CN103963182A - Device Used For Cleaning Line Of Fretsaw - Google Patents
Device Used For Cleaning Line Of Fretsaw Download PDFInfo
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- CN103963182A CN103963182A CN201310170827.2A CN201310170827A CN103963182A CN 103963182 A CN103963182 A CN 103963182A CN 201310170827 A CN201310170827 A CN 201310170827A CN 103963182 A CN103963182 A CN 103963182A
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- solid particle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model relates to a device used for cleaning a line of a fretsaw. According to the device used for cleaning the line of the fretsaw, devices (100,300,400,500 and 700), methods and use methods used for cleaning the line (150) of a fretsaw suitable for sawing a semiconductor workpiece (130) are provided. The devices (100,300,400,500 and 700) respectively comprises a container (110), wherein the container (110) comprises a first opening (115), and the container (110) is filled by loose solid particles (111) and is adjusted to enable the line (150) to pass through the loose solid particles (111) via the first opening (115).
Description
Technical field
Theme described herein relates generally to clean method and the cleaning systems of scroll saw, more particularly relates to the method and system for the line of the clean scroll saw that is suitable for cutting semiconductor material.
Background technology
Substantially, scroll saw is for the production of thin wafer or divide the material that is conventionally cast into ingot and for example, is made up of () silicon, glass, sapphire, pottery and other fragile materials.Conventionally the wafer of, producing is thus for the production of solar cell or other semiconductor elements.In typical scroll saw, between two line guide rollers, be provided for the line of sawing workpieces to produce sawing region.Sawing region can comprise many sawing lines, and described many sawing lines are through arranging to form netted sawing region, and then removable ingot or workpiece are through described netted sawing region.
Conventionally, for the line of sawing can be a class of two classes.The first kind comprises the line that self workpiece is not had to abrasive action or only have less abrasive action.For example, steel wire has so less abrasive action or there is no abrasive action workpiece, and therefore substantially needs to supply the slurries that contain grinding agent to sawing region, to make line in mobile can utilize the abrasive properties cut workpiece of described slurries.The line of another type is those lines (being often known as coated thread) workpiece with abrasive action itself.For example, the line (such as the line of dipping diamond dust) that contains abrasive grains being set on surface does not use to contain and is suspended in the slurries of additional grinding agent wherein and workpiece is had to abrasive action.
The scroll saw of that two classes line arranges conventionally have different structures, especially with regard to the supply and recycling of slurries.The first kind scroll saw that comprises the line that does not have abrasive action or only have less abrasive action often reclaims slurries after using, so that contained abrasive grains in recycling slurries.For this purpose, often lay in place fine filtering system.In addition normally ethylene glycol fundamental mode of the slurries that use in this type of scroll saw.In contrast, comprise that the Equations of The Second Kind scroll saw of the line with abrasive action itself can have better simply structure, because they do not use this type of fine filtering system substantially.In addition, the slurries in Equations of The Second Kind scroll saw can be aqua type substantially, and are therefore conducive to ecological.
Substantially, the smear metal being produced by sawing workpieces can be removed from sawing region.There is no abrasive action or only have in the scroll saw of line of less abrasive action in use, the smear metal being produced by sawing workpieces can be attached to line surface and substantially can by fresh slurries without interruption or after filtering recycling slurries remove.But, only may be not by utilizing slurries to remove smear metal completely from the surface of this type of line.Have in use during the scroll saw of line (, coated thread) of abrasive action or scroll saw arrange, can be attached to coated thread from the smear metal of workpiece, may cause like this cutting-rate reduction, disturb with the rolling of line and reduce the organic efficiency of smear metal.This may cause the increase of material and the rising of running cost substantially.
For this purpose, should be understood that and smear metal easily effectively need to be removed from the line such as painting diamond wire, guarantee the continuous high-quality sawing of scroll saw and the high efficiente callback of residue smear metal or discarded smear metal.Therefore, theme described herein relates to improved clean method and system, especially about the sawing line that cleans scroll saw, to realize aforesaid high-quality sawing, material and running cost interests.
Summary of the invention
On the one hand, be provided for the device of the line of the clean scroll saw that is suitable for sawing semiconductor workpiece.Described device comprises the container that comprises the first opening.Described container is particles filled by porous solid, and through adjusting to make line and to pass porous solid particle by the first opening.
On the other hand, the scroll saw that is provided for cutting semiconductor workpiece is arranged.Described scroll saw is arranged and is comprised the scroll saw that comprises the line that is suitable for sawing semiconductor workpiece, and comprises the device of the line for clean scroll saw of the container that comprises the first opening.Described container is particles filled by porous solid, and through adjusting to make line to pass porous solid particle by the first opening.
Aspect another, provide as mentioned above for the usage of the device of the line of clean scroll saw or the usage that the scroll saw of cutting semiconductor workpiece is arranged as mentioned above, to clean and to sharpen the line of scroll saw by allowing line move through porous solid particle in container.
Aspect another, provide the method for the clean line that is suitable for cutting semiconductor workpiece.Described method comprises allows line move through the porous solid particle in said vesse.
The present invention is also for for realizing disclosed method and comprising the equipment for carrying out the part of appliance of method step described in each.These method steps can be by hardware element, by the computer of suitable software programming, carry out by the two any combination or in any other mode.In addition, the present invention is also for the method for operating of described equipment.It comprises the method step of each function for realizing equipment.
Belong to the obviously further aspect of the present invention, advantage and feature structure of claim, embodiment and accompanying drawing from clump.
Brief description of the drawings
For one skilled in the art, comprise that the present invention complete and wide adaptability of best mode of the present invention is set forth more specifically at the remaining part of description, comprise and consult the following drawings:
Fig. 1 is the schematic diagram that device, line and the workpiece of the line for cleaning scroll saw are shown according to this paper embodiment.
Fig. 2 be according to this paper embodiment as shown in Figure 1 for the schematic diagram in the cross section of the exemplary means of the line of clean scroll saw.
Fig. 3 is according to the schematic diagram of device, line and the workpiece that the line for cleaning scroll saw is shown of this paper embodiment.
Fig. 4 is according to the schematic diagram of device, line and the workpiece that the line for cleaning scroll saw is shown of this paper embodiment.
Fig. 5 and Fig. 6 are according to the schematic diagram of the movable fixture that the line for cleaning scroll saw is shown of this paper embodiment.
Fig. 7 and Fig. 8 are according to the schematic diagram of the mobile alignment of the movable fixture that the line for cleaning scroll saw is shown of this paper embodiment.
Fig. 9 is according to the schematic diagram of the closed cleaning fluid loop of the device of the line for clean scroll saw of this paper embodiment.
Figure 10 is the schematic diagram of arranging for the scroll saw of cutting semiconductor workpiece that illustrates according to this paper embodiment, and described scroll saw is arranged and is suitable for cleaning and sharpening one or more lines for sawing.
Detailed description of the invention
Now will consult in detail different embodiments, wherein one or more examples are shown at each picture in picture.Provide each example not mean that restriction as explanation.For example, the feature that is illustrated or is described as a part for an embodiment can be used to other embodiments or jointly use with other embodiments, to produce another embodiment.The present invention means and comprises this type of modifications and variations.
Ground as used herein, term " workpiece " means the workpiece representing such as the ingot of being made up of silicon, glass, sapphire, pottery or any other one or more fragile materials.Brick material or wafer (for example) are cut, sawed or divided to obtain to workpiece conventionally for manufacturing solar cell or semiconductor element.
Ground as used herein, term " scroll saw " means any scroll saw that represents to come by metal wire or metal cables cut workpiece, for example car side's machine (squarer).Conventionally, there are two class scroll saws: continuous type (, infinite or loop) and oscillation mode (or Reciprocatory).Generally speaking, continuous type scroll saw is for cutting the Silicon Wafer for semi-conductor industry.
Ground as used herein, term " line " means any line or the cable that represent to be generally used for sawing workpieces.For example, line can have one or the multiply that is woven together, and depending on application, diamond can maybe may not be used as grinding agent.Substantially, can make line roughening to there is abrasiveness, can make abrasive composites and line bonding, or for example the adamantine pearl of dipping (and sept) can be threaded onto on the surface of line.Substantially, in background described herein, term " line " means and represents at least single line, and therefore should not be construed as the possibility of eliminating existence more than single line.Ground as used herein, term " coated thread " means any line of expression or cable, and described line or cable wrap are drawn together and line or the surperficial abrasive composites (for example, diamond grit) boning of cable.For example, the big or small diamond grit with 10 μ m to 20 μ m can be imbedded to the line of the diameter with 80 μ m to 120 μ m.But in embodiment herein, coated thread also can have greater or lesser linear diameter and sand grains size.For example, linear diameter can be in the scope of 40 μ m to 500 μ m or in the scope of 60 μ m to 400 μ m (for example, in car side's machine, linear diameter can be 350 μ m).
Embodiment described herein comprises the device (being also known as hereinafter " cleaning device ") for the line of the clean scroll saw that is suitable for sawing workpieces.In detail, the embodiment of cleaning device described herein for for scroll saw coated thread (namely there is from the teeth outwards the line of fixing grinding agent, such as dipping adamantine line) clean.
Substantially, use the scroll saw of coated thread can there is the design different from the scroll saw that uses the line of coating not.Reason is that rear a kind of scroll saw may need abrasiveness slurries to the abrasive action of dividing workpiece is provided.In contrast, the scroll saw that comprises coated thread itself has abrasive properties (normally because be attached to the abrasive grains on line surface) and therefore can use the aqua type sawing fluid that is more conducive to environment, because they do not need additionally to add the abrasiveness slurries for cutting or divide workpiece.
Conventionally, in the high-performance scroll saw of the invaluable workpiece that uses coated thread sawing for example to be made by silicon or sapphire, on the line-oriented device that can comprise line groove, guide one or more lines, high accuracy sawing is guaranteed in the precalculated position by line is maintained like this with enough and to spare gap.
In embodiment herein, one of ordinary skill in the art should be interpreted as the region of cutting or divide workpiece place by cutting or sawing region.Sawing region is usually located between two line-oriented devices.In the time using many lines, can form cancellated sawing region, described sawing region can cut into multiple cross sections or chunk by workpiece simultaneously.Substantially, during Sawing Process, one or more line can on-line velocity moves in reciprocal back and forth mode from-20m/s is changed to the situation of 20m/s.Depending on profile used, can use the little wire rate such as 8m/s in cutting beginning or ending phase.Therefore,, in embodiment herein, the speed that one or more lines can 0 to 20m/s or 10 to 15m/s moves.
In the scroll saw using such as the coated thread of diamond coated line, need to remove the smear metal that may embed line surface for following reason.The smear metal of just cut workpiece can be attached to line surface and can (for example) cover the diamond grit on line.This can improve the flow rate on line, thereby increases the bad pairing effect that two adjacent lines attract each other due to their the each lip-deep fluid cumulative in surface causes separately surface tension.This pairing effect may cause line pairing, and damages thus workpiece and reduce overall cutting precision.
Generally speaking, may reduce cutting precision because the lip-deep smear metal of coated thread may be filled or contamination line guider in groove, thereby cause line to jump out groove.Therefore, this may damage workpiece and one or more lines itself, and therefore may significantly reduce cutting efficiency, and this may cause again the high line consumption of high running cost and each (criticizing) workpiece of each workpiece.In other words, maintaining cutting efficiency can allow higher cutting speed and therefore allow higher productivity ratio.
The inventor is surprised to find that, and contrary with conventional nozzle or hydro-peening line cleaning systems known in affiliated field, the interaction on porous solid particle and line surface can effectively be removed smear metal from the whole surface of line.In other words, important discovery is in this context, for example, entity contact between porous solid particle and line (, coated thread) or friction are one of the most effective modes that smear metal or particle are removed from line.In detail, porous solid particle can be easily around line, thereby smear metal and particle are removed from the whole surface of line, and this is contrary with stationary brush, and stationary brush can not realize line cleaning efficiency so thoroughly at any given time conventionally.
In addition, inventor's discovery, porous solid particle can not only clean coated thread, but utilizes best configuration can sharpen coated thread, thereby improves the cutting efficiency of coated thread and the oeverall quality of cutting.As shown in the results, also contribute to reduce the amount of conventionally utilizing conventional nozzle or hydro-peening cleaning systems to clean the cleaning fluid that line uses as the cleaning device of the line of clean scroll saw with porous solid particle.
In embodiment as herein described, be provided for the device of the line of clean scroll saw.Described cleaning device comprises the container particles filled by porous solid conventionally.Substantially, container can be completely particles filled by porous solid.But in further embodiment herein, container also can be filled by porous solid particulate fraction in the case of not losing the ability of its effective line that cleans scroll saw.In other words, the inner space of container can be by porous solid particles filled 10% to 95%, 30% to 90% or 55% to 85%.
In further embodiment herein, the container of cleaning device can comprise immobilization material before using for the first time.During cleaning procedure, this immobilization material can be broken down into fragment, and described fragment serves as porous solid particle as herein described.In other words, cleaning device can be submitted to client, in the container of described cleaning device, comprise immobilization material.Once cleaning device running, immobilization material is just decomposed into fragment as above.This is achieved easily and the transport of safety cleaning device.
The container of cleaning device generally includes at least one opening for allowing line enter container and contact with the porous solid particle entity in container.Substantially, porous solid particle is crossed or passed to coated thread.Porous solid particulate fraction or rub mutually around line and with the surface of line completely, thus remove any discarded particle or the residue smear metal that for example, had previously used the Sawing Process of coated thread from ().
Porous solid particle in container loosens, and that is to say, particle is relatively removable each other.This guarantees through always contacting with fresh porous solid particle entity in container or through one of container or more coated threads, so that the smear metal or the waste material that are attached to coated thread surface are effectively removed.By the movement of line, porous solid particle will move their position and be mixed with each other.Due to loose particles can be therefore easily around the line of internal tank, so this whole surf zone that can guarantee crossover track has superior cleaning effect.
Substantially, porous solid particle has diameter that can be in 1 μ m to 10mm, 10 μ m to 8mm or 50 μ m to 6mm scopes.The normally grains of sand of porous solid particle as herein described, the described grains of sand can comprise any rock in small, broken bits or mineral grain (for example, silica dioxide granule) and above-mentioned mixture.But the porous solid particle in embodiment described herein can also comprise the particle of being made up of any material in following material: sand, pottery, silicon, metal, plastics or its any combination.
Particle also can be formed and be applied by another kind of (such as pottery, silicon, metal, plastics or its any combination) by the class in previously mentioned material.In other words, the concrete composition of the porous solid particle in the container of cleaning device can through adjust to optimize or strengthening to the clean of line that will be clean or sharpen effect.The concrete shape (for example, oval, spherical or irregularly shaped) of porous solid particle also may affect clean or sharpen efficiency, and therefore also can correspondingly adjust.At this point, cleaning device can adapt to the type of line and needed clean or sharpen effect individually.
Conventionally, in embodiment herein, container comprises at least one opening, and described opening provides one or more lines of the porous solid particle leading in container.Substantially, allow one or more lines move through porous solid particle to remove surperficial any smear metal or the debris particle that may be attached to described one or more lines.One or more lines can enter and leave container from same opening.For example, many lines, for example 2 to 10 lines, 10 to 100 lines, 100 to 1000 lines or perhaps can simultaneously lead to the porous solid particle in container by least one opening of container more than 1000 lines.In other words, cleaning device can provide passage for many lines, and described many lines can move through the container of cleaning device in parallel with each other.
In the further embodiment of this paper, container can provide the entrance that leads to cleaning fluid supply system so that cleaning fluid to be provided.Cleaning fluid can provide by aforesaid at least one opening, maybe can provide by two or more openings in container.
Cleaning fluid supply system can comprise the pump for cleaning fluid is provided under pressure, and on the large surf zone of porous solid particle, distributes the nozzle of cleaning fluid.In embodiment herein, cleaning fluid supply system can be movably, maybe can provide multiple nozzles to guarantee the uniform distribution of container cleaning liquid inside.
Cleaning fluid can play cooling medium, the frictional heat producing for being dissipated in sawing or cleaning procedure center line.Conventionally, cleaning fluid further contributes to remove smear metal by porous solid particle from coated thread.
Substantially, comprise from the cleaning fluid of the smear metal of cleaned line and also can be removed from container.For such object, container can comprise another opening, and the cleaning fluid that comprises smear metal is subject to the impact of gravity or for example, is removed from described opening by effective aspirating mechanism (, comprising one or more pump).Then, smear metal can be by filter (for example, cross-flow filtration system, dead-end filtration system, stack filter, revolving filter, planar array filter etc.) or centrifuge (for example, rotary drum centrifuge decanter) is removed from cleaning fluid and the recovery for future through collection.Then can in cleaning device, recycle cleaning fluid.Therefore, cleaning device can comprise wieldy closed cleaning fluid loop, and described cleaning fluid loop makes cleaning fluid efficiency reach maximum and that cost is dropped to is minimum.
According to embodiment herein, cleaning fluid can be aqua type and be optionally conduction or nonconducting (more details vide infra).Cleaning fluid may further include one or more in following additive: anticorrisive agent (for the protection of scroll saw), bactericide, fungicide, pH buffer solution, surface tension remodeling agent and above-mentioned any combination.For example, in embodiment herein, cleaning fluid can comprise commercial product, wherein can use the mixture of a small amount of percentage, for example, and 5% clean cpd (soap) and be dissolved in the mixture of the defoamer of deionized water.In the further embodiment of this paper, cleaning fluid can comprise 2.5% clean cpd, 0.05% complexing agent, defoamer and the surfactant that (for example) contains 0.1% polymer.Wherein, complexing agent is used on certain material surface and reacts, and to prevent that other materials from depending on that surface, and surfactant can be used for changing surface tension.
The agent of surface tension remodeling for example, suppresses so-called pairing effect due to the capillary ability of their reduction () cleaning fluids conventionally, specific as follows.Many lines of operation that typical scroll saw uses in the groove of guide roller (a few tenths of millimeter) close to each other.Therefore the surface tension of the cleaning fluid of leaving on cleaned line can attract two adjacent lines, thereby causes unwelcome pairing effect, and described pairing effect may damage workpiece.Therefore,, by reducing the surface tension of sawing fluid, can reduce pairing effect.
In embodiment herein, when provide cleaning fluid in closed fluid system time, in cleaning fluid, the additive of any costliness can recycle after aforesaid smear metal is removed or filters, thereby further reduces running cost.
Generally speaking, the container of cleaning device described herein can have many different configurations, and some of them are configured in below and describe.For example, the container of cleaning device can comprise first, second, and third opening.Generally speaking, can line be imported in container by the first opening, can provide cleaning fluid by the second opening, and can line be derived outside container by the 3rd opening.For example, for example, but the container of cleaning device can be depending on that the special-purpose of container (, if simultaneously clean many lines) is same arranges opening still less (, one or two) or more than three openings.Generally speaking, the container of cleaning device can be set to the box of rectangle.For example, but it can be also the shape of () cylinder.
Substantially, according to embodiment herein, coated thread that be clean can 5m/s to 10m/s or the speed of 10m/s to 15m/s by the porous solid particle in the container of cleaning device.Porous solid particle rubs mutually with the surface of line in mobile, thereby any waste material or smear metal are removed from coated thread, clean and sharpen coated thread thus.According to the further aspect of the following stated, cleaning device can be through arranging to make cleaning device removable.
For example, in some embodiments herein, cleaning device can move through arranging with the direction along the moving direction (as understood herein, line cardinal principle moves along its longitudinal axis) that is different from one or more lines.The result that this class of cleaning device or cleaning device container moves guarantees that fresh porous solid particle offers the surface of one or more lines continuously, to ensure best clean and sharpen effect in the longer period.Substantially, in embodiment herein, also can expect, allow one or more lines in cleaning device, move (except they are along the movement of their longitudinal axis) to realize same aforementioned effect.
Therefore, generally speaking, can be with respect to the line movable cleaner moving along the longitudinal axis of line oneself, or can in the container of described cleaning device, move with respect to cleaning device the line moving along its longitudinal axis, or both situations occur simultaneously.In either case, the movement of described (cleaning device or line) conventionally can be along being different from the direction of line along the moving direction of its longitudinal axis, for example, and the moving direction perpendicular to line along its longitudinal axis.
At the embodiment that comprises this paper arranging for the scroll saw of sawing workpieces or scroll saw, cleaning device can be in the time arranging with the workpiece in movement by being pushed over sawing region by sawing moves with workpiece parallel in movement or along the direction parallel with workpiece in movement.Cleaning device can (for example) move along the direction of the moving direction perpendicular to workpiece.In embodiment, cleaning device can move along the direction of the axis direction that is different from the line in moving.Even if this movement of cleaning device also can be carried out in the case of the workpiece that will not cut.Therefore, cleaning device can clean coated thread in the time that workpiece is cut or during new workpiece is written into scroll saw or scroll saw layout.In addition, clean line (seeing following more details) when cleaning device also can stop moving online.
Cleaning device also can clean line in the situation that there is no scroll saw or in the situation that not having scroll saw to arrange.In such embodiment, cleaning device can be also movably with respect to the direction that moves axially of line.In detail, can describe as follows according to the moving direction of the cleaning device with respect to the line at least one movement of embodiment.
Clean or sharpen technique during or clean and sharpen technique during, can continuous moving cleaning device, so that the distance between inwall and the line of the cleaning device that moves axially direction that is parallel to line is continuously changed.In other words, suppose that line only moves along the axis direction of line, so can be along the special continuous moving cleaning device of the direction that moves axially direction that is different from line.This guarantee line always by fresh porous solid particle around, make like this clean of cleaning device and sharpen effect to reach best.
Generally speaking, the continuous moving of cleaning device can comprise: the position of the longitudinal axis that continuously changes line in the container of cleaning device.
In further embodiment as herein described, cleaning device can be along with respect to line or around the circular or oval route continuous moving of line, line itself may move through cleaning device along its axis direction.Substantially, cleaning device can be to move, with make line keep always by the porous solid particle in the container of cleaning device around.Depending on the shape of the container of cleaning device, also may remain unchanged during the contiguous circumferential of cleaning device or elliptic motion even if move through distance between the line of cleaning device and the inwall of cleaning device.
Herein further in embodiment, the container of cleaning device or cleaning device can be around the longitudinal axis rotation of the container of cleaning device or cleaning device self.Substantially, in the situation that cleaning device or container rotate by this way, line through location to be different from position along the center longitudinal axis of cleaning device or container by cleaning device or container.This specific movement of device or container can be independent of or carry out in conjunction with any movement in above-mentioned movement.
In other embodiments herein, cleaning device can comprise the device of the porous solid particle in the container for mixing cleaning device.This mixing arrangement can provide and be similar to as clean with respect to the bests of continuous moving cleaning device described one or more lines and sharpen effect above.Therefore, can provide mixing arrangement for mobile porous solid particle for static cleaning device.
In other words the cleaning device that, is fixed on ad-hoc location can be provided with mixing arrangement and be similar to realized clean and sharpen effect in the time using cleaning device movably or container to realize.In further embodiment, also can provide mixing arrangement for cleaning device movably.
In further embodiment herein, cleaning device can comprise voltage feeding unit, and described voltage feeding unit can be given the charging of porous solid particle, thereby improves the cleaning efficiency of cleaning device by improving the smear removal performance of cleaning device.
Further embodiment can comprise to porous solid particle and magnetizing.In embodiment herein, in the situation that porous solid particle is magnetized, the container of cleaning device can be made up of nonmagnetic substance.
In embodiment herein, if porous solid particle is charged, the container of cleaning device can be made up of the material of dielectric or electric insulation so.Substantially, the scroll saw or the scroll saw that newly assemble such cleaning device arrange also can have or new clothes distribution dielectric wire guide roller.May need scroll saw or scroll saw to arrange that work further changes, to contribute to the charging of porous solid particle and not to whole system charging or for preventing short circuit.
Fig. 1 is the schematic diagram of the exemplary means of the line of clean scroll saw.Cleaning device 100 comprises the container 110 of being filled by porous solid particle 111.Porous solid particle can comprise the particle of sand, pottery, silicon, metal, plastics and any combination thereof.Cleaning device comprises the first opening 115 substantially, and line (normally coated thread) can enter container 110 by the first opening 115.
Cleaning device 100 can further comprise cleaning fluid supply system 112, and cleaning fluid supply system 112 provides cleaning fluid 113 to the inside of container 110.For this purpose, container 110 can comprise the second opening 116, supplies cleaning fluid 113 by the second opening 116.Generally speaking, cleaning fluid 113 can contribute to smear metal to be removed from the surface of line 150, and described removal is that the Physical interaction by rubbing mutually between porous solid particle 111 and described line 150 surfaces is realized.
Conventionally, cleaning fluid is aqua type, and is therefore conducive to ecological.In embodiment herein, cleaning fluid can also play cooling agent.Thus, can dissipate from any heat of line, thereby make line cooling.Generally speaking, can use the cooling agent of any type, such as aqua type cooling agent, for example deionized water, and diethylene glycol (DEG) (diethylene glycol; Or polyethylene glycol (polyethyleneglycol DEG); PEG) fundamental mode cooling agent, but cooling agent can have high heat capacity, low viscosity, low cost, nontoxic, chemical inertness, and neither cause the corrosion that does not also promote cleaning device or line.Optionally, cooling agent can be conduction or nonconducting (being electrical insulator).In embodiment herein, can in cleaning fluid, (for example add different additives, corrosion inhibitor, bactericide, fungicide, pH buffer solution, the agent of surface tension remodeling) to improve the cleaning efficiency of cleaning device, and in order to prevent any damage to workpiece, line or cleaning device.
In embodiment herein, the container of cleaning device can comprise single opening substantially, and coated thread or many coated threads can enter cleaning device by described single opening, move through porous solid particle and exit cleaning device by same opening.In addition, clean supply system can provide cleaning fluid for internal tank by described identical opening.Optionally, container can further comprise the outlet that uses cleaning fluid for removing.Can filter the cleaning fluid having used, any debris particle of removing from coated thread can be collected whereby and be reclaimed.Then filtered cleaning fluid can recycle or be supplied to the container of cleaning device.Therefore, closed circuit cleaning fluid supply system can provide fresh cleaning fluid continuously for the inside of cleaning device.
In the further embodiment of this paper, the container of cleaning device can provide every line at least one opening, that is to say, clean at the same time and sharpen in the embodiment of this paper of many lines, the container of cleaning device can have at least one independent opening of every line or the opening (one group of line can for example comprise 2 to 10 lines, 10 to 100 lines, 100 to 1000 lines or more multi-thread) for one group of line.
In the illustrative embodiments shown in Fig. 1, cleaning device 100 comprises the 3rd opening 117, and clean line 150 can exit by the 3rd opening 117 container 110 of cleaning device 100.Therefore, generally speaking, line 150 that be clean moves through the porous solid particle 111 in the container 110 of cleaning device and exits described container 110 by the 3rd opening 117 from the first opening 115.By the Physical interaction between line and porous solid particle, clean line and effectively removed any smear metal on line.In addition, the surperficial sand grains that is attached to the coated thread that cleaning device will be clean also can be sharpened by porous solid particle.
Conventionally the speed that, line can 0 to 20m/s or 10 to 15m/s is through the porous solid particle in the container of cleaning device.Even if these clean rate at a high speed allow line also to be cleaned during Sawing Process.
Fig. 1 further illustrates workpiece 130 and the roller 140 that can be cut by the line 150 in movement, and roller 140 is guide line 150 substantially.Roller 140 generally includes for the accurate guide groove (not illustrating in the drawings) of guide line 150, even if thereby also allow high accuracy sawing in the time using the many lines that are arranged in close proximity to each other.Line, roller and workpiece are not a part for cleaning device as described herein conventionally.
Conventionally can not relying on any other device uses the cleaning device 100 shown in Fig. 1 for example, to clean coated thread (, diamond coated line).But in embodiment herein and as shown in part in Fig. 1, cleaning device also can be arranged in scroll saw.The scroll saw of wishing any type can newly assemble one or more cleaning device as herein described.
Conventionally, one or more cleaning device can or be set before the sawing region of scroll saw below, or in front and back, sawing region, one or more cleaning device be all set.In some Sawing Process, the high sawing degree of accuracy is primary, and thereby can before sawing region, provide cleaning device.Therefore, for example can effectively remove from guide roller or be arranged on any residual dirt particle on the coated thread of other devices before sawing region.In addition, the structure of cleaning device is simple and compact substantially, thereby allows easily to install or replacement part easily.
In Fig. 2, illustrate in greater detail the exemplary cross section 114 of Fig. 1.This cross section illustrate in greater detail porous solid particle be how can for example, with coated thread (, diamond coated line) thus surface interaction remove any waste material or smear metal from described diamond coated line.In other words, when coated thread 150(is along arrow indicated direction) while moving through porous solid particle 111, porous solid particle 111 is stirred and is rubbed mutually with the surface of coated thread 150, thereby removes smear metal or waste material 220 from the surface of coated thread 150.The surperficial sand grains 210 that is attached to coated thread also can be sharpened during described cleaning procedure.Conventionally, cleaning fluid 113 can be assisted the removal of smear metal 220 and the further effect such as the cooling of line or sterilization can be provided.
Fig. 3 illustrates the further embodiment of cleaning device as herein described.Cleaning device 300 shown in Fig. 3 comprises cleaning fluid supply system 112, and cleaning fluid supply system 112 is movably with respect to the container 110 of cleaning device 300.Four-headed arrow 310 represents the reciprocating motion of cleaning fluid supply system 112.But in embodiment herein further, cleaning fluid supply system can move along any direction of coordinate system (X, Y and Z) as shown in Figure 3.Generally speaking, the cleaning fluid supply system 112 in movement can guarantee that the homogeneous of cleaning fluid 113 in the whole container 110 of cleaning device 300 distributes.
Cleaning device 300 can further comprise the lid 118 with removable or interchangeable opening 116 alternatively.In lid 118, such opening can provide continuously for the cleaning fluid 113 of the cleaning fluid supply system 112 in movement the opening 116 of equal size.Provide and there is like this lid 118 that can be parallel to the opening 116 that movably cleaning fluid supply system 112 moves and can prevent that container 110 inside are by the environmental pollution around described container.
In addition, cleaning device shown in Figure 3 can comprise voltage feed unit 320, and voltage feed unit 320 charges to the porous solid particle 111 in the container 110 of cleaning device 300.Substantially, provide the cleaning device of such charging may look the provisioning request for the material type of porous solid particle to porous solid particle and use conduction cleaning fluid or nonconducting cleaning fluid.
Conventionally, use the scroll saw of such cleaning device or the part that scroll saw is arranged guide roller and the further electric insulation that can comprise electric insulation, to avoid short circuit or to prevent the electrical hazard to maintenance personal.The container of such cleaning device can be made up of dielectric substance, or at least its outside can cover with dielectric substance.In embodiment, at least the inside of container can be made up of conductive material, but its outside can be made up of non electrically conductive material.
Be not limited to any one embodiment in this paper embodiment, cleaning device may further include the mixing arrangement for stirring or mix porous solid particle.In the cleaning device 300 of Fig. 3, mixing arrangement 370 can be positioned at the container 110 of cleaning device 300.Optionally, mixing arrangement can be removable with respect to container 110.According to further embodiment of this paper, more than one mixing arrangement can be for the porous solid particle in the container of stirring cleaning device.
Cleaning device 400 shown in Figure 4 can comprise multiple cleaning fluid supply systems 112.Aforesaid multiple cleaning fluid supply system can be the single cleaning fluid supply system with single nozzles jointly, and described single nozzles homogeneous in the container 110 of cleaning device 400 distributes cleaning fluid 113.Optionally, also can be through arranging to make cleaning fluid supply system removable with respect to the container of cleaning device with the cleaning fluid supply system of multiple single nozzles.
In embodiment, the container 110 of cleaning device 400 can comprise container 110 is divided into two or fragmenting plate 410 or partition wall more than the independent compartment of two.In Fig. 4, three such compartments are illustrated as 420,430 and 440.Each compartment can comprise the porous solid particle of different sizes (namely having different-diameter).For example, the first compartment 420 can comprise the porous solid particle with the diameter that is greater than the particle in the second compartment 430, and particle in the second compartment 430 can comprise the porous solid particle with the diameter that is greater than the porous solid particle in the 3rd compartment 440.The layout of the such size classification of solid particle or grouping can be improved the clean of cleaning device 400 and sharpen effect.In addition, the porous solid particle in each compartment can be made from a variety of materials or apply.
In embodiment herein, each compartment also can comprise the mixture of the porous solid particle with different sizes, or compartment is from can putting upside down or change in the following manner to the hierarchical order of less bulk solids particle greatly: have after the compartment of larger grain size and can and then have the compartment compared with small particle size, then have compared with the compartment and then again after the compartment of small particle size with larger grain size.
In addition, independent compartment 420,430,440 can comprise independent cleaning fluid supply system 112.Each supply system in these supply systems can provide different cleaning fluids or comprise the cleaning fluid of different additive.Using different supply system in the situation that, so each supply system can be also closed loop system, that is to say, the cleaning fluid of a compartment can with another or another multiple compartment in cleaning fluid isolation.
Fig. 5 and Fig. 6 illustrate exemplary movable cleaning device 500.The container 110 of cleaning device 500 can parallel and is moved along the direction identical with the workpiece 130 that is pushed over sawing region during Sawing Process.Generally speaking, actuator 630 can contribute in container and cleaning device any one or boths' movement.Conventionally,, with respect to line travelling workpiece, line is along its longitudinal axis high-speed mobile.As shwon in Figures 5 and 6, workpiece 130 just along arrow 610 indicated with respect to line 150 substantially downward direction move (, workpiece just moves along the direction Y in coordinate system shown in figure).Similarly, the container of cleaning device also can move along the indicated direction downward with respect to line 150 of arrow 620 (, equally along direction Y).
Generally speaking, cleaning device 500 can move along the direction of the y direction that is different from line 150.This class of cleaning device moves guarantees that fresh porous solid particle, always round coated thread, that is to say, cleans and sharpen effect to maintain continuously optimum level.
The movement of cleaning device can be described according to the coordinate system with coordinate X, Y and Z in addition.For example, the longitudinal axis of line can be defined as X-axis.Conventionally, in this case, cleaning device can only not move along the direction that is parallel to X-axis, although in embodiment herein, depend on the configuration of cleaning device, such movement is possible.For example, comprise that at container described cleaning device is only possible along the movement of X-axis (as defined above) for the embodiment of the mixing arrangement of the porous solid particle in continuous mixer.
Generally speaking, cleaning device can be mobile along any combination of Y-axis and Z-direction or Y-axis and Z-direction (, with respect to the longitudinal axis level of line, vertically or not only level but also vertically) with respect to the longitudinal axis of line that is defined as X-direction.
Conventionally, in embodiment herein, the container 110 of cleaning device 100 can be through arranging to make terrestrial gravitation impel the smear metal of removing from cleaned line to shift to the bottom of container 110, and smear metal can be removed easily from the bottom of container 110 by outlet (these are not shown).In further embodiment, pump or suction system can be used for used cleaning fluid and smear metal easily to remove from the container of cleaning device, and no matter how (not shown) of terrestrial gravitation.
Fig. 7 and Fig. 8 illustrate the further embodiment of cleaning device.In exemplary cleaning device 700, container 110 can be filled with the cylinder of porous solid particle 111 or the shape of pipeline provides.Line 150 can be along its y direction by columniform container 110.Be not limited to this embodiment, columniform container 110 can move along figures, such as the figures 710 of the coated thread 150 in movement, thereby ensures that the porous solid particle 111 that can provide continuously fresh is to rub mutually with the surface of line 150.
In principle, as long as ensure the supply of fresh porous solid particle, any class of cleaning device moves (such as rotation or reciprocating motion) and all can expect.In other words, cleaning device can move along projected route or random path with respect to the coated thread of the container that moves through described cleaning device, to fresh porous solid particle is provided continuously to the surface of coated thread.
Fig. 9 illustrates according to the schematic diagram of the closed cleaning fluid loop 910 of the cleaning device of this paper embodiment.Cleaning device 100 can comprise import 930, provides fresh cleaning fluid by import 930 to the inside of cleaning device 100.Comprise any waste material of removing from line or the used cleaning fluid of smear metal and can leave cleaning device by exporting 940.
Then the cleaning fluid filter 920 of can flowing through, filter 920 separates smear metal or waste material (for example, carrying out in comfortable Sawing Process the silicon grain of the silicon ingot having been cut by line) with cleaning fluid.Can reclaim the smear metal being removed and recycle material to form new workpiece for further processing.This can reduce the total cost of production of for example Silicon Wafer.
Substantially, filter can comprise one or more filter or the centrifuge that can from cleaning fluid, remove smear metal.Additive in cleaning fluid can not be filtered off by filter 920.Because additive may be expensive, so this is achieved the efficient recycling that can further reduce costs.
In addition, filter 920 can comprise and is convenient to one or more pump 950 that cleaning fluid is carried around closed cleaning fluid loop 910.One or more pump also can be positioned at filter 920 outsides, for example, and at import 930 and/or outlet 940 places of cleaning device 100.
Figure 10 illustrates the layout of the scroll saw for cut workpiece 1000 according to this paper embodiment, and described scroll saw arranges that 1000 are suitable for cleaning and sharpening one or more lines of scroll saw.Scroll saw is arranged 1,000 four rollers 140 that comprise for guide line 150.Exemplary scroll saw is arranged 1,000 two sawing regions that comprise for two workpiece 130 of while sawing.Cleaning device 100 can be positioned at front and back, sawing region, is cleaned before cut workpiece and afterwards so that must be used for cutting the line of workpiece.
In Figure 10, in illustrated embodiment, scroll saw is arranged in 1000 can comprise six cleaning devices.But in the further embodiment of this paper, scroll saw is arranged and can be comprised from one to eight in any position or more cleaning devices, to maintain one or more sawing line chipless, for the high accuracy sawing in long-time process.For example, in embodiment, can use two cleaning devices, one is arranged in before sawing region, and another is after sawing region.In further embodiment, the number of the workpiece that the number of the cleaning device of use may equal to be cut simultaneously.
In the further embodiment of this paper, can be at least one cleaning device of cutting chamber disposed outside.Therefore, one or more lines can be before entering cutting chamber, namely in cutting chamber and for obtaining clean between drum and sharpening.One or more lines can, after exiting cutting chamber, namely be cleaned and be sharpened by one or more cleaning device between cutting chamber and take-up reel.
As previously mentioned, can process dividually with cutting technique (namely clean and sharpen) one or more lines.In this case, for example, one or more lines can not processed by cutting chamber by line is directly walked through being arranged in for one or more cleaning device between drum and take-up reel.
According to further embodiment herein, a kind ofly can comprise the porous solid particle in the container that makes coated thread move through cleaning device for method clean and that sharpen coated thread.
Conventionally,, during cleaning and sharpening technique, can make continuously coated thread move through the porous solid particle in container along the y direction of coated thread.But, in further embodiment, can make continuously coated thread move through porous solid particle along the direction of the y direction that is different from coated thread.
In further embodiment, the method that cleans and sharpen coated thread can comprise one or more workpiece of sawing.Conventionally, during Sawing Process, coated thread can continuous moving through the porous solid particle of at least one cleaning device.Optionally, line can move through the porous solid particle of two, four, five or more cleaning devices.In addition,, in embodiment herein, line can move through the porous solid particle of cleaning device the time during being different from sawing workpieces.
Substantially, in embodiment herein, described method can comprise that described line moves through the porous solid particle in container along being different from the direction movable cleaner of y direction of line or the container of cleaning device.For example, mode movable cleaner that can be reciprocal continuously or the container of cleaning device, to make fresh porous solid particle offer continuously the surface of coated thread.In further embodiment, the container of cleaning device or cleaning device can be along circular or oval route with circle or elliptical motion continuous moving.
In the further embodiment of this paper, method for clean line may further include the container that by cleaning fluid supply system, cleaning fluid is added to the cleaning device particles filled by porous solid, and filters possibly the used cleaning fluid of collecting from the described container of cleaning device.Optionally, in above-mentioned clean method, can be with respect to the vessel moving cleaning fluid supply system of cleaning device.Mobile cleaning fluid supply system can comprise that regular movement or continuous moving cleaning fluid supply system reach predetermined time quantum.
Optionally, in embodiment herein, can comprise the charging of porous solid particle or magnetize for the method for clean line.In further embodiment, above-mentioned clean method for example can comprise, by utilizing () mixing arrangement to mix or stirring the porous solid particle in the container of cleaning device.
System and method described above contributes to substantially for the clean of the line of scroll saw and sharpens.Described method is achieved the continuous precise sawing of workpiece, and the damage of the inaccurate location that substantially can prevent (for example) one or more sawing line to workpiece.If one or more groove of guide roller is blocked by smear metal or debris particle, may there is so the inaccurate location of one or more sawing line, described smear metal or debris particle may cause one or more lines to jump out groove in the worst case, thereby cause the even breaking-up of workpiece of remarkable inaccuracy in Sawing Process.Because the waste material of removing from the surface of one or more lines or the extra recovery of smear metal, can reduce the cost of each workpiece.In addition, because the simple structure of cleaning device can easily be carried out by maintenance, installation or the replacing of the parts that cause by the normal wear that uses described cleaning device to cause.Therefore, generally speaking, can be by running cost and line consumption with reduce each workpiece as the cleaning device of general introduction herein.
More than describe the illustrative embodiments of the system and method for the cleaning device that comprises the container particles filled by porous solid in detail.Described system and method is not limited to detailed description of the invention as herein described, but the assembly of system and the step of method can with other assemblies as herein described and step be independent and use dividually.For example, cleaning device can be for dividually line being cleaned with scroll saw, or one or more cleaning device can be arranged in during scroll saw or scroll saw arrange.Therefore, exemplary cleaning device as herein described can be from many different saw cutting systems in conjunction with implementing and utilizing.
Although the specific features of different embodiments of the present invention may be shown in some figure and not shown in other figure, this only for simplicity.According to principle of the present invention, any feature of an accompanying drawing can combine and carries out reference or advocate with any feature of any other figure.
This printed instructions utilizes example to disclose the present invention's (comprising best mode), and also makes any one of ordinary skill in the art can implement the present invention, comprises and manufactures and use any device or system and carry out any method being incorporated to.Although disclose different detailed description of the invention above, one of ordinary skill in the art will recognize, the equal effectively amendment of spirit and scope permission of claims.Particularly, the non-exclusive feature of above-mentioned embodiment can be interosculated.Scope of patenting of the present invention is defined by claims, and can comprise other examples of being expected by one of ordinary skill in the art.If these type of other examples have the constituent as broad as long with the literal wording of claims, if or they comprise and the literal wording of claims equivalent constructions composition without essence difference, think that they are in the scope of claims.
Claims (20)
1. the device (100,300,400,500,700) for the line (150) of the clean scroll saw that is suitable for sawing semiconductor workpiece (130), described device comprises:
The container (110) that comprises the first opening (115), wherein said container (110) is filled by porous solid particle (111), and through adjusting to make described line (150) and to pass through described porous solid particle (111) by described the first opening (115).
2. the device (100,300,400,500,700) of the line (150) for clean scroll saw as claimed in claim 1, it is characterized in that, described porous solid particle (111) is the particle of selecting from following list of materials: any combination of sand, pottery, silicon, metal, plastics or above-mentioned particle.
3. the device (100,300,400,500,700) of the line (150) for clean scroll saw as claimed in claim 1 or 2, is characterized in that, described porous solid particle (111) has the diameter of 1 μ m to 10mm.
4. the device (100,300,400,500,700) of the line (150) for clean scroll saw as claimed in claim 1 or 2, is characterized in that, described porous solid particle (111) has the diameter of 1 μ m to 8mm.
5. the device (100,300,400,500,700) of the line (150) for clean scroll saw as claimed in claim 1 or 2, is characterized in that, described device further comprises cleaning fluid supply system (112).
6. the device (100,300,400,500,700) of the line (150) for clean scroll saw as claimed in claim 5, it is characterized in that, described container (110) comprises the second opening (116) that is suitable for allowing to enter from the cleaning fluid (113) of described cleaning fluid supply system (112) described container (110).
7. the device (100,300,400,500,700) of the line (150) for clean scroll saw as claimed in claim 1 or 2, it is characterized in that, described device further comprises one or more device (320) for charging and magnetize to described porous solid particle (111).
8. the device (100,300,400,500,700) of the line (150) for clean scroll saw as claimed in claim 1 or 2, is characterized in that, described container (110) is movably.
9. the scroll saw for cutting semiconductor workpiece (130) is arranged (1000), comprising:
The scroll saw that comprises the line (150) that is suitable for sawing semiconductor workpiece (130), and
The device (100,300,400,500,700) of the described line (150) for clean described scroll saw as claimed in claim 1 or 2.
10. the scroll saw for cutting semiconductor workpiece as claimed in claim 9 is arranged (1000), it is characterized in that, the described line (150) that is suitable for sawing semiconductor workpiece (130) is diamond wire.
11. scroll saws for cutting semiconductor workpiece as claimed in claim 9 are arranged (1000), it is characterized in that, described porous solid particle (111) has the diameter of 1 μ m to 10mm.
12. scroll saws for cutting semiconductor workpiece as claimed in claim 9 are arranged (1000), it is characterized in that, described scroll saw arranges that (1000) further comprise cleaning fluid supply system (112).
13. scroll saws for cutting semiconductor workpiece as claimed in claim 9 are arranged (1000), it is characterized in that, described container (110) is movably.
The usage of the device (100,300,400,500,700) of 14. 1 kinds of lines (150) for clean scroll saw as claimed in claim 1 or 2, for cleaning and sharpen the line (150) of scroll saw by allowing described line (150) move through the interior described porous solid particle (111) of described container (110).
15. 1 kinds of scroll saws for cutting semiconductor workpiece (130) as claimed in claim 9 are arranged the usage of (1000), for clean and sharpen the line (150) of scroll saw by allowing described line (150) move through the interior porous solid particle (111) of described container (110).
16. 1 kinds of methods for the clean line (150) that is suitable for cutting semiconductor workpiece (130), described method comprises:
Allow described line (150) move through the described porous solid particle (111) in container as claimed in claim 1 or 2 (110).
17. methods for clean line (150) as claimed in claim 16, is characterized in that, described method further comprises by described line (150) cut workpiece (130).
18. the method for clean line (150) as claimed in claim 16, it is characterized in that, allow described line (150) move through described porous solid particle (111) in described container (110) comprise from the key element of following list any one or more: allow described line (150) along its axis direction continuous moving through described porous solid particle (111), and allow described line (150) along the direction continuous moving of axis direction that is different from it through described porous solid particle (111).
19. methods for clean line (150) as claimed in claim 16, it is characterized in that, described method further comprises with respect to described line (150) along being different from container (110) described in the direction continuous moving of described axis direction of the described line (150) in described container (110).
20. as in any one of the preceding claims wherein for cleaning the method for line (150), it is characterized in that, described method further comprise from the key element of following list any one or more: add cleaning fluid (113), magnetize to described porous solid particle (111) charging and to described porous solid particle (111) to described porous solid particle (111).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13153110.5A EP2759386A1 (en) | 2013-01-29 | 2013-01-29 | Device and method for cleaning the wire of a wire saw |
| EP13153110.5 | 2013-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103963182A true CN103963182A (en) | 2014-08-06 |
Family
ID=47628025
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310170827.2A Pending CN103963182A (en) | 2013-01-29 | 2013-05-10 | Device Used For Cleaning Line Of Fretsaw |
| CN201320251120.XU Expired - Fee Related CN203408935U (en) | 2013-01-29 | 2013-05-10 | Device used for cleaning line of fretsaw |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320251120.XU Expired - Fee Related CN203408935U (en) | 2013-01-29 | 2013-05-10 | Device used for cleaning line of fretsaw |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2759386A1 (en) |
| CN (2) | CN103963182A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109205384A (en) * | 2017-07-07 | 2019-01-15 | 梅耶博格（瑞士）股份公司 | The method of winding cutting wire material |
| CN112536477A (en) * | 2020-11-12 | 2021-03-23 | 浙江工业大学 | Electrostatic spraying diamond wire saw cutting machine with saw wire cleaning device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108407117A (en) * | 2018-05-23 | 2018-08-17 | 江苏聚成金刚石科技有限公司 | A kind of slicer improving diamond wire chipping qualities |
| CN114309808A (en) * | 2020-10-09 | 2022-04-12 | 广东博智林机器人有限公司 | Cutting device |
| BE1030326B1 (en) * | 2022-03-10 | 2023-10-09 | Smo Bvba | SYSTEM FOR COOLING AND CONTROLLING A CUTTING WIRE |
| CN116587451B (en) * | 2023-06-21 | 2024-01-26 | 苏州博宏源机械制造有限公司 | Semiconductor wafer material processing device and method |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN203408935U (en) | 2014-01-29 |
| EP2759386A1 (en) | 2014-07-30 |
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Application publication date: 20140806 |