CN104044058A - Method for grinding silicon wafers by means of yellow cover paper - Google Patents
Method for grinding silicon wafers by means of yellow cover paper Download PDFInfo
- Publication number
- CN104044058A CN104044058A CN201410274712.2A CN201410274712A CN104044058A CN 104044058 A CN104044058 A CN 104044058A CN 201410274712 A CN201410274712 A CN 201410274712A CN 104044058 A CN104044058 A CN 104044058A
- Authority
- CN
- China
- Prior art keywords
- paper
- calusena lansium
- silicon chip
- cover paper
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Provided is a method for grinding silicon wafers by means of yellow cover paper. According to the method, the silicon wafers, a clamp, the yellow cover paper and a grinding device are adopted, the yellow cover paper is processed to be in a shape that the yellow cover paper can be embedded into the bottom of the clamp, the yellow cover paper is placed as a mat inside the bottom side of the clamp, then one silicon wafer is placed in the clamp, that is, the yellow cover paper is located between the bottom side of the clamp and the silicon wafer, and the silicon wafer can be ground through the grinding device after the silicon wafer is installed; after 5-7 silicon wafers are ground by the yellow cover paper, the yellow cover paper is taken out, and new yellow cover paper is placed as a mat in the clamp again. According to the method, the silicon wafers in the clamp are more stable in the grinding process; the yellow cover paper is adopted to replace traditional black adhesives or foam cotton or damping cloth, the silicon wafers are effectively prevented from being crushed, the surfaces of the silicon wafers are not prone to being damaged, the percent of pass of the ground silicon wafers is greatly improved, and cost of enterprises is lowered.
Description
Technical field
The present invention relates to optical element processing technique field, be specifically related to a kind of method of utilizing Calusena lansium paper grinding silicon chip.
Background technology
In recent years, along with scientific and technical progress and development, in the various optical systems for digital camera, video camera etc., often adopt silicon chip to be used for improving optical property and make optical system miniaturization.With it together, the apparatus and method that need a kind of grinding silicon chip.
In traditional process of lapping, conventionally adopt silicon chip to pack in specific fixture, and adopt the fixed form of gluing eyeglass, but not only time-consuming but also effort of this method of operating, be unfavorable for very much the carrying out of production line of enterprise.The fixed form that replaces subsequently this gluing; adopt pad to be arranged between silicon chip and fixture; conventionally the pad adopting is the form of black glue, foam or damping cloth; but adopt such pad; silicon chip often can cause the consequence of damaged surfaces to make the qualification rate of the silicon chip after grinding very low in process of lapping; cause certain wasting of resources, increased the cost of enterprise.
Therefore, the problems referred to above are the problems that should pay attention to and solve in the design and use process to lens grinding method.
Summary of the invention
For the problem of above-mentioned existence, the invention provides a kind of method of utilizing Calusena lansium paper grinding silicon chip.
Technical solution of the present invention is: a kind of method of utilizing Calusena lansium paper grinding silicon chip, comprise silicon chip, fixture, Calusena lansium paper and lapping device, the method comprises the following steps: the shape that Calusena lansium paper conversion is become can be embedded in to described clamp base, Calusena lansium paper washer is entered to bottom side in described fixture, again silicon chip is placed in to described fixture, be Calusena lansium paper between the bottom side and described silicon chip of described fixture, just can adopt lapping device to grind described silicon chip after installing; Described Calusena lansium paper, after grinding 5 ~ 7 silicon chips, takes out Calusena lansium paper, and new Calusena lansium paper is encased inside in fixture again.
Further improvement of the present invention is: described fixture adopts plastic-steel to make.
Further improvement of the present invention is: described Calusena lansium paper is thin soft type Calusena lansium paper, and the thickness of the Calusena lansium paper that the method adopts is 0.07 ~ 0.18mm.
A kind of method of utilizing Calusena lansium paper grinding silicon chip of the present invention, using the suitable Calusena lansium paper of cutting as pad pad the bottom at silicon chip, be positioned at fixture, after fixture installs, just can adopt lapping device to grind silicon chip.Ground silicon chip extracting, then put into silicon chip to be ground, after having ground 5 ~ 7 silicon chips, Calusena lansium paper is changed, be about to last silicon chip extracting, Calusena lansium paper after take out using, then put into new Calusena lansium paper, according to above-mentioned steps to needing the silicon chip grinding to grind below.
The invention has the beneficial effects as follows: the present invention adopts plastic-steel fixture, Calusena lansium paper washer is entered at fixture inner bottom part to place silicon chip again, the silicon chip that makes to be arranged in fixture can be more stable at process of lapping.And adopt Calusena lansium paper to substitute traditional black glue, foam or damping cloth, effectively prevent that silicon chip from being damaged by pressure, the surface of silicon chip is difficult for damaged, has greatly improved the qualification rate after silicon chip grinding, has reduced the cost of enterprise, is adapted to carrying out of enterprise's production line.
Accompanying drawing explanation
Fig. 1 is the scheme of installation of a kind of method of utilizing Calusena lansium paper grinding silicon chip of the present invention in process of lapping.
Wherein, 1-fixture, 2-silicon chip, 3-Calusena lansium paper.
The specific embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the present invention is described in further detail, this embodiment, only for explaining the present invention, does not form and limits protection scope of the present invention.
The present embodiment provides a kind of method of utilizing Calusena lansium paper grinding silicon chip, comprise silicon chip 2, fixture 1, Calusena lansium paper 3 and lapping device, the method comprises the following steps: Calusena lansium paper 3 is processed into the shape that can be embedded in described fixture 1 bottom, Calusena lansium paper 3 is encased inside to the interior bottom side of described fixture 1, again silicon chip 2 is placed in to described fixture 1, be Calusena lansium paper 3 between the bottom side and described silicon chip 2 of described fixture 1, just can adopt lapping device to grind described silicon chip 2 after installing; Described Calusena lansium paper 3, after grinding 5 ~ 7 silicon chips 2, is preferably 6, and Calusena lansium paper 3 is taken out, and new Calusena lansium paper 3 is encased inside in fixture 1 again.Described fixture 1 adopts plastic-steel to make.Described Calusena lansium paper 3 is thin soft type Calusena lansium paper 3, and the thickness of the Calusena lansium paper 3 that the method adopts is 0.07 ~ 0.18mm, is preferably 0.10mm.
A kind of method of utilizing Calusena lansium paper 3 grinding silicon chips 2 of the present embodiment, using the suitable Calusena lansium paper 3 of cutting as pad pad the bottom at silicon chip 2, be positioned at fixture 1, after fixture 1 installs, just can adopt lapping device to grind silicon chip 2.Ground silicon chip 2 takes out, put into again silicon chip to be ground 2, after having ground 5 ~ 7 silicon chips 2, Calusena lansium paper 3 is changed, be preferably 6, being about to last silicon chip 2 takes out, Calusena lansium paper 3 after take out using, then put into new Calusena lansium paper 3, according to above-mentioned steps to needing the silicon chip 2 grinding to grind below.
The beneficial effect of the present embodiment is: the present invention adopts plastic-steel fixture, and Calusena lansium paper washer is entered at fixture inner bottom part to place silicon chip again, and the silicon chip that makes to be arranged in fixture can be more stable at process of lapping.And adopt Calusena lansium paper to substitute traditional black glue, foam or damping cloth, effectively prevent that silicon chip from being damaged by pressure, the surface of silicon chip is difficult for damaged, has greatly improved the qualification rate after silicon chip grinding, has reduced the cost of enterprise, is adapted to carrying out of enterprise's production line.
Claims (3)
1. a method of utilizing Calusena lansium paper grinding silicon chip, it is characterized in that: comprise silicon chip (2), fixture (1), Calusena lansium paper (3) and lapping device, the method comprises the following steps: Calusena lansium paper (3) is processed into the shape that can be embedded in described fixture (1) bottom, Calusena lansium paper (3) is encased inside to the interior bottom side of described fixture (1), again silicon chip (2) is placed in to described fixture (1), be that Calusena lansium paper (3) is positioned between the bottom side and described silicon chip (2) of described fixture (1), after installing, just can adopt lapping device to grind described silicon chip (2); Described Calusena lansium paper (3), after grinding 5 ~ 7 silicon chips (2), takes out Calusena lansium paper (3), and new Calusena lansium paper (3) is encased inside in fixture (1) again.
2. a kind of method of utilizing Calusena lansium paper grinding silicon chip according to claim 1, is characterized in that: described fixture (1) adopts plastic-steel to make.
3. a kind of method of utilizing Calusena lansium paper grinding silicon chip according to claim 1, is characterized in that: described Calusena lansium paper (3) is thin soft type Calusena lansium paper (3), and the thickness of the Calusena lansium paper (3) that the method adopts is 0.07 ~ 0.18mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410274712.2A CN104044058A (en) | 2014-06-19 | 2014-06-19 | Method for grinding silicon wafers by means of yellow cover paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410274712.2A CN104044058A (en) | 2014-06-19 | 2014-06-19 | Method for grinding silicon wafers by means of yellow cover paper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104044058A true CN104044058A (en) | 2014-09-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410274712.2A Pending CN104044058A (en) | 2014-06-19 | 2014-06-19 | Method for grinding silicon wafers by means of yellow cover paper |
Country Status (1)
| Country | Link |
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| CN (1) | CN104044058A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5357716A (en) * | 1988-10-20 | 1994-10-25 | Olympus Optical Company Limited | Holding device for holding optical element to be ground |
| JPH08323605A (en) * | 1995-05-25 | 1996-12-10 | Otsuka Chem Co Ltd | Lens abrasion working jig, lens abrasion working method using the jig, and manufacture of the jig |
| JPH11151649A (en) * | 1997-11-19 | 1999-06-08 | Canon Inc | Lens holder |
| CN2376047Y (en) * | 1999-01-18 | 2000-04-26 | 翟秋全 | Damage-free double-sided optical disk |
| CN101585158A (en) * | 2009-07-03 | 2009-11-25 | 周梁成 | Fixture for grinding lens, and lens machining method |
| CN202640079U (en) * | 2012-04-10 | 2013-01-02 | 江西凤凰富士胶片光学有限公司 | Porous anti-damage multi-lens grinding clamp |
| CN103811422A (en) * | 2014-02-25 | 2014-05-21 | 福建安特微电子有限公司 | Cmos silicon wafer lobe processing device and processing method thereof |
-
2014
- 2014-06-19 CN CN201410274712.2A patent/CN104044058A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5357716A (en) * | 1988-10-20 | 1994-10-25 | Olympus Optical Company Limited | Holding device for holding optical element to be ground |
| JPH08323605A (en) * | 1995-05-25 | 1996-12-10 | Otsuka Chem Co Ltd | Lens abrasion working jig, lens abrasion working method using the jig, and manufacture of the jig |
| JPH11151649A (en) * | 1997-11-19 | 1999-06-08 | Canon Inc | Lens holder |
| CN2376047Y (en) * | 1999-01-18 | 2000-04-26 | 翟秋全 | Damage-free double-sided optical disk |
| CN101585158A (en) * | 2009-07-03 | 2009-11-25 | 周梁成 | Fixture for grinding lens, and lens machining method |
| CN202640079U (en) * | 2012-04-10 | 2013-01-02 | 江西凤凰富士胶片光学有限公司 | Porous anti-damage multi-lens grinding clamp |
| CN103811422A (en) * | 2014-02-25 | 2014-05-21 | 福建安特微电子有限公司 | Cmos silicon wafer lobe processing device and processing method thereof |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140917 |