CN104051600A - LED yellow light source for manufacturing yellow light chamber with semiconductors and manufacturing process of LED yellow light source for manufacturing yellow light chamber with semiconductors - Google Patents
LED yellow light source for manufacturing yellow light chamber with semiconductors and manufacturing process of LED yellow light source for manufacturing yellow light chamber with semiconductors Download PDFInfo
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- CN104051600A CN104051600A CN201410301377.0A CN201410301377A CN104051600A CN 104051600 A CN104051600 A CN 104051600A CN 201410301377 A CN201410301377 A CN 201410301377A CN 104051600 A CN104051600 A CN 104051600A
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- led
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- yellow light
- emitting phosphor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses an LED yellow light source for manufacturing a yellow light chamber with semiconductors and a manufacturing process of the LED yellow light source for manufacturing the yellow light chamber with the semiconductors. LED fluorescent glue for packaging the LED yellow light source is mainly composed of silica gel, green fluorescent powder, red fluorescent powder and yellow fluorescent powder in a mixed mode. According to weight, the green fluorescent powder, the red fluorescent powder and the yellow fluorescent powder are jointly 40%-70% of the total amount of the silica gel, wherein the weight proportion of the yellow fluorescent powder to the green fluorescent powder to the red fluorescent powder is 1:0.2-0.5:0.01-0.10, and the peak-emission wavelength of the green fluorescent powder ranges from 490 nm to 540 nm. As the LED fluorescent glue which is better than a traditional yellow lamp in lighting effect and color rendering index is adopted, when the LED yellow light source is used for manufacturing finished lamps, the traditional yellow lamp can be well replaced for manufacturing the yellow light chamber with the semiconductors, and the defects that the traditional yellow lamp is low in lighting effect, poor in reality, serious in light attenuation and the like.
Description
Technical field
The present invention relates to LED packaged light source and manufacture craft thereof, be particularly applied to the yellow packaged light source of LED and manufacture craft thereof that semiconductor is manufactured gold-tinted chamber.
Background technology
Due to LED, have the plurality of advantages such as energy-saving and environmental protection, photochromic easy tune, LED has obtained develop rapidly at lighting field in recent years.Increasing traditional lighting light fixture is replaced by LED lamp, and has obtained good effect.
In field of semiconductor manufacture, there is a kind of lithographic technique---photoetching, be widely used.Interference for fear of other light to photolithographic exposure process, exposure process generally all carries out in a relatively airtight environment, and the indoor light of photoetching need to be removed the short-wavelength light below 500nm, so photoetching chamber is yellow conventionally, is commonly called as Huo Huang room, gold-tinted chamber.At present to manufacture gold-tinted chamber amber light used be at traditional fluorescent tube inwall, to be coated with the fluorescent material of last layer yellow to semiconductor mostly, utilizes the light below 500nm in the white light that yellow fluorescent powder sends fluorescent lamp to filter out.The amber light that profit is manufactured in this way often exists that light efficiency is low, color rendering is bad, light decay is serious, the photochromic defect such as impure.
Utilizing the original amber lights of replacement such as LED amber light is a good solution.To LED packaged light source, want to reach the desired effect of amber light, just the blue light in packaged light source utilizing emitted light all must be override.
Summary of the invention
For addressing the above problem, the object of the present invention is to provide a kind of semiconductor that is applied to manufacture the yellow packaged light source of LED and the manufacture craft thereof in gold-tinted chamber.
The present invention solves the technical scheme that its problem adopts:
A kind of semiconductor is manufactured the LED yellow light sources that gold-tinted chamber is used, the LED fluorescent glue of its encapsulation use is mainly mixed and is formed by silica gel, green emitting phosphor, red fluorescence powder, yellow fluorescent powder, by weight, described green emitting phosphor, red fluorescence powder, yellow fluorescent powder combined amount account for the 40%-70% of silica gel total amount altogether, wherein, weight proportion between yellow fluorescent powder, green emitting phosphor, red fluorescence powder is 1: 0.2-0.5: 0.01-0.10, wherein the emission peak wavelength of green emitting phosphor is 490-540nm.
Further, described silica gel is mainly comprised of A glue and B glue, and the weight ratio of described A glue and B glue is: 1:0.9-1.2.
Further, described green emitting phosphor is mainly TMG green emitting phosphor or GP green emitting phosphor or LuAG green emitting phosphor.
Further, also comprise PCB wiring board, intrinsic blue led luminescence chip on described PCB wiring board, scribbles described LED fluorescent glue on the luminous core of described blue led.
Above-mentioned semiconductor is manufactured a manufacture craft for the LED yellow light sources of using gold-tinted chamber, it is characterized in that comprising the following steps:
A, be ready to complete the PCB wiring board of blue chip die bond, bonding wire craft;
B, accurately weigh silica gel and yellow fluorescent powder, green emitting phosphor and red fluorescence powder respectively, wherein yellow fluorescent powder, green emitting phosphor and red fluorescence powder total amount account for the 40%-70% of silica gel amount, wherein, weight proportion between yellow fluorescent powder, green emitting phosphor, red fluorescence powder is 1: 0.20-0.5: 0.01-0.10, and wherein the emission peak wavelength of green emitting phosphor is 490-540nm;
C, the silica gel weighing, yellow fluorescent powder, green emitting phosphor and red fluorescence powder are put into more than beaker stirs half an hour with glass bar, it is mixed and in vacuum defoamation equipment deaeration within 20 minutes, obtain required LED fluorescent glue;
D, the LED fluorescent glue of gained in step C is uniformly coated on the PCB circuit light source board of A step.The fluorescent glue amount of coating can be undertaken data-optimizedly determining afterwards by photoelectric color integrated test system, until fixing related process parameter area;
Whether the PCB wiring board after E, observation gluing goes back remnants bubble, if also have bubble, carry out secondary deaeration to reach all bubbles of discharging in fluorescent glue;
F, the PCB wiring board of gained in step e is put into baking box toast, after completing, obtain final products.
Further, the silica gel in step B is comprised of A glue and B glue, and the weight ratio of described A glue and B glue is: 1:0.9-1.2.
The invention has the beneficial effects as follows:
A kind of semiconductor that the present invention adopts is manufactured the LED yellow light sources that gold-tinted chamber is used, owing to having adopted the LED fluorescent glue that light efficiency and color rendering index will be good than traditional amber light, and that the fluorescent material of this LED fluorescent glue accounts for the toatl proportion of colloid is higher, the green emitting phosphor of suitable wavelength and the appropriate proportioning between each color fluorescent material have been adopted simultaneously, make light efficiency and the color rendering index of LED fluorescent glue better than traditional amber light, therefore adopting LED yellow light sources to manufacture finished product light fixture can well replace traditional amber light for the yellow room of semiconductor, solved traditional amber light light efficiency low, actuality is bad, the defects such as light decay is serious.
A kind of manufacture craft that is applied to the LED yellow light sources in semiconductor manufacture gold-tinted chamber that the present invention adopts, its light efficiency of LED yellow light sources and the color rendering index by this technique, made are better than traditional amber light, therefore adopt LED yellow light sources to manufacture finished product light fixture and can well replace traditional amber light for the yellow room of semiconductor, solved the defects such as traditional amber light light efficiency is low, actuality is bad, light decay is serious.
Accompanying drawing explanation
Below in conjunction with accompanying drawing and example, the invention will be further described.
Fig. 1 is that traditional amber light is tested resulting spectrogram.
Fig. 2 is the encapsulating structure schematic diagram of the embodiment of the present invention.
Fig. 3 is the resulting spectrogram of the embodiment of the present invention 1 test.
Fig. 4 is the resulting spectrogram of the embodiment of the present invention 2 test.
Fig. 5 is the resulting spectrogram of the embodiment of the present invention 3 test.
Embodiment
A kind of semiconductor of the present invention is manufactured the LED yellow light sources that gold-tinted chamber is used, the LED fluorescent glue of its encapsulation use is mainly by silica gel, green emitting phosphor, red fluorescence powder, yellow fluorescent powder mixes and forms, by weight, described green emitting phosphor, red fluorescence powder, yellow fluorescent powder amounts to the 40%-70% that accounts for silica gel total amount, wherein, yellow fluorescent powder, green emitting phosphor, weight proportion between red fluorescence powder is 1: 0.20-0.5: 0.01-0.10, wherein the emission peak wavelength of green emitting phosphor is 490-540nm, the emission peak wavelength of yellow fluorescent powder is 570-590nm, the emission peak wavelength of red fluorescence powder is 600-630nm.Wherein said silica gel is mainly comprised of A glue and B glue, and the weight ratio of described A glue and B glue is: 1:0.9-1.2.
Particularly, described green emitting phosphor is TMG green emitting phosphor or GP green emitting phosphor or LuAG green emitting phosphor.Red fluorescence powder and and yellow fluorescent powder adopt common fluorescent material.
Utilize above-mentioned LED fluorescent glue, can produce semiconductor and manufacture the LED yellow light sources that gold-tinted chamber is used, shown in Fig. 2, described LED yellow light sources comprises PCB wiring board, on described PCB wiring board, be provided with blue led luminescence chip, on the luminous core of described blue led, scribble above-mentioned LED fluorescent glue.In the present embodiment, take and make COB light source and describe as example, therefore described in Fig. 2, on PCB wiring board, be provided with a plurality of LED luminescence chips, and on a plurality of LED luminescence chips the common last layer LED fluorescent glue that is coated with, LED light source can be also commonly use SMD, as 2835,3528,5730 etc.Wherein especially be applicable to adopt paster type encapsulation, be packaged into after lamp pearl, can manufacture easily all size model spot for replacing the amber light of original use.
The concrete steps of manufacture craft of making above-mentioned LED yellow light sources are as follows:
A, be ready to die bond, PCB wiring board that bonding wire is good.
B, weigh silica gel and yellow fluorescent powder, green emitting phosphor and red fluorescence powder.
C, by the above-mentioned silica gel weighing, yellow fluorescent powder, green emitting phosphor and red fluorescence powder be stirred to few half an hour it is mixed and in vacuum defoamation equipment deaeration within 20 minutes, obtain required LED fluorescent glue.
D, the LED fluorescent glue of gained in step C is uniformly coated on the PCB wiring board of A step, by integrating sphere measurement data, adds and subtracts glue amount, until reach fixing parameter area.
Whether the PCB wiring board after E, observation gluing goes back remnants bubble, if also have bubble, carry out secondary deaeration to reach all bubbles of discharging in fluorescent glue.
F, the PCB wiring board of gained in step e is put into baking box toast, after completing, obtain final products.
Wherein in step B the use ratio range of fluorescent material and silica gel to calculate be that to take total silica gel amount be reference, calculate the percentage of the shared silica gel of fluorescent material.This ratio range is 40%-70%.Ratio between fluorescent material calculates that to take the amount of bloom be reference, and the shared ratio of green powder is 9%-45%; The shared ratio of rouge and powder is 2%-9%.Be that weight proportion between yellow fluorescent powder, green emitting phosphor, red fluorescence powder is 1: 0.2-0.5: 0.01-0.10.
Particularly, described silica gel is comprised of A glue and B glue, and the weight ratio of described A glue and B glue is: 1:0.9-1.2.
Below for making three specific embodiments of COB light source:
Specific embodiment 1, red fluorescence powder adopts BR, and accounting for yellow fluorescent powder usage ratio is 2%-9%; Green emitting phosphor adopts TMG(silicate systems), unsulfided green fluorescence look fluorescent material (GP) also may reach good experiment effect; Green fluorescence look fluorescent material LuAG also can reach experiment effect, and consumption accounts for the 9%-45% of yellow fluorescent powder consumption; Yellow fluorescent powder adopts YAG, and LED chip adopts blue chip.A glue is 1:1 with the ratio of B glue.The spectrum test result of the COB packaged light source obtaining is as Fig. 3.Separately, the color rendering index of this packaged light source is 57.1, colour temperature 2899K.From test spectral power distribution Fig. 3 and and Fig. 1 relatively can find out, this packaged light source spectrum is more level and smooth, the coverage effect of blue light is fine in addition, and color rendering is better.
Specific embodiment 2, red fluorescence powder adopts BR, and accounting for yellow fluorescent powder usage ratio is 5%; Green emitting phosphor adopts TMG, and accounting for yellow fluorescent powder usage ratio is 34%; Yellow fluorescent powder adopts YAG, and LED chip adopts blue chip.A glue is 1:1 with the ratio of B glue.The spectrum test result of the COB packaged light source obtaining is as Fig. 4.Separately, the color rendering index of this packaged light source is 51.5, colour temperature 2784K.From spectral power distribution Fig. 4 of test and and Fig. 1 contrast and can find out, this packaged light source spectrum of this packaged light source is more level and smooth, the coverage effect of blue light is fine in addition, and color rendering is better.
Specific embodiment 3, red fluorescence powder adopts BR, and accounting for yellow fluorescent powder usage ratio is 4%; Green emitting phosphor adopts TMG, and accounting for yellow fluorescent powder usage ratio is 30%; Yellow fluorescent powder adopts YAG, and LED chip adopts blue chip.A glue is 1:1 with the ratio of B glue.The spectrum test result of the COB packaged light source obtaining is as Fig. 5.Separately, the color rendering index of this packaged light source is 49.4, colour temperature 2777K left and right.From spectral power distribution Fig. 5 of test and and Fig. 1 contrast and can find out, this packaged light source spectrum of this packaged light source is more level and smooth, the coverage effect of blue light is fine in addition, and color rendering is better.
The parameter comparison of specific embodiment 1,2,3 and traditional amber light below:
Table 1 specific embodiment 1,2 and traditional amber light parameter comparison
From above embodiment and traditional amber light comparing result, can find out, adopting LED encapsulation yellow light sources to manufacture gold-tinted chamber is technical feasibility with lamp.And described in employing this patent, the LED of raw material and technological parameter manufacturing encapsulation yellow light sources and traditional amber light effect approach, but the light efficiency of LED light source and color rendering index are obviously good than traditional amber light.As adopt LED yellow light sources to manufacture finished product light fixture can well to replace traditional amber light to manufacture gold-tinted chamber for semiconductor.Result has proved the broad applicability of this new method by experiment.If by experiment and the improvement of system, can also obtain more excellent experimental data.
The above, be preferred embodiment of the present invention, and the present invention is not limited to above-mentioned execution mode, as long as it reaches technique effect of the present invention with identical means, all should belong to protection scope of the present invention.
Claims (6)
1. a semiconductor is manufactured the LED yellow light sources that gold-tinted chamber is used, it is characterized in that: the LED fluorescent glue of its encapsulation use is mainly mixed and formed by silica gel, green emitting phosphor, red fluorescence powder, yellow fluorescent powder, by weight, described green emitting phosphor, red fluorescence powder, yellow fluorescent powder combined amount account for the 40%-70% of silica gel total amount altogether, wherein, weight proportion between yellow fluorescent powder, green emitting phosphor, red fluorescence powder is 1: 0.2-0.5: 0.01-0.10, wherein the emission peak wavelength of green emitting phosphor is 490-540nm.
2. a kind of semiconductor according to claim 1 is manufactured the LED yellow light sources that gold-tinted chamber is used, and it is characterized in that: described silica gel is mainly comprised of A glue and B glue, and the weight ratio of described A glue and B glue is: 1:0.9-1.2.
3. a kind of semiconductor according to claim 1 and 2 is manufactured the LED yellow light sources that gold-tinted chamber is used, and it is characterized in that: described green emitting phosphor is mainly TMG green emitting phosphor or GP green emitting phosphor or LuAG green emitting phosphor.
4. a kind of semiconductor according to claim 1 is manufactured the LED yellow light sources that gold-tinted chamber is used, and it is characterized in that: comprise PCB wiring board, intrinsic blue led luminescence chip on described PCB wiring board, scribbles described LED fluorescent glue on the luminous core of described blue led.
5. the arbitrary described semiconductor of claim 1 to 4 is manufactured a manufacture craft for the LED yellow light sources of using gold-tinted chamber, it is characterized in that comprising the following steps:
A, be ready to complete the PCB wiring board of blue chip die bond, bonding wire craft;
B, accurately weigh silica gel and yellow fluorescent powder, green emitting phosphor and red fluorescence powder respectively, wherein yellow fluorescent powder, green emitting phosphor and red fluorescence powder total amount account for the 40%-70% of silica gel amount, wherein, weight proportion between yellow fluorescent powder, green emitting phosphor, red fluorescence powder is 1: 0.20-0.5: 0.01-0.10, and wherein the emission peak wavelength of green emitting phosphor is 490-540nm;
C, the silica gel weighing, yellow fluorescent powder, green emitting phosphor and red fluorescence powder are put into more than beaker stirs half an hour with glass bar, it is mixed and in vacuum defoamation equipment deaeration within 20 minutes, obtain required LED fluorescent glue;
D, the LED fluorescent glue of gained in step C is uniformly coated on the PCB circuit light source board of A step, the fluorescent glue amount of coating can be undertaken data-optimizedly determining afterwards by photoelectric color integrated test system, until fixing related process parameter area;
Whether the PCB wiring board after E, observation gluing goes back remnants bubble, if also have bubble, carry out secondary deaeration to reach all bubbles of discharging in fluorescent glue;
F, the PCB wiring board of gained in step e is put into baking box toast, after completing, obtain final products.
6. a kind of semiconductor according to claim 5 is manufactured the manufacture craft of the LED yellow light sources of using gold-tinted chamber, it is characterized in that: the silica gel in step B is comprised of A glue and B glue, and the weight ratio of described A glue and B glue is: 1:0.9-1.2.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105826451A (en) * | 2016-04-15 | 2016-08-03 | 中山市利光电子有限公司 | High-color-rendering-index LED lamp bead manufacture technology |
| CN110379908A (en) * | 2019-07-13 | 2019-10-25 | 深圳市大柏光电子科技有限公司 | A kind of conversion method between chip wave band change powder ratio |
| CN110399620A (en) * | 2018-04-24 | 2019-11-01 | 江西鸿利光电有限公司 | A method of fluorescent glue proportion calculates suitable for LED encapsulation |
| CN113763832A (en) * | 2021-09-17 | 2021-12-07 | 利亚德光电股份有限公司 | Preparation method of LED display module |
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| CN102244185A (en) * | 2011-07-19 | 2011-11-16 | 彩虹集团公司 | White light LED (light emitting diode) with high color rendering index, high light efficiency and low color temperature and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105826451A (en) * | 2016-04-15 | 2016-08-03 | 中山市利光电子有限公司 | High-color-rendering-index LED lamp bead manufacture technology |
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| CN110399620B (en) * | 2018-04-24 | 2022-12-16 | 江西鸿利光电有限公司 | Method suitable for calculating fluorescent glue ratio in LED packaging |
| CN110379908A (en) * | 2019-07-13 | 2019-10-25 | 深圳市大柏光电子科技有限公司 | A kind of conversion method between chip wave band change powder ratio |
| CN113763832A (en) * | 2021-09-17 | 2021-12-07 | 利亚德光电股份有限公司 | Preparation method of LED display module |
| CN113763832B (en) * | 2021-09-17 | 2024-01-30 | 利亚德光电股份有限公司 | Preparation method of LED display module |
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