CN104014937B - Tac膜分切机的分切装置 - Google Patents
Tac膜分切机的分切装置 Download PDFInfo
- Publication number
- CN104014937B CN104014937B CN201410225436.0A CN201410225436A CN104014937B CN 104014937 B CN104014937 B CN 104014937B CN 201410225436 A CN201410225436 A CN 201410225436A CN 104014937 B CN104014937 B CN 104014937B
- Authority
- CN
- China
- Prior art keywords
- laser
- cut piece
- groups
- smoking
- tac film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 239000000779 smoke Substances 0.000 claims abstract description 12
- 230000000391 smoking effect Effects 0.000 claims description 37
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 abstract description 9
- 239000003546 flue gas Substances 0.000 abstract description 9
- 239000000843 powder Substances 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000003517 fume Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410225436.0A CN104014937B (zh) | 2014-05-27 | 2014-05-27 | Tac膜分切机的分切装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410225436.0A CN104014937B (zh) | 2014-05-27 | 2014-05-27 | Tac膜分切机的分切装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104014937A CN104014937A (zh) | 2014-09-03 |
CN104014937B true CN104014937B (zh) | 2015-11-25 |
Family
ID=51432091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410225436.0A Active CN104014937B (zh) | 2014-05-27 | 2014-05-27 | Tac膜分切机的分切装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104014937B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2220917Y (zh) * | 1995-06-23 | 1996-02-28 | 保定中产新型塑料包装材料有限公司 | 切割塑料薄膜用激光装置 |
CN2675321Y (zh) * | 2004-02-06 | 2005-02-02 | 郑州华翔电子有限公司 | 金属化有机薄膜激光分切机 |
CN1579013A (zh) * | 2001-10-31 | 2005-02-09 | 三星钻石工业股份有限公司 | 在半导体晶片上形成划线的方法以及用以形成这种划线的设备 |
CN203830917U (zh) * | 2014-05-27 | 2014-09-17 | 瑞安市视尚光学眼镜科技有限公司 | Tac膜分切机的分切装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3806743B2 (ja) * | 1996-04-10 | 2006-08-09 | 大日本印刷株式会社 | フィルム加工装置 |
JP2001179474A (ja) * | 1999-12-27 | 2001-07-03 | Dainippon Printing Co Ltd | 開封用切目線の形成方法 |
-
2014
- 2014-05-27 CN CN201410225436.0A patent/CN104014937B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2220917Y (zh) * | 1995-06-23 | 1996-02-28 | 保定中产新型塑料包装材料有限公司 | 切割塑料薄膜用激光装置 |
CN1579013A (zh) * | 2001-10-31 | 2005-02-09 | 三星钻石工业股份有限公司 | 在半导体晶片上形成划线的方法以及用以形成这种划线的设备 |
CN2675321Y (zh) * | 2004-02-06 | 2005-02-02 | 郑州华翔电子有限公司 | 金属化有机薄膜激光分切机 |
CN203830917U (zh) * | 2014-05-27 | 2014-09-17 | 瑞安市视尚光学眼镜科技有限公司 | Tac膜分切机的分切装置 |
Also Published As
Publication number | Publication date |
---|---|
CN104014937A (zh) | 2014-09-03 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Slitting device of TAC film slitting machine Effective date of registration: 20220818 Granted publication date: 20151125 Pledgee: Zhejiang Ruian Rural Commercial Bank Co.,Ltd. Plaza Science and Technology Branch Pledgor: RUIAN SHISHANG OPTICAL GLASSES TECHNOLOGY CO.,LTD. Registration number: Y2022500000060 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231226 Granted publication date: 20151125 Pledgee: Zhejiang Ruian Rural Commercial Bank Co.,Ltd. Plaza Science and Technology Branch Pledgor: RUIAN SHISHANG OPTICAL GLASSES TECHNOLOGY CO.,LTD. Registration number: Y2022500000060 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: The slitting device of TAC film slitting machine Effective date of registration: 20240102 Granted publication date: 20151125 Pledgee: Zhejiang Ruian Rural Commercial Bank Co.,Ltd. Plaza Science and Technology Branch Pledgor: RUIAN SHISHANG OPTICAL GLASSES TECHNOLOGY CO.,LTD. Registration number: Y2023980075064 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |