CN104037617A - Coating film holder for blocking free coating film of laser device - Google Patents
Coating film holder for blocking free coating film of laser device Download PDFInfo
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- CN104037617A CN104037617A CN201410270114.8A CN201410270114A CN104037617A CN 104037617 A CN104037617 A CN 104037617A CN 201410270114 A CN201410270114 A CN 201410270114A CN 104037617 A CN104037617 A CN 104037617A
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- main body
- film plating
- boss
- described main
- plating frame
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Abstract
The invention discloses a coating film holder. The coating film holder comprises a body with a thin middle portion and two thick ends, a assembly accessory with a thick middle portion and two thin ends as well as a slip sheet; two threaded holes are formed in the middle of the end surface of one of the two ends, two through holes are formed in the upper surface of the other end surface, a frame with an opening is arranged in the middle portion, and the upper surface and the lower surface of the frame is respectively provided with a metal sheet oppositely extending to the middle of a rectangle opening; the assembly accessory is in the same size with the body, and two threaded holes corresponding to the through holes of the body in position are formed in the upper surface of a first end, provided with the identical threads and fixed to the body; a high boss and a low boss are arranged on the middle of the assembly accessory, the height difference between the high boss and the low boss is not less than the thickness of the metal sheet on the lower surface of the body, and a slot is formed in the middle of the high boss; the slip sheet moves within the rectangular opening of the frame of the body and vertically clamped by the upper metal sheet and the lower boss. The coating film holder has no blocking effects on coating samples, greatly improves the utilization rate of a chip and reduces the cost of a laser device.
Description
Technical field
The invention belongs to technical field of semiconductors, the film plating frame that particularly a kind of plating films on cavity surfaces of semiconductor lasers is used.
Background technology
The cleavage surface of edge-emission semiconductor laser rear and front end can form resonant cavity, but because the reflectivity of two ends cleavage surface is identical, there is Laser output at two ends, but under normal circumstances, only have the light energy output of one end to be utilized, not only waste laser energy, and can produce a lot of used heat and potential safety hazard.Realizing monolateral high-power output must use cavity surface film coating technology to change the reflectivity of the front rear facet of laser.The chamber face of edge-emission semiconductor laser bar bar is very thin very long, and thickness only has more than 100 micron, and length is generally 10mm, in order to improve plated film efficiency and reliability, laser bar bar need to be put into film plating frame each other in intimate contact.And can not damage laser cavity surface in the process of arranging laser bar bar, and require the chamber face of all laser stripes will be in same level, mutually blocking between each laser stripes when preventing plated film.Due to semi-conductive easy fracture characteristic, requirement to film plating frame device and dress film plating frame technology is very high, common film plating frame device adopts hierarchy conventionally, it is large that the opening of the upper and lower two-layer framework of aperture efficiency of middle one deck framework is wanted, make width be less than or equal in the middle of the laser stripes of one deck frame openings width can in film plating frame, slide, and the level of the chamber face of the laser stripes of making uniform when one deck framework is for dress film plating frame below.But the two ends that its drawback is laser stripes are all covered by upper and lower two frameworks, when plated film, the two ends of laser stripes do not have coating materials to plate completely, and also there is plated film shade the both sides of the coating film area exposing in laser stripes due to upper and lower two frameworks, can cause the optical film thickness of laser cavity surface both sides inconsistent, this just means in the middle of the blooming reflectivity at laser cavity surface two ends and chamber face inconsistent, these parts can only be removed, so just reduce the utilized area of laser, improved the cost of laser.
Realizing in process of the present invention, inventor recognizes the defect that prior art exists, and has invented a kind of unobstructed film plating frame, can make full use of the area of chip of laser, can improve the quantity of laser bar bar, reduces device cost.
Summary of the invention
(1) technical problem that will solve
Existing cavity surface film coating frame blocks laser cavity surface two ends, make laser cavity surface two ends and intermediate optical film thickness inconsistent, two end portions can only be thrown away, so it is more a lot of than the length of actual needs to pack the laser bar bar of film plating frame into, cause the utilance of making laser chip to reduce, device cost increases.For above-mentioned technical problem, the present invention proposes a kind of unscreened film plating frame and fitting attachments thereof, because film plating frame of the present invention is blocked without any the chamber face of laser bar bar, and the chamber face of all laser bar bars is in same level, avoid the generation of laser bar bar two ends and the inconsistent phenomenon of intermediate optical film thickness, also avoided mutually blocking between various lasers bar bar simultaneously.Can intercept as required the length of plated film laser bar bar, improve the utilance of chip, reduce the cost of laser.
(2) technical scheme
The present invention proposes a kind of film plating frame, it comprises:
Main body, intermediate thin two ends are thick, wherein in the middle of the end face of one end, have two screwed holes, and the upper surface on other end surface has two through holes, centre is one to have the framework of opening, and the upper surface of described framework respectively has with lower surface that piece of metal sheet is relative to be extended in the middle of rectangle square opening;
Fitting attachments, its size is identical with main body, and thick middle two ends are thin, and first end upper surface has two screwed holes, and position is corresponding with the through hole of described main body, fixes with screw thread and described main body; In the middle of described fitting attachments, be two high and low boss, the difference in height of described two high and low boss is not less than the thickness of main body lower surface sheet metal, has a rill in the middle of high boss;
Slide plate moves between the rectangular frame square opening of described main body, and is clamped up and down by described two sheet metals.
(3) beneficial effect
There is the beneficial effect of the following aspects in film plating frame of the present invention: 1, because film plating frame of the present invention does not exist any blocking to laser cavity surface, improves the utilance of chip; 2, film plating frame of the present invention can be carried out unobstructed plated film to any laser that is less than film plating frame rectangle square opening width; 3, film plating frame of the present invention can be used for the laser cavity surface plated film that different cavity is long, has improved the versatility of technique.
Brief description of the drawings
Fig. 1 is the exploded perspective schematic diagram of film plating frame in the present invention;
Fig. 2 is the schematic perspective view after film plating frame assembling in the present invention;
Fig. 3 is that the film plating frame that bar bar is housed in the present invention is used schematic diagram;
Fig. 4 is the effect schematic diagram after utilizing film plating frame of the present invention to bar bar plated film.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in further detail.
Fig. 1 shows the unscreened film plating frame structural representation of one that the present invention proposes.As shown in Figure 1, it comprises:
Film plating frame main body 10, it is the thick structures in intermediate thin two ends, in the middle of it, it is a rectangular frame, in the middle of described rectangular frame, there is a rectangle square opening 17, one end of main body 10 is middle thick 11 of having two screwed holes 16 in top, the other end of main body 10 is to have thick 12 of two through holes 15 in the middle of end face, and the upper surface of the rectangular frame in the middle of main body 10 and lower surface respectively have a upper and lower sheet metal 13 and 14 that extends to rectangle square opening.Wherein, described thick 11 and thick 12 is arrived middle rectangular frame by chamfered transition, and described upper and lower sheet metal 13,14 extends to the centre of described square opening.
Film plating frame assembling accessory 20, its size is identical with described main body, is intermediate thin two ends thick structure; One end at assembling accessory 20 is the concave station 22 that has two screwed holes 25, the other end at assembling accessory 20 is concave station 21, centre at assembling accessory 20 is two high and low boss 23 and 24, wherein, there is a stria 26 centre of described high boss 23, promote bar bar in the tweezers end of rectangle square opening 17 interior translations in the interior slip of stria 26; And described high and low boss 23 and 24 both ends of the surface are an inclined-plane, match with two thick 11 of described main body 10,12 inclined-plane, the position of described two screwed holes 25 is corresponding with the position of two through hole 15 in described main body 10; .Described main body 10 is created in two screwed holes 25 that described two through holes 15 are tightened on described assembling accessory 20 by screw.
In addition, in film plating frame of the present invention and assembling accessory thereof, also comprise slide block 30, two screws 40 and two screws 50.
The assembly drawing of film plating frame main body 10 and assembling accessory 20 thereof as shown in Figure 2, screw 50 is screwed in through the through hole 15 in main body 10 on the screwed hole 25 of film plating frame assembling accessory 20, thereby film plating frame main body 10 and assembling accessory 20 are fixed together, the lower surface of film plating frame main body 10 rectangular frames overlaps with the upper surface of film plating frame assembling accessory 20 high boss 23; The lower surface of the lower sheet metal 14 of film plating frame main body 10 overlaps with the upper surface of the low boss 24 of film plating frame assembling accessory 20; Slide block 30 is clipped in the middle of sheet metal 13 and 14, can in the square opening of rectangle frame 17, slide freely; Screw 40 is screwed on screwed hole 16;
As shown in Figure 3, bar bar is contained in one end away from screwed hole 16 in the square opening 17 of film plating frame rectangular frame to the schematic diagram of film plating frame main body and assembling accessory dress bar bar thereof, and slide block 30 holds out against bar bar, and screw 40 holds out against slide block 30.
After Bar bar installs, take off from assembling accessory 20, put into coating machine plated film, because film plating frame of the present invention is unobstructed, so laser cavity surface plated film uniformly, as shown in Figure 4, wherein each rectangular strip represents a laser bar bar to its effect.
In addition, in another embodiment of the present invention, described main body 10 and assembling accessory 20 are circular, and described rectangular frame is that both sides are semicircular framework.
In sum, the present invention is a kind of film plating frame and assembling accessory thereof that is mainly used in plating films on cavity surfaces of semiconductor lasers, can realize the unscreened plated film of films on cavity surfaces of semiconductor lasers.This technology can improve the utilance of chip, reduces the cost of semiconductor laser bar bar.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (8)
1. a film plating frame, it comprises:
Main body, intermediate thin two ends are thick, wherein in the middle of the end face of one end, have two screwed holes, and the upper surface on other end surface has two through holes, centre is one to have the framework of opening, and the upper surface of described framework respectively has with lower surface that piece of metal sheet is relative to be extended in the middle of rectangle square opening;
Fitting attachments, its size is identical with main body, and thick middle two ends are thin, and first end upper surface has two screwed holes, and position is corresponding with the through hole of described main body, fixes with screw thread and described main body; In the middle of described fitting attachments, be two high and low boss, the difference in height of described two high and low boss is not less than the thickness of main body lower surface sheet metal, has a rill in the middle of high boss;
Slide plate moves between the rectangular frame square opening of described main body, and is clamped up and down by described two sheet metals.
2. film plating frame according to claim 1, is characterized in that, middle rectangular frame is arrived by chamfered transition in described main body two ends.
3. film plating frame according to claim 1, is characterized in that, two sheet metals up and down on the rectangular frame of described main body extend to the centre of plating described framework square opening separately.
4. film plating frame according to claim 1, is characterized in that, described main body is passed described two through holes by screw and is tightened in the screwed hole of fitting attachments relevant position.
5. film plating frame according to claim 1, is characterized in that, after described main body is assemblied on fitting attachments, the high boss upper surface of the lower surface of described main body rectangular frame and described fitting attachments coincides.
6. film plating frame according to claim 1, is characterized in that, the high boss of described fitting attachments and low protruding edge of table are inclined-plane.
7. film plating frame according to claim 1, is characterized in that, after described main body is assemblied on described fitting attachments, in described fitting attachments, the upper surface of low boss is lower than the lower surface of described main body rectangular frame lower surface sheet metal.
8. film plating frame according to claim 1, is characterized in that, described main body and described fitting attachments are rectangle or circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410270114.8A CN104037617B (en) | 2014-06-17 | 2014-06-17 | A kind of film plating frame device for the unobstructed plated film of laser instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410270114.8A CN104037617B (en) | 2014-06-17 | 2014-06-17 | A kind of film plating frame device for the unobstructed plated film of laser instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104037617A true CN104037617A (en) | 2014-09-10 |
| CN104037617B CN104037617B (en) | 2016-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410270114.8A Expired - Fee Related CN104037617B (en) | 2014-06-17 | 2014-06-17 | A kind of film plating frame device for the unobstructed plated film of laser instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104037617B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105938976A (en) * | 2016-03-08 | 2016-09-14 | 北京工业大学 | Semiconductor laser cavity surface coating clamp |
| CN111501042A (en) * | 2020-06-02 | 2020-08-07 | 海南师范大学 | Edge-emitting semiconductor laser chip cavity surface coating clamp |
| CN114488374A (en) * | 2022-03-11 | 2022-05-13 | 中国科学院长春光学精密机械与物理研究所 | Preparation tool for metal film layer of echelle grating and use method of preparation tool |
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| JPS6088427A (en) * | 1983-10-21 | 1985-05-18 | Hitachi Ltd | Device for liquid phase growth |
| JPS61220390A (en) * | 1985-03-26 | 1986-09-30 | Toshiba Corp | Jig for forming protective film for end surface of semiconductor laser |
| CN2651264Y (en) * | 2003-06-23 | 2004-10-27 | 中国科学院半导体研究所 | Coating film rack with guides |
| US20100128445A1 (en) * | 2008-11-26 | 2010-05-27 | Shenzhen Century Epitech Photonics Technology Co. Ltd. | Clamp for mounting semiconductor laser bar chips and method of mounting chips |
| CN103225068A (en) * | 2013-04-01 | 2013-07-31 | 武汉电信器件有限公司 | Clamping fixture for film coating of end surfaces of semiconductor laser chips |
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2014
- 2014-06-17 CN CN201410270114.8A patent/CN104037617B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6088427A (en) * | 1983-10-21 | 1985-05-18 | Hitachi Ltd | Device for liquid phase growth |
| JPS61220390A (en) * | 1985-03-26 | 1986-09-30 | Toshiba Corp | Jig for forming protective film for end surface of semiconductor laser |
| CN2651264Y (en) * | 2003-06-23 | 2004-10-27 | 中国科学院半导体研究所 | Coating film rack with guides |
| US20100128445A1 (en) * | 2008-11-26 | 2010-05-27 | Shenzhen Century Epitech Photonics Technology Co. Ltd. | Clamp for mounting semiconductor laser bar chips and method of mounting chips |
| CN103225068A (en) * | 2013-04-01 | 2013-07-31 | 武汉电信器件有限公司 | Clamping fixture for film coating of end surfaces of semiconductor laser chips |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105938976A (en) * | 2016-03-08 | 2016-09-14 | 北京工业大学 | Semiconductor laser cavity surface coating clamp |
| CN105938976B (en) * | 2016-03-08 | 2019-03-22 | 北京工业大学 | Plating films on cavity surfaces of semiconductor lasers fixture |
| CN111501042A (en) * | 2020-06-02 | 2020-08-07 | 海南师范大学 | Edge-emitting semiconductor laser chip cavity surface coating clamp |
| CN111501042B (en) * | 2020-06-02 | 2023-09-01 | 海南师范大学 | Edge-emitting semiconductor laser chip cavity surface coating clamp |
| CN114488374A (en) * | 2022-03-11 | 2022-05-13 | 中国科学院长春光学精密机械与物理研究所 | Preparation tool for metal film layer of echelle grating and use method of preparation tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104037617B (en) | 2016-11-16 |
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| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20161116 Termination date: 20170617 |