CN103974529A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN103974529A CN103974529A CN201310035613.4A CN201310035613A CN103974529A CN 103974529 A CN103974529 A CN 103974529A CN 201310035613 A CN201310035613 A CN 201310035613A CN 103974529 A CN103974529 A CN 103974529A
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- electronic component
- pcb
- test point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structure Of Printed Boards (AREA)
Abstract
A printed circuit board comprises a signal layer, a power supply layer and a grounding layer. The signal layer is provided with a first electronic element and a second electronic element. The first electronic element is connected to the second electronic element through a plurality of guide wires arranged on the signal layer for signal transmission, each guide wire is provided with a testing point, and a layer of welding resistance paint is printed on the top of the signal layer and covers the guide wires and the testing points; when the printed circuit board is in failure and is maintained as required, after the specific position of the testing point to be tested is found, the welding resistance paint on the testing point is scraped to expose the testing point, and a probe of a testing instrument is connected to the testing point to acquire the signal to be tested. A failure testing connector arranged on the printed circuit board can be omitted, and space of the printed circuit board is saved.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB).
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) be that electronics arranges one of inner indispensable parts, on it, be distributed with the multiple electronic components relevant to device running such as semiconductor integrated circuit chip, above-mentioned electronic component forms certain application circuit by the wiring on printed circuit board (PCB), thereby makes electronic installation be able to normal operation.Fault detect connector is set conventionally on printed circuit board (PCB) can printed circuit board (PCB) be detected to obtain guilty culprit in the time that printed circuit board (PCB) breaks down, but the detecting fault connector being arranged on printed circuit board (PCB) takes up room.
Summary of the invention
In view of this, be necessary to provide a kind of printed circuit board (PCB), test point be set on described printed circuit board (PCB) and save printed circuit board space to replace existing fault detect connector.
A kind of printed circuit board (PCB), comprise a signals layer, one bus plane and a ground plane, on described signals layer, be provided with the first electronic component and the second electronic component, described the first electronic component is connected with signal transmission with described the second electronic component by the some wires that are arranged on described signals layer, one test point is set respectively on each wire, the end face of described signals layer is printed with one deck welding resistance paint, described welding resistance paint covers described some wires and described test point, when described printed circuit board (PCB) breaks down need to detect time, find the welding resistance paint scraping off after the particular location of test point that needs to detect in described test point so that described test point is come out, the probe of tester is connected to the signal that described test point detects to obtain needs.
Described printed circuit board (PCB) is saved printed circuit board space by test point is set on the wire on signals layer to replace existing fault detect connector, in the time that described printed circuit board (PCB) breaks down, can connect the signal that described test point obtains wire transmission by tester and whether conform with the regulations, and then obtain the fault of described printed circuit board (PCB).
Brief description of the drawings
Fig. 1 is the schematic diagram of the preferred embodiments of printed circuit board (PCB) of the present invention.
Fig. 2 is the cutaway view of printed circuit board (PCB) in Fig. 1.
Main element symbol description
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Please refer to Fig. 1 and Fig. 2, printed circuit board (PCB) 100 of the present invention comprises a signals layer 10, a bus plane 20 and a ground plane 30.Between described signals layer 10 and described bus plane 20, be filled with dielectric, between described bus plane 20 and described ground plane 30, be filled with dielectric.
On described signals layer 10, be provided with the first electronic component 8(as central processing unit) and the second electronic component 5(as South Bridge chip), described the first electronic component 8 is connected with described bus plane 20 by two via holes 81 and 82, and described the second electronic component 5 is connected with described bus plane 20 by two via holes 51 and 52.Described the first electronic component 8 is connected with signal transmission with described the second electronic component 5 by the some wires (being 3 wires 11,12 and 13 in present embodiment) that are arranged on described signals layer 10.One test point 1,2 and 3 is set respectively on described wire 11,12 and 13.Described test point 1,2 and 3 can be arranged on any position on described wire 11,12 and 13 as required, and it is not connected with described bus plane 20 and described ground plane 30.The end face of described signals layer 10 is printed with one deck welding resistance paint 40, described welding resistance paint 40 covers described wire 11,12 and 13 and described test point 1,2 and 3, is used for preventing from being arranged on wire 11,12 and 13 on described signals layer 10 and described test point 1,2 and 3 outside exposed and cause described printed circuit board (PCB) 100 short circuits.
Described bus plane 20 provides operating current by connecting described via hole 81 and 82 for described the first electronic component 8, described bus plane 20 also provides operating current by connecting described via hole 51 and 52 for described the second electronic component 5, so that described first and second electronic component 8 and 5 is normally worked.
When described printed circuit board (PCB) 100 breaks down need to detect time, assumed fault is to be caused by the signal transmission of described first and second electronic component 8 and 5, first tester finds corresponding test point as test point 2, scrape again welding resistance paint 40 in described test point 2 off so that described test point 2 is come out, the probe of tester is connected to the signal that described test point 2 is transmitted to obtain described wire 12, tester can learn by described tester whether the signal that described wire 12 transmits meets specification, and then can obtain the fault of described printed circuit board (PCB) 100.
Described printed circuit board (PCB) 100 is by arranging test point 1,2 and 3 on the wire 11,12 and 13 on signals layer 10, without fault detect connector is set on printed circuit board (PCB), save the space of printed circuit board (PCB), in the time that described printed circuit board (PCB) 100 breaks down, can connect the signal that described test point obtains wire transmission by tester and whether conform with the regulations, and then obtain the fault of described printed circuit board (PCB) 100.
Claims (3)
1. a printed circuit board (PCB), comprise a signals layer, one bus plane and a ground plane, on described signals layer, be provided with the first electronic component and the second electronic component, described the first electronic component is connected with signal transmission with described the second electronic component by the some wires that are arranged on described signals layer, one test point is set respectively on each wire, the end face of described signals layer is printed with one deck welding resistance paint, described welding resistance paint covers described some wires and described test point, when described printed circuit board (PCB) breaks down need to detect time, find the welding resistance paint scraping off after the particular location of test point that needs to detect in described test point so that described test point is come out, the probe of tester is connected to the signal that described test point detects to obtain needs.
2. printed circuit board (PCB) as claimed in claim 1, is characterized in that: between described signals layer and described bus plane, be filled with dielectric, between described bus plane and described ground plane, be filled with dielectric.
3. printed circuit board (PCB) as claimed in claim 1, it is characterized in that: described the first electronic component is connected with described bus plane by two via holes, described the second electronic component is connected with described bus plane by two via holes, two via holes of described bus plane by connecting described the first electronic component provide operating current for described the first electronic component, and described bus plane also two via holes by connecting described the second electronic component provides operating current for described the second electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310035613.4A CN103974529A (en) | 2013-01-30 | 2013-01-30 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310035613.4A CN103974529A (en) | 2013-01-30 | 2013-01-30 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103974529A true CN103974529A (en) | 2014-08-06 |
Family
ID=51243411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310035613.4A Pending CN103974529A (en) | 2013-01-30 | 2013-01-30 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103974529A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113516947A (en) * | 2021-04-22 | 2021-10-19 | 武汉天马微电子有限公司 | Display panel and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2620459Y (en) * | 2003-05-21 | 2004-06-09 | 山东新华医疗器械股份有限公司 | Jointing lengthening device of printed circuit board with switch |
| US20080250377A1 (en) * | 2007-04-04 | 2008-10-09 | Bird Steven C | Conductive dome probes for measuring system level multi-ghz signals |
| CN101682989A (en) * | 2007-03-10 | 2010-03-24 | 新美亚通讯设备有限公司 | Embedded capacitive stack |
| CN101677486A (en) * | 2008-09-19 | 2010-03-24 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board and manufacturing method thereof |
-
2013
- 2013-01-30 CN CN201310035613.4A patent/CN103974529A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2620459Y (en) * | 2003-05-21 | 2004-06-09 | 山东新华医疗器械股份有限公司 | Jointing lengthening device of printed circuit board with switch |
| CN101682989A (en) * | 2007-03-10 | 2010-03-24 | 新美亚通讯设备有限公司 | Embedded capacitive stack |
| US20080250377A1 (en) * | 2007-04-04 | 2008-10-09 | Bird Steven C | Conductive dome probes for measuring system level multi-ghz signals |
| CN101677486A (en) * | 2008-09-19 | 2010-03-24 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 李攀峰: "《数控机床维修工必备手册》", 30 June 2011, 北京：机械工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113516947A (en) * | 2021-04-22 | 2021-10-19 | 武汉天马微电子有限公司 | Display panel and display device |
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Legal Events
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140806 |