CN1022419C - Resins without solvent dipping - Google Patents
Resins without solvent dipping Download PDFInfo
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- CN1022419C CN1022419C CN 89105944 CN89105944A CN1022419C CN 1022419 C CN1022419 C CN 1022419C CN 89105944 CN89105944 CN 89105944 CN 89105944 A CN89105944 A CN 89105944A CN 1022419 C CN1022419 C CN 1022419C
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Abstract
The present invention relates to B. F. universal epoxy-polyester dipping resin without solvent. The B. F. universal epoxy-polyester dipping resin without solvent comprises bisphenol-A epoxy resin, estolide phenylmaleimide of tung oil, m-benzol undaturated polyesters resin, butylated phenolic resin, diluting agents, overoxidation initiating agents and polymerization inhibitors. The B. F. universal epoxy-polyester dipping resin without solvent is used for the insulation dipping treatment of coils of motors, and has the characteristics of high heat resistance class, high solidifying speed, wide application range, low production cost, high adhesive strength, etc.
Description
The present invention relates to a kind of BF grade universal epoxy one polyester resins without solvent dipping, be applicable to electrical equipment and electrical coil insulation dip treating.
Machinery Industry Ministry Guilin Electric Science Institute compiles the 35th~39 page of the 24th~31 page of " insulating material communication " 1974 the 2nd phase and 1980 the 5th~6 phase and has reported that respectively the Shanghai Long March makes " development of maleimide tung oil acid anhydride-Resins, epoxy F level solvent-free immersion paint " literary composition of people such as the civilian and Hubei Prov. Chemical Research Inst Zhang Xuling of " development report of 5152-2 epoxy solvent-free impregnating varnish " of lacquer factory, the former discloses by 6101 Resins, epoxy, 304 unsaturated polyester resins, tung oil acid anhydride, vinylbenzene, 284 resol, the 5152-2 epoxy solvent-free impregnating varnish of benzoyl peroxide preparation, make solidifying agent owing to adopt tung oil acid anhydride, its temperature classification low (B level), cohesive strength is low, narrow application range, owing to used by Viscotrol C, Tetra hydro Phthalic anhydride, MALEIC ANHYDRIDE, 304 unsaturated polyester resins of ethylene glycol, cause curing speed slow, the solidification value height; It is the Resins, epoxy F level solvent-free immersion paint that raw material is formed that the latter discloses with Resins, epoxy, maleimide tung oil acid anhydride, vinylbenzene and superoxide, its complex manufacturing, cost height, and package stability is poor, and the scope of application is little.Guilin Inst. of Electrical Equipment Science of Machinery Industry Commission compiles the 25th~28 page of " insulating material communication " 1987 the 4th phase and has reported that Hunan Xiangtan Electrical Machinery Plant 5 builds " application of the general solvent-free paint of 114-4BF level " newly write, the 3rd national insulating material and insulation technology seminar collection of thesis are numbered 068 paper and have been reported Hengyang Insulating Material General Factory, Hunan prov., strain state electric locomotive factory: " the 114-4F grade low-temp solidifies the development and the application of solvent-free paint ", disclose with the xylene formaldehyde resin modified unsaturated polyester resin, Resins, epoxy, dry vegetable oil, the butanol etherification Cresol Formaldehyde Resin, vinylbenzene and superoxide are the general solvent-free paint of 114-4BF level of feedstock production, and they also exist production complicated, the cost height, curing speed waits shortcoming slowly.
Purpose of the present invention aims to provide BF grade universal epoxy-polyester resins without solvent dipping that a kind of composition comprises novel solidifying agent, and it can improve resistance toheat, curing speed and the scope of application of resin effectively.
Content of the present invention is: adopting bisphenol A type epoxy resin, tung oil acid anhydride phenyl maleimide, metaphenylene unsaturated polyester resin, butylated phenolic resin, reactive thinner, peroxide initiator, stopper is feedstock production BF grade universal epoxy-polyester resins without solvent dipping, and its composition (weight) comprising:
(1) 100 part of bisphenol A type epoxy resin,
(2) 150~270 parts of tung oil acid anhydride phenyl maleimides,
(3) 125~225 parts of metaphenylene unsaturated polyester resins,
(4) 125~225 parts of butylated phenolic resins,
(5) 167~275 portions of reactive thinners,
(6) 2.0~3.3 parts of peroxide initiators,
(7) 0.3~0.4 parts of stoppers.
In the content of the present invention, bisphenol A type epoxy resin can be E-44 Resins, epoxy or E-51 Resins, epoxy; The peroxide initiator is a dicumyl peroxide, also can be benzoyl peroxide or peroxidized t-butyl perbenzoate; Reactive thinner is a vinylbenzene, also can be Phthalic acid, diallyl ester (DAP) or alpha-methyl styrene; Stopper is a Resorcinol, also can be right-tert-butyl catechol.
In the content of the present invention, metaphenylene unsaturated polyester resin is by preparations such as m-phthalic acid, MALEIC ANHYDRIDE, dibasic alcohol, vinylbenzene, and its preferable consumption is 160~190 parts (weight); Butylated phenolic resin is the butanol etherification Cresol Formaldehyde Resin, that is 284 resol, and it is by cresols, formaldehyde, butanols preparation, and its preferable consumption is 160~190 parts (weight).
Solidifying agent in the content of the present invention-tung oil acid anhydride phenyl maleimide, preferable consumption (weight) is 170~250 parts, its method for making has been done to be described in detail in application number is 89105938.5 application for a patent for invention.It is to be the raw material one-step synthesis with tung oil, MALEIC ANHYDRIDE and aniline, preparation process is that react 100 parts of (weight) tung oil, 20~40 parts of MALEIC ANHYDRIDE 0.5~4 hour at 90~180 ℃ (1), (2) 5~20 parts of aniline are being added below 100 ℃, add 20~250 milliliters of organic solvents such as benzene, toluene or dimethylbenzene simultaneously, 100~200 ℃ of reactions 0.5~5 hour, (3) be evacuated to aneroid and flow out, promptly obtain the tung oil acid anhydride phenyl maleimide.
The present invention forms (weight) preferably: (1) 100 part of bisphenol A type epoxy resin, (2) 170~250 parts of tung oil acid anhydride phenyl maleimides, (3) 160~190 parts of metaphenylene unsaturated polyester resins, (4) 160~190 parts of butylated phenolic resins, (5) 215~230 portions of reactive thinners, (6) 2.3~3.1 parts of peroxide initiators, (7) 0.3~0.4 parts of stoppers.
Below in conjunction with embodiment the present invention is further described in detail:
Embodiment 1: with 100 parts of (weight) E-44 Resins, epoxy, 125 parts of metaphenylene unsaturated polyester resins, 150 parts of tung oil acid anhydride phenyl maleimides, stirred 1 hour at 55 ℃, add 167 parts of vinylbenzene at 30 ℃, 0.3 part Resorcinol, 2.0 parts of dicumyl peroxides, at room temperature stir 0.5h, add 125 part of 284 resol then, stirred 1~1.5 hour, and obtained the general resins without solvent dipping of BF level, its performance sees Table 1.
Embodiment 2: with 100 parts of (weight) E-44 Resins, epoxy, 175 parts of metaphenylene unsaturated polyester resins, 210 parts of tung oil acid anhydride phenyl maleimides, stirred 1 hour at 55 ℃, add 220 parts of vinylbenzene, 0.3 part of Resorcinol, 2.6 parts of dicumyl peroxides at 30 ℃, at room temperature stirred 0.5 hour, add 175 part of 284 resol, stirred 1~1.5 hour, obtain the general resins without solvent dipping of BF level, its performance sees Table 1.
Embodiment 3: with 100 parts of (weight) E-44 Resins, epoxy, 225 parts of metaphenylene unsaturated polyester resins, 270 parts of tung oil acid anhydride phenyl maleimides, stirred 1 hour at 55 ℃, add 275 parts of vinylbenzene, 0.4 part of Resorcinol, 3.3 parts of dicumyl peroxides at 30 ℃, at room temperature stirred 0.5 hour, add 225 part of 284 resol, stirred 1~1.5 hour, and obtained the general resins without solvent dipping of BF level, its performance sees Table 1.
Comparative Examples 1: with 100 parts of (weight) E-44 Resins, epoxy, 100 part of 304 unsaturated polyester resin, 150 parts of ketone oil anhydrides, stirred 1 hour at 55 ℃, add 227 parts of vinylbenzene, 0.3 part of Resorcinol, 2.3 parts of benzoyl peroxides at 30 ℃, at room temperature stirred 0.5 hour, add 179 part of 284 resol, stirred 1~1.5 hour, and obtained B level epoxy solvent-free paint, its performance sees Table 1.
Comparative Examples 2: with 100 parts of (weight) E-44 Resins, epoxy, 175 parts of metaphenylene unsaturated polyester resins, 210 parts of maleimide tung oil acid anhydrides, stirred 1 hour at 55 ℃, add 220 parts of vinylbenzene, 0.3 part of Resorcinol, 2.6 parts of dicumyl peroxides at 30 ℃, stirred 0.5 hour, add 175 part of 284 resol, stirred 1~1.5 hour, and obtained bismaleimides-Resins, epoxy F level solvent-free paint, its performance sees Table 1.
From as can be known above-mentioned, the present invention compares has technology to have following features mutually:
1, the B level epoxy solvent-free paint that make curing agent with tung oil acid anhydride, adds 304 unsaturated polyester resins is compared, and temperature classification improves, and is increased to the F level by the B level, and solidification temperature reduces, and curing rate improves, and the scope of application is wide, expands as the BF level by the B level, the adhesion strength height.
2, compare with maleimide amine-epoxy F level solvent-free paint, production technology is simple, cost, bin stability improve.
3, compare with the general solvent-free paint of 114-4BF level, production technology is simple, and curing rate improves.
Claims (7)
1, a kind of resins without solvent dipping is characterized in that forming (weight) and comprising:
(1) 100 part of bisphenol A type epoxy resin,
(2) 150~270 parts of tung oil acid anhydride phenyl maleimides,
(3) 125~225 parts of metaphenylene ring filling vibrin,
(4) 125~225 parts of butylated phenolic resins,
(5) 167~275 portions of reactive thinners,
(6) 2.0~3.3 parts of peroxide initiators,
(7) 0.3~0.4 parts of stoppers.
2,, it is characterized in that bisphenol A type epoxy resin is E-44 Resins, epoxy or E-51 Resins, epoxy according to the described resins without solvent dipping of claim 1.
3,, it is characterized in that reactive thinner is vinylbenzene, alpha-methyl styrene or Phthalic acid, diallyl ester according to claim 1 or 2 described resins without solvent dipping.
4,, it is characterized in that the peroxide initiator is dicumyl peroxide, benzoyl peroxide or peroxidized t-butyl perbenzoate according to the described resins without solvent dipping of claim 3.
5,, it is characterized in that stopper is Resorcinol or right-tert-butyl catechol according to the described resins without solvent dipping of claim 4.
6,, it is characterized in that the preferable consumption (weight) of tung oil acid anhydride phenyl maleimide is 170~250 parts according to the described resins without solvent dipping of claim 1.
7,, it is characterized in that the preferable consumption (weight) of tung oil acid anhydride phenyl maleimide is 170~250 parts according to the described resins without solvent dipping of claim 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 89105944 CN1022419C (en) | 1989-08-16 | 1989-08-16 | Resins without solvent dipping |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 89105944 CN1022419C (en) | 1989-08-16 | 1989-08-16 | Resins without solvent dipping |
Publications (2)
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CN1040383A CN1040383A (en) | 1990-03-14 |
CN1022419C true CN1022419C (en) | 1993-10-13 |
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CN 89105944 Expired - Fee Related CN1022419C (en) | 1989-08-16 | 1989-08-16 | Resins without solvent dipping |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100375764C (en) * | 2005-03-02 | 2008-03-19 | 上海电气集团上海电机厂有限公司 | Process for preparing impregnating resin for electrical purposes |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100420715C (en) * | 2006-05-12 | 2008-09-24 | 吴江市太湖绝缘材料厂 | Solvent-free impregnating resin for vacuum pressure impregnation of high-voltage motor |
CN100453578C (en) * | 2006-05-12 | 2009-01-21 | 吴江市太湖绝缘材料厂 | Solvent-free impregnating insulating paint |
CN100560670C (en) * | 2007-10-22 | 2009-11-18 | 苏州巨峰绝缘材料有限公司 | B. F-grade general epoxy less-solvent insulating impregnating varnish and preparation method thereof |
CN101805533B (en) * | 2010-05-11 | 2012-05-02 | 陕西宏业机电化工有限公司 | Heat-resistance energy-saving environment-protection epoxy solvent-free paint and production method thereof |
EP2763142A1 (en) * | 2013-02-04 | 2014-08-06 | Siemens Aktiengesellschaft | Impregnating resin for an electrical insulation body, electrical insulation body and method for producing the electrical insulation body |
CN103483555B (en) * | 2013-09-28 | 2016-01-20 | 上海飞域实验室设备有限公司 | The interpolymer of a kind of epoxy resin and unsaturated polyester and application thereof |
CN109265947A (en) * | 2018-08-14 | 2019-01-25 | 安徽汇创新材料有限公司 | A kind of glass toughening manure pit sizing material and preparation method thereof |
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1989
- 1989-08-16 CN CN 89105944 patent/CN1022419C/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100375764C (en) * | 2005-03-02 | 2008-03-19 | 上海电气集团上海电机厂有限公司 | Process for preparing impregnating resin for electrical purposes |
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CN1040383A (en) | 1990-03-14 |
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Address after: Sichuan city of Mianyang province mianzhou Road No. 177 Applicant after: Eastern insulating material plant Address before: No. 42, Mian Sui Road, Mianyang, Sichuan Applicant before: Eastern insulating material plant |
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