CN103923616A - Synthetic diamond heat-conductive paste and preparation method thereof - Google Patents
Synthetic diamond heat-conductive paste and preparation method thereof Download PDFInfo
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- CN103923616A CN103923616A CN201310016155.XA CN201310016155A CN103923616A CN 103923616 A CN103923616 A CN 103923616A CN 201310016155 A CN201310016155 A CN 201310016155A CN 103923616 A CN103923616 A CN 103923616A
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- heat
- powder
- rhinestone
- synthetic diamond
- conductive paste
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Abstract
The invention relates to a synthetic diamond heat-conductive paste and a preparation method thereof. The synthetic diamond heat-conductive paste comprises a mixture of silicon dioxide powder, aluminium oxide powder, synthetic diamond powder and dimethicone. The synthetic diamond heat-conductive paste has low thermal impedance, and is capable of fully moistening a joint surface between a heat dissipation element and a heating electronic element, filling gaps of the joint surface and forming an extremely-low-thermal-impedance interface, and therefore the heat energy generated by the heating electronic element during running can be transferred to the surface of the heat dissipation element in a heat conduction manner via the synthetic diamond heat-conductive paste, and the temperature of the heating electronic element is effectively reduced. The preparation method comprises uniformly stirring the mixture containing silicon dioxide powder, aluminium oxide powder, synthetic diamond powder and synthetic diamond heat-conductive paste at a constant temperature of 25 DEG C-35 DEG C for 8 h.
Description
Technical field
The present invention system is applied to the technical field of electronic element radiating, espespecially its technical a kind of rhinestone heat-conducting cream and manufacture method thereof of providing, this rhinestone heat-conducting cream can fully be filled up gap and the tool low thermal impedance of heat-generating electronic elements and heat dissipation element, and can effectively reduce production costs.
Background technology
Along with the intensive and microminiaturized degree of IC promotes day by day, the more and more less and at full speed operation that electronic component becomes, electronic component just can guarantee to have good serviceability and stability in its operating temperature range, and therefore, its requirement to heat radiation is more and more higher.For removing fast the high heat producing when electronic component moves, in electronical elements surface, one heat dissipation element is installed and is become general in the industry way, its operating mode increases the cooling surface area of heat dissipation element and the high thermal conductivity of material nothing more than utilizing, heat is passed rapidly to directed outwards and distribute, and heat is taken away in the mode of forced convection by high speed fan.
For the dissipation of heat that heat dissipation element can be produced heat-generating electronic elements is rapidly gone out, between heat-generating electronic elements and heat dissipation element, need to there is good heat transmission, be should there is less thermal contact resistance between heat-generating electronic elements and heat dissipation element, but, due to the restriction of processing technology and production cost, make the contact surface of heat-generating electronic elements and heat dissipation element cannot reach complete even curface, in the time that both fit, its contact surface cannot contact completely and form gap, and air thermal conductivity very low (being almost heat insulation body) in gap, have a strong impact on the effect of heat-generating electronic elements to heat dissipation element transferring heat.For this reason, generally coated heat dielectric surface material between heat dissipation element and heat-generating electronic elements, to fill up the clearance between heat dissipation element and heat-generating electronic elements, by reducing thermal contact resistance, improving radiating effect, to ensure the normal operation of heat-generating electronic elements.In known thermal interface material, heat-conducting cream is because the thermal contact resistance having compared with little is widely used, but the heat-conducting cream of traditional tool high conduction performance is taking silver powder as base material, price very costliness is quite uneconomical, for this reason, provide a kind of gap and the tool low thermal impedance that can fully fill up heat-generating electronic elements and heat dissipation element, and the heat-conducting cream that can effectively reduce production costs is real in necessary.
Therefore for the existing problem points of above-mentioned known heat dissipation element, how to develop a kind of innovative product that has more desirable practicality, real human consumer eagerly looks forward to, and is also that relevant dealer must make great efforts target and the direction that research and development break through.
In view of this, contriver this in manufacturing development and the design experiences of being engaged in for many years related products, for above-mentioned target, in detail after design and scrupulous assessment, eventually the present invention of a true tool practicality.
Summary of the invention
For improving the problems referred to above, the object of the present invention is to provide a kind of rhinestone heat-conducting cream and manufacture method thereof, this rhinestone heat-conducting cream can fully be filled up gap and the tool low thermal impedance of heat-generating electronic elements and heat dissipation element, and can effectively reduce production costs.
For achieving the above object, the present invention first in material, find tool low thermal impedance and cost far below the high thermal conductivity material of silver powder the thermal conductance weighting material as heat-conducting cream, these thermal conductance weighting materials are the mixture of silicon-dioxide, alumina powder and rhinestone powder.Thermal paste generally includes a substrate and the thermal conductivity of the matrix filled with the filler, the thermal conductivity of the substrate is currently used mostly for the paste is selected from polymer materials, such as polyvinyl acetate, polyethylene, dimethicone, acrylate, polypropylene, epoxy resins, polyoxymethylene, polyvinyl alcohol, olefin resin, or a mixture of several of the composition, the thermal conductivity of the filler is selected from a material having good thermal conductivity, such as copper, aluminum, silver, gold, iron, nickel, , cobalt, molybdenum, tungsten, aluminum, a nickel-B Sintered, artificial diamond, aluminum carbide, silica, zinc oxide, titanium dioxide or a mixture consisting of several.Rhinestone heat-conducting cream of the present invention is the mixture that comprises SiO 2 powder, alumina powder, rhinestone powder and dimethyl silicone oil, at 25 DEG C～35 DEG C normality temperature, makes after uniform stirring through 8 hours.
Wherein, the matrix that rhinestone heat-conducting cream of the present invention comprises 10 to 25 weight percents and puddle the thermal conductance weighting material of 75 to 90 weight percents in matrix, this matrix is dimethyl silicone oil, the rhinestone powder of the SiO 2 powder that this thermal conductance weighting material comprises 10 to 15 weight percents, the alumina powder of 20 to 50 weight percents and 15 to 60 weight percents.
Wherein, the particle diameter of this rhinestone powder is less than 5 μ m, and its thermal conductivity is up to 2000W/m.K.
Wherein, this rhinestone powder is irregularly shaped particles structure.
Pass through foregoing description, effect that the present invention contrasts prior art is as follows: the heat-conducting cream of traditional tool high conduction performance is taking silver powder as thermal conductance weighting material, its price very costliness is quite uneconomical, the mixture that rhinestone heat-conducting cream of the present invention comprises SiO 2 powder, alumina powder, rhinestone powder and dimethyl silicone oil, it can fully soak coating surface, fill up the gap of heat-generating electronic elements and heat dissipation element, form an extremely low thermal resistance interface, and can effectively reduce production costs.
Relevant the technology used in the present invention, means and effect thereof, hereby lift a preferred embodiment and coordinate after graphic being described in more detail in, and believes the above-mentioned object of the present invention, structure and feature, when can by one deeply and concrete understanding.
Brief description of the drawings
Fig. 1: rhinestone heat-conducting cream manufacturing step schema of the present invention.
Fig. 2: rhinestone heat-conducting cream of the present invention is applied to electronic product schematic diagram.
Embodiment
The present invention system provides a kind of rhinestone heat-conducting cream, the mixture that comprises SiO 2 powder, alumina powder, rhinestone powder and dimethyl silicone oil, its matrix by 10 to 25 weight percents and the thermal conductance weighting material of puddling 75 to 90 weight percents in matrix combine, wherein, this matrix is dimethyl silicone oil, the rhinestone powder of the SiO 2 powder that this thermal conductance weighting material comprises 10 to 15 weight percents, the alumina powder of 20 to 50 weight percents and 15 to 60 weight percents.Wherein, the particle diameter of this rhinestone powder is less than 5 μ m, and its thermal conductivity is up to 2000W/m.K.
Consult shown in Fig. 1, the manufacture method of this rhinestone heat-conducting cream, the steps include:
Step 1 (10). the SiO 2 powder of preparation 10 to 15 weight percents;
Step 2 (20). the alumina powder of preparation 20 to 50 weight percents;
Step 3 (30). the rhinestone powder of preparation 15 to 60 weight percents, the median size of this rhinestone powder is less than 5 μ m;
Step 4 (40). the dimethyl silicone oil of preparation 10 to 25 weight percents;
Step 5 (50). at 25 DEG C of-35 DEG C of normality temperature, SiO 2 powder, alumina powder, rhinestone powder and dimethyl silicone oil are mixed;
Step 6 (60). the uniform stirring by SiO 2 powder, alumina powder, rhinestone powder and dimethyl silicone oil through 8 hours, SiO 2 powder, alumina powder, rhinestone powder are evenly mixed in dimethyl silicone oil, form rhinestone heat-conducting cream.
Consult shown in Fig. 2, one heat dissipation element 70 is attached at a heat-generating electronic elements 80, the contact surface of this heat dissipation element 70 and this heat-generating electronic elements 80 cannot contact completely and form a gap 91, in this gap 91, be covered with rhinestone heat-conducting cream 92 of the present invention, it can fully soak coating surface these rhinestone heat-conducting cream 92 tool low thermal impedance, fill up this gap 91, form an extremely low thermal resistance interface, this heat dissipation element 70 comprises a radiating bottom plate 71 and number radiating fin 72, by this, the heat energy that this heat-generating electronic elements 80 produces while running, can be sent to these heat dissipation element 70 surfaces (comprising this radiating bottom plate 71 and each radiating fin 72 outside surfaces) in heat conducting mode via this rhinestone heat-conducting cream 92, continue again via the gas of these heat dissipation element 70 near surfaces, mode and this heat dissipation element 70 with thermal forced convection carry out heat exchange, the heat energy that this heat-generating electronic elements 80 is produced brings to extraneous atmospheric environment, effectively reduce the temperature of this heat-generating electronic elements 80 own.
Wherein, the thermal resistance value experimental data of rhinestone heat-conducting cream of the present invention and known heat-conducting cream is as shown in Table 1:
The thermal resistance value comparison sheet of the different heat-conducting creams of table one
Be to be that technical characterictic of the present invention is specifically described for preferred embodiment of the present invention above; Only, person skilled in the art is when can the present invention being changed and amendment not departing under spirit of the present invention and principle, and these change and revise, and all should be covered by the category that following claim defines.
Claims (5)
1. a rhinestone heat-conducting cream, it is characterized in that: combined by the matrix of 10 to 25 weight percents and the thermal conductance weighting material of puddling in matrix, the rhinestone powder of the SiO 2 powder that this thermal conductance weighting material comprises 10 to 15 weight percents, the alumina powder of 20 to 50 weight percents and 15 to 60 weight percents, wherein the thermal conductivity of rhinestone powder is up to 2000W/m.K.
2. rhinestone heat-conducting cream as claimed in claim 1, is characterized in that, this matrix is dimethyl silicone oil.
3. rhinestone heat-conducting cream as claimed in claim 1, is characterized in that, the particle diameter of this rhinestone powder is less than 5 μ m.
4. a manufacture method for rhinestone heat-conducting cream, is characterized in that step is:
(1) prepare the SiO 2 powder of 10 to 15 weight percents;
(2) prepare the alumina powder of 20 to 50 weight percents;
(3) prepare the rhinestone powder of 15 to 60 weight percents;
(4) prepare the dimethyl silicone oil of 10 to 25 weight percents;
(5) at 25 DEG C to 35 DEG C normality temperature, SiO 2 powder, alumina powder, rhinestone powder and dimethyl silicone oil are mixed;
(6) by SiO 2 powder, alumina powder, rhinestone powder and dimethyl silicone oil process uniform stirring, SiO 2 powder, alumina powder, rhinestone powder are evenly mixed in dimethyl silicone oil, form rhinestone heat-conducting cream.
5. the manufacture method of rhinestone heat-conducting cream as claimed in claim 4, is characterized in that, the particle diameter of this rhinestone powder is less than 5 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310016155.XA CN103923616A (en) | 2013-01-16 | 2013-01-16 | Synthetic diamond heat-conductive paste and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310016155.XA CN103923616A (en) | 2013-01-16 | 2013-01-16 | Synthetic diamond heat-conductive paste and preparation method thereof |
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| CN103923616A true CN103923616A (en) | 2014-07-16 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105086950A (en) * | 2015-08-12 | 2015-11-25 | 惠州市科程通科技有限公司 | High thermal conductive paste |
| CN115058232A (en) * | 2022-06-09 | 2022-09-16 | 昆山纳诺新材料科技有限公司 | Preparation method of low-cost heat-conducting paste |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633833A (en) * | 2008-07-23 | 2010-01-27 | 昆山纳诺新材料科技有限公司 | Nano-diamond thermal grease |
-
2013
- 2013-01-16 CN CN201310016155.XA patent/CN103923616A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633833A (en) * | 2008-07-23 | 2010-01-27 | 昆山纳诺新材料科技有限公司 | Nano-diamond thermal grease |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105086950A (en) * | 2015-08-12 | 2015-11-25 | 惠州市科程通科技有限公司 | High thermal conductive paste |
| CN105086950B (en) * | 2015-08-12 | 2018-06-05 | 惠州市科程通科技有限公司 | A kind of high heat conduction cream |
| CN115058232A (en) * | 2022-06-09 | 2022-09-16 | 昆山纳诺新材料科技有限公司 | Preparation method of low-cost heat-conducting paste |
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Application publication date: 20140716 |