CN104048195B - 带有结构支撑的led灯泡 - Google Patents
带有结构支撑的led灯泡 Download PDFInfo
- Publication number
- CN104048195B CN104048195B CN201410072125.5A CN201410072125A CN104048195B CN 104048195 B CN104048195 B CN 104048195B CN 201410072125 A CN201410072125 A CN 201410072125A CN 104048195 B CN104048195 B CN 104048195B
- Authority
- CN
- China
- Prior art keywords
- support structure
- led
- light
- light emitting
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0066—Reflectors for light sources specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/802,315 US9353932B2 (en) | 2013-03-13 | 2013-03-13 | LED light bulb with structural support |
| US13/802315 | 2013-03-13 | ||
| US13/802,315 | 2013-03-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104048195A CN104048195A (zh) | 2014-09-17 |
| CN104048195B true CN104048195B (zh) | 2018-11-30 |
Family
ID=50396854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410072125.5A Expired - Fee Related CN104048195B (zh) | 2013-03-13 | 2014-02-28 | 带有结构支撑的led灯泡 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9353932B2 (enExample) |
| EP (1) | EP2778502B1 (enExample) |
| JP (1) | JP2014179318A (enExample) |
| CN (1) | CN104048195B (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230112968A1 (en) * | 2007-10-06 | 2023-04-13 | Lynk Labs, Inc. | High frequency multi-voltage and multi-brightness led lighting devices |
| US8764247B2 (en) * | 2012-11-07 | 2014-07-01 | Palo Alto Research Center Incorporated | LED bulb with integrated thermal and optical diffuser |
| US9528689B2 (en) | 2013-03-13 | 2016-12-27 | Palo Alto Research Center Incorporated | LED lighting device with cured structural support |
| US10066791B2 (en) * | 2013-12-02 | 2018-09-04 | Tiehan Ge | Spiral LED filament and light bulb using spiral LED filament |
| US10060584B2 (en) * | 2014-09-11 | 2018-08-28 | City Electric Supply, Inc. | LED luminaire |
| US9523494B2 (en) * | 2015-02-17 | 2016-12-20 | Flextronics Ap, Llc | LED lighting unit |
| JP6137231B2 (ja) * | 2015-04-08 | 2017-05-31 | 三菱電機株式会社 | ランプ |
| US9467190B1 (en) * | 2015-04-23 | 2016-10-11 | Connor Sport Court International, Llc | Mobile electronic device covering |
| JP6611036B2 (ja) * | 2015-09-10 | 2019-11-27 | パナソニックIpマネジメント株式会社 | 発光装置及び照明用光源 |
| CN105588016B (zh) * | 2016-03-11 | 2018-07-24 | 贵州光浦森光电有限公司 | 一种带热辐射环的led灯丝灯泡 |
| DE102016105537A1 (de) * | 2016-03-24 | 2017-09-28 | Osram Opto Semiconductors Gmbh | Filament mit lichtemittierenden halbleiterchips, leuchtmittel und verfahren zur herstellung eines filaments |
| WO2018087072A1 (en) * | 2016-11-14 | 2018-05-17 | Lumileds Holding B.V. | Method of manufacturing an led lighting assembly |
| US10724706B2 (en) * | 2016-12-01 | 2020-07-28 | Signify Holding B.V. | Optical component for generating a light effect |
| WO2018136755A1 (en) * | 2017-01-20 | 2018-07-26 | Ostman Charles Hugo | Light emitting structures |
| DE102017109836B4 (de) | 2017-05-08 | 2023-07-06 | Ledvance Gmbh | Leuchtmittel mit Kühlkörper |
| CN111094837B (zh) * | 2017-09-14 | 2022-11-18 | 昕诺飞控股有限公司 | 照明设备及制造照明设备的方法 |
| CN108397696A (zh) * | 2018-04-28 | 2018-08-14 | 中国人民大学 | 一种晶体发光高清球泡灯及制作方法 |
| US10767816B1 (en) * | 2019-04-24 | 2020-09-08 | Xiamen Eco Lighting Co. Ltd. | Light bulb apparatus |
| US20220228715A1 (en) * | 2019-05-29 | 2022-07-21 | Signify Holding B.V. | Lighting device comprising a light emitting filament |
| US11754230B2 (en) | 2019-08-01 | 2023-09-12 | Signify Holding B.V. | Optical structure for producing decorative lighting effects |
| CN114731746A (zh) * | 2019-11-21 | 2022-07-08 | 昕诺飞控股有限公司 | 用于螺旋led灯丝系统的光束成形 |
| CN116348710A (zh) * | 2020-10-15 | 2023-06-27 | 昕诺飞控股有限公司 | 照明设备和制造照明设备的方法 |
| US11906133B2 (en) | 2022-03-31 | 2024-02-20 | Alliance Sports Group, L.P. | Outdoor lighting apparatus |
| WO2025201945A1 (en) * | 2024-03-25 | 2025-10-02 | Signify Holding B.V. | A led filament |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201757351U (zh) * | 2010-08-23 | 2011-03-09 | 高唐县高立电器设备厂 | 一种新型高杆太阳能组合照明灯 |
| FR2957723A1 (fr) * | 2010-03-16 | 2011-09-23 | Design4 | Systeme pour l'alimentation electrique d'un dispositif d'eclairage a diodes electroluminescentes, dispositif d'eclairage a diodes electroluminescentes |
| CN102620157A (zh) * | 2011-01-26 | 2012-08-01 | 罗姆股份有限公司 | Led灯泡 |
| CN102889480A (zh) * | 2012-07-19 | 2013-01-23 | 王定锋 | 三维发光的led灯泡模组和制造方法 |
| CN202769319U (zh) * | 2012-06-06 | 2013-03-06 | 深圳市众明半导体照明有限公司 | 一种led球灯泡 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6580228B1 (en) | 2000-08-22 | 2003-06-17 | Light Sciences Corporation | Flexible substrate mounted solid-state light sources for use in line current lamp sockets |
| US6578986B2 (en) * | 2001-06-29 | 2003-06-17 | Permlight Products, Inc. | Modular mounting arrangement and method for light emitting diodes |
| DE10231127B4 (de) * | 2001-09-19 | 2008-09-25 | Toshiba Lighting & Technology Corp. | Hochdruck-Entladungslampe und Leuchtkörper |
| KR101164758B1 (ko) | 2002-07-25 | 2012-07-12 | 조나단 에스. 담 | 경화용 발광 다이오드를 사용하기 위한 방법 및 장치 |
| US7086756B2 (en) | 2004-03-18 | 2006-08-08 | Lighting Science Group Corporation | Lighting element using electronically activated light emitting elements and method of making same |
| US7585096B2 (en) * | 2005-05-18 | 2009-09-08 | Visteon Global Technologies, Inc. | Compound trough reflector for LED light sources |
| JP2007266246A (ja) * | 2006-03-28 | 2007-10-11 | Mitsubishi Electric Corp | Ledモジュール |
| US20110260945A1 (en) | 2007-08-03 | 2011-10-27 | Fumio Karasawa | Coating Composition and Article Using the Same |
| US20090140279A1 (en) * | 2007-12-03 | 2009-06-04 | Goldeneye, Inc. | Substrate-free light emitting diode chip |
| US7923272B2 (en) | 2007-12-28 | 2011-04-12 | Hwang-Pao Lee | Method of forming a resin cover lens of LED assembly |
| GB0801509D0 (en) | 2008-01-28 | 2008-03-05 | Photonstar Led Ltd | Light emitting system with optically transparent thermally conductive element |
| KR100978208B1 (ko) | 2008-03-10 | 2010-08-25 | 민병현 | 조립형 엘이디 조명기기 |
| KR100883345B1 (ko) * | 2008-08-08 | 2009-02-12 | 김현민 | 라인형 led 조명장치 |
| US9129832B2 (en) | 2008-08-26 | 2015-09-08 | Dingguo Pan | LED multi-chip bonding die and light strip using the same |
| JP2010218714A (ja) | 2009-03-13 | 2010-09-30 | Makoto Ishihara | 螺旋状led発光体およびそれを用いたled照明器具 |
| JP2011126262A (ja) * | 2009-04-09 | 2011-06-30 | Teijin Ltd | 熱伝導性樹脂複合成形体、led照明装置 |
| TWM376709U (en) | 2009-09-02 | 2010-03-21 | Liquidleds Lighting Corp | Curved tubular LED lamp |
| US8926127B2 (en) | 2010-01-15 | 2015-01-06 | Edward Lawrence Sinofsky | Lightweight solid state lighting panel |
| US8783915B2 (en) | 2010-02-11 | 2014-07-22 | Bridgelux, Inc. | Surface-textured encapsulations for use with light emitting diodes |
| US9175811B2 (en) | 2010-02-12 | 2015-11-03 | Cree, Inc. | Solid state lighting device, and method of assembling the same |
| JP5284308B2 (ja) | 2010-04-19 | 2013-09-11 | 日本メクトロン株式会社 | フレキシブル回路基板及びその製造方法 |
| JP5486431B2 (ja) | 2010-07-27 | 2014-05-07 | 日東電工株式会社 | 発光装置用部品、発光装置およびその製造方法 |
| KR101157065B1 (ko) * | 2011-02-07 | 2012-06-21 | 나노엘이디(주) | 방열 및 방수 기능을 갖는 엘이디 램프 |
| US8314566B2 (en) * | 2011-02-22 | 2012-11-20 | Quarkstar Llc | Solid state lamp using light emitting strips |
| US20120243212A1 (en) | 2011-03-22 | 2012-09-27 | David Smith | Portable and bendable utility light |
| CA2834348A1 (en) * | 2011-04-26 | 2012-11-01 | The Procter & Gamble Company | Stemmed lighting assembly with disk-shaped illumination element |
| TWI468621B (zh) * | 2011-07-05 | 2015-01-11 | Ind Tech Res Inst | 照明裝置及其組裝方法 |
| JP2013033890A (ja) * | 2011-08-03 | 2013-02-14 | Toyoda Gosei Co Ltd | 発光装置 |
| US9528689B2 (en) * | 2013-03-13 | 2016-12-27 | Palo Alto Research Center Incorporated | LED lighting device with cured structural support |
-
2013
- 2013-03-13 US US13/802,315 patent/US9353932B2/en not_active Expired - Fee Related
-
2014
- 2014-02-27 JP JP2014037120A patent/JP2014179318A/ja active Pending
- 2014-02-28 CN CN201410072125.5A patent/CN104048195B/zh not_active Expired - Fee Related
- 2014-03-11 EP EP14158751.9A patent/EP2778502B1/en not_active Not-in-force
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2957723A1 (fr) * | 2010-03-16 | 2011-09-23 | Design4 | Systeme pour l'alimentation electrique d'un dispositif d'eclairage a diodes electroluminescentes, dispositif d'eclairage a diodes electroluminescentes |
| CN201757351U (zh) * | 2010-08-23 | 2011-03-09 | 高唐县高立电器设备厂 | 一种新型高杆太阳能组合照明灯 |
| CN102620157A (zh) * | 2011-01-26 | 2012-08-01 | 罗姆股份有限公司 | Led灯泡 |
| CN202769319U (zh) * | 2012-06-06 | 2013-03-06 | 深圳市众明半导体照明有限公司 | 一种led球灯泡 |
| CN102889480A (zh) * | 2012-07-19 | 2013-01-23 | 王定锋 | 三维发光的led灯泡模组和制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2778502A2 (en) | 2014-09-17 |
| US20140268739A1 (en) | 2014-09-18 |
| US9353932B2 (en) | 2016-05-31 |
| JP2014179318A (ja) | 2014-09-25 |
| EP2778502A3 (en) | 2015-09-02 |
| EP2778502B1 (en) | 2017-05-10 |
| CN104048195A (zh) | 2014-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181130 Termination date: 20210228 |