CN1040210A - Two component epoxy resin composition without solvent impregnation - Google Patents
Two component epoxy resin composition without solvent impregnation Download PDFInfo
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- CN1040210A CN1040210A CN 89104103 CN89104103A CN1040210A CN 1040210 A CN1040210 A CN 1040210A CN 89104103 CN89104103 CN 89104103 CN 89104103 A CN89104103 A CN 89104103A CN 1040210 A CN1040210 A CN 1040210A
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Abstract
The invention discloses a kind of pair of component BF grade universal epoxy resin composition without solvent impregnation.Composition provided by the invention comprises 18～30% (weight) bisphenol A type epoxy resin, 40～60% (weight) tung oil acid anhydride phenyl maleimide, 20～30% (weight) reactive thinner, 0.2～1.0% (weight) peroxide initiator and 0.2～1.0% (weight) promotor.This composition is applicable to BF level electrical equipment and electrical coil insulation dip treating, and it is good to have resistance toheat, characteristics such as cohesive strength height.
Description
The present invention relates to a kind of pair of component B.F grade universal epoxy resin composition without solvent impregnation, be applicable to electrical equipment and electrical coil insulation dip treating.
" insulating material communication " 1980 the 4th phases the 1st～4 page of " J-1132-D type epoxy solvent-less dripping impregnating varnish " of having reported Jiaxing engineering department of insulating material factory compiled by China Machinery Industry Ministry Guilin Electric Science Institute, discloses the J-1132-D type two component epoxy solvent-free dripping impregnating varnish of being made up of Resins, epoxy, tung oil acid anhydride, vinylbenzene, initiator and promotor; Dongfang Insulating Material Factory is compiled " east insulation " the 1st phase in 1987 the 1st～11 page of " development report of B level epoxy solvent-less dripping impregnating varnish " literary composition of having reported Dongfang Insulating Material Factory Zhao equality people, discloses two component B level epoxy solvent-free paints of forming with E-44 Resins, epoxy, tung oil acid anhydride, 304 unsaturated polyesters, vinylbenzene, initiator and promotor; Owing to adopt tung oil acid anhydride to make solidifying agent, the temperature classification of lacquer is low, narrow application range, cohesive strength are low.
Purpose of the present invention is intended to overcome above-mentioned deficiency of the prior art, proposes a kind of temperature classification height, the scope of application is wide, cohesive strength is high two component B.F grade universal epoxy resin composition without solvent impregnation.
Content of the present invention is: adopt bisphenol A type epoxy resin, tung oil acid anhydride phenyl maleimide, reactive thinner, peroxide initiator and promotor to form two component B.F grade universal epoxy resin composition without solvent impregnation.
Composition of the present invention (weight %) comprising: 18～30% bisphenol A type epoxy resins, 40～60% tung oil acid anhydride phenyl maleimides, 20～30% reactive thinners, 0.2～1.0% peroxide initiator, 0.2～1.0% promotor.
The preparation method of said composition is:
(1) 18～30% bisphenol A type epoxy resin, 0.2～1.0% peroxide initiator, 10～15% reactive thinners stirred 0.5～1.0 hour down at 50 ℃, obtained composition A.
(2) 40～60% tung oil acid anhydride phenyl maleimides, 0.2～1.0% promotor, 10～15% reactive thinners stir under 50 ℃ and obtained composition B in 0.5～1.0 hour.
(3) at room temperature, A and B composition are mixed by certain weight ratio, obtain B.F grade universal epoxy resin composition without solvent impregnation.
Bisphenol A type epoxy resin described in the content of the present invention is E-44 Resins, epoxy or E-51 Resins, epoxy, and preferable consumption is 20～27%(weight %); Reactive thinner is a vinylbenzene, also can be Phthalic acid, diallyl ester or alpha-methyl styrene, and preferable consumption is 23～27%; The peroxide initiator is a dicumyl peroxide, also can be benzoyl peroxide or peroxidized t-butyl perbenzoate, and preferable consumption is 0.4～0.7%; Promotor is 2.4.6-three ((dimethylamino) methyl) phenol, also can be N.N-dimethyl benzylamine or other tertiary amine, and preferable consumption is 0.4～0.8%.
Novel solidifying agent-tung oil acid anhydride phenyl maleimide described in the content of the present invention is by tung oil, MALEIC ANHYDRIDE, aniline preparation, particular content has been done to be described in detail in application number is 89105938.5 Chinese patent application, and its preparation method comprises: (1), with 100 parts of (weight) tung oil, 20～40 parts of MALEIC ANHYDRIDE 90～180 ℃ of reactions 0.5～4 hour; (2), with 5～20 parts of (weight) aniline adding below 100 ℃, add 20～250 milliliters of organic solvents simultaneously, for example benzene, toluene or dimethylbenzene were 100～200 ℃ of reactions 0.5～5 hour; (3), be evacuated to aneroid and flow out, promptly obtain the tung oil acid anhydride phenyl maleimide.In the present invention, its preferable consumption (weight %) is 45～54%.
The present invention has following characteristics compared to existing technology:
1, temperature classification improves, and is increased to the F level by the B level;
2, the scope of application enlarges, by being applicable to that B-class insulation expands as the B.F class B insulation;
3, cohesive strength improves.
Below in conjunction with embodiment the present invention is further described in detail:
Embodiment 1: with 100 parts of (weight) E-44 Resins, epoxy, 190 parts of tung oil acid anhydride phenyl maleimides, 98 parts of vinylbenzene, stirred 0.5 hour at 50 ℃, add 4.1 parts of dicumyl peroxides, stirred 0.5 hour at 30 ℃, add 4.1 parts of 2.4.6-three ((dimethylamino) methyl) phenol, stirred 0.5 hour, and obtained B.F grade universal epoxy resin composition without solvent impregnation, its performance sees Table 1.
Embodiment 2: with 100 parts of (weight) E-44 Resins, epoxy, 229 parts of tung oil acid anhydride phenyl maleimides, 112 parts of vinylbenzene, stirred 0.5 hour at 50 ℃, add 2.7 parts of dicumyl peroxides down, stirred 0.5 hour at 30 ℃, add 2.7 parts of 2.4.6-three ((dimethylamino) methyl) phenol, stirred 0.5 hour, and obtained B.F grade universal epoxy resin composition without solvent impregnation, its performance sees Table 1.
Embodiment 3: with 100 parts of (weight) E-44 Resins, epoxy, 270 parts of tung oil acid anhydride phenyl maleimides, 126 parts of vinylbenzene, stirred 0.5 hour at 50 ℃, add 1.1 parts of benzoyl peroxides, stirred 0.5 hour at 30 ℃, add 1.4 parts of N.N-dimethyl benzylamines, stirred 0.5 hour, and obtained B.F grade universal epoxy resin composition without solvent impregnation, its performance sees Table 1.
Comparative Examples 1: with 100 parts of (weight) E-44 Resins, epoxy, 150 parts of tung oil acid anhydrides, 83 parts of vinylbenzene, stirred 0.5 hour at 50 ℃, add 2.7 parts of dicumyl peroxides, stirred 0.5 hour at 30 ℃, add 2.7 parts of 2.4.6-three ((dimethylamino) methyl) phenol, stirred 0.5 hour, and obtained B level epoxy solvent-less dripping impregnating varnish, its performance sees Table 1.
Comparative Examples 2: with 100 parts of (weight) E-44 Resins, epoxy, 229 parts of bismaleimides tung oil acid anhydrides, 112 parts of vinylbenzene, stirred 0.5 hour at 50 ℃, add 1.3 parts of dicumyl peroxides, stirred 0.5 hour at 30 ℃, add 1.3 parts of 2.4.6-three ((dimethylamino) methyl) phenol, stirred 0.5 hour, and obtained bismaleimides-Resins, epoxy F level solvent-free dripping impregnating varnish, its performance sees Table 1.
Table 1:
Claims (6)
1, a kind of two component epoxy resin composition without solvent impregnation, it is characterized in that forming (weight %) comprising: 18～30% bisphenol A type epoxy resins, 40～60% tung oil acid anhydride phenyl maleimides, 20～30% reactive thinners, 0.2～1.0% peroxide initiator, 0.2～1.0% promotor.
2,, it is characterized in that the preferable consumption (weight %) of tung oil acid anhydride phenyl maleimide is 45～54% according to the described two component epoxy resin composition without solvent impregnation of claim 1.
3,, it is characterized in that reactive thinner is vinylbenzene, Phthalic acid, diallyl ester or alpha-methyl styrene according to claim 1 or 2 described two component epoxy resin composition without solvent impregnation.
4,, it is characterized in that the peroxide initiator is dicumyl peroxide, benzoyl peroxide or peroxidized t-butyl perbenzoate according to the described two component epoxy resin composition without solvent impregnation of claim 3.
5,, it is characterized in that promotor is 2.4.6-three ((dimethylamino) methyl) phenol, N.N-dimethyl benzylamine or other tertiary amine according to the described two component epoxy resin composition without solvent impregnation of claim 4.
6,, it is characterized in that bisphenol A type epoxy resin is E-44 Resins, epoxy or E-51 Resins, epoxy according to the described two component epoxy resin composition without solvent impregnation of claim 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89104103 CN1021054C (en) | 1989-08-23 | 1989-08-23 | Two component epoxy resin composition without solvent impregnation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89104103 CN1021054C (en) | 1989-08-23 | 1989-08-23 | Two component epoxy resin composition without solvent impregnation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1040210A true CN1040210A (en) | 1990-03-07 |
| CN1021054C CN1021054C (en) | 1993-06-02 |
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ID=4855423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89104103 Expired - Fee Related CN1021054C (en) | 1989-08-23 | 1989-08-23 | Two component epoxy resin composition without solvent impregnation |
Country Status (1)
| Country | Link |
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| CN (1) | CN1021054C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100560670C (en) * | 2007-10-22 | 2009-11-18 | 苏州巨峰绝缘材料有限公司 | B. F-grade general epoxy less-solvent insulating impregnating varnish and preparation method thereof |
| CN101921531A (en) * | 2010-09-08 | 2010-12-22 | 东华大学 | Active phthalimide epoxy solvent-free dripping impregnating varnish and preparation method thereof |
| CN102086318A (en) * | 2010-12-21 | 2011-06-08 | 中电电气集团有限公司 | Special impregnating resin for surface dip-coating of silicon steel sheet with low polarity and preparation method thereof |
| CN1930263B (en) * | 2004-03-19 | 2012-02-29 | 住友电木株式会社 | Resin composition and semiconductor devices made by using the same |
-
1989
- 1989-08-23 CN CN 89104103 patent/CN1021054C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1930263B (en) * | 2004-03-19 | 2012-02-29 | 住友电木株式会社 | Resin composition and semiconductor devices made by using the same |
| CN100560670C (en) * | 2007-10-22 | 2009-11-18 | 苏州巨峰绝缘材料有限公司 | B. F-grade general epoxy less-solvent insulating impregnating varnish and preparation method thereof |
| CN101921531A (en) * | 2010-09-08 | 2010-12-22 | 东华大学 | Active phthalimide epoxy solvent-free dripping impregnating varnish and preparation method thereof |
| CN101921531B (en) * | 2010-09-08 | 2012-12-05 | 东华大学 | Active phthalimide epoxy solvent-free dripping impregnating varnish and preparation method thereof |
| CN102086318A (en) * | 2010-12-21 | 2011-06-08 | 中电电气集团有限公司 | Special impregnating resin for surface dip-coating of silicon steel sheet with low polarity and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1021054C (en) | 1993-06-02 |
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