CN103969965A - Device for precisely controlling temperature of immersing liquid of immersed photoetching machine and temperature control method thereof - Google Patents
Device for precisely controlling temperature of immersing liquid of immersed photoetching machine and temperature control method thereof Download PDFInfo
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Abstract
The invention discloses a device for precisely controlling temperature of immersing liquid of an immersed photoetching machine. The device comprises a pressurization pump, a primary heat exchanger, a secondary heat exchanger and a flow servo valve, wherein an immersing liquid inlet of the primary heat exchanger is communicated with an outlet of the pressurization pump, and the immersing liquid is subjected to heat exchange in the primary heat exchanger so as to realize primary control on the temperature of the immersing liquid; an immersing liquid inlet of the secondary heat exchanger is communicated with an immersing liquid outlet of the primary heat exchanger, and the immersing liquid is subjected to heat exchange in the secondary heat exchanger so as to realize secondary control on the temperature of the immersing liquid; an inlet of the flow servo valve is communicated with the immersing liquid outlet of the primary heat exchanger; the flow servo valve is connected in parallel with the secondary heat exchanger and is used for adjusting the flow of the immersing liquid entering the secondary heat exchanger. The flow of coolants entering the primary heat exchanger and the secondary heat exchanger are cooperatively controlled, and the flow servo valve is used for adjusting the flow of the immersing liquid entering the secondary heat exchanger, so that two-stage control on the temperature of the immersing liquid can be realized, and the immersing liquid with stable and precise temperature is obtained and used for an immersed type photoetching technology.
Description
Technical field
The present invention relates to immersed photoetching machine, be specifically related to a kind of device and Temp. control method thereof of accurate control submersible photoetching apparatus soaking liquid temperature.
Background technology
In traditional photoetching technique, the medium between camera lens and photoresist is air, and immersion technology is to change air dielectric into liquid, light by liquid medium after optical source wavelength be shortened, according to following Rayleigh criterion:
Wherein, the photoetching resolution that R is optical lithography system, k
1for process factor, λ is exposure wavelength, and NA is numerical aperture, and from Rayleigh criterion, exposure wavelength shortens, and when process factor and numerical aperture are constant, R reduces, and photoetching resolution improves, and adopts immersion technology, can improve photoetching resolution.
In immersed photoetching machine, between last optical surface and silicon chip, soak and expired immersion liquid, the temperature variation of immersion liquid can cause the variation of refractive index and the viscosity of immersion liquid on the one hand, thereby cause the focal plane shift that exposes, cause the variation of numerical aperture NA value, and then make litho machine decrease resolution, on the other hand, immersion liquid temperature variation will cause silicon chip and projection objective temperature variation, cause optical imagery aberration, can further reduce the resolution of immersed photoetching machine.Therefore, controlling the temperature of immersion liquid and keeping its stability is the gordian technique that immersed photoetching machine need to solve, and in actual immersed photoetching machine, apparatus soaking liquid flow field requires immersion liquid accuracy of temperature control to reach 0.01 ℃ of +/-.
Application number is that 201020596742.2 Chinese patent discloses a kind of submergence and makes photoetching apparatus soaking liquid temperature control equipment, and it utilizes the method for thermoelectric cooling to reach the object of apparatus soaking liquid flow field temperature stabilization, and can measure in real time the temperature of immersion liquid.In actual conditions, immersed photoetching machine requires high to immersion liquid, need to adopt the ultrapure water of deionization and the body that degass, adopt the method for thermoelectric cooling to carry out the pollution control that dip temperature control is unfavorable for immersion liquid, and it adopts the method for a temperature adjusting to immersion liquid, the ability that lacks secondary temperature adjusting, its Temp. control method cannot make dip temperature accurate and stable.
Summary of the invention
Above defect or Improvement requirement for prior art, the invention provides a kind of device and Temp. control method thereof of accurate control submersible photoetching apparatus soaking liquid temperature, utilize heat exchange principle, adopt a plurality of heat exchangers and multistage servo flow control, can precise and stable control immersion liquid temperature, and pollution-free to immersion liquid.
For achieving the above object, device and the Temp. control method thereof of accurate control submersible photoetching apparatus soaking liquid temperature of the present invention, an aspect of technical solution of the present invention,
A device for accurate control submersible photoetching apparatus soaking liquid temperature, is characterized in that, comprising:
Supercharge pump, pending immersion liquid has after processing by this supercharge pump pumping after certain pressure with output;
Primary heat exchanger, its immersion liquid entrance is communicated with described supercharge pump outlet, and immersion liquid and refrigerant after described supercharge pump is processed output carry out heat interchange in this primary heat exchanger, to realize the elementary regulation and control of dip temperature;
Secondary heat exchanger, its immersion liquid entrance is communicated with described primary heat exchanger immersion liquid outlet, for refrigerant, the immersion liquid after this secondary heat exchange process is carried out to heat interchange again, so that dip temperature is adjusted again, realizes the secondary regulation and control of dip temperature;
Serving volume valve, its entrance is communicated with described primary heat exchanger immersion liquid outlet, its outlet is communicated with described secondary heat exchanger outlet, in parallel with described secondary heat exchanger to form, make the immersion liquid from described primary heat exchanger is processed can enter respectively secondary heat exchanger and serving volume valve, to regulate the immersion liquid flow that carries out heat interchange with refrigerant enter described secondary heat exchanger, realize the regulation and control to dip temperature;
By coordination, control the cold medium flux that enters described primary heat exchanger and secondary heat exchanger, and in conjunction with described serving volume valve to entering the adjusting of the immersion liquid flow of described secondary heat exchanger, can realize the two-stage regulation and control to dip temperature, thereby acquisition temperature stabilization and accurate immersion liquid are for immersion lithography process with filtered air.
Further, also comprise throttling valve, its entrance is communicated with described secondary heat exchanger immersion liquid outlet, and its outlet is communicated with described flow servo valve outlet port, so that the immersion liquid flow flowing out through described secondary heat exchanger is controlled.
Further, also comprise elementary serving volume valve, its entrance is communicated with refrigerant output terminal, its outlet is communicated with described primary heat exchanger refrigerant entrance, elementary serving volume valve to be to control flow into the cold medium flux of primary heat exchanger through self, thereby controls heat-exchange capacity and realize the elementary regulation and control of temperature.
Further, also comprise secondary serving volume valve, its entrance is communicated with described primary heat exchanger refrigerant exit, its outlet is communicated with the refrigerant entrance of described secondary heat exchanger, control from primary heat exchanger through self flowing into the cold medium flux of secondary heat exchanger, thereby control heat-exchange capacity and realize the secondary regulation and control of temperature.
Further, also comprise the first surplus valve, it is communicated with elementary serving volume valve entrance and refrigerant recovering end, to guarantee elementary serving volume valve intake pressure value; Also comprise the second surplus valve, it is communicated with secondary serving volume valve entrance and refrigerant recovering end, to guarantee the intake pressure value of secondary serving volume valve.
Further, the immersion liquid of flowing out through flow servo valve outlet port with from described immersion liquid of flowing out through throttling valve outlet, after converge in described throttling valve exit, enter respectively two minutes pipelines, part immersion liquid flows to immersion lithography process with filtered air from a minute pipeline, remaining immersion liquid flows to described supercharge pump entrance from another minute pipeline, again flow into two heat exchangers to form immersion liquid loop, thereby in assurance immersion liquid loop, temperature is stable.
Further, also comprise retaining valve, its outlet is communicated with described supercharge pump entrance, the used discarded immersion liquid of immersion lithography process with filtered air is after degasification impurity removal process, flow to described retaining valve entrance, through retaining valve and supercharge pump, again enter immersion liquid loop, to realize recycling of immersion liquid.
Further, also comprise secondary temperature sensor, be installed on immersion lithography process with filtered air entrance, for measuring, after described two-stage temperature adjusting, pass into the dip temperature of immersion lithography process with filtered air; Also comprise elementary temperature sensor, be arranged on the immersion liquid outlet of described primary heat exchanger, for measuring dip temperature after the elementary regulation and control of excess temperature, elementary temperature sensor and secondary temperature sensor are preferably precision temperature sensor; Also comprise flow sensor, described in being arranged on, to immersion lithography process with filtered air, provide on minute pipeline of immersion liquid, for guaranteeing to flow into the immersion liquid flow of immersion lithography process with filtered air.
Second aspect of technical solution of the present invention, a kind of device of applying accurate control immersed photoetching machine temperature, to carrying out the method for temperature control, is characterized in that,
The desired value of design temperature two-stage regulation and control, adopts the hand-reset factor to characterize the relation of two-stage goal of regulation and control value respectively, and temperature two-stage goal of regulation and control value adopts following formula to represent:
SV2＝SV1+MR
In formula, SV2 is the desired value of the secondary regulation and control of temperature, also the final goal temperature regulating and controlling, SV1 is the desired value of the elementary regulation and control of temperature, MR is the hand-reset factor, adopts the size of fuzzy logic adaptive method adjusting hand-reset factor M R, the target temperature of controlling for coordinating two-stage, thereby guarantee the reasonable that is related between the target temperature of two-stage regulation and control, and then guarantee the efficiency of the elementary regulation and control of temperature and the precision of the secondary regulation and control of temperature.
Further, adopt the membership function in described fuzzy logic adaptive method to calculate △ MR size, at the appointed time, in section, k the value of MR adopts following formula to calculate:
MR(k)＝MR(k-1)+ΔMR
In formula: MR (k) is k preset value of the hand-reset factor, Δ MR is that k preset value of the hand-reset factor is with respect to the increment of the preset value of k-1 the hand-reset factor, k=0,1,2...R, R is infinitely great, and the process of calculating MR (k) is completed by master controller cycle calculations;
The final goal temperature that the desired value SV2 of the secondary regulation and control of temperature also regulates and controls, adopts following formula to calculate:
SV2＝SV1(k)+MR(k)
In formula, SV1 (k) is k preset value of the elementary regulation and control of temperature, by continuous adjustment MR (k) and SV1 (k), realizes the desired value SV2 of the secondary regulation and control of temperature and the desired value SV1 relation of the elementary regulation and control of temperature is reasonable.
Further, the difference between the desired value SV1 of the elementary regulation and control of temperature and the actual temperature of the elementary regulation and control gained of described elementary temperature sensor measurement of take is feedback, the non-overshoot that adopts elementary regulation and control actual temperature to be not more than elementary goal of regulation and control value is controlled, thereby by regulating elementary serving volume valve valve port output quantity to control the cold medium flux that enters primary heat exchanger, realize the desired value SV1 that approaches fast elementary regulation and control of the elementary regulation and control that betide primary heat exchanger.
Further, the difference between the desired value of the secondary regulation and control of temperature and the actual temperature of the secondary temperature control gained of described secondary temperature sensor measurement of take is feedback, adopt stable PI to control secondary serving volume valve valve port output quantity, thereby by regulating secondary serving volume valve valve port output quantity to regulate the cold medium flux that enters secondary heat exchanger, realize the desired value SV2 that accurately approaches secondary regulation and control of the secondary regulation and control that betide secondary heat exchanger.
Further, adoption rate gain-limitation factor-alpha and integral time modifying factor β the refrigerant output quantity μ (t) passing through in elementary serving volume valve of t time (20) and secondary serving volume valve (21) is revised, in t time serving volume valve, output quantity μ (t) adopts following formula to calculate:
Wherein, the target temperature that r is temperature adjusting, y is system output, e is temperature deviation, K
pfor proportional gain, T
ifor integral time, α is proportional gain restriction factor, and β is modifying factor integral time;
By Z-N critical proportional band law, obtain proportional gain K
pwith T integral time
i, formula is,
K
p＝0.45K
u
T
i＝0.83T
d
In formula, K
ufor critical gain, T
dfor the critical concussion cycle;
Proportional gain restriction factor α and integral time modifying factor β calculating by following formula, complete:
In formula, the pure hysteresis τ of standard
b=τ/T, τ is retardation time, T is system time constant, K
ufor critical gain.
Technical solution of the present invention has the following advantages:
1. adopt heat exchanger to carry out heat exchange, stopped immersion liquid and too much the contacting of thermoelectric cooling apparatus in thermoelectric cooling, thereby avoided pollution;
2. adopt secondary attemperating unit and Temp. control method, guaranteed temperature controlled stable and accurate;
3. adopt the Temp. control method of non-overshoot, made temperature control regulate the time short, can obtain rapidly required technological temperature.
Accompanying drawing explanation
Fig. 1 accurately controls the schematic diagram of submersible photoetching apparatus soaking liquid temperature device in the embodiment of the present invention;
Fig. 2 accurately controls immersion liquid cyclic process schematic diagram in submersible photoetching apparatus soaking liquid temperature device in the embodiment of the present invention;
Fig. 3 be in the embodiment of the present invention hand-reset factor M R self-adaptation regulate in elementary serving volume valve valve port average output
the membership function adopting;
Fig. 4 be in the embodiment of the present invention hand-reset factor M R self-adaptation regulate in secondary serving volume valve valve port average output
the membership function adopting;
Fig. 5 is temperature control flow figure in the embodiment of the present invention;
Control effect exemplary plot for one that Fig. 6 is temperature-controlled process in the application embodiment of the present invention;
Fig. 7 is a departure exemplary plot of temperature-controlled process in the application embodiment of the present invention.
In institute's drawings attached, the technical characterictic of identical Reference numeral TYP, 10-immersion liquid loop head wherein, 11-immersed photoetching machine entrance, 12-refrigerant delivery outlet, 13-refrigerant recovering end, the elementary serving volume valve of 20-, 21-level serving volume valve, 22-serving volume valve, 23-primary heat exchanger, 24-secondary heat exchanger, 31-the first surplus valve, 32-the second surplus valve, 33-retaining valve, 34-supercharge pump, 35-throttling valve, 36-throttling valve, 40-temperature sensor, 41-pressure transducer, 42-level precision temperature sensor, 43-flow sensor, 44-pressure transducer, 45-temperature sensor, 46-temperature sensor, the elementary precision temperature sensor of 47-, 48-flow sensor, 49-temperature sensor, 50-temperature sensor, 60-degasification removal of impurity technique, 61-work stage, 62-silicon chip, 63-immersion liquid, 64-projection objective.
Embodiment
In order to make object, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with drawings and Examples, the embodiment of the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the embodiment of the present invention, is not intended to limit the present invention embodiment.In addition,, in each embodiment of the described embodiment of the present invention, involved technical characterictic just can not combine mutually as long as do not form each other conflict.
Fig. 1 accurately controls the schematic diagram of submersible photoetching apparatus soaking liquid temperature device in the embodiment of the present invention.Supercharge pump 34 outlets are communicated with primary heat exchanger 23 immersion liquid entrances, secondary heat exchanger 24 immersion liquid entrances are communicated with primary heat exchanger 23 immersion liquid outlets, serving volume valve 22 is communicated with primary heat exchanger 23 immersion liquid outlets and secondary heat exchanger 24 outlets, in parallel with secondary heat exchanger 24, after immersion liquid is processed by the pumping of supercharge pump 34, there is certain pressure to output in primary heat exchanger, in primary heat exchanger 23, carry out heat exchanger with refrigerant, temperature is regulated, realize the elementary regulation and control of dip temperature, rear entering respectively in secondary heat exchanger 24 and serving volume valve 22, the immersion liquid and the refrigerant that enter secondary heat exchanger 24 carry out heat interchange again, further temperature is regulated and controled, be the secondary regulation and control of temperature, serving volume valve 22 can regulate and control to enter the immersion liquid flow of secondary heat exchanger 24, thereby control the immersion liquid flow that carries out heat interchange, to realize temperature adjusting.
By coordination, control the cold medium flux that enters primary heat exchanger 23 and secondary heat exchanger 24, and the adjusting that enters the immersion liquid flow of secondary heat exchanger 24 in conjunction with 22 pairs of serving volume valves, can realize the two-stage regulation and control to dip temperature, thereby acquisition temperature stabilization and accurate immersion liquid are for immersion lithography process with filtered air.
Throttling valve 36 entrances are communicated with secondary heat exchanger 24 immersion liquid outlets, and its outlet is communicated with serving volume valve 22 outlets, and the immersion liquid flow that 36 pairs of secondary heat exchanger of throttling valve 24 flow out is controlled.The immersion liquid of flowing out through serving volume valve 22 outlets enters respectively two minutes pipelines with the immersion liquid of flowing out from throttling valve 36 outlets converge in throttling valve 36 exits, part immersion liquid flows to immersion lithography process with filtered air from a minute pipeline, remaining immersion liquid flows to the entrance of supercharge pump 34 from another minute pipeline, again flow into two heat exchangers to form immersion liquid loop, thereby in assurance immersion liquid loop, temperature is stable.
Elementary serving volume valve 20 entrances are communicated with refrigerant output terminal, its outlet is communicated with primary heat exchanger 23 refrigerant entrances, the cold medium flux that 20 pairs of elementary serving volume valves flow into primary heat exchanger 23 through self is controlled, thereby controls heat-exchange capacity and realize the elementary regulation and control of temperature.
Secondary serving volume valve 21 entrances are communicated with primary heat exchanger refrigerant exit, outlet is communicated with the refrigerant entrance of secondary heat exchanger 24, control from primary heat exchanger 23 through self flowing into the cold medium flux of secondary heat exchanger 24, thereby control heat-exchange capacity and realize the secondary regulation and control of temperature.
The first surplus valve 31 is communicated with elementary serving volume valve 20 entrances and refrigerant recovering end, to guarantee elementary serving volume valve intake pressure value; The second surplus valve 32 is communicated with secondary serving volume valve 21 entrances and refrigerant recovering end, to guarantee the intake pressure value of secondary serving volume valve.
Retaining valve 33 outlets are communicated with supercharge pump 34 entrances, and the used discarded immersion liquid of immersion lithography process with filtered air, after degasification impurity removal process 60, flows to retaining valve 33 entrances, through retaining valve and supercharge pump, again enters immersion liquid loop, to realize recycling of immersion liquid.
Secondary temperature sensor 42 is installed on immersion lithography process with filtered air entrance 11 front ends, for measuring, after two-stage temperature adjusting, pass into the dip temperature of immersion lithography process with filtered air, elementary temperature sensor 47 is arranged on the immersion liquid outlet of primary heat exchanger 23, for measuring dip temperature after the elementary regulation and control of excess temperature, elementary temperature sensor and secondary temperature sensor are precision temperature sensor.Temperature sensor 40, is arranged on the pipeline between retaining valve 33 and supercharge pump 34, for measuring the dip temperature after degasification impurity removal process that enters immersion liquid loop.Temperature sensor 45 is arranged on primary heat exchanger 23 immersion liquid entrances, for measuring the dip temperature that enters primary heat exchanger.Temperature sensor 50 is arranged on the immersion liquid outlet of secondary heat exchanger 24, for measuring the dip temperature through the secondary regulation and control of excess temperature.Temperature sensor 46 is arranged on primary heat exchanger refrigerant entrance, for measuring the refrigerant initial temperature of carrying out heat interchange.Temperature sensor 49 is arranged on secondary heat exchanger refrigerant entrance, for measuring the refrigerant temperature that enters secondary heat exchanger.
Pressure transducer 41 is arranged between temperature sensor 40 and supercharge pump 34 on pipeline, for guaranteeing to enter the immersion liquid pressure of supercharge pump 34.Pressure transducer 44 is arranged between supercharge pump and temperature sensor 45 on pipeline, flows into the immersion liquid pressure of primary heat exchanger 23 for monitoring.
Flow sensor 48 is arranged on the pipeline between temperature sensor 47 and secondary heat exchanger 24 immersion liquid entrances, for guaranteeing to flow into the immersion liquid flow of secondary heat exchanger 24.Flow sensor 43 is arranged on to immersion lithography process with filtered air and provides on minute pipeline of immersion liquid, for guaranteeing to flow into the immersion liquid flow of immersion lithography process with filtered air.
Throttling valve 35 is arranged between secondary temperature sensor 42 and immersion lithography process with filtered air entrance 11, for accurately guaranteeing to enter the immersion liquid flow of immersion lithography process with filtered air.
Fig. 2 accurately controls immersion liquid cyclic process schematic diagram in submersible photoetching apparatus soaking liquid temperature device in the embodiment of the present invention, immersion liquid enters in immersion lithography process with filtered air, immersion liquid 63 submergence projection objectives 64 and silicon chip 62, immersion liquid enters immersion liquid cooling loop and is cooled from immersion liquid cooling loop entrance 10, temperature enters in the litho machine that uses immersion liquid after reaching designated value, projection objective 64 and silicon chip 62 are carried out to submergence, carry out photoetching process, used waste gas immersion liquid, through degasification and impurity removal process 60, enters immersion liquid cooling circuit by retaining valve 33 again.
In the embodiment of the present invention, the device that immersed photoetching machine temperature is accurately controlled in application carries out in the method for temperature control, the desired value of design temperature two-stage regulation and control, adopts the hand-reset factor to characterize the relation of two-stage goal of regulation and control value respectively, and temperature two-stage goal of regulation and control value adopts following formula to represent:
SV2＝SV1+MR
In formula, SV2 is the desired value of the secondary regulation and control of temperature, the final goal temperature also regulating and controlling, and SV1 is the desired value of the elementary regulation and control of temperature, MR is the hand-reset factor.The hand-reset factor M R of suitable size can coordinate the target temperature of two-stage regulation and control, thereby guarantees the reasonable that is related between the target temperature of two-stage regulation and control, and then guarantees the efficiency of the elementary regulation and control of temperature and the precision of the secondary regulation and control of temperature.
After the desired value SV2 of the desired value SV1 of the elementary regulation and control of temperature and the secondary regulation and control of temperature sets, by regulating respectively elementary serving volume valve 20 valve port output quantities and secondary serving volume valve 21 valve port output quantities, thereby regulate respectively the coolant quantity that enters primary heat exchanger coolant quantity and secondary heat exchanger, the temperature that temperature value that actual elementary temperature adjusting reaches and actual secondary temperature adjusting are reached approaches respectively the desired value SV1 of the elementary regulation and control of temperature and the desired value SV2 of the secondary regulation and control of temperature.
Introducing hand-reset factor M R is in order to guarantee that elementary serving volume valve and secondary serving volume valve have good output quantity, has good valve port size.If MR arranges excessive, the adjustable extent of elementary serving volume valve 20 reduces, and elementary temperature control efficiency is by variation, too small if MR arranges, and the adjustable extent of serving volume valve 21 diminishes, and secondary accuracy of temperature control is influenced.In order to make the serving volume valve of two-stage all the time in suitable range of adjustment, thereby better realize the elementary regulation and control of temperature and the secondary regulation and control of temperature, adopt fuzzy logic adaptive to regulate the size of hand-reset factor M R, in order to characterize the size of MR, first adopt following formula to characterize serving volume valve output quantity mean value
In formula, u
i(k) be k output quantity of i level serving volume valve, k=1,2,3R, R is infinitely great, i=1 or 2,1 represents elementary, 2 represent secondary, u
1for elementary serving volume valve output quantity, u
2for secondary serving volume valve output quantity.
Stable in order to guarantee temperature adjusting, to u
1having carried out amplitude limit, is u
1max=80%, u
1min=8%, if
mR is bigger than normal, if
mR is less than normal, same, if
mR is less than normal, if
mR is bigger than normal.For
And
With
And
MR has definite size state, and the former is bigger than normal, and the latter is less than normal.But, for the intermediateness outside this two class, as worked as
and
deng, the state of MR has uncertainty.
Adopt the membership function in described fuzzy logic adaptive method first to calculate △ MR size, at the appointed time, in section, k the value of MR adopts following formula to calculate:
MR(k)＝MR(k-1)+ΔMR
In formula: MR (k) is k preset value of the hand-reset factor, Δ MR is that k preset value of the hand-reset factor is with respect to the increment of the preset value of k-1 the hand-reset factor, k=0,1,2...R, R is infinitely great, and the process of calculating MR (k) is completed by master controller cycle calculations.
Fig. 3 and Fig. 4 are respectively the elementary serving volume valve output quantity mean value that MR self-adaptation regulates
with secondary flow servo output quantity mean value
the membership function adopting.By fuzzy logic, come self-adaptation to regulate the large submethod of MR to be: the current state of MR is divided into large, bigger than normal, suitable, less than normal, little 5 states, corresponding Δ MR is respectively NB, NM, Z0, PM, PB, the state that it is corresponding, adopts fuzzy rule as shown in table 1, and wherein Δ V is the valve port opening variation of serving volume valve 22, Δ V=+v represents that valve port opening increases v, and vice versa.
As Fig. 3 dotted line illustrates
time, corresponding Δ MR is: 33.3% possibility is NB, 33.3% possibility is NM, if now
be quantified as 75%, as shown in Figure 4, its corresponding Δ MR is: 50% possibility is NM, the Z0 of 50% possibility, and according to the fuzzy rule of linear interpolation method and table 1, the computing method of final Δ MR are:
ΔMR＝33.3％×50％NB+33.3％×50％NM+33.3％×50％NM+33.3％×50％NM
By above-mentioned Δ MR, in current two-stage temperature adjusting method, MR (k) computing formula is:
MR(k)＝MR(k-1)+ΔMR
Can regulate elementary temperature adjusting desired value SV1 (k) to be:
SV1(k)＝SV2+MR(k)；
Secondary temperature adjusting desired value SV2 is the target temperature of temperature adjusting.
Table 1
The difference between the desired value SV1 of the elementary regulation and control of temperature and the actual temperature of the elementary regulation and control gained of described elementary temperature sensor measurement of take is feedback, the non-overshoot that adopts elementary regulation and control actual temperature to be not more than elementary goal of regulation and control value is controlled, thereby by regulate elementary serving volume valve valve port output quantity to control the cold medium flux that enters primary heat exchanger, realize betide primary heat exchanger elementary regulation and control fast.
The difference between the desired value of the secondary regulation and control of temperature and the actual temperature of the secondary temperature control gained of described secondary temperature sensor measurement of take is feedback, adopt stable PI to control secondary serving volume valve valve port output quantity, thereby by regulate secondary serving volume valve valve port output quantity to regulate the cold medium flux that enters secondary heat exchanger, realize betide secondary heat exchanger secondary regulation and control accurately.
Adoption rate gain-limitation factor-alpha and integral time modifying factor β the refrigerant output quantity μ (t) passing through in elementary serving volume valve of t time (20) and secondary serving volume valve (21) is revised, in t time serving volume valve, output quantity μ (t) adopts following formula to calculate:
Wherein, the target temperature that r is temperature adjusting, y is system output, e is temperature deviation, K
pfor proportional gain, T
ifor integral time, α is proportional gain restriction factor, and β is modifying factor integral time;
By Z-N critical proportional band law, obtain proportional gain K
pwith T integral time
i, formula is,
K
p＝0.45K
u
T
i＝0.83T
d
In formula, K
ufor critical gain, T
dfor the critical concussion cycle;
Proportional gain restriction factor α and integral time modifying factor β calculating by following formula, complete:
In formula, the pure hysteresis τ of standard
b=τ/T, τ is retardation time, T is system time constant, K
ufor critical gain.
In the embodiment of the present invention, by regulating size adjustment elementary serving volume valve valve port output quantity and the secondary serving volume valve valve port output quantity of valve port.
The Temp. control method flow process of carrying out based on device in the embodiment of the present invention is as shown in Figure 5:
Step S00: open this device;
Step S01: the temperature adjusting desired value SV of this device is set, the desired value SV2=SV of secondary temperature adjusting;
Step S02: master controller calculates the optimum PI parameter of two-stage temperature adjusting, reads acquiescence hand-reset factor M R size, and acquiescence MR is the optimum MR preserving last time;
Step S03: calculate elementary temperature adjusting desired value SV1=SV+MR;
Step S04: calculate proportional gain restriction factor α and integral time modifying factor β in the embodiment of the present invention by Z-N critical proportional band law respectively;
Step S05: whether the absolute value that judges the temperature sensor 47 Current Temperatures T1 of place and elementary temperature control preset value SV1 deviation is greater than em, if so, enters step S06, otherwise, step S07 entered.Em is for entering elementary temperature controlled threshold value, em=2 ℃ in the present embodiment;
Step S06: respectively the valve port of elementary serving volume valve 20 and secondary serving volume valve 21 is adjusted to maximal value, the maximum valve port value of serving volume valve 20 is 80%, and the maximum valve port value of serving volume valve 21 is 100%;
Step S07: judge that the absolute value of the temperature sensor 47 Current Temperatures T1 of place and elementary temperature adjusting goal-selling value SV1 deviation is whether between es and em, if, enter step S08, otherwise enter step S09, the selection of es directly affects the present embodiment temperature control efficiency and accuracy of temperature control, in should installing, select em=0.1;
Step S08: according to aforesaid elementary temperature adjusting desired value SV1, elementary temperature control PI parameter and proportional gain restriction factor α and integral time modifying factor β the valve port size of elementary serving volume valve is set;
Step S09: whether the absolute value that judges the temperature sensor 47 Current Temperatures T1 of place and elementary temperature adjusting desired value SV1 deviation is less than or equal to es, if so, enters step S10, otherwise, repeat to enter successively step S05, S06, S07, S08;
Step S10: secondary serving volume valve valve port size is set according to the secondary PI parameter of step S02;
Step S11: according to characterizing serving volume valve output quantity mean value
formula calculate respectively the output quantity mean value of elementary serving volume valve 20 and secondary serving volume valve 21
with
Step S12: judgement output quantity mean value
with
whether meet the demands, for elementary serving volume valve 20, its valve port size makes
time for meeting the demands, in like manner, for secondary serving volume valve 21, valve port size makes
time for meeting the demands.If met the demands, enter step S09, continue two-stage temperature control and regulate, if do not met the demands, enter step S13;
Step S13: the output quantity mean value obtaining according to step S11
with
the size of adjusting MR, regulative mode adopts fuzzy self-adaption method as above, after step S13 has obtained new MR, reenters step S03, calculates two-stage temperature adjusting desired value SV1, SV2.
Fig. 6 and Fig. 7 are respectively the temperature control effect figure that adopts embodiment of the present invention device and Temp. control method to obtain, in Fig. 7, by the method for two-stage temperature adjusting, after system stability, the dip temperature error of final output is in ± 0.01 ℃, average error is-0.00142 ℃, mean absolute error MAE=0.0056 ℃; As shown in Figure 6, UPW is immersion liquid, under experimental situation temperature disturbance, when refrigerant temperature is under 10-18 ℃ ± 0.5/h and the immersion liquid delivery rate situation of change that is 0.5-5L/min, adopt device and the Temp. control method of the embodiment of the present invention successfully to control the temperature of immersion liquid and guaranteed the stable of temperature, embodiment of the present invention Temp. control method makes immersion liquid with interior temperature, reach desired value at 300s.
Those skilled in the art will readily understand; the foregoing is only the preferred embodiment of the embodiment of the present invention; not in order to limit the embodiment of the present invention; any modification of doing within all spirit in the embodiment of the present invention and principle, be equal to and replace and improvement etc., within all should being included in the protection domain of the embodiment of the present invention.
Claims (13)
1. accurately control a device for submersible photoetching apparatus soaking liquid temperature, it is characterized in that, comprising:
Supercharge pump (34), pending immersion liquid has after processing by this supercharge pump pumping after certain pressure with output;
Primary heat exchanger (23), its immersion liquid entrance is communicated with described supercharge pump outlet, and immersion liquid and refrigerant after described supercharge pump is processed output carry out heat interchange in this primary heat exchanger, to realize the elementary regulation and control of dip temperature;
Secondary heat exchanger (24), its immersion liquid entrance is communicated with described primary heat exchanger (23) immersion liquid outlet, for refrigerant, the immersion liquid after this secondary heat exchange process is carried out to heat interchange again, so that dip temperature is adjusted again, realize the secondary regulation and control of dip temperature;
Serving volume valve (22), its entrance is communicated with described primary heat exchanger (23) immersion liquid outlet, its outlet is communicated with described secondary heat exchanger (24) outlet, in parallel with described secondary heat exchanger (24) to form, make the immersion liquid from described primary heat exchanger (23) is processed can enter respectively secondary heat exchanger (24) and serving volume valve (22), to regulate the immersion liquid flow that carries out heat interchange with refrigerant enter described secondary heat exchanger (24), realize the regulation and control to dip temperature;
By coordination, control the cold medium flux that enters described primary heat exchanger (23) and secondary heat exchanger (24), and in conjunction with described serving volume valve (22) to entering the adjusting of the immersion liquid flow of described secondary heat exchanger (24), can realize the two-stage regulation and control to dip temperature, thereby acquisition temperature stabilization and accurate immersion liquid are for immersion lithography process with filtered air.
2. the device of a kind of accurate control submersible photoetching apparatus soaking liquid temperature according to claim 1, it is characterized in that, also comprise throttling valve (36), its entrance is communicated with described secondary heat exchanger (24) immersion liquid outlet, its outlet is communicated with described serving volume valve (22) outlet, so that the immersion liquid flow flowing out through described secondary heat exchanger (24) is controlled.
3. the device of a kind of accurate control submersible photoetching apparatus soaking liquid temperature according to claim 1 and 2, is characterized in that, also comprises
Elementary serving volume valve (20), its entrance is communicated with refrigerant output terminal, its outlet is communicated with described primary heat exchanger (23) refrigerant entrance, elementary serving volume valve (20) to be to control flow into the cold medium flux of primary heat exchanger (23) through self, thereby controls heat-exchange capacity and realize the elementary regulation and control of temperature.
4. according to the device of a kind of accurate control submersible photoetching apparatus soaking liquid temperature one of claim 1-3 Suo Shu, it is characterized in that, also comprise
Secondary serving volume valve (21), its entrance is communicated with described primary heat exchanger (23) refrigerant exit, its outlet is communicated with the refrigerant entrance of described secondary heat exchanger (24), to control from primary heat exchanger (23), through self, flow into the cold medium flux of secondary heat exchanger (24), thereby control heat-exchange capacity and realize the secondary regulation and control of temperature.
5. according to the device of a kind of accurate control submersible photoetching apparatus soaking liquid temperature one of claim 1-4 Suo Shu, it is characterized in that, also comprise:
The first surplus valve (31), it is communicated with elementary serving volume valve (20) entrance and refrigerant recovering end, to guarantee elementary serving volume valve intake pressure value;
The second surplus valve (32), it is communicated with secondary serving volume valve (21) entrance and refrigerant recovering end, to guarantee the intake pressure value of secondary serving volume valve.
6. according to the device of a kind of accurate control submersible photoetching apparatus soaking liquid temperature one of claim 1-5 Suo Shu, it is characterized in that, the immersion liquid of flowing out through serving volume valve (22) outlet enters respectively two minutes pipelines with the immersion liquid of flowing out from described throttling valve (36) outlet converge in described throttling valve (36) exit, part immersion liquid flows to immersed photoetching machine from a minute pipeline, remaining immersion liquid flows to described supercharge pump (34) entrance from another minute pipeline, and again flows into two heat exchangers to form immersion liquid loop.
7. according to the device of a kind of accurate control submersible photoetching apparatus soaking liquid temperature one of claim 1-6 Suo Shu, it is characterized in that, also comprise
Retaining valve (33), its outlet is communicated with described supercharge pump (34) entrance, the used discarded immersion liquid of immersion lithography process with filtered air is after degasification impurity removal process, flow to described retaining valve (33) entrance, through retaining valve (33), flow to described supercharge pump (34) entrance, again to enter immersion liquid loop.
8. according to the device of a kind of accurate control submersible photoetching apparatus soaking liquid temperature one of claim 1-7 Suo Shu, it is characterized in that, also comprise:
Secondary temperature sensor (42), is installed on immersed photoetching machine entrance, for measuring, passes into the dip temperature of immersed photoetching machine after described two-stage temperature adjusting;
Elementary temperature sensor (47), is arranged on the immersion liquid outlet of described primary heat exchanger (23), for measuring dip temperature after the elementary regulation and control of excess temperature;
Elementary temperature sensor (47) and secondary temperature sensor (42) are preferably precision temperature sensor.
9. application rights requires the method that in 1-8, the device described in any one carries out temperature control, it is characterized in that, comprises
The desired value of design temperature two-stage regulation and control, adopts the hand-reset factor to characterize the relation of two-stage goal of regulation and control value respectively, and temperature two-stage goal of regulation and control value adopts following formula to represent:
SV2＝SV1+MR
In formula, SV2 is the desired value of the secondary regulation and control of temperature, the final goal temperature also regulating and controlling, and SV1 is the desired value of the elementary regulation and control of temperature, MR is the hand-reset factor;
Wherein, adopt fuzzy logic adaptive method to regulate the size of hand-reset factor M R, for difference size between the target temperature of coordination temperature two-stage regulation and control, and then guarantee the efficiency of the elementary regulation and control of temperature and the precision of the secondary regulation and control of temperature.
10. a kind of Temp. control method as claimed in claim 9, is characterized in that, adopts the membership function in described fuzzy logic adaptive method to calculate △ MR size, and at the appointed time, in section, k the value of MR adopts following formula to calculate:
MR(k)＝MR(k-1)+ΔMR
In formula: MR (k) is k preset value of the hand-reset factor, Δ MR is that k preset value of the hand-reset factor is with respect to the increment of the preset value of k-1 the hand-reset factor, k=0,1,2...R, R is infinitely great, and the process of calculating MR (k) is completed by master controller cycle calculations;
The final goal temperature value that the desired value SV2 of the secondary regulation and control of temperature also regulates and controls, adopts following formula to calculate:
SV2＝SV1(k)+MR(k)
In formula, SV1 (k) is k preset value of the elementary regulation and control of temperature, by continuous adjustment MR (k) and SV1 (k), realizes the difference size of controlling the desired value SV2 of the secondary regulation and control of temperature and the desired value SV1 of the elementary regulation and control of temperature.
11. a kind of Temp. control methods as described in claim 9 or 10, it is characterized in that, adopt non-overshoot control mode to realize the elementary regulation and control of temperature, be specially, the difference between the desired value SV1 of the elementary regulation and control of temperature and the actual temperature of the elementary regulation and control gained that described elementary temperature sensor (47) is measured in real time of take is feedback, the non-overshoot that adopts elementary regulation and control actual temperature to be not more than elementary goal of regulation and control temperature is controlled, by regulating elementary serving volume valve (20) thus valve port output quantity is controlled the cold medium flux enter primary heat exchanger, realize the elementary regulation and control of temperature.
12. a kind of Temp. control methods as described in one of claim 9-11, it is characterized in that, adopt stable PI control mode to realize the secondary regulation and control of temperature, the difference between the desired value SV2 of the secondary regulation and control of temperature and the actual temperature of the secondary temperature control gained that described secondary temperature sensor (42) is measured in real time of take is feedback, adopt stable PI to control secondary serving volume valve (21) valve port output quantity, by regulating secondary serving volume valve (21) thus valve port output quantity regulates the cold medium flux enter secondary heat exchanger, realize the secondary regulation and control of temperature.
13. a kind of Temp. control methods as described in claim 11 or 12, is characterized in that, adopt following formula to calculate the refrigerant output quantity μ (t) that t passes through in elementary serving volume valve (20) and secondary serving volume valve (21) valve port constantly:
Wherein, the target temperature that r is temperature adjusting, y is system output, e is temperature deviation, K
pfor proportional gain, T
ifor integral time, α is proportional gain restriction factor, and β is modifying factor integral time;
By Z-N critical proportional band law, obtain proportional gain K
pwith T integral time
i, formula is:
K
p＝0.45K
u
T
i＝0.83T
d
In formula, K
ufor critical gain, T
dfor the critical concussion cycle;
Proportional gain restriction factor α and integral time modifying factor β calculating by following formula, complete:
In formula, the pure hysteresis τ of standard
b=τ/T, τ is retardation time, T is system time constant, K
ufor critical gain.
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| CN109270972A (en) * | 2018-10-11 | 2019-01-25 | 中国船舶重工集团公司第七〇九研究所 | A kind of thermostatically-controlled equipment |
| CN111443749A (en) * | 2020-03-26 | 2020-07-24 | 九江历源整流设备有限公司 | Temperature adjusting method, device, equipment and computer storage medium |
| CN111443749B (en) * | 2020-03-26 | 2022-02-11 | 九江历源整流设备有限公司 | Temperature adjusting method, device, equipment and computer storage medium |
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