CN103928581B - Led芯片及其倒封装制作方法 - Google Patents
Led芯片及其倒封装制作方法 Download PDFInfo
- Publication number
- CN103928581B CN103928581B CN201410186466.5A CN201410186466A CN103928581B CN 103928581 B CN103928581 B CN 103928581B CN 201410186466 A CN201410186466 A CN 201410186466A CN 103928581 B CN103928581 B CN 103928581B
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- China
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- sio
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- manufacture method
- led chips
- niag
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000005538 encapsulation Methods 0.000 title abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 64
- 239000010410 layer Substances 0.000 claims abstract description 62
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052681 coesite Inorganic materials 0.000 claims abstract description 41
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 41
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 41
- 229910052682 stishovite Inorganic materials 0.000 claims abstract description 41
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 229910005544 NiAg Inorganic materials 0.000 claims abstract description 32
- 238000005530 etching Methods 0.000 claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 claims abstract description 27
- 239000011241 protective layer Substances 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims description 16
- 229920002120 photoresistant polymer Polymers 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 11
- 238000001259 photo etching Methods 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 claims description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 5
- 238000001039 wet etching Methods 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910015844 BCl3 Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000010894 electron beam technology Methods 0.000 claims description 3
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 230000008021 deposition Effects 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 230000006872 improvement Effects 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 239000013067 intermediate product Substances 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410186466.5A CN103928581B (zh) | 2014-05-05 | 2014-05-05 | Led芯片及其倒封装制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410186466.5A CN103928581B (zh) | 2014-05-05 | 2014-05-05 | Led芯片及其倒封装制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103928581A CN103928581A (zh) | 2014-07-16 |
CN103928581B true CN103928581B (zh) | 2016-11-02 |
Family
ID=51146737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410186466.5A Active CN103928581B (zh) | 2014-05-05 | 2014-05-05 | Led芯片及其倒封装制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103928581B (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103000770A (zh) * | 2011-09-15 | 2013-03-27 | 张庆 | 一种控制阵列式高压led侧壁倾斜角度的新工艺 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110284983A1 (en) * | 2010-05-21 | 2011-11-24 | Solapoint Corporation | Photodiode device and manufacturing method thereof |
US8962358B2 (en) * | 2011-03-17 | 2015-02-24 | Tsmc Solid State Lighting Ltd. | Double substrate multi-junction light emitting diode array structure |
-
2014
- 2014-05-05 CN CN201410186466.5A patent/CN103928581B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103000770A (zh) * | 2011-09-15 | 2013-03-27 | 张庆 | 一种控制阵列式高压led侧壁倾斜角度的新工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN103928581A (zh) | 2014-07-16 |
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SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 215123 Suzhou Province Industrial Park, Jiangsu new road, No. 8 Applicant after: FOCUS LIGHTINGS TECHNOLOGY CO., LTD. Address before: 215123 Suzhou Province Industrial Park, Jiangsu new road, No. 8 Applicant before: Focus Lightings Tech Inc. |
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COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: FOCUS LIGHTING (SUZHOU) CO., LTD. TO: FOCUS LIGHINGS TECHNOLOGY CO., LTD. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200907 Address after: 223800 west side of development avenue of Suqian economic and Technological Development Zone in Jiangsu province (room 2005 of business center) Patentee after: FOCUS LIGHTINGS TECHNOLOGY (SUQIAN) Co.,Ltd. Address before: 215123 No. 8 Qing Qing Road, Suzhou Industrial Park, Jiangsu, China Patentee before: FOCUS LIGHTINGS SCIENCE & TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: 223800 south of Dongwu Road, Suqian Economic and Technological Development Zone, Jiangsu Province Patentee after: FOCUS LIGHTINGS TECHNOLOGY (SUQIAN) Co.,Ltd. Address before: 223800 west side of development avenue of Suqian economic and Technological Development Zone in Jiangsu province (room 2005 of business center) Patentee before: FOCUS LIGHTINGS TECHNOLOGY (SUQIAN) Co.,Ltd. |