CN103936989A - Polyimide structure and polyimide resin composition - Google Patents
Polyimide structure and polyimide resin composition Download PDFInfo
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- CN103936989A CN103936989A CN201310122597.2A CN201310122597A CN103936989A CN 103936989 A CN103936989 A CN 103936989A CN 201310122597 A CN201310122597 A CN 201310122597A CN 103936989 A CN103936989 A CN 103936989A
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- 239000000203 mixture Substances 0.000 title abstract description 7
- 229920001721 polyimide Polymers 0.000 title abstract 5
- 239000004642 Polyimide Substances 0.000 title abstract 3
- 239000009719 polyimide resin Substances 0.000 title abstract 2
- -1 polyol compound Chemical class 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229920005862 polyol Polymers 0.000 claims description 7
- 150000007530 organic bases Chemical class 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 4
- 150000008065 acid anhydrides Chemical class 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000000962 organic group Chemical group 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 28
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 14
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 150000002009 diols Chemical class 0.000 description 7
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229930188620 butyrolactone Natural products 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- AXFVIWBTKYFOCY-UHFFFAOYSA-N 1-n,1-n,3-n,3-n-tetramethylbutane-1,3-diamine Chemical compound CN(C)C(C)CCN(C)C AXFVIWBTKYFOCY-UHFFFAOYSA-N 0.000 description 1
- LCANECIWPMDASZ-UHFFFAOYSA-N 2-isocyanatoethanol Chemical compound OCCN=C=O LCANECIWPMDASZ-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- BVURNMLGDQYNAF-UHFFFAOYSA-N dimethyl(1-phenylethyl)amine Chemical compound CN(C)C(C)C1=CC=CC=C1 BVURNMLGDQYNAF-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000012407 engineering method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ABMDIECEEGFXNC-UHFFFAOYSA-N n-ethylpropanamide Chemical compound CCNC(=O)CC ABMDIECEEGFXNC-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N tetrahydropyridine hydrochloride Natural products C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Epoxy Resins (AREA)
Abstract
The invention provides a polyimide structure and a polyimide resin composition, wherein the polyimide structure comprises structural units represented by a formula 1, a formula 2 and a formula 3. -R1- (formula 1)The bonds between the structural units represented by the above formulas 1, 2 and 3 are selected from the group consisting of structural units represented by formulas 4 to 9 and any combination thereof,wherein R is1And R3Each independently is a divalent organic radical; r2Is a trivalent organic radical; r4A tetravalent organic group having 4 or more than 4 atoms; a is 1 to 100; r1And R2In a weight ratio of 950/50 to 999/1; r5To R13Each independently is a divalent organic radical; b to i are each independently 1 to 100.
Description
Technical field
The present invention relates to a kind of pi structure and pi resin combination, relate in particular to a kind of pi structure and pi resin combination with good acidproof heat-proof.Background technology
Printed circuit board (PCB) (Printed circuit board, PCB), claims again printed-wiring board (PWB) (Printed wire board, PWB).Printed circuit board (PCB) is the supporter of electronic component, is also the supplier that electronic element circuit connects.Traditional circuit card, adopts the engineering method of printing etching resist, makes circuit and the drawing of circuit, is therefore called as printed circuit board (PCB) or printed-wiring board (PWB).Because the continuous microminiaturization of electronic product is with becoming more meticulous, the circuit card of most is all to adopt to attach etching resist (press mold or coating), after exposure imaging, then makes circuit card with etching.
Technicalization electronic product emphasize compact, can roll under flexible trend, start to develop flexible printed wiring board (Flexible Printed Circuit, FPC), claim again soft board.Flexible printed wiring board has the characteristics such as light weight, thin little, flexible, low voltage, low consumpting power.Can be used in the fields such as computer and perimeter equipment, communication product, consumption electronic products, automobile, military affairs.Flexible printed wiring board can be divided into printed wiring (Printed Circuit), lead (Lead Line), junctor (Connector), Multifunctional whole assembly system (Integration of Function) four large classes according to its function.
In general, printed circuit board (PCB) is comprised of insulating substrate, solid and copper conductor.Conventionally the electronic components such as IC wafer, electric capacity, resistance of also can arranging in pairs or groups, so that electronic product performance function.Because the base material of flexible printed wiring board is soft plastic cement insulation layer, therefore have deflection, light, can quantity-produced characteristic, its processing procedure difficulty is high compared with hardboard.Generally speaking, when making after circuit with copper conductor, for preventing that copper wire oxidation and protection circuit from avoiding the impact of envrionment temperature and humidity, can in copper wire, cover one deck resin combination and using as protective layer.Therefore, above-mentioned resin combination should have good acidproof heat-proof, to guarantee that printed circuit board (PCB) maintains its good electrical properties (electrical characteristics).
Summary of the invention
The invention provides a kind of pi structure, it has good acidproof heat-proof.
The invention provides a kind of pi resin combination, it comprises above-mentioned pi structure, therefore has good acidproof heat-proof.
The present invention proposes a kind of pi structure, and it comprises suc as formula 1 represented structural unit, suc as formula 2 represented structural units and suc as formula 3 represented structural units.
-R
1-(formula 1)
Suc as formula 1 represented structural unit, suc as formula 2 represented structural units and suc as formula the bond between 3 represented structural units, it is the group that selects free style 4 to the represented structural unit of formula 9 and arbitrary combination thereof to form.
Wherein, R
1and R
3independent is separately divalent organic base; R
2for trivalent organic radical; R
4for thering is the quadrivalent organic radical of 4 or 4 above atoms; A is 1 to 100; R
1and R
2weight ratio be 950/50 to 999/1; R
5to R
13independent is separately divalent organic base; B to i is independently 1 to 100 separately.
In one embodiment of this invention, above-mentioned R
2residue for polyol compound.
In one embodiment of this invention, above-mentioned polyol compound is selected from one of them or its combination of 1,1,1-TriMethylolPropane(TMP) and glycerol.
In one embodiment of this invention, the weight average molecular weight of above-mentioned pi structure (weight-average molecular weight) is 10000 to 40000, is more preferred from 10000 to 30000.
In one embodiment of this invention, above-mentioned R
1and R
2weight ratio be 970/30 to 999/1.
In one embodiment of this invention, the weight average molecular weight of above-mentioned pi structure is 17000 to 19000, and the volume ratio of pi structure and a solvent is 60/40 o'clock, and its range of viscosities is 35 to 45Pas.
In one embodiment of this invention, the bond between the structural unit formula 1 of above-mentioned pi structure, formula 2 and formula 3 is the group that selects free style 4 to the represented structural unit of formula 9 and arbitrary combination thereof to form.
In one embodiment of this invention, the bond between the structural unit formula 1 of above-mentioned pi structure, formula 2 and formula 3 is the group that selects free style 5 and the represented structural unit of formula 6 and arbitrary combination thereof to form.
In one embodiment of this invention, the bond between the structural unit formula 1 of above-mentioned pi structure, formula 2 and formula 3 is the represented structural unit of formula 5.
The present invention reintroduces a kind of pi resin combination, and it comprises above-mentioned pi structure and epoxy resin, and wherein the end of pi structure is acid anhydrides or carboxyl.
In one embodiment of this invention, the weight ratio of above-mentioned pi structure and epoxy resin is 10: 1 to 1000: 1.
Based on above-mentioned; pi resin combination of the present invention has good acidproof heat-proof; therefore can be used as the protective layer of printed circuit board (PCB); to avoid copper wire on printed circuit board (PCB) that the problem of oxidation occurs, or avoid copper wire on printed circuit board (PCB) to be subject to the impact of envrionment temperature and humidity.Thus, can make printed circuit board (PCB) there is good electrical properties.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below is described in detail below.
Embodiment
The present invention proposes a kind of pi structure and pi resin combination.Pi structure of the present invention has good hot acid thermotolerance, therefore comprises that the resin combination of this pi structure also has good acidproof heat-proof.Hold above-mentioned; pi resin combination of the present invention can be applicable in printed circuit board (PCB) processing procedure; after coating the substrate of printed circuit board (PCB) and the surface of line layer; form the protective layer of printed circuit board (PCB), to avoid temperature in environment and humidity to impact printed circuit board (PCB) and make the not good problem of electrical properties of printed circuit board (PCB).
Synthetic pi structure
First, solvent, diatomic alcohol compounds, polyol compound are mixed with isocyanate compound, under the existence of catalyst, under the condition in temperature greater than or equal to 50 degree Celsius, react 1 to 8 hour, to form the first product.The first product comprises that end has the compound of isocyanate group.Polyol compound is for example trivalent alcohol compound.In the present embodiment, diatomic alcohol compounds and trivalent alcohol compound all can react with isocyanate compound, and form the compound that end has isocyanate group.
In the present embodiment, diatomic alcohol compounds refers to the compound at two ends with hydroxyl, and it is for example polylactone glycol (polylactone diol), polyether glycol (polylether diol), polycarbonate diol (polycarbonate diol), polyester glycol (polyester diol) or ethylene glycol (diol).Polylactone glycol can be selected from commercially available product Perstorp capa 2077A, Perstorp capa 2200A or Perstorp capa 2302.Polyether glycol can be selected from commercially available product PTMEG 1000 or PTMEG 2000.Polycarbonate diol can be selected from commercially available product UBE UM-90.
In the present embodiment, trivalent alcohol compound is for example that 1,1,1-TriMethylolPropane(TMP), glycerol or polylactone triol (polylactone triol) or other have the compound of three hydroxyls.Polylactone triol can be selected from commercially available product Perstorp capa 3031.
In the present embodiment, isocyanate compound is for example 2-isocyanato ethanol (2-isocyanatoethanol), benzene-2,4-vulcabond, six is stretched methyl vulcabond, Toluene-2,4-diisocyanate, 6-vulcabond, isophorone diisocyanate, diphenylmethanediisocyanate or other applicable diisocyanate cpds.
In the present embodiment, solvent is for example N, N '-diethylformamide, N, N '-dimethyl formamide, N, N '-diethyl acetamide, dimethyl sulfoxide (DMSO), diethyl sulfoxide, METHYLPYRROLIDONE, gamma-butyrolactone, pimelinketone, diglyme, triglyme, propylene glycol monoethyl ether acetate or above-mentioned arbitrary combination.
In the present embodiment, catalyst be for example benzyl dimethylamine, the 3rd amine as tetramethyl butane diamine, trolamine, N, N '-dimethyl hexahydropyridine, triethylamine, α-methylbenzyl dimethylamine, N-methyl good fortune quinoline and Triethylene Diamine.In addition, also can use organometallic compound as catalyst, it is for example dibutyl tin laurate, tin methide dichloride, naphthenic acid zinc, above-mentioned arbitrary combination or other applicable organometallic compounds.
Then, the first product is mixed with anhydride compound, in temperature, under the condition of 100° centigrade to 180 degree, react 3 hours to 20 hours to form pi structure.The end of above-mentioned pi structure has acid anhydrides or carboxyl.
In the present embodiment, anhydride compound is for example burnt melitic dicarboxylic anhydride, 5-(2,5-diketo tetrahydrofuran base)-3-methyl-cyclohexyl alkene-1,2-dicarboxylic anhydride benzophenone tetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride or naphthalene tetracarboxylic dianhydride.
Synthetic pi resin combination
The pi resin combination that above-mentioned pi structure is mixed to form to the present embodiment with epoxy resin, wherein the weight ratio of pi structure and epoxy resin is 10: 1 to 1000: 1.Should be noted that, the pi resin combination of the present embodiment is the kind of stop collar epoxy resins not, and this field has knows that the knowledgeable can select applicable epoxy resin on demand voluntarily conventionally.
Pi structure
Pi structure of the present invention comprises suc as formula 1 represented structural unit, suc as formula 2 represented structural units and suc as formula 3 represented structural units.
-R
1-(formula 1)
Suc as formula 1 represented structural unit, suc as formula 2 represented structural units and suc as formula the bond between 3 represented structural units, it is the group that selects free style 4 to the represented structural unit of formula 9 and arbitrary combination thereof to form.
Hold above-mentionedly, the represented structural unit of formula 1 can be from diol compound, and it is for example polylactone glycol, polyether glycol, polycarbonate, polyester glycol or ethylene glycol.The represented structural unit of formula 2 can be from three alkylol cpds, and it is for example polylactone triol.The represented structural unit of formula 3 can react from the compound of vulcabond the bond structure forming with anhydride compound, or the represented structural unit of formula 3 can react the bond structure forming from quadrol (diamine) with anhydride compound.
Wherein, R
1and R
3independent is separately divalent organic base; R
2for trivalent organic radical; R
4for thering is the quadrivalent organic radical of 4 or 4 above atoms; A is 1 to 100; R
1and R
2weight ratio be 950/50 to 999/1; R
5to R
13independent is separately divalent organic base; B to i is independently 1 to 100 separately.
Hold above-mentionedly, formula 4 to the represented structural unit of formula 9 is in synthetic pi configuration process, by reacting formed bond structure between diatomic alcohol compounds, trivalent alcohol compound, isocyanate compound, anhydride compound or above-mentioned arbitrary combination.
For example, the represented structural unit of formula 4 is for example from 2-isocyanato ethanol.The represented structural unit of formula 5 is for example to react formed bond structure between diisocyanate cpd and diol compound.The represented structural unit of formula 6 is for example from polylactone glycol.The represented structural unit of formula 7 is for example to react formed bond structure between diol compound and succinic acid (diacid).The represented structural unit of formula 8 is for example from polyether glycol.The represented structural unit of formula 9 is for example from diol compound.
In the present embodiment, the weight average molecular weight of above-mentioned pi structure is 10000 to 40000.In one embodiment, the weight average molecular weight of above-mentioned pi structure is for example 17000 to 19000, and when the volume ratio of pi structure and solvent is 60/40, and its range of viscosities is 35 to 45Pas.
In addition, above-mentioned R
2for the residue of polyol compound, wherein above-mentioned polyol compound is for example one of them or its combination of 1,1,1-TriMethylolPropane(TMP) and glycerol.In the present embodiment, above-mentioned R
1and R
2weight ratio be 970/30 to 999/1.
Particularly, due to the R in formula 2
2structure can there are three bonds, so it can provide nonlinear bond mode, so that pi structure has cross-linked network bond.In other words, when the content of the structural unit of formula 2 is higher, can further improve the crosslinking degree of pi structure.Thus, pi structure is not vulnerable to the impact of acid and temperature and produces fracture, and then improves the acidproof heat-proof of pi structure.
In the present embodiment, the bond between the structural unit formula 1 of above-mentioned pi structure, formula 2 and formula 3 is for example the group that selects free style 4 to the represented structural unit of formula 9 and arbitrary combination thereof to form.Yet, the invention is not restricted to this.In one embodiment, the bond between the structural unit formula 1 of above-mentioned pi structure, formula 2 and formula 3 is for example the group that selects free style 5 and the represented structural unit of formula 6 and arbitrary combination thereof to form.In another embodiment, the bond between the structural unit formula 1 of above-mentioned pi structure, formula 2 and formula 3 is for example the represented structural unit of formula 5.
Pi resin combination
The present invention reintroduces a kind of pi resin combination, and it comprises above-mentioned pi structure and epoxy resin, and wherein the end of pi structure is acid anhydrides or carboxyl.In one embodiment, the part by weight of above-mentioned pi structure and epoxy resin is as being 10: 1 to 1000: 1.
From the above, the present invention proposes a kind of pi structure, and it has good crosslinking degree, is not therefore vulnerable to the impact of temperature and acid.In addition, the present invention more proposes a kind of pi resin combination, and it comprises above-mentioned pi structure, thereby has good acidproof heat-proof.Therefore; pi resin combination of the present invention can be applicable in printed circuit board (PCB) processing procedure; after coating the substrate of printed circuit board (PCB) and the surface of line layer; form the protective layer of printed circuit board (PCB), to avoid temperature in environment and humidity to impact printed circuit board (PCB) and make the not good problem of electrical properties of printed circuit board (PCB).
Experimental example
To the making method of pi structure of the present invention be described with experimental example 1 below.First, by Perstorp Capa 2077A (the polylactone glycol of 215g, purchased from PERSTORP company), with 0.6 Perstorp Capa 3031 (polylactone triol, purchased from PERSTORP company), mix equably with the butyrolactone (purchased from Aldrich company) of 226g and the dibutyl tin lauroleate of 0.1g.Then, add the diphenylmethanediisocyanate of 125g, and under the condition that is 100° centigrade in temperature, react after approximately 6 hours and obtain reaction mixture.Subsequently, reaction mixture is cooled to room temperature, in wherein adding 3 of 100g, 3,4, the butyrolactone of 4-sulfobenzide tetracarboxylic acid dicarboxylic anhydride and 66g (can purchased from Aldrich company), is to react after approximately 6 hours under the conditions of 120 degree Celsius in temperature, can obtain having the compound of pi structure.
The evaluation of pi resin combination
Table one is that experimental example 2 is to the composition of the pi structure of experimental example 8.Table two is listed experimental example 2 to composition and every characteristic of the pi resin combination of experimental example 8.Table three is that comparative example 1 is to the composition of the pi structure of comparative example 4.Table four is listed comparative example 1 to composition and every characteristic of the pi resin combination of comparative example 4.
In the pi resin combination of experimental example 1 to 8 and comparative example 1 to 3, the pi structure shown in table two and table four are interior and the addition of epoxy resin, wherein the solid content of pi structure is 60%, the solid content of epoxy resin is 40%.To the pi resin combination of experimental example 6, the pi structure of dry film and the weight ratio of epoxy resin after slaking is 125: 4 to experimental example 2.
Experimental example 1 comprises the use of polyvalent alcohol to experimental example 8.Comparative example 1 is to 4 uses that do not comprise polyvalent alcohol of comparative example.In table one listed experimental example and the comparative example shown in table three, dicarboxylic anhydride is used 3,3 ', 4,4 '-sulfobenzide tetracarboxylic acid dicarboxylic anhydride (3,3 ', 4,4 '-diphenylsulfonetetracarboxylic dianhydride), vulcabond is used diphenylmethanediisocyanate (Methylene diphenyl diisocyanate), polyvalent alcohol is used Perstorp capa 3031, and dibasic alcohol is used Perstorp capa 2077A.
Table one
Table two
Table three
Table four
In sum; pi resin combination of the present invention has good acidproof heat-proof; therefore can be used as the protective layer of printed circuit board (PCB); to avoid copper wire on printed circuit board (PCB) that the problem of oxidation occurs, or avoid copper wire on printed circuit board (PCB) to be subject to the impact of envrionment temperature and humidity.Thus, can make printed circuit board (PCB) there is good electrical properties.
Although the present invention discloses as above with embodiment; but it is not in order to limit the present invention; any person of ordinary skill in the field; without departing from the spirit and scope of the present invention; when doing suitably to change and equal replacement, therefore the scope that protection scope of the present invention should be defined with the application's claim is as the criterion.
Claims (11)
1. a pi structure, is characterized in that, this pi structure comprises:
Suc as formula 1 represented structural unit;
Suc as formula 2 represented structural units; And
Suc as formula 3 represented structural units,
-R
1-(formula 1)
Should suc as formula 1 represented structural unit, should be suc as formula 2 represented structural units and the group that should select free style 4 to the represented structural unit of formula 9 and arbitrary combination thereof to form suc as formula the bond between 3 represented structural units,
Wherein, R
1and R
3independent is separately divalent organic base; R
2for trivalent organic radical; R
4for thering is the quadrivalent organic radical of 4 or 4 above atoms; A is 1 to 100; R
1and R
2weight ratio be 950/50 to 999/1; R
5to R
13independent is separately divalent organic base; B to i is independently 1 to 100 separately.
2. pi structure according to claim 1, is characterized in that R
2residue for polyol compound.
3. pi structure according to claim 2, is characterized in that, this polyvalent alcohol based compound is selected from one of them or its combination of 1,1,1-TriMethylolPropane(TMP) and glycerol.
4. pi structure according to claim 1, is characterized in that, the weight average molecular weight of this pi structure is 10000 to 40000.
5. pi structure according to claim 1, is characterized in that, this R
1and R
2weight ratio be 970/30 to 999/1.
6. pi structure according to claim 1, is characterized in that, the weight average molecular weight of this pi structure is 17000 to 19000, and the volume ratio of this pi structure and a solvent is 60/40 o'clock, and its range of viscosities is 35 to 45Pas.
7. pi structure according to claim 1, is characterized in that, the bond between the structural unit formula 1 of this pi structure, formula 2 and formula 3 is the group that selects free style 4 to the represented structural unit of formula 9 and arbitrary combination thereof to form.
8. pi structure according to claim 1, is characterized in that, the bond between the structural unit formula 1 of this pi structure, formula 2 and formula 3 is the group that choosing is freely comprised of formula 5 and the represented structural unit of formula 6 and arbitrary combination thereof.
9. pi structure according to claim 1, is characterized in that, the bond between the structural unit formula 1 of this pi structure, formula 2 and formula 3 is the represented structural unit of formula 5.
10. a pi resin combination, is characterized in that, this pi resin combination comprises:
Pi structure as claimed in claim 1, wherein, this pi structure end is acid anhydrides or carboxyl; An and epoxy resin.
11. pi resin combinations according to claim 10, is characterized in that, the weight ratio of this pi structure and this epoxy resin is 10: 1 to 1000: 1.
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| CN114656918A (en) * | 2022-04-21 | 2022-06-24 | 合肥国轩高科动力能源有限公司 | Insulating glue solution for coating blank edge of lithium ion battery positive plate and preparation method |
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| CN1637034A (en) * | 2004-01-08 | 2005-07-13 | 日立化成工业株式会社 | Polyurethane-imide resin,adhesive composition and adhesive composition for circuit connection |
| US20070088134A1 (en) * | 2005-10-13 | 2007-04-19 | Ajinomoto Co. Inc | Thermosetting resin composition containing modified polyimide resin |
| CN101501093A (en) * | 2006-10-24 | 2009-08-05 | 新田株式会社 | Polyimide resin |
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| US6784275B2 (en) * | 2001-06-28 | 2004-08-31 | Dainippon Ink And Chemicals, Inc. | Active energy ray-curable polyimide resin composition |
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2013
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| CN1637034A (en) * | 2004-01-08 | 2005-07-13 | 日立化成工业株式会社 | Polyurethane-imide resin,adhesive composition and adhesive composition for circuit connection |
| US20070088134A1 (en) * | 2005-10-13 | 2007-04-19 | Ajinomoto Co. Inc | Thermosetting resin composition containing modified polyimide resin |
| CN101501093A (en) * | 2006-10-24 | 2009-08-05 | 新田株式会社 | Polyimide resin |
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| CN114656918A (en) * | 2022-04-21 | 2022-06-24 | 合肥国轩高科动力能源有限公司 | Insulating glue solution for coating blank edge of lithium ion battery positive plate and preparation method |
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| TWI510521B (en) | 2015-12-01 |
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Application publication date: 20140723 |