CN103923437A - High-thermal-conductivity resin and manufacturing method thereof - Google Patents
High-thermal-conductivity resin and manufacturing method thereof Download PDFInfo
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- CN103923437A CN103923437A CN201310016268.XA CN201310016268A CN103923437A CN 103923437 A CN103923437 A CN 103923437A CN 201310016268 A CN201310016268 A CN 201310016268A CN 103923437 A CN103923437 A CN 103923437A
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- epoxy resin
- resin
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- thermal conductive
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Abstract
The invention relates to high-thermal-conductivity resin and a manufacturing method thereof. The high-thermal-conductivity resin comprises a mixture of artificial diamond powder and epoxy resin, has low thermal impedance, and is capable of fully adhering to a contact surface, filling gaps of a joint surface between a heat dissipation element and a heating electronic element and forming an extremely-low-thermal-impedance interface, and therefore the heat energy generated by the heating electronic element during running can be transferred to the surface of the heat dissipation element in a heat conduction manner via the high-thermal-conductivity resin, and the temperature of the heating electronic element is effectively reduced. The high-thermal-conductivity resin is strong in adhesive force and good in thermal conductivity, is capable of completely avoiding harmfulness caused by employing toxic chemical substances, and can be directly adhered to a joint face for enabling construction to be extremely simple. The manufacturing method comprises adding a diluent into the mixture of the artificial diamond powder and epoxy resin, and uniformly stirring for 2 hours to obtain the product.
Description
Technical field
The present invention is applied to the then technical field of heat radiation of element, espespecially its technical a kind of high thermal conductive resin and manufacture method thereof of providing, and this high thermal conductive resin clinging power is strong, have good thermal conductivity and can avoid adopting the harm of the virose chemical substance of tool completely.
Background technology
Along with electronic product power promotes day by day, the more and more less and at full speed operation that related elements becomes, these a little elements just can guarantee to have good serviceability and stability in its operating temperature range, therefore, its requirement to heat radiation is more and more higher.For removing fast the high heat producing when Heating element moves, become general in the industry way in Heating element surface mounting one heat dissipation element, its operating mode increases the cooling surface area of heat dissipation element and the high thermal conductivity of material nothing more than utilizing, heat is passed rapidly to directed outwards and distribute, and heat is taken away in the mode of forced convection by high speed fan.
For the dissipation of heat that heat dissipation element can be produced Heating element is rapidly gone out, between Heating element and heat dissipation element, need to there is good heat transmission, be should there is less thermal contact resistance between Heating element and heat dissipation element, but, due to the restriction of processing technology and production cost, make the contact surface of Heating element and heat dissipation element cannot reach complete even curface, in the time that both fit, its contact surface cannot contact completely and form gap, and air thermal conductivity very low (being almost heat insulation body) in gap, have a strong impact on the effect of Heating element to heat dissipation element transferring heat.For this reason, generally coated heat dielectric surface material between heat dissipation element and Heating element, to fill up the clearance between heat dissipation element and Heating element, by reducing thermal contact resistance, improving radiating effect, to ensure the normal operation of Heating element.Known electronic product custom adopts tin cream to follow and thermal interface material as heat dissipation element and Heating element are bonding, these tin cream systems form with tin, lead and soldering flux together consolute, its fusing point low and be easy to processing, but in this kind of soldering tin material, contained lead belongs to heavy metal, not only endanger environment and serious threat operator is healthy, again, known electronic product is to be combined into heat radiation module with tin cream and other tinsels (as copper or aluminium), nickel plating in its surface, just can guarantee adhesive performance, processing procedure is loaded down with trivial details and need bear extra nickel plating cost.Day by day come back at environmental consciousness, in the increasingly strict situation of environmental regulation, provide a kind of hot interface that has high thermal conductivity concurrently and meet environmental protection demand and easy construction to follow material real in necessary.
Therefore for above-mentioned known bonding following and the existing problem points of thermal interface material, how to develop a kind of innovative product that has more desirable practicality, real human consumer eagerly looks forward to, and is also target and direction that relevant dealer must make great efforts research and development breakthrough.
In view of this, contriver this in manufacturing development and the design experiences of being engaged in for many years related products, for above-mentioned target, in detail after design and scrupulous assessment, eventually the present invention of a true tool practicality.
Summary of the invention
For improving the problems referred to above, the object of the present invention is to provide a kind of high thermal conductive resin and manufacture method thereof, this high thermal conductive resin clinging power is strong, has good thermal conductivity, and can avoid adopting the harm of the virose chemical substance of tool completely.
For realizing object of the present invention, first in material, find the high thermal conductivity material of tool low thermal impedance as the thermal conductance weighting material of high thermal conductive resin, this thermal conductance weighting material is rhinestone powder.Generally comprises a thermally conductive resin, and the thermal conductivity of the matrix filled with the filler within the matrix, the matrix is currently used in most of the thermally conductive resin is selected from low molecular weight polymers, such as silicone resin, acrylic resin, epoxy resin, and the thermal conductivity optional filler material having good thermal conductivity from, such as copper, aluminum, silver, gold, iron, nickel, cobalt, molybdenum, tungsten, aluminum, nickel based B Sintered, artificial diamond, aluminum carbide, silica, zinc oxide , titanium dioxide, or a mixture consisting of several.The mixture that high thermal conductive resin of the present invention comprises rhinestone powder and epoxy resin, at 25 DEG C of-35 DEG C of normality temperature, add tetrahydrophthalic acid 2-glycidyl ester (cyclohex-4-ene-1,2-dicarboxylate) or butylglycidyl ether (Butyl glycidyl ether) thinner to make after uniform stirring through 2 hours.
Wherein, the matrix that high thermal conductive resin of the present invention comprises 50 to 95 weight percents and puddle the thermal conductance weighting material of 5 to 50 weight percents in matrix, this matrix is epoxy resin, this thermal conductance weighting material is artificial diamond powder.
Wherein, this rhinestone powder is irregularly shaped particles structure.
Wherein, the particle diameter of this rhinestone powder is less than 5 μ m.
Wherein, the viscosity of this high thermal conductive resin at 25 DEG C of-35 DEG C of normality temperature is the scopes of 3,000 centipoises (cps, centipoises) to 5,000 centipoises.
Pass through foregoing description, effect that the present invention contrasts prior art is: known electronic product custom adopts tin cream to follow and thermal interface material as heat dissipation element and Heating element are bonding, these tin creams form with tin, lead and soldering flux together consolute, lead contained in this kind of soldering tin material belongs to heavy metal, not only endanger environment and serious threat operator is healthy, again, known electronic product is to be combined into heat radiation module with tin cream and other tinsels (as copper or aluminium), and processing procedure is loaded down with trivial details and need bear extra nickel plating cost.The mixture that high thermal conductive resin of the present invention comprises rhinestone powder and epoxy resin, its clinging power is strong, have good thermal conductivity and can avoid adopting the harm of the virose chemical substance of tool completely, and it is very easy to be directly adhered to bonding surface construction, can be widely used in then using on the heat radiation module of computer, notebook computer, electrical equipment, mobile phone, LED light fixture and every profession and trade.
Relevant the technology used in the present invention, means and effect thereof, hereby lift a preferred embodiment and coordinate after graphic being described in more detail in, and believes the above-mentioned object of the present invention, structure and feature, when can by one deeply and concrete understanding.
Brief description of the drawings
Fig. 1: high thermal conductive resin manufacturing step schema of the present invention.
Embodiment
The invention provides a kind of high thermal conductive resin, the mixture that comprises rhinestone powder and epoxy resin, the matrix that it comprises 50 to 95 weight percents and puddle the thermal conductance weighting material of 5 to 50 weight percents in matrix, this matrix is epoxy resin, this thermal conductance weighting material is artificial diamond powder, and this rhinestone powder is irregularly shaped particles structure.
Wherein, the viscosity of this high thermal conductive resin at 25 DEG C of-35 DEG C of normality temperature is the scopes of 3,000 centipoises (cps, centipoises) to 5,000 centipoises.
Consult shown in Fig. 1, the manufacture method of this high thermal conductive resin, the steps include:
Step 1 (10). preparation 5 to 50 weight percents rhinestone powder, the median size of this rhinestone powder is less than 5 μ m;
Step 2 (20). the epoxy resin of preparation 50 to 95 weight percents;
Step 3 (30). at 25 DEG C of-35 DEG C of normality temperature, rhinestone powder and epoxy resin are uniformly mixed to formation rhinestone powder and epoxy resin composition;
Step 4 (40). add tetrahydrophthalic acid 2-glycidyl ester or butylglycidyl ether thinner in rhinestone powder and epoxy resin composition, through the uniform stirring of 2 hours, rhinestone powder is evenly mixed in epoxy resin, forms high thermal conductive resin.
Be that technical characterictic of the present invention is specifically described for preferred embodiment of the present invention above; Only, person skilled in the art is when can the present invention being changed and amendment not departing under spirit of the present invention and principle, and these change and revise, and all should be covered by the category that following claim defines.
Claims (5)
1. a high thermal conductive resin, is characterized in that: the matrix that comprises 50 to 95 weight percents and puddle the rhinestone powder of 5 to 50 weight percents in matrix, its viscosity at 25 DEG C of-35 DEG C of normality temperature is 3,000 centipoises to 5, the scope of 000 centipoise.
2. high thermal conductive resin as claimed in claim 1, is characterized in that, this matrix is epoxy resin.
3. high thermal conductive resin as claimed in claim 1, is characterized in that, the particle diameter of this rhinestone powder is less than 5 μ m.
4. a manufacture method for high thermal conductive resin, is characterized in that step is:
(1) prepare the rhinestone powder of 5 to 50 weight percents;
(2) prepare the epoxy resin of 50 to 95 weight percents;
(3) at 25 DEG C of-35 DEG C of normality temperature, rhinestone powder and epoxy resin are uniformly mixed, form rhinestone powder and epoxy resin composition;
(4) add tetrahydrophthalic acid 2-glycidyl ester or butylglycidyl ether thinner in rhinestone powder and epoxy resin composition, through the uniform stirring of 2 hours, rhinestone powder is evenly mixed in epoxy resin, forms high thermal conductive resin.
5. the manufacture method of high thermal conductive resin as claimed in claim 4, is characterized in that, the particle diameter of this rhinestone powder is less than 5 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016268.XA CN103923437A (en) | 2013-01-16 | 2013-01-16 | High-thermal-conductivity resin and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016268.XA CN103923437A (en) | 2013-01-16 | 2013-01-16 | High-thermal-conductivity resin and manufacturing method thereof |
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| CN103923437A true CN103923437A (en) | 2014-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310016268.XA Pending CN103923437A (en) | 2013-01-16 | 2013-01-16 | High-thermal-conductivity resin and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105885482A (en) * | 2016-06-03 | 2016-08-24 | 广东昭信照明科技有限公司 | Heat radiation coating and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0279801A (en) * | 1988-09-16 | 1990-03-20 | Nikon Corp | Optical resin composition having high refractive index |
| CN1704458A (en) * | 2004-05-28 | 2005-12-07 | 台盐实业股份有限公司 | Composition of heat-conductive materials and preparation method thereof |
| CN1941347A (en) * | 2005-09-29 | 2007-04-04 | 中国砂轮企业股份有限公司 | High-heat conductive efficency circuit board |
-
2013
- 2013-01-16 CN CN201310016268.XA patent/CN103923437A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0279801A (en) * | 1988-09-16 | 1990-03-20 | Nikon Corp | Optical resin composition having high refractive index |
| CN1704458A (en) * | 2004-05-28 | 2005-12-07 | 台盐实业股份有限公司 | Composition of heat-conductive materials and preparation method thereof |
| CN1941347A (en) * | 2005-09-29 | 2007-04-04 | 中国砂轮企业股份有限公司 | High-heat conductive efficency circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105885482A (en) * | 2016-06-03 | 2016-08-24 | 广东昭信照明科技有限公司 | Heat radiation coating and preparation method thereof |
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Application publication date: 20140716 |