silicon Wafers in pallet or be sealed
The MEMS device on part is filled, so that g power is sufficiently high to cause the contact between movable part.If be removed in g power
Any given bare die on wafer is still detained afterwards, detects and removes from product group then the bare die can be detected by chip.Class
As, if any given packed MEMS portion being arranged in tray box or carrier after g power is removed still is detained, this
A little parts can be detected by chip and detect and also remove from product group.
Alternative is packed part shock-testing or centrifuge, this is very expensive and time-consuming.
Fig. 1 is the picture of conventional centrifuge.The centrifuge is the G-5005 type centrifuge of OKTEK.Embodiment party of the invention
Formula may include this centrifuge, be exposed to rotary centrifugal force (RCF) for will be up to 48 " wafers with being designed to provide
Unique platform custom hardware.Other existing centrifuge models etc. can be used in WLC system as described herein.These
WLC system is designed to easy to use and safe.For example, the existing centrifuge of repacking can be efficient and may be only
Need cross head driver.
Fig. 2 is the picture with traditional wafer keeping box of wafer.The wafer keeping box is 2 slot type titanium wafer cassettes, tool
Have the Delrin(Delrin for crystal round fringes protection) hub part.These wafer keeping box can be used in one or more of WLC system
In a embodiment.
Fig. 3 is the picture of traditional wedge-shaped center hub part.The center hub part can be the wedge-shaped center hub part of pin joint, can
In one or more embodiments of WLC system.Tenon joint type (dovetail) center hub part of these types can provide box
Quick insertion and removal, allow operation readiness and to minimize the risk of operator's setup error.Releasedly by box
The other similar mechanisms for being fastened to drive hub part can be also used in the position of tenon joint type hub part.
Fig. 4 is the picture of wafer scale centrifuge (WLC) system of embodiment according to the present invention.Here, two wafers
Keeping box is configured in a vertical manner on central tenon joint type hub part, which is attached to basic centrifuge.It is making
It makes, hub part and box are critically balanced.
In specific embodiment, wafer is loaded in face of the top (landing pad side) of tenon joint type mounting rack.This is by g power
It is located in the +Z direction about the MEMS device on wafer.Every side of WLC system needs to match with the wafer of identical quantity
To ensure balance appropriate.Do not make component appropriate balance that there can be safety hazard.Rotating wafer (spinning wafer) can wrap
2 or 4 wafers or even number wafer are included to ensure to balance.
Fig. 5 is to show embodiment according to the present invention to use the schematic diagram of the method for WLC test manufacture MEMS device.The figure
Show producer and many wafers be provided to test reception device, these wafers can be with one formed thereon or
The MEMS wafer of multiple MEMS devices.Test trigger can initiate WLC test processes, independently of CP trigger.Then pass through
WLC test/Screening Treatment wafer becomes fully enclosed product.
The embodiment of method may include some or all of following steps:
One or more wafers are inserted into one or more wafer keeping box.Wafer keeping box can be pre-installed in centrifugation
It is mounted in centrifuge in machine or after wafer is inserted into it.
Controlled accelerating curve (programmed curve, such as smooth, continuous, step-by-step movement are applied to Silicon Wafer
, pulse etc.).
One or more wafers are removed from box (before or after removing box from centrifuge).
The stimulating method is incorporated in probe of wafer production stream, such as determines which is in the MEMS device of wafer scale
With/do not have static friction problem, and by MEMS device and without the wafer separate of static friction problem.
Embodiments of the present invention may include wafer scale centrifuge (WLC) system and use the system testing MEMS device
Method.Wafer scale centrifuge (WLC) system may include basic centrifuge system and the box installation for being connected to basic centrifuge system
Hub part.This method may include to one or more MEMS wafers by basic centrifuge system using controlled accelerating curve
(for example, smooth and continuous accelerating curve, the curve of piecewise-linear, static acceleration, long-time constant acceleration etc.).One
Each of a or multiple MEMS wafers can have one or more MEMS devices formed thereon.Two or more
MEMS wafer may be provided in two or more wafer keeping box, two or more wafer keeping box are configured in box installation
On hub part.This method may also include the one or more target MEMS wafers of identification, it may include pass through probe of wafer or other electrical measurements
Trial sets the static friction for identifying one or more MEMS devices in one or more MEMS wafers.
Other embodiments of the present invention include disc centrifuge (TLC) system and use the system testing MEMS device
Method.Disc centrifuge (TLC) system may also comprise basic centrifuge system and the box installation for being connected to basic centrifuge system
Hub part.This method may include to two or more MEMS components by basic centrifuge system using smooth and continuous acceleration
Curve.These components may include the scribing being configured in disc type cassette or disc type carrier etc., encapsulation or processed part
Disk etc..These disc type cassettes or carrier are configurable on box installation hub part.This method may also comprise the one or more targets of identification
MEMS component or part may include the static friction in the one or more for identify these MEMS scribings or part processed.
Fig. 6 is the schematic diagram for acting on the power on the wafer in centrifuge for showing embodiment according to the present invention.These
Equation shows force vector ApzAnd AnIt is equal.
Z g force vector between the bare die of wafer center and the bare die of edge does not have difference.
However, there are bigger differences for Y g power.It is zero tangential force in wafer center.At crystal round fringes, tangential force is
10.16K, higher than the g power 13% in Z-direction.
For the general equation of the angular speed under desired g power are as follows:
Fig. 7 is rotary centrifugal force (the RCF)-angular speed relationship schematic diagram for indicating embodiment according to the present invention.
Fig. 8 is the simplified stream for showing the method using WLC system manufacture MEMS device of embodiment according to the present invention
Cheng Tu.This method uses the WLC system with the basic centrifuge system for being connected to box installation hub part, such as outlined below:
801. provide wafer scale centrifuge (WLC) system with the basic centrifuge system for being connected to box installation hub part；
One or more MEMS wafers are inserted into one or more boxes by 802.；
One or more boxes are connected to box installation hub part by 803.；
804. pairs of MEMS wafers apply controlled accelerating curve；
805. remove one or more MEMS wafers from one or more boxes；
806. determine one or more MEMS devices with physical problem on wafer；And
807. execute other required steps.
As shown, this method has series of steps, these steps are changeable, modification, replacement, reset, expand, reduction
Or any combination of them.That is, this method repeats any of above step.These steps can individually carry out or with
Other descriptions or even without description the step of combination carry out.These steps can be carried out in the order shown or in other sequences
Suddenly, if necessary.Other processing steps can also be used using the combination of hardware and software to carry out these steps.It can also make
These steps are carried out with other processing of the realizations such as hardware or software.Certainly, many other modifications may be present, modify and replace
It changes.Other details of this method can be found in the whole instruction and in greater detail below in description.
In one embodiment, the present invention provides the methods for using WLC system testing MEMS device.As shown in figure 8,
This method can begin at step 801, provide WLC system.In step 802, one or more MEMS wafers can be inserted into one
Or multiple boxes, each MEMS wafer have at least one MEMS device formed thereon.In specific embodiment, one
Or multiple wafers may include two or more wafers (even number wafer), and can be inserted into (even number in two or more boxes
A box), box is configured on box installation hub part in a manner of accurate balance.Each MEMS wafer may include top or landing pad
Side.In step 803, these boxes can be connected to the box installation hub part of WLC system.MEMS wafer and box may be configured so that each
The top surface of MEMS wafer installs hub part to box.Box is either vertically or horizontally mounted on box installation hub part.
In step 804, it is carried out in WLC system once, controlled acceleration can be applied to MEMS wafer by WLC system
It writes music line.In step 805, after the processing in WLC system, one or more MEMS wafers are moved from one or more boxes
It removes.In step 806, the MEMS device with physical problem on these wafers is then identified.These physical problems may include
Static friction problem in MEMS device.Other steps can be if necessary additionally carried out.
In one embodiment, MEMS is tested using wafer scale centrifuge (WLC) system the present invention can provide a kind of
The method of device, the WLC system include basic centrifuge system and the box installation hub part for being connected to basic centrifuge system.The party
Method may include providing two or more MEMS wafers, and each MEMS wafer is filled with one or more MEMS formed thereon
It sets.Two or more MEMS devices are configurable in two or more wafer keeping box.In one embodiment, it may be present
Even a or four MEMS wafers, it is therein that each there are one or more MEMS devices formed thereon.
These wafer keeping box are configurable on box installation hub part.It is brilliant that box can be the 2 slot type titaniums with Delrin hub part
Circle box, but other wafer cassettes can also be used.In specific embodiment, the MEMS wafer in wafer keeping box can accurately be put down
The mode of weighing apparatus configures on hub part.Wafer keeping box can be installed vertically or horizontally.Box installation hub part may include the joggle of pin joint
Formula central box installs hub part.
In specific embodiment, each of two or more MEMS wafers include top or landing pad side.
When installing MEMS wafer and wafer keeping box, configuration may include positioning MEMS wafer so that each of in wafer keeping box
The top surface of wafer installs hub part to box.These wafer keeping box can also be configured so that from the g power phase for applying accelerating curve
The direction Z+ is oriented in for one or more MEMS devices in each MEMS wafer.
Controlled accelerating curve can be applied to MEMS wafer by basic centrifuge system, and can recognize one or more
A target MEMS wafer.Controlled accelerating curve may include smooth accelerating curve, static acceleration curve, continuous acceleration
It writes music line, step-type accelerating curve, pulse acceleration curve, long term constant accelerating curve or other curves.More specifically
Ground, the MEMS device that one or more shows static friction can be identified in MEMS wafer.It can be in identifying processing using each
Kind processing, including chip detection, probe of wafer, conventional detection production etc. and their combination.
Fig. 9 is mounted to the customization 8DUT(measured device of multiaxis test block) it is centrifuged the picture of plate.The DUT test board can wrap
Include the PCB(printed circuit board being arranged on installation cube), it may be configured for 8 equipment (showing on circuit boards),
This 8 equipment can be MEMS device, MEMS package part etc..In various embodiments, according to application and/or equipment ruler
It is very little, the equipment of different number can be mounted on test board (for example, 2,4,6,10 etc.).
Figure 10 is the picture with embodiment according to the present invention, the centrifuge measuring system of customized modification.Such as
Shown in figure, the bluetooth transceiver being battery powered is installed in the center of hub part.Two DUT boards are installed in opposite end.
As shown in figure 9, these DUT boards can be customized 8DUT centrifuge plate.The configuration provides the appearance of 16DUT in single run
Amount.These DUT boards can be configured in various positions through the installation cube for making to be equipped with the PCB with MEMS device above
Body rotation or all 6 axis for realizing stimulation relative to the direction of the centripetal force generated by centrifuge plate system by changing plate
Line (- x ,-y ,-z ,+x ,+y ,+z).
Figure 11 is the measured device (DUT) of embodiment according to the present invention or the picture of centrifuge measuring system.DUT can
To be wafer, bare die, encapsulation chip, active package chip etc..As shown, the fixing shell including revolving part or arm can couple
To calculating equipment.Fixing shell can be basic centrifuge instrument or system, the G-5005 type of all OKTEK as shown in Figure 1
Centrifuge.Similar to Figure 10, DUT test board and battery may be coupled to the end of rotating arm.
In a specific embodiment, revolving part can also comprise the power supply for being attached to the equipment.The power supply can be battery,
Capacitor etc., and be configured to the equipment and operation power is provided.Revolving part can also include being attached to the device
Communication source.The communication source may be configured to provide the signal from the equipment to analytical equipment.The communication source may include such as Wi-
The source of Fi, wireless, optics, bluetooth, near-field communication, microwave, laser etc. and combinations thereof.In addition, analytical equipment may include being configured
At the communication control processor for receiving signal from the communication source.
In a specific embodiment, which includes the accelerometer based on MEMS.Controlled per period revolution can wrap
Include the controlled per period revolution changed over time.In this case, analytical equipment can be configured in response to controlled
The per period revolution changed over time determines the gravity changed over time for being applied to the equipment.Analytical equipment can also be matched
It is set to the gravity in response to changing over time and one or more signals determination from the accelerometer based on MEMS and base
In the associated stiction of the accelerometer of MEMS.In a specific embodiment, these one or more signals can with it is multiple
Former power is associated, wherein recuperability is associated with the accelerometer based on MEMS.
In embodiments, centrifuge measuring system can be configured to have multiple customized modifications, in order to which MEMS is set
The test of standby, package of MEMS part etc..Rotating arm can be by being electrically coupled to USB(universal serial bus) DAQ(data collection system)
The optical switch of module controls.The USB DAQ module may be coupled to calculating equipment, such as desktop computer, tablet computer,
Mobile phone etc..In addition, bluetooth transceiver can be set in fixing shell, and it is configured to transmit from DUT test board
Data (as shown in Figure 9).Various software measurement tool LabVIEW etc. can be used to locate for data from bluetooth transceiver
Reason.
Figure 12 is the schematic diagram for showing the method for the measuring system of centrifuge of operation embodiment according to the present invention.More
Body, the figure shows applied acceleration (acceleration of g) and the accelerating curve as time goes by and according to equipment
Export the relationship of (RBM) between the static friction energy found in DUT as time goes by.Indicate two key points: MEMS
When detection quality (PM) and MEMS stop structure are contacted, and when PM is released.
In embodiments, the present invention provides the methods for determining defective equipment under high gravity.This method can
Revolving part including equipment to be attached to centrifuge, and apply operation power to the equipment.The revolving part of centrifuge have by
The rotation speed of control, and the equipment has the operation power being applied thereto.The rotation speed can be associated with gravity.In reality
It applies in mode, this method may include that the equipment is rotated relative to gravity, to apply gravity with specified angle.By in not Tongfang
The equipment is upwardly biased, the equipment can be tested on all 6 axis.Then, there is the operation applied with thereon in the equipment
Power and while by gravity, can receive one or more signals from the equipment in calculating equipment.It is set using calculating
It is standby, in response to one or more signals and gravity, it may be determined that the equipment has zero defect.
In a specific embodiment, this method may include that the power supply that will be coupled is attached to revolving part and equipment, thus for
The equipment provides operation power.The power supply can be selected from battery, capacitor etc..
In a specific embodiment, this method can further include while the equipment has the operation power being applied thereto
Adjustment factor is applied to the equipment, and has in the equipment and applies with operation power thereon and while by gravity, from
The equipment output response is in one or more signals of adjustment factor.In addition, one can be exported from the communication source for being attached to centrifuge
A or multiple signals.These one or more signals can be from Wi-Fi, wireless, optics, bluetooth, near-field communication, microwave, laser
The communication mechanism selected in is exported.
In a specific embodiment, which may include the accelerometer based on MEMS, and control the side of rotation speed
Method step may include the timely rotation speed for changing revolving part.Calculate can determine in equipment in response to one or more signals and
Rotation speed static friction associated with accelerometer source.In addition, one or more signals can be associated with recuperability,
In, recuperability is associated with the accelerometer based on MEMS.
Figure 13 is the schematic diagram for showing the method that embodiment according to the present invention explains DUT.The attached drawing is provided for solving
Release the energy equation of the data in the centrifugation test process of one or more equipment.As previously mentioned, during the test by three
Crucial moment: test time started T0, landing time TTDWith release time TR.In T0Place, centrifuge is operated with 0RPM, thus az=
0g.In TTD, there is the acceleration for ramping to the first acceleration at place, wherein az=a1.In TRPlace has ramp down to the second acceleration
The acceleration of degree, wherein az=a2.As shown, DUT is the equipment with the detection quality (PM) for serving as spring.Provide equation
And contact the ENERGY E of PM to substrate surfaceTdThe ENERGY E of=F × d and storage in the springs=(1/2)K×d2.Herein,
ETd=Es。
Figure 14 is the schematic diagram for showing the conservation of energy of DUT of embodiment according to the present invention.Shown by herein
It is that landing energy is recuperability, recuperability is stored in the energy in spring.The equipment illustrates if not no static friction
In the case of detection quality position.By static friction, static friction energy is subtracted equal to landing energy and is released energy.
Ratio using the ratio equal to energy as static friction acceleration (a1-a2) and landing acceleration (a1).
Inherent static friction energy is defined as the static friction energy (that is, Van der Waals force) from pure surface physics.By other
Factor is added to inherent static friction energy to form total static friction energy.These factors may include that the pollutant of form membrane is (organic
Object), contact surface treatment/topological structure, particle, surface hardness (impact can change topological structure if soft) etc..These
Other factors can be changed quite greatly with the variation of manufacturing process, and many things can influence the static friction recovery of MEMS device
Potentiality.All of these factors taken together all shows need stiction nargin why.
Figure 15 is the schematic diagram for showing the static friction for DUT of embodiment according to the present invention and restoring to consider.Top is attached
Illustrating particle can be to the effect of the reduction of the spring energy stored.EsWith particle diameter dpSquare reduce.Central diagram shows
Out due to the increase of the static friction energy of surface contamination.Bottom attached drawing shows the irregular static friction due to surface topology
The reduction of energy, surface topology irregularly cause contact area to reduce.
If static friction energy or the unchanged property that releases energy, static friction limitation is set as E(stiction)/ETD<
1.0 being sufficient.In other words, ETD>E(stiction).However, due to variability, it is therefore necessary to release energy and landing energy
Between have nargin, to ensure that live part will not be clung.In order to be similar to ensure that institute is required in the case where all changes
Nargin, experience static friction data and SEM particle from system described herein and measurement of centrifuge method can be used in we
Dimension data.
Figure 16 and Figure 17 is embodiment according to the present invention, for the calculating of energy variation estimation and static friction nargin
Simplify indicate.Returned energy is previously stored the energy in spring, and by reducing due to the factor vr of particle size.?
In specific embodiment, SEM data of the factor from design and for metal bump equipment is estimated as vr=(1-(0.5/
1.6))2=0.473.In addition, static friction energy passes through the factor v due to process variabilitysTo increase.In a specific embodiment,
The factor is estimated as v from the experience variability data from measurement of centrifuges≈80/20=4.Using these factors (in Figure 16
Show), final static friction nargin can be identified as E(stiction)/ETD=vr/vs=14%.Of course, it is possible to have other variations, modify and replace
Generation.
Figure 18 is the schematic diagram for showing the user interface of analytical equipment of embodiment according to the present invention.Number from DUT
According to that can be recorded and show on the screen, to allow user to be readily determined the quality of these equipment.
It will also be appreciated that example and embodiment described herein are for illustrative purposes only, and suggest
Those skilled in the art carry out various modifications or change according to these examples and embodiment, these modifications or variation are included within
In spirit herein and permission and the scope of the appended claims.
Claims (20)
1. centrifuge screening system, comprising:
Basic centrifuge system, including variable speed control, drive hub part and protective shell；
Box installs hub part, is connected with the basic centrifuge system；And
One or more boxes, configuration is on box installation hub part；Wherein each box is configured to keep MEMS wafer, each
The MEMS wafer has multiple MEMS devices；And
Wherein, one or more of boxes and box installation hub part are by accurate balance.
2. the system as claimed in claim 1, wherein the basis centrifuge system includes finished product centrifuge or the G- of OKTEK
5005 type centrifuges.
3. the system as claimed in claim 1, wherein box installation hub part includes the tenon joint type central cassette installation hub part of pin joint,
And it is configured to keep two wafer keeping box or two pallet carriers or tray box.
4. the system as claimed in claim 1, wherein
Each of one or more of boxes include the 2 slot titanium wafer cassettes with Delrin rib-shaped piece.
5. the system as claimed in claim 1, wherein one or more of boxes are either vertically or horizontally mounted on the box peace
It fills on hub part.
6. for the method using centrifuge screening system testing MEMS device, wherein it includes basis that the centrifugal sieve, which selects system,
Centrifuge system and hub part is installed with the basic centrifuge system joining box, which comprises
One or more MEMS wafers are provided, are formed with one or more MEMS devices in each MEMS wafer；
In the interior one or more of MEMS wafers of configuration of each of two or more boxes；
The two or more boxes are configured on box installation hub part in a balanced fashion；
By the basic centrifuge system, controlled accelerating curve is applied to one or more of MEMS wafers；With
And
Identify one or more target MEMS devices；And
Wherein, the configuration of one or more of MEMS wafers and the two or more boxes is configured in a manner of accurate balance
On box installation hub part.
7. method as claimed in claim 6, wherein
The two or more boxes include two or more wafer keeping box, wherein in one or more of MEMS wafers
Each include top side or bonding pad side, one or more of MEMS wafers and the two or more wafers are protected
The configuration of box is held so that the top side of each of one or more of MEMS wafers is from the two or more
Hub part is installed in face of the box in wafer keeping box.
8. method as claimed in claim 6, wherein one or more of MEMS wafers and the two or more boxes
It configures so that the g power obtained by the application accelerating curve is relative to each of one or more of MEMS wafers
One or more MEMS devices be oriented in +Z direction.
9. method as claimed in claim 6, wherein
The step of identifying one or more target MEMS devices includes one that identification is located in one or more of MEMS wafers
Static friction in a or multiple MEMS devices；And
The step of identifying one or more target MEMS devices includes that chip detects processing, wafer detects processing or traditional wafer
Needle surveys production process.
10. method as claimed in claim 6, wherein the controlled accelerating curve includes smooth accelerating curve, static state
Accelerating curve, continuous accelerating curve, segmented accelerating curve or pulsed accelerating curve.
11. method as claimed in claim 6, wherein
The two or more boxes include two or more tray boxes or pallet carrier；And
The step of configuring one or more of MEMS wafers in two or more boxes is included in the two or more
MEMS scribing part, MEMS package part or MEMS are configured in each of tray box or pallet carrier handles part.
12. the system of test equipment under high gravity, comprising:
Centrifuge, including rotating member；
Configure two or more boxes on the rotating member, wherein each box is configured to keep MEMS wafer, often
A MEMS wafer has multiple MEMS devices, wherein being applied with operation power in each MEMS device；
Rotating control assembly is connected with the centrifuge, wherein the rotating control assembly be configured to it is controlled every
Period revolution rotates the rotating member；And
Analytical equipment, for monitoring the one or more letter about controlled per period revolution from the equipment
Number；And
Wherein, the two or more boxes and the rotating member are by accurate balance.
13. system as claimed in claim 12, wherein
The rotating member further includes and the joining power source of the equipment；
The power source is configured to provide the operation power to the equipment；And
The power source is selected from the group being made of battery, capacitor.
14. system as claimed in claim 12, wherein
The rotating member further includes and the joining communication source of the equipment；
The communication source is configured to provide the signal from the equipment to the analytical equipment；
The communication source is selected from the group being made of Wi-Fi, wireless, optics, bluetooth, near-field communication, microwave and laser；And
The analytical equipment includes the communication sink for being configured to receive the signal from the communication source.
15. system as claimed in claim 12, wherein
The equipment includes the accelerometer based on MEMS, wherein it is described based on the accelerometer disposition of MEMS in installation unit
On；
The installation unit is spatially configured to for the accelerometer based on MEMS being oriented relative to by the centrifuge
The centripetal force of generation is at predetermined angle；
Controlled per period revolution includes the controlled per period revolution changed over time；
The analytical equipment be configured to determine be applied in response to the controlled per period revolution changed over time it is described
The gravity of equipment changed over time；
The analytical equipment be configured to determine in response to the gravity changed over time and one or more of signals with
The associated stiction of the accelerometer based on MEMS；And
One or more of signals are associated with recuperability, wherein the recuperability and the accelerometer phase based on MEMS
Association.
16. determining the method for defect equipment under high gravity, comprising:
Wafer scale centrifuge screening system is provided, the wafer scale centrifuge screening system include basic centrifuge system and with institute
State the joining box installation hub part of basic centrifuge system；
MEMS wafer is attached to the box being mounted on the wafer scale centrifuge screening system, each MEMS wafer includes
Multiple MEMS devices, wherein being applied with operation power at least one of described MEMS device；
The rotation speed of the rotating member of centrifuge is controlled when being applied with the operation power in the MEMS device, wherein institute
It is associated with gravity to state rotation speed；Then
When being applied with the operation power in the MEMS device and by gravity, receive in calculating equipment from described
One or more signals of MEMS device；And
In the calculating equipment, in response to one or more of signals and the gravity, whether the MEMS device is determined
For defect equipment；And
Wherein, the box and box installation hub part are by accurate balance.
17. the method described in claim 16, wherein
The method also includes the MEMS device will be attached to the joining power source of the rotating member, thus to described
MEMS device provides the operation power；
The power source is selected from the group being made of battery, capacitor；And
The method also includes rotating the MEMS device relative to the gravity, with along the MEMS device at least one
Axis applies the gravity.
18. according to the method for claim 16, further includes:
When being applied with the operation power in the MEMS device, apply adjustment factor to the MEMS device；
One or more of signals are exported from the joining communication source of the centrifuge；And
When being applied with the operation power in the MEMS device and by the gravity, from the MEMS device in response to
The adjustment factor exports one or more of signals.
19. the method described in claim 16, wherein one or more of signals are exported from communication agency, the communication equipment
Structure is selected from the group being made of Wi-Fi, wireless, optics, bluetooth, near-field communication, microwave, laser.
20. the method described in claim 16, wherein
The MEMS device includes the accelerometer based on MEMS；
The step of controlling rotation speed includes the rotation speed for changing the rotating member in time；And
One or more of signals are associated with recuperability, wherein the recuperability and the accelerometer phase based on MEMS
Association；
The method also includes:
In the calculating equipment, in response to one or more of signals and the rotation speed, determination is based on described
The associated stiction of the accelerometer of MEMS.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361805445P | 2013-03-26 | 2013-03-26 | |
| US61/805,445 | 2013-03-26 | ||
| US201361820123P | 2013-05-06 | 2013-05-06 | |
| US61/820,123 | 2013-05-06 | ||
| US201361829034P | 2013-05-30 | 2013-05-30 | |
| US61/829,034 | 2013-05-30 | ||
| US14/222,575 | 2014-03-21 | ||
| US14/222,575 US9651473B2 (en) | 2013-03-26 | 2014-03-21 | Wafer level centrifuge for MEMS stiction detection and screening system and method |
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| CN104069955A CN104069955A (en) | 2014-10-01 |
| CN104069955B true CN104069955B (en) | 2019-01-08 |
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| US9651473B2 (en) | 2013-03-26 | 2017-05-16 | MCube Inc. | Wafer level centrifuge for MEMS stiction detection and screening system and method |
| US10317333B2 (en) | 2013-05-30 | 2019-06-11 | MCube Inc. | Centrifuge MEMS stiction test system and method |
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| JP2001183415A (en) * | 1999-12-28 | 2001-07-06 | Molex Inc | Ic socket for bare chip |
| US8587331B2 (en) * | 2009-12-31 | 2013-11-19 | Tommie E. Berry | Test systems and methods for testing electronic devices |
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| US5184068A (en) * | 1990-09-24 | 1993-02-02 | Symtek Systems, Inc. | Electronic device test handler |
| US5227717A (en) * | 1991-12-03 | 1993-07-13 | Sym-Tek Systems, Inc. | Contact assembly for automatic test handler |
| GB2262656B (en) * | 1991-12-20 | 1995-11-29 | Hitachi Ltd | Process and apparatus for transferring an object and for processing semiconductor wafers |
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