CN104069955A - Centrifuge mems stiction test system and method - Google Patents
Centrifuge mems stiction test system and method Download PDFInfo
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Abstract
A centrifuge system and method of testing MEMS devices using the system are provided. A wafer level centrifuge system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system. The method can include applying a smooth and continuous acceleration profile to two or more MEMS wafers via the base centrifuge system. Each of the two or more MEMS wafers can have one or more MEMS devices formed thereon. The system can also include an analysis device for monitoring one or more signals from the device with respect to the controlled number of revolutions per time period. The analysis device can be configured to determine a stiction force associated with the DUT (Device Under Test) in response to the time-varying gravitational forces and to the one or more signals from the DUTs.
Description
The cross reference of related application
The application requires priority and the following patent application of following patent application to be incorporated to by reference the application for all objects: in the 61/805th of submission on March 26th, 2013, No. 445 U.S. Provisional Applications (attorney docket 92580-010500US-871209); In the 61/829th of submission on May 30th, 2013, No. 034 U.S. Provisional Application (attorney docket 92580-010600US-871209); In the 61/820th of submission on May 6th, 2013, No. 123 U.S. Provisional Applications (attorney docket 92580-011600US-871209); And in the 14/222nd of submission on March 21st, 2014, No. 575 U.S. Patent applications (attorney docket 92580-010510US-903808).Above-mentioned the 14/222nd, No. 575 U.S. Patent application requires above-mentioned temporary patent application for all objects, on May 26th, 2013 submit to the 61/805th, 445 U.S. Provisional Applications (attorney docket 92580-010500US-871209); In the 61/829th of submission on May 30th, 2013, No. 034 U.S. Provisional Application (attorney docket 92580-010600US-871209); And in the 61/820th of submission on May 6th, 2013, No. 123 U.S. Provisional Applications (attorney docket 92580-011600US-871209), priority and these U.S. Provisional Patent Application be incorporated to by reference above-mentioned the 14/222nd, No. 575 U.S. Patent applications.
Background technology
The research and development of integrated microelectronics continues obtaining breakthrough aspect CMOS and MEMS.CMOS technology has become the main manufacturing technology of integrated circuit (IC).Sensor based on microelectromechanical systems (MEMS) can with IC technical relation, to implement the sensor application of multiple evolution.Due to the growth of integrated MEMS-CMOS equipment application, concerning ensureing product reliability, become essential for testing the method and system of these integrated equipments.
Summary of the invention
The present invention relates to MEMS(microelectromechanical systems).
Embodiment of the present invention can comprise wafer scale centrifuge (WLC) system and use the method for this system testing MEMS equipment.Wafer scale centrifuge (WLC) system can comprise basic centrifuge system and with the joining box of this basis centrifuge system, hub part is installed.The method can comprise by basic centrifuge system level and smooth and continuous accelerating curve is applied to two or more MEMS wafers.In detailed description of the invention, accelerating curve can comprise the constant DC acceleration of long duration.Each in two or more MEMS wafers all can have formation one or more MEMS equipment thereon.Two or more MEMS wafers can be located at two or more wafers and keep in box, and wherein this wafer keeps box to be configured on boxlike installation hub part.The method also can comprise the one or more target MEMS wafers of identification, and this can comprise that identification is positioned at the static friction of the one or more MEMS equipment on one or more MEMS wafers.
Other embodiments of the present invention can comprise pallet level centrifuge (TLC) system and use the method for this system testing MEMS equipment.Pallet level centrifuge (TLC) system also can comprise basic centrifuge system and with the joining boxlike of this basis centrifuge system, hub part is installed.The method can comprise by basic centrifuge system level and smooth and continuous accelerating curve is applied to two or more MEMS parts.Equally, also can apply the constant DC acceleration of long duration.These parts can comprise that it is configured in tray box or carrier etc. by the pallet of the part of scribing, packed part or processed part etc.These tray boxes or carrier are configurable to be installed on hub part at upper box.The method also can comprise the one or more target MEMS parts of identification or part, and this can comprise that these MEMS of identification are by the one or more static friction in scribing or processed part.
Wafer scale centrifuge (WLC) and pallet level centrifuge (TLC) all provide continuous, harmless method so that all MEMS equipment in Silicon Wafer in pallet or packed part are exposed to g power (g-force), wherein this g power is enough high, to cause the contact between movable part.If any given nude film (die) on wafer is still detained after g power is removed, then can detects and detect this nude film and from product population, remove this nude film by chip.Similarly, if any given packed MEMS part of being located in tray box or carrier is still detained after g power is removed, then can detects and detect these parts and from product group, remove these parts by chip.
Embodiment of the present invention can comprise a kind of system and use the method for this system testing MEMS equipment.In embodiment, the invention provides a kind of in high gravity situation the system of testing equipment, wherein this system comprises the centrifuge with rotating member.Operand power can be applied to equipment, and wherein this equipment can be attached to rotating member.This system can comprise rotating control assembly, and it can be attached to centrifuge.This rotating control assembly can be configured to make rotating member rotation in response to controlled per time period revolution.This system also can comprise analytical equipment, and it is for monitoring the one or more signals relevant with controlled per time period revolution from equipment.Those of ordinary skill in the art will appreciate that other variation, amendment and substitute.
In detailed description of the invention, rotating member also can comprise and the joining power source of equipment.This power source can be battery, capacitor etc., and can be configured to provide operand power to equipment.Rotating member also can comprise and the joining communication source of equipment.This communication source can be configured to the signal from equipment to offer analytical equipment.Communication source can comprise that such source is as Wi-Fi, wireless, optics, bluetooth, near-field communication, microwave, laser etc. and combination thereof.In addition, analytical equipment can comprise the communication sink that is configured to receive from this communication source signal.
In detailed description of the invention, equipment comprises the accelerometer based on MEMS, its configurable with the similar installation unit of the equipment shown in Fig. 9 on.Installation unit can be configured to the accelerometer based on MEMS to be oriented with the centripetal force being generated by centrifuge and to become predetermined angle spatially.By revolving installation cube, can test all axis of the accelerometer being mounted.Controlled per time period rotates and can comprise controlled time dependent per time period revolution.In this case, analytical equipment can be configured to determine in response to controlled time dependent per time period revolution the time dependent gravity of the equipment that is applied to.Analytical equipment also can be configured to determine in response to time dependent gravity with from one or more signals of the accelerometer based on MEMS the stiction being associated with the accelerometer based on MEMS.In detailed description of the invention, these one or more signals can be associated with recuperability, and wherein this recuperability is associated with the accelerometer based on MEMS.
In embodiment, the invention provides the method for determine damaged equipment in this gravity situation.The method can comprise equipment is attached to the rotating member of centrifuge and operand power is applied to equipment.In the time being applied with operand power on equipment, the rotating member of centrifuge can have controlled rotary speed.This rotary speed can be associated with gravity.In embodiment, the method can comprise with respect to gravity slewing, thus the angle weight application to specify.By the orientation arrangement equipment with different, equipment can be tested on six all axis.Then,, in the time being applied with operand power on equipment and being subject to gravity, can be received in computing equipment from one or more signals of equipment.By using computing equipment, in response to this one or more signals and gravity, equipment can be confirmed as to be damaged or not to be damaged.
In detailed description of the invention, the method can comprise that connection power source is to rotating member and equipment, thereby provides operand power to equipment.This power source can be selected from battery, capacitor etc.
In detailed description of the invention, the method can comprise and in the time being applied with operand power on equipment, apply adjustment factor to equipment, and in the time being applied with operand power on equipment and being subject to gravity output in response to one or more signals of the factor of adjustment.In addition, these one or more signals can be from exporting with the joining communication source of centrifuge.These one or more signals can be exported from communication agency, and wherein this communication agency is selected from Wi-Fi device, wireless device, Optical devices, blue-tooth device, near field communication means, microwave device, laser aid etc.
In detailed description of the invention, equipment can comprise the accelerometer based on MEMS, and the method step of control rotary speed can comprise the rotary speed of timely change rotating member.Can in computing equipment, determine in response to one or more signals and rotary speed the static friction source that is associated with accelerometer.In addition, these one or more signals can be associated with recuperability, and wherein this recuperability is associated with the accelerometer based on MEMS.
Other embodiments of the present invention can relate to the various equipment based on MEMS with detection quality of test.
With reference to detailed description of the invention and accompanying drawing, can more completely understand each other object of the present invention, feature and advantage.
Brief description of the drawings
Fig. 1 shows traditional centrifuge;
Fig. 2 shows traditional wafer maintenance box with wafer;
Fig. 3 shows conventional wedge tenon center hub part;
Fig. 4 shows wafer scale centrifuge (WLC) system according to embodiment of the present invention;
Fig. 5 shows the sketch of manufacturing the method for MEMS equipment according to the use WLC test of embodiment of the present invention;
Fig. 6 illustrates to act on the sketch being positioned at according to the power on the wafer of the centrifuge of embodiment of the present invention;
Fig. 7 shows the sketch of rotary centrifugal force (the RCF)-angular speed relation according to embodiment of the present invention;
Fig. 8 shows according to embodiment of the present invention for using WLC system to manufacture the simplified flow chart of the method for MEMS equipment;
Fig. 9 shows according to the customization 8DUT(that is mounted to multi-axial cord test block of embodiment of the present invention and is subject to measurement equipment) centrifuge plate;
Figure 10 shows the centrifuge measuring system with custom-modification according to embodiment of the present invention;
Figure 11 shows equipment under test (DUT) system according to embodiment of the present invention;
Figure 12 shows according to the sketch of the method for the operation centrifuge measuring system of embodiment of the present invention;
Figure 13 shows according to the sketch of the method for the explanation DUT of embodiment of the present invention;
Figure 14 shows according to the sketch of the conservation of energy of the DUT of embodiment of the present invention;
Figure 15 shows according to the static friction of the DUT of embodiment of the present invention and recovers the sketch of considering;
Figure 16 and Figure 17 are the reduced representation for energy variation estimation and the calculating of static friction surplus according to embodiment of the present invention; And
Figure 18 shows according to the sketch of the graphic user interface of the analytical equipment of embodiment of the present invention.
Detailed description of the invention
The present invention relates to MEMS(Micro-Electro-Mechanical-Systems, microelectromechanical systems).More specifically, embodiments of the present invention provide for improvement of the method and structure of integrated MEMS device that comprises inertial sensor etc.
Embodiments of the present invention provide for stimulating in a controlled manner the solution of MEMS contact to detect for static friction and to screen possibly the MEMS device of wafer form.The method can be applicable to from wafer to complete packing device in the MEMS of any development phase device.
In many MEMS devices, silicon structure is designed to because given acceleration is moved, or moves as side effect, and when arriving when end of travel and another Surface Contact.Problem is, stimulates MEMS device to comprise mechanically percussion mechanism with the usual method that arrives contact point.Under wafer form, these methods are unavailable, and these methods are in the case of considering that complicated dynamic impulsion test be unrepeatable.
Wafer scale centrifuge (Wafer Level Centrifuge, and pallet level centrifuge (Tray Level Centrifuge WLC), TLC) all provide continuous, non-destructive mode to expose the MEMS device in all Silicon Wafer or packed parts that are arranged in pallet, thereby make g power enough high to cause the contact between movable part.If any given nude film after g power is removed on wafer is still detained, this nude film can be surveyed and be detected and remove from product group by chip so.Similarly, if any given packed MEMS part arranging in tray box or carrier after g power is removed is still detained, these parts can be surveyed and be detected and also from product group, remove by chip.
Substitute mode is packed part shock-testing or centrifuge, and this is very expensive and consuming time.
Fig. 1 is the picture of traditional centrifuge.This centrifuge is the G-5005 type centrifuge of OKTEK.Embodiments of the present invention can comprise this centrifuge, its have be designed to be provided for by up to 48 " Wafer exposure is in the custom hardware of the unique platform of rotary centrifugal force (RCF).Other existing centrifuge model etc. can be used on as described herein in WLC system.These WLC systems can be designed to be easy to use and safety.For example, to reequip existing centrifuge can be high efficiency and may only need cross head driver.
Fig. 2 is the picture with traditional wafer maintenance box of wafer.It is 2 slot type titanium wafer cassette that this wafer keeps box, and it has the Delrin(Delrin for crystal round fringes protection) hub part.These wafers keep box to can be used in one or more embodiments of WLC system.
Fig. 3 is the picture of traditional wedge shape center hub part.The wedge shape center hub part that this center hub part can be pin joint, it can be used in one or more embodiments of WLC system.Tenon joint type (dovetail) the center hub part of these types can provide the quick insertion of box and remove, and it allows operation readiness and the risk of operator's setup error is reduced to minimum.Other the similar mechanism that releasedly box is fastened to drive hub part also can be used on the position of tenon joint type hub part.
Fig. 4 is the picture of wafer scale centrifuge (WLC) system according to the embodiment of the present invention.Here, two wafers keep box to be configured on central tenon joint type hub part in vertical mode, and this central authorities' tenon joint type hub part is attached to basic centrifuge.On manufacturing, hub part and box are by balance critically.
In specific embodiment, wafer is loaded with in the face of the top of tenon joint type installing rack (bond pad side).This by g power be positioned at about the MEMS device on wafer+Z direction on.Each side of WLC system need to mate to guarantee with the wafer of equal number suitable balance.Do not make parts appropriate balance can have safety hazard.Rotation wafer (spinning wafer) can comprise 2 or 4 wafers, or even number wafer is to guarantee balance.
Fig. 5 illustrates the sketch that uses according to the embodiment of the present invention WLC test to manufacture the method for MEMS device.The figure shows producer provides many wafers to test receiving system, and these wafers can be the MEMS wafers with one or more MEMS devices formed thereon.Test trigger can be initiated WLC test processes, and it is independent of CP trigger.Then become the product of encapsulation completely through the wafer of WLC test/screen processing.
Some or all during the embodiment of method can comprise the following steps:
-one or more wafers are inserted to one or more wafers maintenance boxes.Wafer maintenance box can be arranged in advance in centrifuge or after in wafer is inserted into it and be arranged in centrifuge.
-Silicon Wafer is applied to controlled accelerating curve (curve being programmed, such as level and smooth, continuous, step-type, pulse etc.).
-one or more wafers are removed from box (before or after box is removed from centrifuge).
-this stimulating method is incorporated to probe of wafer produce in stream, for example determine which has/do not have static friction problem in the MEMS of wafer scale device, and by MEMS device and the wafer separate without static friction problem.
Embodiments of the present invention can comprise wafer scale centrifuge (WLC) system and use the method for this system testing MEMS device.Wafer scale centrifuge (WLC) system can comprise basic centrifuge system and be connected to the box installation hub part of basic centrifuge system.The method can comprise by basic centrifuge system applies controlled accelerating curve (for example, level and smooth and continuous accelerating curve, piece-wise linear curve, static acceleration, long-time constant acceleration etc.) to one or more MEMS wafers.Each in one or more MEMS wafers can have one or more MEMS devices formed thereon.Two or more MEMS wafers can be arranged on two or more wafers and keep in box, and two or more wafers keep box to be configured on box installation hub part.The method also can comprise the one or more target MEMS wafers of identification, can comprise by the static friction of the one or more MEMS devices on probe of wafer or the one or more MEMS wafers of other electrical testing configuration identification.
Other embodiment of the present invention comprises disc centrifuge (TLC) system and uses the method for this system testing MEMS device.Disc centrifuge (TLC) system also can comprise basic centrifuge system and be connected to the box installation hub part of basic centrifuge system.The method can comprise by basic centrifuge system the level and smooth and continuous accelerating curve of two or more MEMS parts application.These parts can comprise the dish scribing that is configured in disc type cassette or disc type carrier etc., part encapsulation or processed etc.These disc type cassettes or carrier are configurable to be installed on hub part at box.The method also can comprise identification one or more target MEMS parts or part, and it can comprise the static friction in these MEMS scribings of identification or processed part one or more.
Fig. 6 is the sketch that acts on the power on the wafer in centrifuge illustrating according to the embodiment of the present invention.These equations show force vector A
pzand A
nequate.
Z g force vector between the nude film of wafer center and the nude film of edge does not have difference.
But there is bigger difference in Y g power.Be zero tangential force in wafer center.At crystal round fringes place, tangential force is 10.16K, higher than the g power 13% in Z-direction.
For at the general equation of expecting the angular speed under g power being:
Fig. 7 is the sketch that represents rotary centrifugal force (RCF)-angular speed relation according to the embodiment of the present invention.
Fig. 8 is the simplified flow chart that the method for use WLC system manufacture MEMS device is according to the embodiment of the present invention shown.The method is used has the WLC system that is connected to box and installs the basic centrifuge system of hub part, as following general introduction:
801. provide wafer scale centrifuge (WLC) system with the basic centrifuge system that is connected to box installation hub part;
One or more MEMS wafers are inserted one or more boxes by 802.;
One or more boxes are connected to box by 803. installs hub part;
804. pairs of MEMS wafers are applied controlled accelerating curve;
805. remove one or more MEMS wafers from one or more boxes;
806. determine the one or more MEMS devices with physical problem on wafer; And
807. carry out other required steps.
As shown in the figure, the method has series of steps, and these steps can change, revise, replace, reset, expand, reduce or their any combination., the method repeats any in above step.These steps can be carried out individually or be carried out with step combination other description or that even do not describe.Can shown in order or with other order carry out these steps, if necessary.Also can utilize the combination of hardware and software to carry out these steps with other treatment step.Also can process to carry out these steps with other of the realization such as hardware or software.Certainly, can there is many other modification, amendment and replacement.Other details of this method can whole description and following more specifically describe in find.
In one embodiment, the invention provides the method that uses WLC system testing MEMS device.As shown in Figure 8, the method can start from step 801, and WLC system is provided.In step 802, one or more MEMS wafers can be inserted to one or more boxes, each MEMS wafer has at least one MEMS device formed thereon.In specific embodiment, one or more wafers can comprise two or more wafers (even number wafer), and can be inserted into (even number box) in two or more boxes, and box is configured in box in the mode of accurate balance and installs on hub part.Each MEMS wafer can comprise top or bond pad side.In step 803, these boxes can be connected to the box of WLC system hub part is installed.The configurable top surface that makes each MEMS wafer of MEMS wafer and box is installed hub part to box.Box is arranged on vertically or flatly box and installs on hub part.
In step 804, in WLC system, carry out once, can apply controlled accelerating curve to MEMS wafer by WLC system.In step 805, after the processing in WLC system, one or more MEMS wafers are removed from one or more boxes.In step 806, then identify the MEMS device with physical problem on these wafers.These physical problems can comprise the static friction problem in MEMS device.If necessary can additionally carry out other steps.
In one embodiment, the present invention can provide a kind of method that uses wafer scale centrifuge (WLC) system to test MEMS device, and this WLC system comprises basic centrifuge system and is connected to the box installation hub part of basic centrifuge system.The method can comprise provides two or more MEMS wafers, each MEMS wafer to have one or more MEMS devices formed thereon.Two or more MEMS devices are configurable within two or more wafers keep box.In one embodiment, can the company of existence or four MEMS wafers, wherein each has one or more MEMS devices formed thereon.
These wafers keep box configurable on box installation hub part.Box can be the 2 slot type titanium wafer cassette with Delrin hub part, but also can use other wafer cassette.In specific embodiment, wafer keeps the mode that MEMS wafer in box can accurate balance to be configured on hub part.Wafer keeps box vertically or flatly to install.Box is installed the tenon joint type central box installation hub part that hub part can comprise pin joint.
In specific embodiment, each top or the bond pad side of comprising in two or more MEMS wafers.In the time that MEMS wafer and wafer maintenance box are installed, configuration can comprise locates MEMS wafer to make the top surface of the each wafer within wafer keeps box, to box, hub part is installed.These wafers maintenance boxes also configurable making are oriented in Z+ direction from the g power that applies accelerating curve with respect to the one or more MEMS devices on each MEMS wafer.
Can apply controlled accelerating curve to MEMS wafer by basic centrifuge system, and can identify one or more target MEMS wafers.Controlled accelerating curve can comprise level and smooth accelerating curve, static acceleration curve, continuous accelerating curve, step-type accelerating curve, pulse accelerating curve, long-term constant acceleration curve or other curve.More specifically, one or more MEMS devices that show static friction can be identified on MEMS wafer.Various processing be can in identifying processing, use, chip detection, probe of wafer, tradition detection production etc. and their combination comprised.
Fig. 9 is the customization 8DUT(measured device that is mounted to multiaxis test block) picture of centrifugal plate.This DUT test board can comprise the PCB(printed circuit board (PCB) being arranged on installation cube), can be configured for 8 equipment (illustrating) on circuit board, these 8 equipment can be that MEMS equipment, MEMS encapsulation part are graded.In various embodiments, according to application and/or equipment size, the equipment of varying number can be arranged on test board (for example, 2,4,6,10 etc.).
Figure 10 is the picture with centrifuge measuring system according to the embodiment of the present invention, self-defined amendment.As shown in the figure, battery-powered bluetooth transceiver is installed in Gu Jian center.Two DUT plates are installed in relative end.As shown in Figure 9, these DUT plates can be self-defined 8DUT centrifuge plates.This is configured in single run provides the capacity of 16DUT.These DUT plates can be configured in various positions with the installation cube rotation by the PCB with MEMS equipment is installed above making or by change plate with respect to the direction of the centripetal force being produced by centrifuge plate system realize stimulation all 6 axis (– x ,-y ,-z ,+x ,+y ,+z).
Figure 11 is measured device (DUT) according to the embodiment of the present invention or the picture of centrifuge measuring system.DUT can be wafer, nude film, packaged chip, active package chip etc.As shown in the figure, the fixed housing that comprises revolving part or arm can be attached to computing equipment.Fixed housing can be basic centrifuge instrument or system, the G-5005 type centrifuge of all OKTEK as shown in Figure 1.Be similar to Figure 10, DUT test board and battery can be attached to the end of turning arm.
In detailed description of the invention, revolving part can comprise the power supply that is attached to this equipment in addition.This power supply can be battery, capacitor etc., and can be configured to this equipment operand power is provided.Revolving part can also comprise the communication source that is attached to this device.This communication source can be configured to provide the signal from this equipment to analytical equipment.This communication source can comprise the source of such as Wi-Fi, wireless, optics, bluetooth, near-field communication, microwave, laser etc. and combination thereof.In addition, analytical equipment can comprise the communication control processor that is configured to receive from this communication source signal.
In detailed description of the invention, this equipment comprises the accelerometer based on MEMS.Controlled per time period revolution can comprise controlled time dependent per time period revolution.In this case, analytical equipment can be configured to determine in response to controlled time dependent per time period revolution the time dependent gravity that is applied to this equipment.Analytical equipment can also be configured to determine in response to time dependent gravity and from one or more signals of the accelerometer based on MEMS the stiction being associated with the accelerometer based on MEMS.In detailed description of the invention, these one or more signals can be associated with recuperability, and wherein, recuperability is associated with the accelerometer based on MEMS.
In embodiment, centrifuge measuring system can be configured to have multiple self-defined amendments, so that the test of MEMS equipment, package of MEMS part etc.Turning arm can be by being electrically coupled to USB(USB) DAQ(data collecting system) optical switch of module controls.This USB DAQ module can be attached to computing equipment, such as desktop computer, tablet PC, mobile phone etc.In addition, bluetooth transceiver can be arranged in fixed housing, and is configured to the data (as shown in Figure 9) of transmission from DUT test board.Data from bluetooth transceiver can be processed with such as LabVIEW etc. of various software measurement tools.
Figure 12 is the sketch that the method for the measuring system of operation centrifuge is according to the embodiment of the present invention shown.More specifically, the figure shows applied acceleration (acceleration of g) along with passage of time and this accelerating curve and the static friction energy found in DUT according to equipment output (RBM) between along with the relation of passage of time.While having pointed out that two key point: MEMS detection quality (PM) contact with MEMS stop structure, and in the time that PM is released.
In embodiment, the invention provides the method for define defect equipment under high gravity.The method can comprise the revolving part that equipment is attached to centrifuge, and applies operand power to this equipment.The revolving part of centrifuge has controlled rotary speed, and this equipment has the operand power being applied thereto.This rotary speed can be associated with gravity.In embodiment, the method can comprise with respect to gravity rotates this equipment, thereby with specified angle weight application.By this equipment of setovering in different directions, can on all 6 axis, test this equipment.Then,, when this equipment has the operand power on applying with it and is subject to gravity, can in computing equipment, receive the one or more signals from this equipment.Use computing equipment, in response to one or more signals and gravity, can determine that this equipment has zero defect.
In detailed description of the invention, the method can comprise connected power supply is attached to revolving part and equipment, thus for this equipment provides operand power.This power supply can be selected from battery, capacitor etc.
In detailed description of the invention, the method can also be included in when this equipment has the operand power being applied thereto adjustment factor is applied to this equipment, and when this equipment has the operand power on applying with it and is subject to gravity, the one or more signals from this equipment output in response to adjustment factor.In addition, can export one or more signals from being attached to the communication source of centrifuge.These one or more signals can be exported from the communication mechanism of selecting Wi-Fi, wireless, optics, bluetooth, near-field communication, microwave, laser etc.
In detailed description of the invention, this device can comprise the accelerometer based on MEMS, and the method step of control rotary speed can comprise the rotary speed of timely change revolving part.In computing equipment, can determine the static friction source being associated with accelerometer in response to one or more signals and rotary speed.In addition, one or more signals can be associated with recuperability, and wherein, recuperability is associated with the accelerometer based on MEMS.
Figure 13 is the sketch that the method for explaining according to the embodiment of the present invention DUT is shown.This accompanying drawing provides the energy equation of the data of the centrifugal test process for explaining one or more equipment.As previously mentioned, in test process by three crucial moments: test time started T
0, landing time T
tDwith T release time
r.At T
0place, centrifuge turns round with 0RPM, thus a
z=0g.At T
tDplace, has slope to rise to the acceleration of the first acceleration, wherein a
z=a
1.At T
rplace, has slope to drop to the acceleration of the second acceleration, wherein a
z=a
2.As shown in the figure, DUT is the equipment with the detection quality (PM) of serving as spring.Equation and the contact PM energy E to substrate surface is provided
td=F × d and be stored in the energy E in spring
s=(1/2) K × d
2.Here, E
td=E
s.
Figure 14 is the sketch that the conservation of energy of DUT is according to the embodiment of the present invention shown.Shown in this article, landing energy is recuperability, and recuperability is the energy being stored in spring.If described equipment has represented not have the position of the detection quality in the situation of static friction.By static friction in the situation that, the static friction energy energy that equals to land deducts and releases energy.Employing equals the ratio of energy as the ratio of static friction acceleration (a1 – a2) and landing acceleration (a1).
Inherent static friction energy is defined as the static friction energy (, Van der Waals force) from pure surface physics.Other factors are added into inherent static friction energy to form total static friction energy.These factors can comprise pollutant (organic matter), contact-making surface processing/topological structure, particle, case hardness (if softness is impacted and can be changed topological structure) of form membrane etc.These other factors can change with the variation of manufacture process quite large, and a lot of things can affect the static friction revegetation potentiality of MEMS equipment.All of these factors taken together has all shown to need stiction nargin why.
Figure 15 is the sketch that illustrates that the recovery of the static friction for DUT is according to the embodiment of the present invention considered.Top accompanying drawing illustrates that particle can be to the effect of the minimizing of stored spring energy.E
swith particle diameter d
psquare reduce.Middle accompanying drawing illustrates the increase due to the static friction energy of surface contamination.Bottom accompanying drawing illustrates that the irregular contact area that causes of surface topology reduces due to the reducing of the irregular static friction energy of surface topology.
If static friction energy or the unchanged property that releases energy are E by static friction limit setting so
(stiction)/ E
tD<1.0 is just enough.In other words, E
tD>E
(stiction).But, due to variability, thus be necessary between energy, to there is nargin releasing energy and land, to guarantee that on-the-spot part can not cling.Guarantee necessary nargin all changes in the situation that in order to be similar to, we can use from experience static friction data and the SEM particle size data of described system and measurement of centrifuge method herein.
Figure 16 and Figure 17 be according to the embodiment of the present invention, estimate and the reduced representation of the calculating of static friction nargin for energy variation.Returned energy is the energy being stored in spring, and reduces by the factor vr due to particle size.In detailed description of the invention, this factor is from designing and being v for the SEM data estimation of metal bump equipment
r=(1-(0.5/1.6))
2=0.473.In addition, static friction energy is by the factor v due to change in process
sincrease.In detailed description of the invention, this factor is v from the experience variability data estimation from measurement of centrifuge
s≈ 80/20=4.Use these factors (shown in Figure 16), final static friction nargin can be defined as E
(stiction)/ E
tD=v
r/ v
s=14%.Certainly, can there be other change, revise and substitute.
Figure 18 is the sketch that the user interface of analytical equipment is according to the embodiment of the present invention shown.Data from DUT can be recorded and show on screen, to allow user easily to determine the quality of these equipment.
What will also be understood that is, example described herein and embodiment are only for illustrative object, and suggestion those skilled in the art carry out various amendments or variation according to these examples and embodiment, these amendments or variation will be included in the application's spirit and the scope of authority and appended claims.
Claims (20)
1. centrifuge screening system, comprising:
Basis centrifuge system, comprises variable speed control, drive hub part and containment vessel;
Box is installed hub part, is connected with described basic centrifuge system; And
One or more boxes, are configured in tenon joint type box and install on hub part.
2. the system as claimed in claim 1, wherein said basic centrifuge system comprises the G-5005 type centrifuge of finished product centrifuge or OKTEK.
3. the system as claimed in claim 1, wherein said box is installed hub part and is comprised that the tenon joint type central cassette of pin joint installs hub part, and is configured to keep two wafers to keep boxes or two pallet carriers or tray box.
4. the system as claimed in claim 1, wherein,
Each in described one or more box includes the 2 groove titanium wafer cassette with Delrin rib-shaped piece; And
Described one or more box and described box are installed hub part by accurate balance.
5. the system as claimed in claim 1, wherein said one or more boxes are arranged on vertically or flatly described box and install on hub part.
6. for using the method for centrifuge screening system testing MEMS equipment, wherein said centrifuge screening system comprises basic centrifuge system and with the joining box of described basic centrifuge system, hub part is installed, and described method comprises:
One or more MEMS parts are provided, on each described MEMS parts, are formed with one or more MEMS equipment;
In two or more boxes, configure described one or more MEMS parts;
At described box, described two or more boxes of configuration on hub part are installed;
By described basic centrifuge system, controlled accelerating curve is applied to described one or more MEMS parts; And
Identify one or more target MEMS parts.
7. method as claimed in claim 6, wherein,
The mode that is configured to accurate balance of described one or more MEMS parts and described two or more boxes is configured in described box and installs on hub part;
Described one or more MEMS parts comprise that two or more MEMS wafers and described two or more boxes comprise that two or more wafers keep box, each in wherein said two or more MEMS wafers includes top side or bond pad side, and the described top side of each described in the configuration of described two or more MEMS wafers and described two or more wafers maintenance boxes makes in two or more MEMS wafers all keeps in boxes in the face of described box is installed hub part from described two or more wafers.
8. method as claimed in claim 6, the configuration of wherein said one or more MEMS parts and described two or more boxes makes by applying g power that described accelerating curve obtains with respect in each one or more be oriented at+Z of the MEMS equipment directions in described one or more MEMS parts.
9. method as claimed in claim 6, wherein,
The step of identifying one or more target MEMS parts comprises that identification is arranged in the static friction of the one or more MEMS equipment on described one or more MEMS parts; And
The step of identifying one or more target MEMS parts comprises that chip is detected processing, wafer is detected and processed or traditional wafer probe production process.
10. method as claimed in claim 15, wherein said controlled accelerating curve comprises level and smooth accelerating curve, static acceleration curve, continuous accelerating curve, segmented accelerating curve or pulsed accelerating curve.
11. methods as claimed in claim 15, wherein,
Described two or more boxes comprise two or more tray boxes or pallet carrier; And
The step that configures described one or more MEMS parts in two or more boxes is included in each in described two or more tray boxes or pallet carrier and configures MEMS scribing part, MEMS packed part or MEMS processing section.
12. under high gravity the system of testing equipment, comprising:
Centrifuge, comprises rotating member;
Equipment, is connected with described rotating member, on wherein said equipment, is applied with operand power;
Rotating control assembly, is connected with described centrifuge, and wherein said rotating control assembly is configured to make described rotating member rotation in response to controlled per time period revolution; And
Analytical equipment, for monitoring the one or more signals about described controlled per time period revolution from described equipment.
13. systems as claimed in claim 12, wherein,
Described rotating member also comprises and the joining power source of described equipment;
Described power source is configured to provide described operand power to described equipment; And
The group that described power source selects free battery, capacitor to form.
14. systems as claimed in claim 12, wherein,
Described rotating member also comprises and the joining communication source of described equipment;
Described communication source is configured to provide the signal from described equipment to described analytical equipment;
The group that described communication source selects free Wi-Fi, wireless, optics, bluetooth, near-field communication, microwave and laser to form; And
Described analytical equipment comprises the communication sink that is configured to receive from described communication source described signal.
15. systems as claimed in claim 12, wherein,
Described equipment comprises the accelerometer based on MEMS, and the wherein said accelerometer based on MEMS is configured on installation unit;
Described installation unit is configured to the described accelerometer based on MEMS to be oriented with respect to the centripetal force being generated by described centrifuge and to become predetermined angle spatially;
Described controlled per time period revolution comprises controlled time dependent per time period revolution;
Described analytical equipment is configured to determine the time dependent gravity that is applied to described equipment in response to described controlled time dependent per time period revolution;
Described analytical equipment is also configured to determine in response to described time dependent gravity and described one or more signal the stiction being associated with the described accelerometer based on MEMS; And
Described one or more signal is associated with recuperability, and wherein said recuperability is associated with the described accelerometer based on MEMS.
16. determine the method for damaged equipment under high gravity, comprising:
Equipment is attached to the rotating member of centrifuge, on wherein said equipment, is applied with operand power;
The rotary speed of controlling the described rotating member of described centrifuge in the time being applied with described operand power on described equipment, wherein said rotary speed is associated with gravity; Then
In the time being applied with described operand power on described equipment and being subject to gravity, in computing equipment, receive the one or more signals from described equipment; And
In described computing equipment, in response to described one or more signals and described gravity, determine whether described equipment is damaged equipment.
17. methods as claimed in claim 16, wherein,
Described method also comprises and will be attached to described equipment with the joining power source of described rotating member, thereby provides described operand power to described equipment;
The group that described power source selects free battery, capacitor to form; And
Described method also comprises with respect to described gravity makes described equipment rotation, applies described gravity with at least all six axis along described equipment.
18. methods according to claim 16, also comprise:
In the time being applied with described operand power on described equipment, apply adjustment factor to described equipment;
From exporting described one or more signals with the joining communication source of described centrifuge; And
In the time being applied with described operand power on described equipment and being subject to described gravity, from described device responds in the described one or more signals of described adjustment factor output.
19. methods as claimed in claim 16, wherein said one or more signals are exported from communication agency, the group that described communication agency selects free Wi-Fi, wireless, optics, bluetooth, near-field communication, microwave, laser etc. to form.
20. methods as claimed in claim 16, wherein,
Described equipment comprises the accelerometer based on MEMS;
The step of controlling rotary speed comprises the described rotary speed of the described rotating member of timely change; And
Described one or more signal is associated with recuperability, and wherein said recuperability is associated with the described accelerometer based on MEMS;
Described method also comprises:
In described computing equipment, in response to described one or more signals and described rotary speed, determine the stiction being associated with described accelerometer.
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| US201361805445P | 2013-03-26 | 2013-03-26 | |
| US61/805,445 | 2013-03-26 | ||
| US201361820123P | 2013-05-06 | 2013-05-06 | |
| US61/820,123 | 2013-05-06 | ||
| US201361829034P | 2013-05-30 | 2013-05-30 | |
| US61/829,034 | 2013-05-30 | ||
| US14/222,575 | 2014-03-21 | ||
| US14/222,575 US9651473B2 (en) | 2013-03-26 | 2014-03-21 | Wafer level centrifuge for MEMS stiction detection and screening system and method |
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| CN104069955A true CN104069955A (en) | 2014-10-01 |
| CN104069955B CN104069955B (en) | 2019-01-08 |
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| CN104069955B (en) | 2019-01-08 |
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