JP2018100780A - Temperature control method of heat medium for temperature control and supply device of heat medium for temperature control using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a temperature control method of a heat medium for temperature control which can maintain a temperature of a load to a predetermined temperature with high accuracy, and to provide a supply device of the heat medium for temperature control which uses the temperature control method.SOLUTION: A supply device of a heat medium for temperature control controls a temperature of a heat medium reflowing from a load 40 through a return pipe 32 to a predetermined temperature by a cooling circuit part 10 and a heating circuit part 30 and supplies the heat medium to the load through a supply pipe. The cooling circuit part includes: a heat exchanger 24 which cools the heat medium to a temperature lower than the predetermined temperature; a storage tank 26 which stores the cooled heat medium; and a squeeze pump 27 which pumps the heat medium stored in the storage tank to the load through the supply pipe. A heating part is provided at the outlet side of the squeeze pump and includes a heater 38 which heats the heat medium flowing in a passage connected with the supply pipe to the predetermined temperature.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a temperature control heat medium supply device that maintains a load temperature at a predetermined temperature by cooling or heating the load with a temperature-controlled heat medium, and in particular, the load temperature may vary in load capacity or load. The present invention relates to a temperature control method for a temperature control heat medium that can maintain the temperature of a load at a predetermined temperature with high accuracy even if the processing conditions vary, and a temperature control heat medium supply device using the method.

  The temperature control heat medium supply device controls the temperature of the heat medium having a large heat capacity to a predetermined temperature and supplies the load to the load to maintain the load at a constant temperature. In the temperature control heat medium supply apparatus, a refrigeration system that circulates and cools a cooling circuit that includes a heat exchanger for controlling the temperature of the heat medium to a predetermined temperature and a refrigerant that exchanges heat energy with the heat medium. Circuit.

The cooling circuit includes a storage tank (also referred to as a buffer tank) that stores a temperature control heat medium whose temperature is adjusted by a heat exchanger, and a pump that circulates the closed flow path by pumping the heat medium from the storage tank through the flow path to the load. Etc. The refrigeration circuit compresses the refrigerant into a high-temperature and high-pressure refrigerant gas, an expansion valve that cools and condenses the refrigerant gas to lower the temperature, an expander that evaporates the liquid refrigerant decompressed by the expansion valve, and refrigeration heat It has an exchange etc.

  The heat medium for temperature adjustment returns to the supply apparatus at a temperature higher or lower than the temperature sent from the supply apparatus for the temperature adjustment heat medium by the transfer of heat energy performed on the load side. The temperature of the heat medium is controlled to a predetermined temperature by the heat exchanger and supplied to the load. However, if the temperature of the heat medium returning from the load fluctuates beyond the capacity of the heat exchanger, the heat medium is predetermined. Therefore, the load is supplied to the load at a temperature higher or lower than a predetermined temperature.

  The transfer of heat energy on the load side varies depending on the size of the heat load, the heat input time, and the like, and accordingly, the temperature of the heat medium that returns to the temperature adjustment heat medium supply device also varies. Factors that degrade the processing accuracy of products (workpieces) when the temperature change of the heat medium becomes large and the temperature cannot be controlled sufficiently, causing the so-called hunting phenomenon that the temperature of the heat medium rises and falls with respect to the set temperature. It becomes.

That is, when the temperature of the temperature control heat medium is supplied to the load without being controlled to a predetermined temperature, the temperature of the load cannot be maintained at the predetermined temperature, so that the processing conditions fluctuate, and the quality of the product (work) is problematic. .

For this reason, even if the temperature control heat medium changes suddenly, high-precision temperature control that can quickly follow the set temperature is required for the temperature control heat medium supply device. In addition, an apparatus that can change the temperature of the heat medium in a short time even when the set temperature of the heat medium for temperature control is changed in accordance with the change of the load condition is preferable.

  In order to realize these, it is necessary to sufficiently increase the temperature adjustment capability so that the temperature of the heat medium liquid having a large heat capacity can be changed in a short time. However, it is extremely uneconomical to excessively increase the temperature adjustment capability only for changing the set temperature.

  In order to solve such a problem, the following Patent Document 1 discloses a temperature control apparatus including a heat medium circuit unit that cools or heats a heat medium recirculated from a load to a predetermined temperature and supplies the heat medium to the load. However, the main circuit unit is composed of a compressor, a water-cooled condenser, an expansion valve, and a pipe that connects these devices in series to the load, and the heat medium is controlled to a predetermined temperature. A technique for directly controlling the temperature of the heat medium supplied to the load to a predetermined temperature by controlling the rotation speed of the compressor whose rotation speed is controlled by the inverter power supply. Disclosure.

  The technology disclosed in the following Patent Document 1 is that the control unit provided in the heat medium circuit unit controls the rotation speed of the compressor whose rotation speed is controlled by the inverter power supply, so that the pressure of the heat medium supplied to the expansion valve And the flow rate is controlled, and the temperature of the heat medium supplied to the load is controlled directly to a predetermined temperature by controlling the cold heat generated by being expanded by the expansion valve. The control is provided with a sensor for detecting the temperature (or pressure) of the heat medium at or near the heat medium inlet of the load, and the temperature (or pressure) of the heat medium detected by the sensor by the control unit and the set temperature. (Or the set pressure) is used to control the rotational speed of the compressor, the opening degree of the expansion valve, and the opening degree of the control valve.

  However, the technique described in Patent Document 1 below controls the temperature of the refrigerant that exchanges thermal energy with the heat medium by controlling the rotational speed of the compressor. For this reason, the temperature control range is limited to the temperature range which can be controlled by the rotation speed of the compressor. In addition, cooling of the heat medium is fundamental and it is not possible to support heating of the heat medium. In order to support heating of the heat medium, the water-cooled condenser and the expansion valve must be bypassed, and hot gas must be supplied to the load while controlling the flow rate with a control valve provided in the hot gas circuit section. There is a problem that a temperature control circuit is required.

In the technique described in Patent Document 2 below, when the temperature of the temperature control fluid in the heat exchanger is to be changed, the waiting time is shortened (the temperature of the heat medium liquid is changed in a short time). A closed channel circulator that circulates and circulates a constant temperature control heat medium liquid A for temperature adjustment in the side heat exchanger and a temperature control heat medium liquid A that is supplied to the closed channel circulator When the closed-flow circulator starts operation with the heat transfer medium circulator, the closed-flow circulator communicates with the temperature control heat transfer medium external tank. Switching means for disconnecting the communication between the road circulator and the temperature control heat medium liquid external tank is provided. According to the technique described in Patent Document 2, the temperature of the heat medium liquid having a large heat capacity can be changed in a short time, but it can be applied when the temperature of the temperature control fluid needs to be changed. There is a problem that the hunting phenomenon due to temperature fluctuation of the return temperature control fluid cannot be handled.
JP 2002-81793 A JP 2002-39657 A

  The present invention has been made in view of the above-described problems. The object of the present invention is to change the temperature of a load for supplying a temperature control heat medium due to a change in load capacity, a processing condition of the load, or the like. Even so, an object of the present invention is to provide a temperature adjusting heat medium temperature adjusting method capable of maintaining the temperature of the load at a predetermined temperature with high accuracy, and a temperature adjusting heat medium supplying apparatus using the method.

  In order to solve the above-mentioned problem, the invention according to claim 1 is configured such that the temperature of the heat medium returning from the load through the return pipe is controlled to a predetermined temperature by the cooling circuit section and the heating circuit section, and the temperature is changed through the supply pipe. In the temperature control heat medium supply device for supplying a heat medium to a load, the cooling circuit unit stores a heat exchanger that cools the heat medium to a temperature lower than the predetermined temperature, and stores the cooled heat medium. A storage tank, and a pressure pump that pumps the heat medium stored in the storage tank to a load through the supply pipe, and the heating unit is provided on an outlet side of the pressure pump, and the supply pipe And a heater for heating the heat medium flowing through the flow path connected to the predetermined temperature to the predetermined temperature.

  In controlling the heat medium supplied to the load to a predetermined temperature, the heat medium is cooled to a temperature lower than the predetermined temperature by the heat exchanger, for example, a temperature lower by 1 to 3 ° C., and the cooled heat medium is stored in the storage tank. Store in. The temperature of the heat medium can be quickly adjusted to a predetermined temperature by directly heating the heat medium flowing through the flow path connected to the supply pipe at the outlet from the storage tank to the load. Rather than controlling the heat medium to a predetermined temperature by cooling, the temperature of the heat medium can be controlled more responsively by directly heating the heat medium flowing through the flow path. As a result, it is possible to perform temperature control with good followability with respect to temperature fluctuations of the heat medium due to load processing conditions and the like.

  Invention of Claim 2 is the supply apparatus of the heat medium for temperature control of Claim 1, Comprising: The temperature sensor 1 which measures the temperature of the said heat medium of the exit side of the said heat exchanger, and the said heater Based on the temperature sensor 2 for measuring the temperature of the heat medium on the outlet side, and the temperature signals of the temperature sensor 1 and the temperature sensor 2, the heat medium flows through the heat exchanger and exchanges heat energy with the heat medium. A refrigeration circuit unit that cools the refrigerant to a set temperature and a temperature control unit that controls the heater are provided.

  Conventional temperature control heat medium supply devices measure the temperature of the heat medium with a temperature sensor provided at the outlet for supplying the heat medium to the load, and the refrigerant flowing in the heat exchanger on the refrigeration circuit side by the temperature signal Was controlling the temperature. However, the cooling of the heat medium having a large heat capacity has poor followability to the temperature fluctuation. On the other hand, the temperature sensor 1 is provided on the outlet side of the heat exchanger on the cooling circuit side, the temperature of the heat medium is measured, and the temperature control unit controls the temperature so that the temperature is 1 ° C. to 3 ° C. lower than the predetermined temperature. The heat medium is stored in the storage tank. When supplying the heat medium stored in the storage tank to the load, a temperature sensor is provided in the flow path connected to the supply pipe, the temperature of the heat medium flowing therethrough is measured, and the heat medium flowing through the flow path is directly measured by the heater. It is heated and controlled by the temperature control unit so as to reach a predetermined temperature. As a result, even if the heat medium has a large heat capacity, it is possible to perform temperature control with good followability with respect to temperature fluctuations caused by fluctuations in load processing conditions and the like.

Invention of Claim 3 is the supply apparatus of the heat medium for temperature control of Claim 1 or 2, Comprising: The capacity | capacitance of the said storage tank is comprised so that it can change according to the thermal fluctuation of load. It is characterized by that.

The storage tank that stores the heat medium has a function as a so-called buffer tank. When the temperature of the heat medium varies greatly, the temperature variation of the heat medium can be absorbed by increasing the capacity of the storage tank. Conversely, when the temperature variation of the heat medium is small, the capacity of the storage tank can be reduced, and the consumption of heat energy on the cooling circuit side can be reduced.

  Invention of Claim 4 is the supply apparatus of the heat medium for temperature control in any one of Claim 1 to 3, Comprising: The said cooling circuit part is equipped with the temperature sensor 3 which measures the temperature of the said storage tank, The temperature adjustment control unit controls the refrigeration circuit unit based on temperature data of the temperature sensor 3 so that the temperature of the storage tank is 1 ° C. to 3 ° C. lower than the predetermined temperature. To do.

  The temperature of the heat medium stored in the storage tank is measured by the temperature sensor 3, and the temperature control unit controls the heater based on the temperature signal, thereby controlling the heat medium to a predetermined temperature with higher accuracy. can do.

  The invention according to claim 5 is for temperature control in which the temperature of the heat medium returning from the load through the return pipe is controlled to a predetermined temperature, and the load is maintained at the predetermined temperature by circulating the heat medium. A method of supplying a heat medium, wherein the temperature of the refrigerant flowing through the heat exchanger is set to a set temperature by a temperature signal of a temperature sensor 1 provided on the outlet side of the heat exchanger. The refrigeration circuit for cooling is controlled to cool the temperature of the heat medium to a temperature lower than the predetermined temperature, and from the storage tank in which the cooled heat medium is stored, the heat medium is supplied to the load by a pressure pump. The heater is controlled by a temperature signal of a temperature sensor 2 provided on the outlet side of the heater so that the temperature of the heat medium flowing through the flow path connected to the supply pipe for supplying the heater is changed to the predetermined temperature. With control to Temperature control method that temperature control heat medium is.

  Invention of Claim 6 is the temperature control method of the heat medium for temperature control of Claim 5, Comprising: The capacity | capacitance of the said storage tank is made into the temperature of the said heat medium which circulates through a return pipe, and load. It changes based on the temperature difference with the temperature of the supplied heat medium.

  Since the present invention is configured as described above, according to the present invention, even if the temperature of the load for supplying the temperature adjusting heat medium fluctuates due to load change, processing conditions, etc., the load temperature is set to a predetermined value with good follow-up. It is possible to provide a temperature control method for a temperature control heat medium that can be maintained at a temperature, and a temperature control heat medium supply device using the method.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings of the examples. In order to clarify the features of the present invention, the conventional temperature control heat medium supply device (hereinafter, referred to as the temperature control heat supply device) shown in FIG. Will be described. A temperature control apparatus 100 shown in FIG. 4 includes a refrigeration circuit unit 10 and a cooling circuit unit 20. The refrigeration circuit unit 10 includes a refrigerant gas compressor 12 that compresses the refrigerant into a high-temperature and high-pressure refrigerant gas, a condenser 15 that cools and condenses the refrigerant gas to form a high-pressure liquid refrigerant, and depressurizes the liquid refrigerant. Thus, an expansion valve 13 that lowers the temperature and an evaporator 14 (heat exchanger (refrigeration circuit side)) that evaporates liquid refrigerant decompressed by the expansion valve 13 are sequentially connected in series. In addition, the refrigeration circuit unit 10 includes a refrigeration heat exchanger 15 through which cooling water for cooling the liquid refrigerant gas flows.

The cooling circuit unit 20 includes a heat exchanger 24 (cooling circuit side) that cools the heat medium whose temperature rises and returns at the load 40, a storage tank 26 that stores the heat medium cooled by the heat exchanger 24, and a storage tank A heater 28 for heating the heat medium 26 and a temperature sensor 25 for measuring the temperature of the heat medium in the storage tank are provided. The temperature control unit 50 controls the heater 28 by a temperature signal from the temperature sensor 25 and controls the temperature of the heat medium stored in the storage tank 26 to a predetermined temperature.

In the temperature control apparatus 100, the temperature sensor 25 heats the heat medium in the storage tank 26 to control the temperature in order to set the heat medium to a predetermined temperature and supply it to the load. Here, since the capacity of the storage tank is about 30 to 50 liters, it is necessary to heat the heat medium having such a capacity by the heater 28. That is, there is a problem that it is necessary to control all of the heat medium stored in the storage tank to a predetermined temperature, and it takes time to control to a predetermined temperature.

In addition, when the temperature of the return heat medium is higher than the normal temperature due to the fluctuation of the heat energy exchange in the load 40 and is not sufficiently cooled in the heat exchanger 24, the predetermined temperature can be obtained without being heated by the heater 28. The temperature may be exceeded (overshoot). In order to solve this problem, the temperature control unit 50 controls the expansion valve 13 of the refrigeration circuit 10 and cools the temperature of the heat medium at a lower temperature so that the temperature of the heat medium falls below a predetermined temperature (undershoot). ), And a so-called hunting phenomenon occurs in which the temperature of the heat medium rises and falls. In other words, the configuration of the temperature control device 100 has a problem that the temperature followability of the heat medium is poor with respect to the fluctuation of the heat energy exchange with the load.

  In order to solve such a problem, the temperature control device 1 shown in FIG. 1 which is an embodiment of the present invention controls the temperature of the refrigeration circuit unit 10, the cooling circuit unit 20, the heating circuit unit 30, and the heat medium. And a control unit 51. Here, one feature of the temperature control apparatus 1 is that the temperature sensor is provided on the outlet side of the heat exchanger 24 (inlet of the storage tank 26) and the temperature sensor 25 and temperature sensor 35 are provided on the outlet of the heater 28. is there.

  Another feature of the temperature control device 1 is that a heater that heats the heat medium is separated from a storage tank that stores the heat medium, and the heater 30 is a flow path that is fed from the pressure pump 27 and connected to the supply pipe 21. It is the place which is comprised so that the heat medium which flows through may be heated directly.

  By setting it as such an apparatus structure, the temperature control part 51 can control the heater 38 based on the temperature signal immediately before the heat medium supplied to load. Further, the temperature of the heat medium flowing through the flow path cooled by the heat exchanger 24 is directly measured, and the expansion valve 13 of the refrigeration circuit 10 is controlled by the temperature signal, so that in the heat exchanger 14 (the refrigeration circuit side). The temperature control of the heat medium can be performed by the temperature control of the refrigerant.

  As a result, for example, when the heat energy exchange on the load side fluctuates and the temperature of the return heat medium becomes higher than the normal temperature, the temperature control unit 51 expands based on the temperature signal from the temperature sensor 25. By controlling the valve 13, the temperature of the heat medium can be quickly controlled to a temperature lower by, for example, 1 ° C. to 3 ° C. than a predetermined temperature. Conversely, even when the temperature of the return heat medium is lower than the normal temperature due to fluctuations in heat energy exchange on the load side, the temperature control unit 51 controls the expansion valve 13 to perform temperature control with good followability. Can do.

  Further, the storage tank and the heater are separated from each other, the temperature of the heat medium flowing through the outlet of the heater 38 is measured by the sensor 35, and the heater 38 is controlled based on the temperature signal from the sensor 35. Even if the temperature of the heat medium stored in the storage medium changes, the heat medium flowing through the flow path can be directly heated and the temperature can be controlled, so that the temperature control of the heat medium with good followability is possible.

  Furthermore, it is preferable to configure the capacity of the storage tank 26 so that it can be changed according to the load condition. In FIG. 1, the storage tank 26 is not provided with a variable partition wall. However, for example, by providing a movable partition wall in a direction perpendicular to the height direction of the storage tank, the capacity of the storage tank 26 can be varied. It is preferable to configure.

With such a configuration, the capacity of the storage tank 26 is increased when the temperature of the heat medium greatly changes due to heat fluctuation on the load side, and the capacity of the storage tank 26 is decreased when the temperature change is small. can do. With such a configuration, the storage tank 26 can be provided with a buffer function against a temperature change of the heat medium. In addition, it is preferable to perform the fluctuation | variation of the storage capacity of the storage tank 26 under control of the temperature control part 30, for example.

  FIG. 2 is a flowchart of the temperature control method for the temperature control heat medium according to the embodiment of the present invention. The heat medium returning from the load is cooled by a heat exchanger (S1), and the temperature of the cooled heat medium is measured by a temperature sensor (S2). The temperature control unit 51 compares the temperature measured by the temperature sensor 25 with a set temperature (predetermined temperature), and the difference is a predetermined temperature difference range, for example, a range of -3 ° C to -1 ° C. (S3).

  If the temperature difference is not within the predetermined temperature range, the cooling circuit unit 10 is instructed to lower the cooling temperature of the heat medium (S5), and the cooled heat medium is connected to the heat medium supply pipe 31 from the storage tank 26 by the pressure pump 27. In the flow path to be heated, the heater 38 heats (S4), and the temperature is measured by the temperature sensor provided at the outlet of the heater 38 (S6).

The temperature control unit 51 determines whether or not the temperature difference between the temperature of the heat medium and the set temperature B, for example, within a range of ± 0.1 ° C. to ± 0.3 ° C. (S7). The heater 38 is instructed to increase the heating temperature (S9). The heated heat medium is supplied to the load (S8), and the heat medium whose heat energy has been exchanged in the load returns to the heat exchanger 24 through the return pipe 22 (S10).

  FIG. 3 is a graph comparing the temperature change of the heat medium accompanying the load fluctuations of the temperature control apparatus 1 shown in FIG. 1 which is an embodiment of the present invention and the conventional temperature control apparatus 100 shown in FIG. . In making this comparison, the temperature control device 1 and the temperature control device 100 both supply a fluorine-based heat medium as a heat medium, a heater capacity of several Kw, a flow rate of the heat medium by a pressure pump of several tens of liters / minute, and a load. The set temperature of the heat medium was 25 ° C., and the allowable accuracy of the heat medium when supplying to the load was ± 0.2 ° C.

  The load assumed a wafer (work) in the plasma processing apparatus. In the plasma processing apparatus, the wafer mounted on the wafer mounting table is subjected to plasma processing and processed. When the wafer is subjected to plasma processing, the wafer is heated by the plasma and the temperature rises. The temperature rise is cooled by a heat medium flowing through the flow path inside the wafer mounting table to maintain the wafer at a predetermined temperature. For this reason, it is preferable that the temperature of the wafer can always be kept constant by the temperature of the heat medium sent from the temperature control device. For this reason, in this comparative example, the temperature of the heat medium supplied from the temperature controller is set to 25 ° C. ± 0.2 ° C.

However, the temperature of the heat medium that returns to the temperature control device varies depending on the wafer processing conditions, for example, the etching conditions. Therefore, when the heat medium was heated in the load and returned to the temperature control device at 25.4 ° C., the time required to return to a predetermined temperature of 25 ° C. ± 0.2 ° C. was measured.

As shown in FIG. 3, in the conventional temperature control apparatus 100, the outlet temperature of the heat medium rises from the set temperature (25 ° C.) as the temperature of the wafer (load) rises, and returns to the set temperature (25 ° C.). Took 3 minutes. On the other hand, in the temperature control apparatus 1 according to an embodiment of the present invention, the outlet temperature of the heat medium starts to rise from the set temperature (25 ° C.), and the set temperature (25 ° C. ± 0.2 ± 0.2) is reached in about 1 minute. ℃). This is because the temperature control unit 50 controls the heater 38 and the temperature control unit 50 based on temperature signals from the temperature sensor 25 provided at the outlet of the heat exchanger 24 and the temperature sensor 35 provided at the outlet of the heater 38. This shows that the refrigeration circuit unit 10 is appropriately controlled.

In the comparative example in FIG. 3, the capacity of the storage tank is constant at 28 liters. However, when the capacity of the storage tank (heat medium holding amount) is changed to an appropriate capacity corresponding to the load, the heat fluctuation of the load is changed. It was confirmed that the heat storage capacity of the storage tank can absorb to some extent, and that better temperature followability can be obtained.

It is a lineblock diagram of temperature control device 1 which is one embodiment of the present invention. It is a flowchart of the temperature adjustment by the temperature adjustment apparatus which is one embodiment of this invention. It is the graph which showed the temperature change of the heat medium of the temperature control apparatus 1 and the temperature control apparatus 100 accompanying a load fluctuation. It is a block diagram of the conventional temperature control apparatus.

DESCRIPTION OF SYMBOLS 1 Temperature control apparatus 10 Refrigeration circuit part 11 Refrigerant piping 12 Refrigerant gas compressor 13 Expansion valve 14 Heat exchanger (refrigeration circuit side)
DESCRIPTION OF SYMBOLS 15 Condenser 16 Cooling water piping 20 Cooling circuit part 21 31 Supply pipe 22 32 Return pipe 23 33 Control line 24 Heat exchanger (cooling circuit side)
25 35 Temperature sensor 26 Refrigerant storage tank 27 Pressure feed pump 28 38 Heater 30 Heating circuit section 40 Load 50 51 Temperature control section

Claims (6)

In a temperature control heat medium supply device that controls the temperature of the heat medium that flows back from the load through the return pipe to a predetermined temperature by the cooling circuit section and the heating circuit section, and supplies the heat medium to the load through the supply pipe ,
The cooling circuit unit includes a heat exchanger that cools the heat medium to a temperature lower than the predetermined temperature, a storage tank that stores the cooled heat medium,
A pressure feed pump that pumps the heat medium stored in the storage tank to a load through the supply pipe;
The heating unit is provided on the outlet side of the pressure pump, and includes a heater that heats the heat medium flowing through a flow path connected to the supply pipe to the predetermined temperature. Feeding device. A temperature sensor 1 for measuring the temperature of the heat medium on the outlet side of the heat exchanger;
A temperature sensor 2 for measuring the temperature of the heating medium on the outlet side of the heater;
Based on the temperature signals of the temperature sensor 1 and the temperature sensor 2, the refrigeration circuit section that flows through the heat exchanger and cools the refrigerant that exchanges heat energy with the heat medium to a set temperature and the heater are controlled. The temperature control heat supply device according to claim 1, further comprising a temperature control unit configured to control the temperature control. The temperature control heat medium supply device according to claim 1, wherein the capacity of the storage tank is configured to be variable according to a heat fluctuation of a load.   The cooling circuit unit includes a temperature sensor 3 for measuring the temperature of the storage tank, and the temperature control unit sets the temperature of the storage tank to 1 ° C. from the predetermined temperature based on the temperature data of the temperature sensor 3. The temperature control heat medium supply device according to any one of claims 1 to 3, wherein the refrigeration circuit unit is controlled so that the temperature is 3 ° C lower than the temperature. A method of supplying a temperature control heat medium that controls the temperature of a heat medium that circulates from a load through a return pipe to a predetermined temperature, and circulates and flows the heat medium to maintain the load at a predetermined temperature.
Controlling the refrigeration circuit that cools the temperature of the refrigerant flowing in the heat exchanger to a set temperature by a temperature signal of the temperature sensor 1 provided on the outlet side of the heat exchanger, the heat medium that circulates through the return pipe, Cooling the temperature of the heat medium to a temperature lower than the predetermined temperature;
The temperature at which the temperature of the heat medium flowing from the storage tank in which the cooled heat medium is stored to the supply pipe that supplies the heat medium to the load by a pressure pump is provided on the outlet side of the heater A temperature control method for a temperature control heat medium, wherein the heater is controlled by a temperature signal of a sensor 2 and the temperature of the heat medium is controlled to the predetermined temperature.   6. The capacity of the storage tank is changed based on a temperature difference between the temperature of the heat medium returning through the return pipe and the temperature of the heat medium supplied to the load. The temperature control method of the heat medium for temperature control as described.

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