201126129 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種量測設備’且特別是有關於—種非 觸式的光學量測設備。 【先前技術】 發光二極體(light-emitting diode’ LED)晶圓的加工過程3 先用石蠟將晶圓固持在陶瓷載盤上，接著再對上述晶圓進二疋 磨和拋光製程，以使晶圓的厚度符合需求。通常，每—個=研BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring device and in particular to a non-contact optical measuring device. [Prior Art] Process of light-emitting diode (LED) wafers 3 First, the wafer is held on a ceramic carrier by paraffin, and then the wafer is subjected to a second honing and polishing process to Make the thickness of the wafer meet the needs. Usually, every one = research
載盤上可以放置8至10片2吋晶圓或是放置3片4 瓷 T日日圓。 在上述的上蠟、研磨及拋光製程，均要對每一晶圓厚度進行 測0 圖1是習知技術中利用量測儀器量測晶圓厚度的示音 圖。請參照圖1，習知技術是使用電子式錶頭或千分儀等量= 儀器100來量測晶圓108的厚度。量測儀器100包括旋鈕 接觸式量測件1〇4及顯示面板106。測試過程中，利用人工、 104工件向上拉高，放開後104向下掉落於待測物上方， 晶圓⑽’ _高度差來測定厚度’此時顯示面板1()6 出所測到之厚度。然後，再由人工記錄所測得之厚度。不 上述習知量測儀器100存在如下缺陷：首先，在量測 中，需接觸晶圓108表面。由於接觸的力道不易控制，容』 擊薄化後之晶圓剛，導致晶圓受損或破片。此外，^ ，晶圓⑽之厚度均勻性，對於每一片2时晶圓需取3 :個，量測’而對於每一片4忖晶圓需取晶圓上的9二 進灯篁測。由於每載盤上可以放置8至1G片 鬥 ，者3片4如圓，所以每i錢f量_次數高達= =產=於人卫量測速度慢且不連續，導致量測效率差，進 201126129 【發明内容】 測件月&供種光學量測設備，以提高量測效率並避免待 發月長:出種光學夏測設備，其用於量測至少一個待測 此光予量測投備包括基座、光學量測模組、轉動件 用光學量測模組及轉動件均配置於基座上。轉動件 雷)^載相件並帶動待測件轉動。控制模組配置於基座上且 1連接至絲量_組㈣祕。控 相對移動，使光學量測模組對準待導= 制轉動件轉動’以量測待測件的厚度。 支架ίίϋ的I實施例中，上述之光學量測模組包括可動式 配置；，可動式支架配置於基座上，光學量測件 待可動式支架適於將光學量測件移動至 在本發明的一實施例中，上诚之来與旦 式支架及光學量測件。固定式支架配置固定 =固，支架上，而轉動件更適於移動，以上= 下方。此外，光學量測件包括一個雷射量‘ 定式支i Γ先模組包括第1 固定式支架上。第二固定式支架配第置於置於 千董測件配置於第二固以支架上。第 旦二光 學置測件相對，而轉動件更適於移動，=二-第二光 學量測件與第二光學量測件之間。此外，上述至第-光 件及第二光學量測件例如分別包括一個雷射’量測頭。光學置測 201126129 在本發明的-實施例中，上述之轉動件包括轉盤和轉轴， 其中轉盤用以放置待測件，轉軸的-端抱接於基座，另一 接轉盤，且轉軸適於移動及轉動。 在本發明的-實施例中，上述之光學量測設備更包括一個 載盤。此載盤適於配置於轉動件上，並設有多個容置孔，每一 容置孔用以容置一個待測件。 在本發明的一實施例中，上述之轉動件更適於移動，以調 整轉動件之一承載面與基座之間的距離。8 to 10 2 wafers can be placed on the carrier or 3 4 Japanese T-day yen can be placed. In the above waxing, grinding and polishing processes, the thickness of each wafer is measured. Fig. 1 is a diagram showing the thickness of the wafer measured by a measuring instrument in the prior art. Referring to FIG. 1, the conventional technique is to measure the thickness of the wafer 108 using an electronic meter or a micrometer equivalent = the instrument 100. The measuring instrument 100 includes a knob contact type measuring member 1〇4 and a display panel 106. During the test, using manual, 104 workpieces are pulled up, and after release 104, they fall down on the object to be tested. The wafer (10)' _ height difference is used to measure the thickness. At this time, the display panel 1 () 6 is measured. The thickness. Then, the measured thickness is manually recorded. The above conventional measuring instrument 100 has the following drawbacks: First, in the measurement, it is necessary to contact the surface of the wafer 108. Since the force of the contact is not easy to control, the wafer is thinned and the wafer is damaged or fragmented. In addition, ^, the thickness uniformity of the wafer (10), for each slice of 2 wafers need to take 3: measurement 'and for each 4 忖 wafer need to take the 9 binary light on the wafer. Since 8 to 1G buckets can be placed on each carrier, 3 slices 4 are round, so the amount of _ times per megagram is as high as = = production = slow and discontinuous measurement speed, resulting in poor measurement efficiency. Into 201126129 [Summary of the Invention] Weighing and measuring optical measuring equipment to improve the measurement efficiency and avoid the waiting month: an optical summer measuring device for measuring at least one light dose to be measured The test preparation includes a base, an optical measurement module, an optical measurement module for the rotating member, and a rotating member disposed on the base. Rotating member Ray) ^ The phase-carrying member drives the member to be tested to rotate. The control module is arranged on the base and 1 is connected to the wire amount _ group (four) secret. Control the relative movement, and align the optical measurement module with the rotation of the rotating member to measure the thickness of the device to be tested. In the embodiment of the bracket ίίϋ, the optical measuring module includes a movable configuration; the movable bracket is disposed on the base, and the optical measuring component is to be moved to the movable bracket to move the optical measuring component to the present invention. In one embodiment, the singularity comes with a denture bracket and an optical measuring member. The fixed bracket configuration is fixed = solid, on the bracket, and the rotating member is more suitable for moving, above = below. In addition, the optical measuring component includes a laser amount ‘ fixed-type Γ first module including the first fixed bracket. The second fixed bracket is placed on the second solid bracket. The second optical optical component is opposite, and the rotating component is more suitable for movement, between the second-second optical measuring component and the second optical measuring component. Further, the above-described first to light-optic members and second optical measuring members respectively include, for example, a laser's measuring head. Optical Detecting 201126129 In the embodiment of the present invention, the rotating member comprises a turntable and a rotating shaft, wherein the rotating plate is used for placing the workpiece to be tested, the end of the rotating shaft is connected to the base, and the rotating shaft is connected to the rotating shaft, and the rotating shaft is suitable. Move and rotate. In an embodiment of the invention, the optical measuring device described above further includes a carrier. The carrier is adapted to be disposed on the rotating member, and is provided with a plurality of receiving holes, each of the receiving holes for accommodating a device to be tested. In an embodiment of the invention, the rotating member is more adapted to move to adjust the distance between the bearing surface of one of the rotating members and the base.
在本發明的-實施例中，上述之轉動件包括轉盤和轉轴， 其中轉盤用以放置待測件，轉軸的一端樞接於基座 接轉盤。 嘴遇 在本發明的-實施例中，上述之光學量測設備更包括—個 載盤’適於配置於轉動件上，用以承載多個待測件。 在本發明的—實施例中，上述之載盤為陶究盤。 在本發明的一實施例中，上與 取放裝置。此自動取放裝置勺丄ί干Γ 自動 架配置;轉動'4物= 架適於沿二物層用於放置待測件 動至位於轉動件旁的=回移動，以使這些置物層其中之—移 架旁，且第m預設位置+機械手臂配置於置物 待測件移動至轉動件上述預設位置之置物層上的 機械手臂狀械手臂配置於置物轉，且第二 之置物層上。冑件上的待測件移動至位於預設位置 在本發明的一實絲々|丨山 制電路及顯示穿置。批心，上述之控制模組包括操作板、控 .、、 '"置控制電路電性連接至操作板、轉動件及光 201126129 學量測，組’且控制電路適於控制轉動件及光學量測模組運 作，以量測並記錄待測件的厚度。顯示裝置電性連接至控 路，以顯示待測件的厚度。 本發明之光學量測設備因使用㈣模組控制光學量測模 組量測待測件的厚度，且控機組可自動_量測出的厚度，、 所以能有效提升量測效率。此外，由於量稱度的方式是^用 非接觸式的方式，所以能避免待測物在量測的過程中受損。 λ為讓本發明之上述和其他目的、特徵和優點能更明顯易 懂，下文特舉較佳實施例’並配合所附圖式，作詳細說明如下。 【實施方式】 圖2是本發明一實施例之光學量測設備的示意圖。請參照 圖2，本實施例之光學量測設備2〇〇適於用來量測至少一個待 測件300的厚度。此光學量測設備2〇〇包括基座21〇、光學量 測模組220、轉動件230及控制模組240，光學量測模組 及轉動件230均配置於基座21〇上。轉動件230用於承載待測 件300並帶動待測件3〇〇轉動，而控制模組配置於基座 21〇上且電性連接至光學量測模組220及轉動件230。控制模 組240適於控制光學量測模組22〇與轉動件23〇相對移動使 光子里測模組220對準待測件300，並控制轉動件230轉動， 以量測待測件3〇〇的厚度。 上述之光學量測設備200中，基座210具有一個平台，而 光學量測模組220、轉動件230及控制模組24〇是設置於此平 台的承栽面211上。 光學量測模組220例如包括支架221及光學量測件222， 其中支架221配置於基座210上，而光學量測件222配置於支 架221上。在本實施例中，光學量測件222可為雷射量測頭。 201126129 ^例如是可動式支架’其適於將光學量測件222移動至 =°:將承^ 、移動將先學調件222移動至轉動件230所承載之待 測件300上方’使光學量測模組220對準待測件300。而且、， 控，模組還可控制轉動件23〇轉動，以利 之多個位置的厚度。 230 一實^例Γ支架221還可為固定式支架，而轉動件 下方，使光學量測模組細的光學量 ^寺。件並控制轉動件230轉動，以利量測待測件300 之多個位置的厚度。 血上述之轉動件230例如包括轉盤232和轉軸234，其中轉 232用以放置待測件3〇〇,轉軸234❾一端枢接於基座別， ^端連接轉盤232。轉軸234適於轉動以帶動轉盤说轉動。 T ’在—實_中’轉軸23何沿平行於基座2H)的承載面 之方向微1JW移動，以調整待測件與光學量測222之 Ξι?。另外，在一實施例中’轉軸234可朝遠離或接 ^上、承載面211之方向移動（即沿圖2之上下方向移 =)，以調整轉動件230之一承載面231與基座21〇之間的距 離，進而使待測件3〇〇與光學量測件222之間保持適當的距離。 上述之控制模組24〇例如包括操作板241、控制電路（未 =)及顯示裝置242。控制電路電性連接至操作板24卜轉 ^ 23G&光學量測模組22()，且控制電路適於控制轉動件挪 及，學量測模組220運作，以量測並記錄待測件的厚度。 、m241為用戶操作介面，其可設有操作鍵。量測人員可透 k呆241控制控制模·组240進行量測工作。顯示裝置⑽ 201126129 可顯示所量測出的待測件300的厚度。 度時，只學量測設備2〇0來量測待测件300的厚 板^啟動上，然後透過操^ 量測件Ϊ 測模組細對準待測件細，並控制光學 ^件222 f測待測件3⑻的厚度。此和 : 測得的待測件3GG的厚^叫度且顯轉置242會顯示所 與旦ϋ施例之光學制設備2_使馳職組施控制光 量測待測件的厚度，且控制模組240可自 ^己錄所測得的厚度，所以能有效提升量測效率。此外，由於 咖!的方式是採用非接觸式的方式，所以能避免待測物 里'料輕巾受損。另外’量測時’控制馳240可控 ^轉動件230轉動，以使光學量測件222能隨著待測件300的 轉動而連續量測待測件綱之不同位置的厚度。而且，因為轉 ，件230與光予里測件222之間的相對位置可以微調，戶斤以能 量測待測件300之任一位置的厚度。 值得一提的是，為了進一步提升量測效率，光學量測設備 200可進一步包括一個載盤260 (如圖3所示），此載盤260 設於轉動件230上，且可用以承載一個或多個待測件3〇〇。當 轉動件230帶動載盤260轉動時，光學量測設備200可量測載 盤260上的這些待測件3 〇 〇的厚度，所以能大幅提升量測效率。 圖4緣示為本發明另一實施例之光學量測設備的示意 圖’而圖5是從圖4中方向A觀看的自動取放裝置與轉動件 的示意圖。請參照圖4與圖5，本實施例之光學量測設備200， 與圖2之光學量測設備2〇〇的主要區別在於光學量測設備200， 201126129 更包括自動取放裝置250。此自動取放裝置250是用以將多個 待測件300依序放至轉動件23〇上。 此自動取放裝置250包括置物架251、第一機械手臂253 及第二機械手臂254。置物架251配置於轉動件230旁，且置 物架251具有沿一個預定方向D (如圖4中上下方向）排列的 多個置物層252’而每一置物層252用於放置一個待測件3〇〇。 此置物架251適於沿上述預定方向D來回移動，以使這些置 物層252其中之一移動至位於轉動件23〇旁的一個預設位置。 位於預設位置的置物層252大約是與轉動件230之轉盤232位 於同一高度。第一機械手臂253配置於置物架251旁，且第一 機械手臂253適於將位於上述預設位置之置物層252上的待測 件300移動至轉動件23〇,以便對此置物層252上 進行量測。在圖5中，第一機械手臂253例如是職於^位 置之置物層252上的待測件朝向左方移動至轉動件现 上。 此外，第二機械手臂254配置於置物架251旁，且第二 械手臂254適於將位於轉動件23G上的待測件3⑽移動至:於 預設位置之置物層252上。也就是說，當量測完後，第械 手臂254可用於將位於轉動件23〇上的待測件3〇〇 了 預設位置之置物層252上，以利進行下-個待測 、在本實施例中，置物架251可沿預定方向D來回 Μ依序將每—置物層252移動至預設位置，而第 =3可用以將位闕設位置之置物層攻上的 轉動件230上，且第二機械手臂254可用 二= 件300移回位於預設位置之置物層252上 丄谀δ之，本實施例 201126129 之光學量測設備200可自動量測完置物架251上的多個待測件 3〇〇，所以能進一步提升量測效率。在本實施例中，分別使用 第一機械手臂253與第二機械手臂254將待測件300移動至轉 動件23G以及置物層252 〇然，本技術領域巾具有通常知識者， 可以理解在不同實施例中，亦可以使用其他傳動機具或僅使用 -機器手臂達到第-機械手臂253與第二機械手臂254之功 能。 需注意的是，在另一實施例中，上述之每一置物層252 可用以放置圖3所示之載盤260，而每一載盤260上可承載一 個或多個待測件300。第一機械手臂253則用以將位於預設位 置之置物層252上的載盤260移至轉動件230上，而第二機械 手臂254則用以將轉動件23〇上的載盤26〇移回位於預設位置 之置物層252上。 圖6繪示為本發明又一實施例之光學量測設備之示意 圖印參照圖6，本實施例之光學量測設備200”與圖2之光學 量測設備200的主要區別在於光學量測模組之結構不同。 ^光學量測設備200’’的光學量測模組220,，例如包括第一固 _疋式支架223、第-光學量測件224、第二固定式支架225及 ，一光學量測件226。第一固定式支架223配置於基座21〇上， 第光學量測件224配置於第一固定式支架223上。第二固定 式支架225配置於基座210上，第二光學量測件226配置於第 二固定式支架225上’且第一光學量測件224與第二光學量測 件226相對。此外，轉動件23〇除了能轉動外還能移動，以將 待測件300移至第-光學量測件224與第二光學量測件226之 間。在本實施例中，第-光學量測件224及第二光學量測件 226例如分別包括一個雷射量測頭。 201126129 石e F列，用於承載待測件之承載面23〗的面積例 处般測件3〇0之底自3〇2的面積，以使部分待測件300 月匕位於轉盤232外’進而讓第一光學量測件224與第二光學量 測件226都能量測到待測件3〇〇的厚度。 本實施例之光學量測設備雇，，除了與圖2之光學量測設 備200具有相似的優點外，光學量測設備雇，，因具有兩個光 干量測件（即第-光學量測件224與第二光學量測件细）， 所以能更精確地測出待測件遍的厚度。而且，即使待測件In an embodiment of the invention, the rotating member comprises a turntable and a rotating shaft, wherein the rotating plate is used for placing the member to be tested, and one end of the rotating shaft is pivotally connected to the pedestal. In the embodiment of the present invention, the optical measuring apparatus further includes a carrier disk s adapted to be disposed on the rotating member for carrying a plurality of components to be tested. In an embodiment of the invention, the carrier is a ceramic disk. In an embodiment of the invention, the upper and lower pick and place devices. The automatic pick-and-place device spoon 丄 Γ dry Γ automatic frame configuration; rotating '4 object = frame is suitable for placing the object to be tested along the two layers to move to the side of the rotating member = back movement, so that these storage layers - next to the shifting frame, and the m-th preset position + the robot arm is disposed on the storage arm of the workpiece to be tested to move to the predetermined position of the rotating member, and the mechanical arm-shaped arm is disposed on the storage and the second storage layer . The device to be tested on the component is moved to a preset position. In the present invention, a wire 々|丨山制电路 and display piercing. In approval, the above control module includes an operation panel, a control panel, and a '" control circuit electrically connected to the operation panel, the rotating member and the light 201126129, and the control circuit is adapted to control the rotating member and the optical The measurement module operates to measure and record the thickness of the device to be tested. The display device is electrically connected to the control to display the thickness of the device to be tested. The optical measuring device of the invention can measure the thickness of the device to be tested by using the (4) module control optical measuring module, and the controlling unit can automatically measure the thickness, so that the measuring efficiency can be effectively improved. In addition, since the method of weighing is used in a non-contact manner, it is possible to prevent the object to be tested from being damaged during the measurement. The above and other objects, features, and advantages of the present invention will become more apparent from the aspects of the appended claims. Embodiments Fig. 2 is a schematic view of an optical measuring apparatus according to an embodiment of the present invention. Referring to FIG. 2, the optical measuring device 2 of the present embodiment is adapted to measure the thickness of at least one of the devices 300 to be tested. The optical measuring device 2 includes a base 21, an optical measuring module 220, a rotating member 230 and a control module 240. The optical measuring module and the rotating member 230 are disposed on the base 21A. The rotating member 230 is configured to carry the member to be tested 300 and to rotate the device to be tested 3, and the control module is disposed on the base 21A and electrically connected to the optical measuring module 220 and the rotating member 230. The control module 240 is adapted to control the relative movement of the optical measurement module 22 and the rotating member 23 to align the photon measurement module 220 with the device to be tested 300, and control the rotation of the rotating member 230 to measure the device to be tested. The thickness of the crucible. In the above optical measuring device 200, the base 210 has a platform, and the optical measuring module 220, the rotating member 230 and the control module 24 are disposed on the bearing surface 211 of the platform. The optical measuring module 220 includes, for example, a bracket 221 and an optical measuring member 222. The bracket 221 is disposed on the base 210, and the optical measuring member 222 is disposed on the bracket 221. In this embodiment, the optical measuring component 222 can be a laser measuring head. 201126129 ^ For example, a movable bracket 'which is adapted to move the optical measuring member 222 to = °: moving the bearing, moving the first learning member 222 to the upper portion of the workpiece to be tested carried by the rotating member 230' The test module 220 is aligned with the device under test 300. Moreover, the control module can also control the rotation of the rotating member 23 to facilitate the thickness of the plurality of positions. 230. A case Γ bracket 221 can also be a fixed bracket, and below the rotating member, the optical measuring module has a fine optical quantity. And controlling the rotation of the rotating member 230 to measure the thickness of the plurality of positions of the device to be tested 300. The rotating member 230 of the blood includes, for example, a turntable 232 and a rotating shaft 234, wherein the rotating 232 is used for placing the DUT 3, and one end of the rotating shaft 234 is pivotally connected to the base, and the end is connected to the turntable 232. The rotating shaft 234 is adapted to rotate to drive the turntable to rotate. T ′ is moved 1JW in the direction of the bearing surface of the aligning axis 23 parallel to the susceptor 2H) to adjust the Measure of the device under test and the optical measurement 222. In addition, in an embodiment, the rotating shaft 234 can be moved away from or in the direction of the bearing surface 211 (ie, moved downward in the lower direction of FIG. 2) to adjust one of the bearing surfaces 231 and the base 21 of the rotating member 230. The distance between the turns, thereby maintaining an appropriate distance between the device under test 3A and the optical measuring member 222. The control module 24 described above includes, for example, an operation panel 241, a control circuit (not =), and a display device 242. The control circuit is electrically connected to the operation panel 24, and the control circuit is adapted to control the rotation of the rotating member, and the learning module 220 operates to measure and record the device to be tested. thickness of. M241 is a user operation interface, and can be provided with operation keys. The measuring personnel can carry out the measurement work by controlling the control mode group 240. The display device (10) 201126129 can display the measured thickness of the device under test 300. At the time of the measurement, only the measuring device 2〇0 is used to measure the thick plate of the device to be tested 300, and then the module is finely aligned with the device to be tested through the measuring device, and the optical device 222 is controlled. f Measure the thickness of the test piece 3 (8). This sum: the measured thickness of the test piece 3GG and the display transposition 242 will show that the optical device 2_ of the embodiment is used to control the thickness of the device to be tested, and The control module 240 can record the measured thickness, so that the measurement efficiency can be effectively improved. In addition, because the way of coffee! is in a non-contact manner, it can avoid damage to the material in the object to be tested. Further, the 'measurement time' control unit 240 controls the rotation of the rotating member 230 so that the optical measuring member 222 can continuously measure the thickness of the different positions of the member to be tested according to the rotation of the member to be tested 300. Moreover, since the relative position between the rotating member 230 and the light-receiving measuring member 222 can be finely adjusted, the household can measure the thickness of any position of the device to be tested 300. It is worth mentioning that, in order to further improve the measurement efficiency, the optical measuring device 200 may further include a carrier 260 (shown in FIG. 3). The carrier 260 is disposed on the rotating member 230 and can be used to carry one or A plurality of parts to be tested are 3〇〇. When the rotating member 230 drives the carrier 260 to rotate, the optical measuring device 200 can measure the thickness of the to-be-measured members 3 〇 on the carrier 260, so that the measuring efficiency can be greatly improved. Fig. 4 is a schematic view of an optical measuring apparatus according to another embodiment of the present invention, and Fig. 5 is a schematic view of the automatic pick-and-place apparatus and the rotating member as viewed from a direction A in Fig. 4. Referring to FIG. 4 and FIG. 5, the main difference between the optical measuring device 200 of the present embodiment and the optical measuring device 2 of FIG. 2 is that the optical measuring device 200, 201126129 further includes an automatic pick-and-place device 250. The automatic pick-and-place device 250 is used to sequentially place a plurality of DUTs 300 onto the rotating member 23A. The automatic pick-and-place device 250 includes a shelf 251, a first robot arm 253, and a second robot arm 254. The rack 251 is disposed beside the rotating member 230, and the rack 251 has a plurality of storage layers 252' arranged in a predetermined direction D (up and down direction in FIG. 4) and each of the storage layers 252 is used for placing a test object 3 Hey. The rack 251 is adapted to move back and forth in the predetermined direction D to move one of the substrate layers 252 to a predetermined position beside the rotating member 23A. The storage layer 252 at the preset position is approximately at the same height as the turntable 232 of the rotating member 230. The first robot arm 253 is disposed beside the rack 251, and the first robot arm 253 is adapted to move the device to be tested 300 on the storage layer 252 at the preset position to the rotating member 23A so as to be on the storage layer 252. Make measurements. In Fig. 5, the first robot arm 253, for example, the member to be tested placed on the storage layer 252 of the position is moved to the left to the left of the rotating member. Further, the second robot arm 254 is disposed beside the rack 251, and the second arm 254 is adapted to move the member to be tested 3 (10) on the rotating member 23G to the storage layer 252 at a preset position. That is to say, after the equivalent measurement, the arm 254 can be used to place the device to be tested 3 located on the rotating member 23〇 on the storage layer 252 of the preset position, so as to facilitate the next to be tested. In this embodiment, the rack 251 can sequentially move each of the storage layers 252 to a preset position along the predetermined direction D, and the third = 3 can be used to move the rotating member 230 on the placement layer. And the second robot arm 254 can be moved back to the storage layer 252 of the preset position by the two components 300, and the optical measuring device 200 of the embodiment 201126129 can automatically measure multiple of the racks 251. The test piece is 3〇〇, so the measurement efficiency can be further improved. In this embodiment, the first mechanical arm 253 and the second mechanical arm 254 are respectively used to move the device under test 300 to the rotating member 23G and the storage layer 252. The technical field of the art has a general knowledge, and can be understood in different implementations. In the example, the function of the first mechanical arm 253 and the second mechanical arm 254 can also be achieved using other transmission implements or only the --arm. It should be noted that in another embodiment, each of the above-mentioned storage layers 252 can be used to place the carrier 260 shown in FIG. 3, and each of the carriers 260 can carry one or more devices to be tested 300. The first robot arm 253 is used to move the carrier 260 on the storage layer 252 at the preset position to the rotating member 230, and the second mechanical arm 254 is used to shift the carrier 26 on the rotating member 23 It is returned to the storage layer 252 at the preset position. 6 is a schematic diagram of an optical measuring device according to another embodiment of the present invention. Referring to FIG. 6, the optical measuring device 200" of the present embodiment is different from the optical measuring device 200 of FIG. 2 in optical measuring mode. The optical measuring module 220 of the optical measuring device 200 ′′ includes, for example, a first solid 疋 bracket 223 , a first optical measuring member 224 , a second fixed bracket 225 , and a The optical fixture 226 is disposed on the base 21 , and the optical fixture 224 is disposed on the first fixed bracket 223. The second fixed bracket 225 is disposed on the base 210 , The second optical measuring member 226 is disposed on the second fixed bracket 225' and the first optical measuring member 224 is opposite to the second optical measuring member 226. In addition, the rotating member 23 can be moved in addition to being rotatable to The device to be tested 300 is moved between the first optical measuring member 224 and the second optical measuring member 226. In the embodiment, the first optical measuring member 224 and the second optical measuring member 226 respectively comprise a mine. Radiation probe. 201126129 Stone e F column, used to carry the bearing surface of the test piece 23 In the case of a sample, the bottom of the workpiece is 3〇0 from the area of 3〇2, so that some of the parts to be tested are located outside the turntable 232, and then the first optical measuring member 224 and the second optical measuring member 226 are both The energy measures the thickness of the device under test 3. The optical measuring device of the present embodiment employs, in addition to the optical measuring device 200 of FIG. 2, the optical measuring device employs two The light-drying measuring member (that is, the first-optical measuring member 224 and the second optical measuring member are thin), so that the thickness of the workpiece to be tested can be more accurately measured. Moreover, even the member to be tested
3〇〇有龜曲的情形，本實施例之光學量測設備2〇〇，，仍可精確測 出待測件300的厚度。 值得一提的是，為了進一步提升量測效率，光學量測設備 200”可進一步包括一個載盤26〇’，（如圖7所示）。此載盤26〇，, 設於轉動件230上，且可用以承載一個或多個待測件3〇〇。轉 盤260”具有多個貫孔261 ’每一待測件3〇〇 (圖7未繪示）例 如是放置於一個貫孔261處，以使第一光學量測件224能通過 貫孔261而量測待測件300的厚度。此外，前述實施例所述之 自動取放裝置250亦可應用於本實施例之光學量測 200”，以提升量測效率。 综上所述，本發明之光學量測設備至少具有下列優點： 1. 本發明之光學量測設備中，因控制模組可控制光學量測 模組及轉動件運作’以進行量測工作’且可自動記錄測得的數 據，所以能有效提升量測精準度及量測效率。 2. 由於本發明之量測模組是採用非接觸的量測方式，所以 能避免習知採用接觸式量測的方式容易損壞待測件的風險。 3. 在一實施例中，增設自動取放裝置可進一步提升量測效 率。 201126129 4.在一實施例中，使用載盤來承載多個待測件可 升量測效率。 ’ 雖然本發明已以較佳實施例揭露如上，然其並非用以限定 本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍 内’當可作些許之更動與潤飾，因此本發明之保護範圍當視後 附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是習知技術中利用量測儀器量測晶圓厚度的示意圖。 圖2是本發明一實施例之光學置測設備的示意圖。 秦 圖3是本發明一實施例之光學量測設備的載盤的示意圖。 圖4繪示為本發明另一實施例之光學量測設備的示意圖。 圖5是從圖4中方向A觀看的自動取放裝置與轉動件的 侧視不意圖。 圖6繪示為本發明又一實施例之光學量測設備之示意圖。 圖7是本發明另一實施例之光學量測設備的載盤的示意 圖。 【主要元件符號說明】 φ 100 ·電子量測儀器 102 :旋紐 1〇4 :接觸式量測件 106 :顯示面板 108 .待測晶圓 200、200,、200” ：光學量測設備 210 .基座 211 .承載面 220、220” ：光學量測模組 201126129 221 :支架 222 :光學量測件 223 :第一固定式支架 224 :第一光學量測件 225 :第二固定式支架 226 :第二光學量測件 230 :轉動件 231 :承載面 232 :轉盤 • 234 :轉軸 240 :控制模組 241 :操作板 242 :顯示裝置 250 :自動取放裝置 251 :置物架 252 :置物層 253 :第一機械手臂 φ 254:第二機械手臂 260、260” ：載盤 261 :貫孔 300 :待測件 302 :待測件之底面 A :方向 D:預定方向 [S] 13In the case where there is a tortoise, the optical measuring device 2 of the present embodiment can accurately measure the thickness of the member to be tested 300. It is worth mentioning that, in order to further improve the measurement efficiency, the optical measuring device 200" may further include a carrier 26", as shown in Fig. 7. The carrier 26 is disposed on the rotating member 230. And can be used to carry one or more to-be-tested parts. The turntable 260" has a plurality of through holes 261', and each of the devices to be tested 3 (not shown in FIG. 7) is placed, for example, at a through hole 261. So that the first optical measuring member 224 can measure the thickness of the device to be tested 300 through the through hole 261. In addition, the automatic pick-and-place device 250 described in the foregoing embodiments can also be applied to the optical measurement 200" of the present embodiment to improve the measurement efficiency. In summary, the optical measurement device of the present invention has at least the following advantages: 1. In the optical measuring device of the present invention, since the control module can control the optical measuring module and the rotating member to operate 'for measuring work' and can automatically record the measured data, the measuring accuracy can be effectively improved. And measuring efficiency. 2. Since the measuring module of the invention adopts a non-contact measuring method, the risk of the measuring device being easily damaged by the contact measuring method can be avoided. 3. In an embodiment In addition, the automatic pick-and-place device can further improve the measurement efficiency. 201126129 4. In an embodiment, the carrier is used to carry a plurality of test pieces to measure the efficiency. 'Although the invention has been disclosed in the preferred embodiment As above, it is not intended to limit the invention, and any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention, so that the scope of protection of the present invention is attached. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1 is a schematic view showing the measurement of wafer thickness by a measuring instrument in the prior art. Fig. 2 is a schematic view of an optical measuring device according to an embodiment of the present invention. Figure 3 is a schematic view of a carrier of an optical measuring device according to an embodiment of the present invention. Figure 4 is a schematic view of an optical measuring device according to another embodiment of the present invention. Figure 5 is a view from the direction A of Figure 4 Figure 6 is a schematic view of an optical measuring device according to still another embodiment of the present invention. Figure 7 is a schematic view of an optical measuring device according to another embodiment of the present invention. Schematic diagram [Description of main component symbols] φ 100 · Electronic measuring instrument 102 : Rotary 1 〇 4 : Contact type measuring member 106 : Display panel 108 . Wafers to be tested 200 , 200 , 200 ′ : Optical measuring equipment 210. Base 211. Bearing surface 220, 220": optical measuring module 201126129 221: bracket 222: optical measuring member 223: first fixed bracket 224: first optical measuring member 225: second fixed bracket 226: second optical measuring member 230: rotating member 23 1 : Bearing surface 232 : Turntable • 234 : Rotary shaft 240 : Control module 241 : Operation panel 242 : Display device 250 : Automatic pick-and-place device 251 : Shelf 252 : Storage layer 253 : First robot arm φ 254 : Second machine Arm 260, 260": carrier 261: through hole 300: member to be tested 302: bottom surface of the device to be tested A: direction D: predetermined direction [S] 13