CN104048457A - 直喷式相变温度控制系统 - Google Patents

直喷式相变温度控制系统 Download PDF

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Publication number
CN104048457A
CN104048457A CN201410175361.XA CN201410175361A CN104048457A CN 104048457 A CN104048457 A CN 104048457A CN 201410175361 A CN201410175361 A CN 201410175361A CN 104048457 A CN104048457 A CN 104048457A
Authority
CN
China
Prior art keywords
tcu
control unit
thermal control
thermal
evaporation chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410175361.XA
Other languages
English (en)
Chinese (zh)
Inventor
C·A·佐佩兹
T·F·莱姆克兹克
R·A·戴维斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensata Technologies Inc
Original Assignee
Sensata Technologies Massachusetts Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensata Technologies Massachusetts Inc filed Critical Sensata Technologies Massachusetts Inc
Publication of CN104048457A publication Critical patent/CN104048457A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Sustainable Development (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN201410175361.XA 2013-03-15 2014-03-14 直喷式相变温度控制系统 Pending CN104048457A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361789203P 2013-03-15 2013-03-15
US61/789,203 2013-03-15

Publications (1)

Publication Number Publication Date
CN104048457A true CN104048457A (zh) 2014-09-17

Family

ID=50439133

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410175361.XA Pending CN104048457A (zh) 2013-03-15 2014-03-14 直喷式相变温度控制系统

Country Status (7)

Country Link
US (1) US9709622B2 (https=)
EP (1) EP2778696A3 (https=)
JP (1) JP2014194415A (https=)
KR (1) KR20140113881A (https=)
CN (1) CN104048457A (https=)
SG (1) SG10201400683QA (https=)
TW (1) TW201506420A (https=)

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CN116577629A (zh) * 2022-02-09 2023-08-11 株式会社爱德万测试 电子部件处理装置以及电子部件试验装置

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US20170248973A1 (en) * 2016-02-29 2017-08-31 Cascade Microtech, Inc. Probe systems and methods including active environmental control
US20170261547A1 (en) * 2016-03-08 2017-09-14 Temptronic Corporation Temperature Forcing System and Method with Conductive Thermal Probes
KR102693821B1 (ko) * 2016-04-12 2024-08-12 (주)테크윙 전자부품 테스트용 핸들러
EP3465238A4 (en) * 2016-06-02 2020-01-22 KES Systems, Inc. SEMICONDUCTOR AGING TEST SYSTEM AND METHODS
EP3580075A4 (en) * 2017-02-12 2021-01-20 Clearmotion, Inc. HYDRAULIC ACTUATOR WITH A FREQUENCY DEPENDENT RELATIVE PRESSURE RATIO
US10677842B2 (en) * 2017-05-26 2020-06-09 Advantest Corporation DUT testing with configurable cooling control using DUT internal temperature data
WO2020176999A1 (en) * 2019-03-06 2020-09-10 Kingtiger Technology (Canada) Inc. System and method for verifying and analyzing memory for high performance computing systems
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
US11573262B2 (en) * 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
CN120677396A (zh) 2022-10-21 2025-09-19 新加坡商永科股份有限公司 用于对多个区域进行独立的控制的热头
US11693051B1 (en) 2022-10-21 2023-07-04 AEM Holdings Ltd. Thermal head for independent control of zones
US11828795B1 (en) * 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
US11656272B1 (en) 2022-10-21 2023-05-23 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones
CN116520134B (zh) * 2022-11-09 2024-01-09 珠海精实测控技术股份有限公司 一种温控测试系统
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement

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CN1537217A (zh) * 2001-05-31 2004-10-13 ̩ 对被测试的电子器件进行温度控制的装置和方法
CN1759643A (zh) * 2003-03-12 2006-04-12 富士通株式会社 电子设备的冷却结构
JP2009510686A (ja) * 2005-09-28 2009-03-12 エルジー・ケム・リミテッド 車両用バッテリパックの冷却システム
CN202929508U (zh) * 2012-11-30 2013-05-08 河南省电力公司驻马店供电公司 无人值班变电站控制室环境智能管理装置
CN104345753A (zh) * 2013-07-25 2015-02-11 上海浦北信息科技有限公司 一种控温控湿测试台

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SG145539A1 (en) * 2004-03-09 2008-09-29 Micron Technology Inc Integrated circuit (ic) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
US7373967B1 (en) * 2004-06-28 2008-05-20 Delta Design, Inc. Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits
JP4418772B2 (ja) 2005-04-28 2010-02-24 富士通マイクロエレクトロニクス株式会社 温度制御装置
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
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US8274300B2 (en) * 2008-01-18 2012-09-25 Kes Systems & Service (1993) Pte Ltd. Thermal control unit for semiconductor testing
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JP2012185184A (ja) 2012-07-02 2012-09-27 Seiko Epson Corp 電子部品の温度制御装置並びにハンドラ装置

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
CN1537217A (zh) * 2001-05-31 2004-10-13 ̩ 对被测试的电子器件进行温度控制的装置和方法
CN1759643A (zh) * 2003-03-12 2006-04-12 富士通株式会社 电子设备的冷却结构
JP2009510686A (ja) * 2005-09-28 2009-03-12 エルジー・ケム・リミテッド 車両用バッテリパックの冷却システム
CN202929508U (zh) * 2012-11-30 2013-05-08 河南省电力公司驻马店供电公司 无人值班变电站控制室环境智能管理装置
CN104345753A (zh) * 2013-07-25 2015-02-11 上海浦北信息科技有限公司 一种控温控湿测试台

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116577629A (zh) * 2022-02-09 2023-08-11 株式会社爱德万测试 电子部件处理装置以及电子部件试验装置

Also Published As

Publication number Publication date
JP2014194415A (ja) 2014-10-09
EP2778696A3 (en) 2017-05-10
US20140260333A1 (en) 2014-09-18
US9709622B2 (en) 2017-07-18
TW201506420A (zh) 2015-02-16
KR20140113881A (ko) 2014-09-25
EP2778696A2 (en) 2014-09-17
SG10201400683QA (en) 2014-10-30

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20161214

Address after: Massachusetts USA

Applicant after: Sensata Technologies Inc.

Address before: Massachusetts USA

Applicant before: Sensata Technologies Massachusetts Inc.

WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140917