CN103972356A - LED package structure and manufacturing method thereof - Google Patents
LED package structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN103972356A CN103972356A CN201310037525.8A CN201310037525A CN103972356A CN 103972356 A CN103972356 A CN 103972356A CN 201310037525 A CN201310037525 A CN 201310037525A CN 103972356 A CN103972356 A CN 103972356A
- Authority
- CN
- China
- Prior art keywords
- substrate
- lens
- emitting diode
- light
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 238000000034 method Methods 0.000 claims abstract description 27
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A manufacturing method of an LED package structure includes the steps of providing an LED chip; setting the LED chip in a lens forming mold; forming a lens by injection molding; integrating the LED chip and the lens; providing a substrate with surface electrode structure; fixing the lens and the LED chip on the substrate; electrically connecting the LED chip on the lens and the surface electrode structure. The process of the manufacturing method is simple. The invention further provides the LED package structure.
Description
Technical field
The present invention relates to a kind of package structure for LED and manufacture method thereof.
Background technology
Light-emitting diode (Light Emitting Diode, LED) be a kind of semiconductor element that current conversion can be become to the light of particular range of wavelengths, rely on the advantages such as its luminous efficiency is high, volume is little, lightweight, environmental protection, be widely applied in the middle of current every field.In order to utilize better light-emitting diode, around light-emitting diode, can be coated a lens on light and carry out secondary optics correction.
Industry, in the time of encapsulation LED, is normally first fixed on light-emitting diode chip for backlight unit on PCB substrate, and then ejection formation lens, and the lens after moulding are fixed on PCB substrate.But step is relatively loaded down with trivial details like this, cannot improving yield.
Summary of the invention
In view of this, be necessary to provide the simple package structure for LED of a kind of processing procedure and manufacture method thereof.
A manufacture method for package structure for LED, it comprises following step:
One light-emitting diode chip for backlight unit is provided;
This light-emitting diode chip for backlight unit is arranged in the mould of lens, then ejection formation lens, make light-emitting diode chip for backlight unit be combined with lens one;
Provide a surface to there is the substrate of electrode structure;
Lens are fixed on this substrate together with light-emitting diode chip for backlight unit, make the light-emitting diode chip for backlight unit on lens form and be electrically connected with electrode structure simultaneously.
A kind of package structure for LED, it is made up of above-mentioned manufacture method.
In above-mentioned package structure for LED and manufacture method thereof, light-emitting diode chip for backlight unit is to be placed in the mould of lens, in molded lens, directly light-emitting diode chip for backlight unit is combined with lens one, therefore only the lens after moulding need to be fixed on substrate, can be fixed on substrate together with light-emitting diode chip for backlight unit, thereby complete the encapsulation of whole light-emitting diode, be compared to light-emitting diode chip for backlight unit in conventional art and lens and be taken up in order of priority the method being fixed, the step of the manufacture method of package structure for LED of the present invention is less, processing procedure is simpler.
Brief description of the drawings
Fig. 1 is the sectional view of the package structure for LED in embodiment of the present invention.
Fig. 2 to Fig. 4 is the each step schematic diagram representing in the manufacture method of the package structure for LED in embodiment of the present invention.
Main element symbol description
| Package structure for LED | 100 |
| Substrate | 10 |
| Light-emitting diode chip for backlight unit | 20 |
| Lens | 30 |
| Electrode structure | 40 |
| Upper surface | 11 |
| Lower surface | 12 |
| Groove | 13 |
| Optics portion | 31 |
| Support portion | 32 |
| Bottom surface | 311 |
| End face | 312 |
| Side | 313 |
| Holding section | 314 |
| The first electrode | 41 |
| The second electrode | 42 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Refer to Fig. 1, the manufacture method of a kind of package structure for LED that embodiment of the present invention provides is for the manufacture of package structure for LED 100, and this package structure for LED 100 comprises substrate 10, is arranged on light-emitting diode chip for backlight unit 20 and lens 30 on substrate 10.
Described substrate 10 is rectangular-shaped, and it comprises a upper surface 11 and the lower surface 12 relative with this upper surface 11.The upper surface 11 of substrate 10 is provided with electrode structure 40, and this electrode structure 40 comprises the first electrode 41 and second electrode 42 of space.This first electrode 41 and the second electrode 42 are to be arranged in substrate 10, and its upper surface flushes with the upper surface 11 of substrate 10.The relative both sides that are positioned at electrode structure 40 on described substrate 10 are also offered respectively and are formed with groove 13.In the present embodiment, described substrate 10 can be printed circuit board (PCB), metal substrate, silicon substrate or ceramic substrate etc.
Described lens 30 comprise an optics portion 31 and two support portions 32 that these optics portion 31 bottoms protrude out certainly downwards.It is one hemispherical that this optics portion 31 is roughly, the side 313 that it comprises a bottom surface 311, an end face 312 and connects this bottom surface 311 and end face 312.This bottom surface 311 is a plane, wherein the mind-set outstanding holding section 314 that forms outward.Described end face 312 is that one day is away from the outstanding arc surface of substrate 10.Described two support portions 32 are respectively formed at the periphery of bottom surface 311, and corresponding with the groove 13 of substrate 10, for being embedded in groove 13.The diameter of this support portion 32 is greater than the diameter of the groove 13 of substrate 10 slightly, thereby makes to form tight fit between support portion 32 and groove 13, and lens 30 are firmly fixed on substrate 10.
Described light-emitting diode chip for backlight unit 20 is combined with lens 30 one, in its chimeric holding section 314 of being fixed on lens 30 bottom surfaces 311, and the optical axis coincidence of its central shaft and lens 30.The bottom surface of described light-emitting diode chip for backlight unit 20 flushes with the bottom surface of the holding section 314 of lens 30, and exposes from the bottom surface of this holding section 314.The length of described support portion 32 is greater than the degree of depth of the groove 13 of substrate 10, thereby in the time that support portion 32 is embedded in groove 13 completely, between the bottom surface of the holding section 314 of lens 30 and the upper surface 11 of substrate 10, forms hole.Space mid point between the electrode structure 40 of the bottom surface of described light-emitting diode chip for backlight unit 20 and substrate 10 has scolding tin or conducting resinl, makes light-emitting diode chip for backlight unit 20 be contacted and be formed electrical connection by scolding tin or conducting resinl with the electrode structure 40 on substrate 10.
Be understandable that, the bottom surface 311 of described lens 30 also can not form holding section 314, the chimeric 311 center, bottom surface of being fixed on lens 30 of described light-emitting diode chip for backlight unit 20, and its bottom surface flushes with the bottom surface 311 of lens 30.In addition, the length of described support portion 32 also can just in time equal the degree of depth of the groove 13 of substrate 10, now in the time that support portion 32 is embedded in groove 13 completely, the bottom surface of light-emitting diode chip for backlight unit 20 directly contacts and realizes electrical connection with the electrode structure 40 on substrate 10, thereby does not need a scolding tin or conducting resinl.
Please then consult Fig. 2 to Fig. 4, the manufacture method of a kind of package structure for LED that embodiment of the present invention provides comprises following step:
Step 1, provides a light-emitting diode chip for backlight unit 20.
Step 2, is arranged at this light-emitting diode chip for backlight unit 20 in the mould of lens 30, and then ejection formation lens 30 make light-emitting diode chip for backlight unit 20 be combined with lens 30 one.In the present embodiment, the lens 30 after moulding comprise an optics portion 31 and two support portions 32 that these optics portion 31 bottom peripheral edge protrude out certainly downwards.This optics portion 31 comprises a bottom surface 311, an end face 312 and connects the side 313 of this bottom surface 311 and end face 312.This bottom surface 311 is a plane, wherein the mind-set outstanding holding section 314 that forms outward.Described end face 312 is that one day is away from the outstanding arc surface of substrate 10.Described light-emitting diode chip for backlight unit 20 one are incorporated in the holding section 314 of lens 30, and expose from the bottom surface of the holding section 314 of lens 30 its bottom surface.
Step 3, provides a substrate 10, and these substrate 10 surfaces have electrode structure 40.In the present embodiment, described substrate 10 comprises a upper surface 11 and the lower surface 12 relative with this upper surface 11.Electrode structure 40 is formed on the upper surface 11 of substrate 10, and it comprises the first electrode 41 and second electrode 42 of space.The relative both sides that are positioned at electrode structure 40 on described substrate 10 are also offered respectively and are formed with the groove corresponding with the support portion 32 of lens 30 13.
Step 4, is fixed on lens 30 on this substrate 10 together with light-emitting diode chip for backlight unit 20, makes the light-emitting diode chip for backlight unit 20 on lens 30 form and be electrically connected with the electrode structure 40 on substrate 10 simultaneously, thereby forms package structure for LED 100.In the present embodiment, the support portion 32 of described lens 30 is embedded in substrate 10 grooves 13, thereby lens 30 are fixed on substrate 10.Before lens 30 being fixed on this substrate 10, on the electrode structure 40 of substrate 10, put in advance scolding tin or conducting resinl, when thereby the support portion 32 of lens 30 is embedded in substrate 10 grooves 13 completely, light-emitting diode chip for backlight unit 20 is contacted and is formed electrical connection by scolding tin or conducting resinl with the electrode structure 40 on substrate 10.
In the present embodiment, lens 30 are embedded in groove 13 and are fixed on substrate 10 by support portion 32, are understandable that, described lens 30 also can not form support portion 32, but are fixed on substrate 10 by fixing glue.
In the manufacture method of package structure for LED of the present invention, light-emitting diode chip for backlight unit 20 is to be placed in the mould of lens 30, in molded lens 30, directly light-emitting diode chip for backlight unit 20 is combined with lens 30 one, therefore only the lens after moulding 30 need to be fixed on substrate 10, can be fixed on substrate 10 together with light-emitting diode chip for backlight unit 20, thereby complete the encapsulation of whole light-emitting diode, be compared to light-emitting diode chip for backlight unit in conventional art 20 and lens 30 and be taken up in order of priority the method being fixed, the step of the manufacture method of package structure for LED of the present invention is less, processing procedure is simpler.
Be understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (9)
1. a manufacture method for package structure for LED, it comprises following step:
One light-emitting diode chip for backlight unit is provided;
This light-emitting diode chip for backlight unit is arranged in the mould of lens, then ejection formation lens, make light-emitting diode chip for backlight unit be combined with lens one;
Provide a surface to there is the substrate of electrode structure;
Lens are fixed on this substrate together with light-emitting diode chip for backlight unit, make the light-emitting diode chip for backlight unit on lens form and be electrically connected with electrode structure simultaneously.
2. the manufacture method of package structure for LED as claimed in claim 1, it is characterized in that: before lens are fixed on substrate together with light-emitting diode chip for backlight unit, scolding tin or conducting resinl on putting on the electrode structure of substrate in advance, while making lens be fixed on substrate, light-emitting diode chip for backlight unit is contacted and is formed electrical connection by scolding tin or conducting resinl with electrode structure.
3. the manufacture method of package structure for LED as claimed in claim 1, it is characterized in that: in the time that lens are fixed on substrate together with light-emitting diode chip for backlight unit, this light-emitting diode chip for backlight unit directly contacts with the electrode structure on substrate and forms electrical connection.
4. the manufacture method of package structure for LED as claimed in claim 1, it is characterized in that: the lens after moulding comprise an optics portion and the support portion that this optics portion bottom peripheral edge protrudes out certainly downwards, described light-emitting diode chip for backlight unit one is incorporated into the bottom centre of this optics portion, and expose from the bottom of this optics portion its bottom surface.
5. the manufacture method of package structure for LED as claimed in claim 4, it is characterized in that: described substrate comprises upper surface and the lower surface relative with this upper surface, electrode structure is formed on the upper surface of substrate, the relative both sides that are positioned at electrode structure on described substrate are also offered respectively and are formed with the groove corresponding with the support portion of lens, and described lens are embedded in by support portion in the groove of substrate and are fixed on substrate.
6. the manufacture method of package structure for LED as claimed in claim 5, it is characterized in that: described electrode structure comprises the first electrode and second electrode of space, this first electrode and the second electrode are to be arranged in substrate, and the upper surface flush of its upper surface and substrate.
7. the manufacture method of package structure for LED as claimed in claim 1, is characterized in that: described lens are fixed on substrate by fixing glue.
8. the manufacture method of package structure for LED as claimed in claim 1, is characterized in that: the optical axis of described lens overlaps with the central shaft of described light-emitting diode chip for backlight unit.
9. a package structure for LED, is characterized in that: described package structure for LED is made up of the manufacture method described in claim 1 to 8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310037525.8A CN103972356A (en) | 2013-01-31 | 2013-01-31 | LED package structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310037525.8A CN103972356A (en) | 2013-01-31 | 2013-01-31 | LED package structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103972356A true CN103972356A (en) | 2014-08-06 |
Family
ID=51241638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310037525.8A Pending CN103972356A (en) | 2013-01-31 | 2013-01-31 | LED package structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103972356A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098213A (en) * | 2019-05-15 | 2019-08-06 | 德淮半导体有限公司 | A kind of chip module method for packing and positioning |
| CN110660894A (en) * | 2019-11-08 | 2020-01-07 | 徐伟元 | Lens structure for LED packaging and LED packaging structure thereof |
-
2013
- 2013-01-31 CN CN201310037525.8A patent/CN103972356A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098213A (en) * | 2019-05-15 | 2019-08-06 | 德淮半导体有限公司 | A kind of chip module method for packing and positioning |
| CN110660894A (en) * | 2019-11-08 | 2020-01-07 | 徐伟元 | Lens structure for LED packaging and LED packaging structure thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140806 |