CN103937413A - Aluminum oxide polishing solution for alloy polishing and preparation method thereof - Google Patents
Aluminum oxide polishing solution for alloy polishing and preparation method thereof Download PDFInfo
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- CN103937413A CN103937413A CN201410106753.0A CN201410106753A CN103937413A CN 103937413 A CN103937413 A CN 103937413A CN 201410106753 A CN201410106753 A CN 201410106753A CN 103937413 A CN103937413 A CN 103937413A
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Abstract
The invention provides an aluminum oxide polishing solution for alloy polishing. The aluminum oxide polishing solution contains the following components by mass: 1-40% of aluminum oxide, 0.2-1% of a surfactant polyacrylic acid, 0.2-2% of a corrosion inhibitor disodium hydrogen phosphate, 1-10% of a pH regulator, and 48-97.6% of deionized water. The aluminum oxide can be alpha aluminum oxide, the average particle size is 200-10000 nanometers, and the pH range of the polishing solution is preferably 2-4. The polishing solution is used for aluminum alloy or stainless steel substrate polishing, and can quickly realize alloy surface planarization.
Description
Technical field
The present invention relates to the electronic product such as mobile phone, computer surface and manufacture polishing technology field, be specifically related to a kind of alumina polishing solution and preparation method thereof, described polishing fluid is for the polished finish of alloy substrates.
Background technology
In recent years, the application of metal alloy in the electronic product fields such as phone housing, computer casing and frame was more and more.In these application, the training of metal alloy hair is all generally first to cut into the just work in-process of tool shape through the cutter in numerically-controlled machine tool, and then reaches mirror effect after the complete processings such as a few step surface grinding polishings.Through the aluminum alloy surface of cutter cutting, there are a large amount of knife marks, i.e. macroscopical cut.Realize overall planarization and the mirror effect of aluminum alloy surface, chemically machinery polished is current unique method can be mass-produced.In general, first polish away knife mark through the oarse-grained polishing fluid that contains hard, and then realize finish plate through containing soft short grained polishing fluid polishing.The oarse-grained polishing fluid of hard generally has alumina polishing solution and diamond polishing liquid, but always there will be clearance deficiency or scratch more phenomenon.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of alumina polishing solution for alloy polishing and preparation method thereof, for alloy substrates polishing, this polishing fluid can reduce the crystallization of silicon oxide, thereby reduces aluminium alloy or stainless steel surface scuffing and cut.
First the present invention discloses a kind of alumina polishing solution for alloy polishing, comprises each component of following quality percentage composition:
Described tensio-active agent is polyacrylic acid, sodium lauryl sulphate, a kind of or its arbitrary composition in sodium diphenylaminesulfonate.
Described aluminum oxide is α-aluminum oxide, and the median size of described aluminum oxide is 200-10000 nanometer.
Described inhibiter is Sodium phosphate dibasic, acetic acid, oxalic acid, benzotriazole, thiocarbamide and glyoxal ethyline, the combination of one or several in 2 isopropyl imidazole.
Described pH adjusting agent is alkaline organic amine or organic acid, alkaline organic amine as in triethylamine and diisobutyl amine at least one, organic acid as in ethylenediamine tetraacetic acid (EDTA) and citric acid at least one.
The pH scope of described polishing fluid is 2-11, is preferably 2-4.
The present invention also provides the preparation method of an above-mentioned alumina polishing solution for alloy polishing, comprises the steps:
1) weigh respectively each component by formula;
2) in described deionized water, add described tensio-active agent, stir, obtain mixture one;
3) then in mixture one, add inhibitors of dibasic sodium phosphate, stir, obtain mixture two;
4) in mixture two, add pH adjusting agent, be adjusted to desired pH, stir, obtain described alumina polishing solution.
Beneficial effect of the present invention is:
Alumina polishing solution of the present invention, can reduce the crystallization of silicon oxide, thereby avoid aluminium alloy in the time of polishing, scratch aluminium alloy or stainless steel surface and produce cut, its formula is simple, raw material is cheap and easy to get, is worthy to be popularized and is widely used in the electronic product such as mobile phone, computer to manufacture polishing field.
Embodiment
Embodiment 1: a kind of alumina polishing solution for alloy polishing, comprises each component of following quality percentage composition:
Described tensio-active agent is polyacrylic acid.
Described aluminum oxide is α-aluminum oxide, and the median size of described aluminum oxide is 200 nanometers.
Described inhibiter is Sodium phosphate dibasic.
Described pH adjusting agent is the mixture of triethylamine and ethylenediamine tetraacetic acid (EDTA).
The preparation method who uses above-mentioned materials to make the alumina polishing solution of described alloy polishing, comprises the steps:
1) weigh respectively each component by formula;
2) in described deionized water, add described tensio-active agent polyacrylic acid, stir, obtain mixture one;
3) then in mixture one, add inhibitors of dibasic sodium phosphate, stir, obtain mixture two;
4) in mixture two, add pH adjusting agent, regulating pH value is 2-4, stirs, and obtains described alumina polishing solution.
Embodiment 2: a kind of alumina polishing solution for alloy polishing, comprises each component of following quality percentage composition:
Described tensio-active agent is the mixture of polyacrylic acid and sodium lauryl sulphate.
Described aluminum oxide is α-aluminum oxide, and the median size of described aluminum oxide is 500 nanometers.
Described inhibiter is Sodium phosphate dibasic.
Described pH adjusting agent is diisobutyl amine.
The preparation method who uses above-mentioned materials to make the alumina polishing solution of described alloy polishing, comprises the steps:
1) weigh respectively each component by formula;
2) in described deionized water, add described tensio-active agent, stir, obtain mixture one;
3) then in mixture one, add inhibitors of dibasic sodium phosphate, stir, obtain mixture two;
4) in mixture two, add pH adjusting agent, regulating pH value is 9-10, stirs, and obtains described alumina polishing solution.
Utilize polishing machine to use above-mentioned alumina polishing solution to carry out polishing to aluminium alloy substrate, all can obtain bright and clean eyeglass effect, reach extraordinary polishing effect, avoid aluminium alloy in the time of polishing, scratch aluminium alloy or stainless steel surface and produce cut, can be widely used in the electronic product such as mobile phone, computer and manufacture polishing field.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, its framework form can be flexible and changeable, can subseries product.Just make some simple deduction or replace, all should be considered as belonging to the present invention by the definite scope of patent protection of submitted to claims.
Claims (6)
1. for an alumina polishing solution for alloy polishing, it is characterized in that, comprise each component of following quality percentage composition:
Described tensio-active agent is polyacrylic acid, sodium lauryl sulphate, a kind of or its arbitrary composition in sodium diphenylaminesulfonate.
2. the alumina polishing solution for alloy polishing as claimed in claim 1, is characterized in that, described aluminum oxide is α-aluminum oxide, and the median size of described aluminum oxide is 200-10000 nanometer.
3. the alumina polishing solution for alloy polishing as claimed in claim 1, is characterized in that, described inhibiter is Sodium phosphate dibasic, acetic acid, oxalic acid, benzotriazole, thiocarbamide and glyoxal ethyline, the combination of one or several in 2 isopropyl imidazole.
4. the alumina polishing solution for alloy polishing as claimed in claim 1, it is characterized in that, described pH adjusting agent is alkaline organic amine or organic acid, alkaline organic amine as in triethylamine and diisobutyl amine at least one, organic acid as in ethylenediamine tetraacetic acid (EDTA) and citric acid at least one.
5. the alumina polishing solution for alloy polishing as claimed in claim 1, is characterized in that, the pH scope of described polishing fluid is 2-11, is preferably 2-4.
6. the preparation method of the alumina polishing solution for alloy polishing as described in claim 1-4 any one, is characterized in that, comprises the steps:
1) weigh respectively each component by formula;
2) in described deionized water, add described tensio-active agent, stir, obtain mixture one;
3) then in mixture one, add inhibitors of dibasic sodium phosphate, stir, obtain mixture two;
4) in mixture two, add pH adjusting agent, be adjusted to desired pH, stir, obtain described alumina polishing solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410106753.0A CN103937413A (en) | 2014-03-21 | 2014-03-21 | Aluminum oxide polishing solution for alloy polishing and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410106753.0A CN103937413A (en) | 2014-03-21 | 2014-03-21 | Aluminum oxide polishing solution for alloy polishing and preparation method thereof |
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| CN103937413A true CN103937413A (en) | 2014-07-23 |
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| CN201410106753.0A Pending CN103937413A (en) | 2014-03-21 | 2014-03-21 | Aluminum oxide polishing solution for alloy polishing and preparation method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104342704A (en) * | 2014-10-20 | 2015-02-11 | 苏州大学 | Oxidizing agent-free alkaline aluminum alloy polishing liquid and preparation method thereof |
| CN104449397A (en) * | 2014-10-30 | 2015-03-25 | 青岛昌安达药业有限公司 | Stable mechanical equipment polishing solution |
| CN106283059A (en) * | 2016-08-10 | 2017-01-04 | 惠州市米特仑科技有限公司 | A kind of metal surface alumina polishing solution and preparation method thereof |
| CN106479371A (en) * | 2016-08-15 | 2017-03-08 | 惠州市米特仑科技有限公司 | A kind of high precision composite polishing liquid and preparation method thereof |
| CN106497435A (en) * | 2016-10-21 | 2017-03-15 | 过冬 | A kind of Metallographic Analysis polishing fluid and preparation method thereof, using method |
| CN106566413A (en) * | 2016-10-28 | 2017-04-19 | 扬州翠佛堂珠宝有限公司 | Sapphire polishing solution |
| CN106884169A (en) * | 2017-04-24 | 2017-06-23 | 江苏食品药品职业技术学院 | A kind of polishing fluid for accurate stainless steel parts and preparation method thereof |
| CN107699138A (en) * | 2017-10-31 | 2018-02-16 | 诺土（上海）新材料技术有限公司 | A kind of preparation method of the alumina polishing solution of water-based controlled particle size |
| CN111537304A (en) * | 2020-05-15 | 2020-08-14 | 宁波锦越新材料有限公司 | Sample preparation method for Al-Li-Cu alloy and sample |
| CN113444456A (en) * | 2021-06-29 | 2021-09-28 | 广西立之亿新材料有限公司 | Polishing solution for stainless steel surface processing, preparation method and polishing process |
| CN115746713A (en) * | 2022-12-07 | 2023-03-07 | 安徽大学 | High stability suspension property Al 2 O 3 Polishing solution and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1667076A (en) * | 2003-12-22 | 2005-09-14 | 上村工业株式会社 | Polishing solution and method of polishing nonferrous metal materials |
| CN101831244A (en) * | 2010-05-10 | 2010-09-15 | 上海高纳粉体技术有限公司 | High-precision alumina polishing solution and preparation method thereof |
| CN102181232A (en) * | 2011-03-17 | 2011-09-14 | 清华大学 | Composition for low downforce chemically mechanical polishing of coppers in ULSI (Ultra Large Scale Integrated Circuit) multi-layered copper wiring |
-
2014
- 2014-03-21 CN CN201410106753.0A patent/CN103937413A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1667076A (en) * | 2003-12-22 | 2005-09-14 | 上村工业株式会社 | Polishing solution and method of polishing nonferrous metal materials |
| CN101831244A (en) * | 2010-05-10 | 2010-09-15 | 上海高纳粉体技术有限公司 | High-precision alumina polishing solution and preparation method thereof |
| CN102181232A (en) * | 2011-03-17 | 2011-09-14 | 清华大学 | Composition for low downforce chemically mechanical polishing of coppers in ULSI (Ultra Large Scale Integrated Circuit) multi-layered copper wiring |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104342704A (en) * | 2014-10-20 | 2015-02-11 | 苏州大学 | Oxidizing agent-free alkaline aluminum alloy polishing liquid and preparation method thereof |
| CN104449397A (en) * | 2014-10-30 | 2015-03-25 | 青岛昌安达药业有限公司 | Stable mechanical equipment polishing solution |
| CN106283059A (en) * | 2016-08-10 | 2017-01-04 | 惠州市米特仑科技有限公司 | A kind of metal surface alumina polishing solution and preparation method thereof |
| CN106479371A (en) * | 2016-08-15 | 2017-03-08 | 惠州市米特仑科技有限公司 | A kind of high precision composite polishing liquid and preparation method thereof |
| CN106497435A (en) * | 2016-10-21 | 2017-03-15 | 过冬 | A kind of Metallographic Analysis polishing fluid and preparation method thereof, using method |
| CN106566413A (en) * | 2016-10-28 | 2017-04-19 | 扬州翠佛堂珠宝有限公司 | Sapphire polishing solution |
| CN106884169A (en) * | 2017-04-24 | 2017-06-23 | 江苏食品药品职业技术学院 | A kind of polishing fluid for accurate stainless steel parts and preparation method thereof |
| CN107699138A (en) * | 2017-10-31 | 2018-02-16 | 诺土（上海）新材料技术有限公司 | A kind of preparation method of the alumina polishing solution of water-based controlled particle size |
| CN111537304A (en) * | 2020-05-15 | 2020-08-14 | 宁波锦越新材料有限公司 | Sample preparation method for Al-Li-Cu alloy and sample |
| CN111537304B (en) * | 2020-05-15 | 2023-09-29 | 宁波锦越新材料有限公司 | Sample preparation method and sample for Al-Li-Cu series deformation alloy |
| CN113444456A (en) * | 2021-06-29 | 2021-09-28 | 广西立之亿新材料有限公司 | Polishing solution for stainless steel surface processing, preparation method and polishing process |
| CN115746713A (en) * | 2022-12-07 | 2023-03-07 | 安徽大学 | High stability suspension property Al 2 O 3 Polishing solution and preparation method thereof |
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Application publication date: 20140723 |
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