CN103923385B - 一种高牢度电容器金属化薄膜及其制备方法 - Google Patents
一种高牢度电容器金属化薄膜及其制备方法 Download PDFInfo
- Publication number
- CN103923385B CN103923385B CN201410141920.5A CN201410141920A CN103923385B CN 103923385 B CN103923385 B CN 103923385B CN 201410141920 A CN201410141920 A CN 201410141920A CN 103923385 B CN103923385 B CN 103923385B
- Authority
- CN
- China
- Prior art keywords
- film
- metalized film
- auxiliary agent
- raw material
- forcing machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011104 metalized film Substances 0.000 title claims abstract description 18
- 239000003990 capacitor Substances 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims description 7
- 239000004743 Polypropylene Substances 0.000 claims abstract description 21
- 229920001155 polypropylene Polymers 0.000 claims abstract description 21
- -1 polypropylene Polymers 0.000 claims abstract description 14
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 10
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims abstract description 8
- PQLMXFQTAMDXIZ-UHFFFAOYSA-N isoamyl butyrate Chemical compound CCCC(=O)OCCC(C)C PQLMXFQTAMDXIZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- BYLSIPUARIZAHZ-UHFFFAOYSA-N 2,4,6-tris(1-phenylethyl)phenol Chemical compound C=1C(C(C)C=2C=CC=CC=2)=C(O)C(C(C)C=2C=CC=CC=2)=CC=1C(C)C1=CC=CC=C1 BYLSIPUARIZAHZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 7
- 238000003851 corona treatment Methods 0.000 claims abstract description 5
- 238000001914 filtration Methods 0.000 claims abstract description 5
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 4
- 229940094941 isoamyl butyrate Drugs 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 235000002918 Fraxinus excelsior Nutrition 0.000 claims description 6
- 240000007313 Tilia cordata Species 0.000 claims description 6
- 230000032683 aging Effects 0.000 claims description 6
- 239000002956 ash Substances 0.000 claims description 6
- 239000010977 jade Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229920001526 metallocene linear low density polyethylene Polymers 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 4
- 241000628997 Flos Species 0.000 claims description 3
- 229920002367 Polyisobutene Polymers 0.000 claims description 3
- BVTBRVFYZUCAKH-UHFFFAOYSA-L disodium selenite Chemical compound [Na+].[Na+].[O-][Se]([O-])=O BVTBRVFYZUCAKH-UHFFFAOYSA-L 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 3
- 238000005469 granulation Methods 0.000 claims description 3
- 230000003179 granulation Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 claims description 3
- 235000010234 sodium benzoate Nutrition 0.000 claims description 3
- 239000004299 sodium benzoate Substances 0.000 claims description 3
- 229960001471 sodium selenite Drugs 0.000 claims description 3
- 235000015921 sodium selenite Nutrition 0.000 claims description 3
- 239000011781 sodium selenite Substances 0.000 claims description 3
- 238000007738 vacuum evaporation Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 abstract description 3
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 abstract 1
- 239000005030 aluminium foil Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0018—Combinations of extrusion moulding with other shaping operations combined with shaping by orienting, stretching or shrinking, e.g. film blowing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/015—Special provisions for self-healing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/10—Homopolymers or copolymers of propene
- C08J2323/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/10—Homopolymers or copolymers of propene
- C08J2423/14—Copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
本发明公开了一种高牢度电容器金属化薄膜,其特征在于,由下列重量份的原料制成:等规聚丙烯200、无规共聚聚丙烯30-34、癸二酸二丁酯3-4、苯乙烯化苯酚1-2、交联剂TAIC?1-2、丁酸异戊酯2-3、邻苯二甲酸二丁酯6-8、促进剂DTDM?0.5-1.0、硅烷偶联剂KH-560?0.5-1.0、助剂5-6;本发明通过过滤,去除原料中的杂质,使原料性能好,降低了薄膜的报废率,不易破裂;采用电晕处理,提高了薄膜的耐压强度,防止击穿,本发明厚度均匀,不容易脱开,具有良好的载流、抗涌流以及耐脉冲能力,使用寿命长。
Description
技术领域
本发明涉及电容器制造领域,特别是一种高牢度电容器金属化薄膜及其制备方法。
背景技术
电容器用双向拉伸聚丙烯薄膜具有较高的机械性能和电气性能,与普通型薄膜制得的电容器相比,用聚丙烯薄膜制得的电容器以其热收缩率低、性能稳定、耐高温、耐高压,防止击穿等显著优点,使得聚丙烯薄膜制得的电容器的使用范围越来越广。
电容芯子是电容器的心脏,因此电容器制造芯子材质必须具有耐高频,耐高
温,能承受大电流冲击的一种高分子聚丙烯膜作介质,才能保证整机长期稳定地工作。现有技术中大部分采用的介质为聚脂或聚丙烯光膜,电极为铝箔,也有少量产品使用聚丙烯金属化蒸镀膜。由于市场整机都面向于超薄型,微小型发展,虽然箔膜复合材料载流耐电能力强,但它的缺点是体积大不利于组装整机使用,另一缺点是聚丙烯膜与铝箔复合卷制等工艺难易控制,特别是在绕制芯子过程中因两者材质硬韧性的差异,会造成膜箔间出现间隙,至使材料在定型时热收缩不够充分,导致膜箔间容易被电击穿,报废率较高,造成了成本浪费。又因为现有技术制备电容器金属化膜时选用的原料杂质较多,所以会导致生产出来的电容器金属化膜性能较差,而且因为现有技术制备电容器金属化膜时纵向以及横向拉伸工序的各种参数设定的不好,所以很有可能导致拉膜断裂,破膜影响正常生产。
发明内容
本发明的目的是提供一种高牢度电容器金属化薄膜及其制备方法。
为了实现本发明的目的,本发明通过以下方案实施:
一种高牢度电容器金属化薄膜,由下列重量份的原料制成:等规聚丙烯200、无规共聚聚丙烯30-34、癸二酸二丁酯3-4、苯乙烯化苯酚1-2、交联剂TAIC1-2、丁酸异戊酯2-3、邻苯二甲酸二丁酯6-8、促进剂DTDM0.5-1.0、硅烷偶联剂KH-5600.5-1.0、助剂5-6;
所述助剂由下列重量份的原料制成:茂金属线性低密度聚乙烯12-15、苯甲酸钠1-2、当归油1-2、聚异丁烯3-4、硅烷偶联剂KH5501-2、椴木灰烬1-2、亚硒酸钠1-2、纳米玉石粉0.3-0.4、玫瑰精油0.1-0.2;制备方法是将茂金属线性低密度聚乙烯加热至熔融状态,然后,加入纳米玉石粉、椴木灰烬搅拌10-15分钟,最后加入其它成分,搅拌分散均匀,冷却,造粒,即得。
本发明所述高牢度电容器金属化薄膜,由以下具体步骤制成:
(1)将等规聚丙烯、无规共聚聚丙烯、癸二酸二丁酯、苯乙烯化苯酚混合加热熔融,再加入助剂以及其余剩余成分充分搅拌,送入挤出机熔融、过滤,然后再通过挤出机挤出片状熔体,过滤>1200目,所述挤出机的温度为220-260℃;
(2)将步骤(1)制成的片状熔体通过激冷辊及风淋室冷却定型后制得铸片,依次进行纵向拉伸、横向拉伸、粗化面电晕处理;
(3)收卷、第一次时效处理、第二次时效处理;
(4)真空蒸发金属化膜,粗化面形成金属化层。
本发明的有益效果为:本发明通过过滤,去除原料中的杂质,使原料性能好,降低了薄膜的报废率,不易破裂;采用电晕处理,提高了薄膜的耐压强度,防止击穿,本发明厚度均匀,不容易脱开,具有良好的载流、抗涌流以及耐脉冲能力,使用寿命长。
具体实施方式
下面通过具体实例对本发明进行详细说明。
一种高牢度电容器金属化薄膜,由下列重量份(公斤)的原料制成:等规聚丙烯200、无规共聚聚丙烯30、癸二酸二丁酯3、苯乙烯化苯酚1、交联剂TAIC1、丁酸异戊酯2、邻苯二甲酸二丁酯6、促进剂DTDM0.5、硅烷偶联剂KH-5600.5、助剂5;
所述助剂由下列重量份(公斤)的原料制成:茂金属线性低密度聚乙烯12、苯甲酸钠1、当归油2、聚异丁烯3、硅烷偶联剂KH5501、椴木灰烬1、亚硒酸钠1、纳米玉石粉0.3、玫瑰精油0.1;制备方法是将茂金属线性低密度聚乙烯加热至熔融状态,然后,加入纳米玉石粉、椴木灰烬搅拌10-15分钟,最后加入其它成分,搅拌分散均匀,冷却,造粒,即得。
本发明所述高牢度电容器金属化薄膜,由以下具体步骤制成:
(1)将等规聚丙烯、无规共聚聚丙烯、癸二酸二丁酯、苯乙烯化苯酚混合加热熔融,再加入助剂以及其余剩余成分充分搅拌,送入挤出机熔融、过滤,然后再通过挤出机挤出片状熔体,过滤>1200目,所述挤出机的温度为220-260℃;
(2)将步骤(1)制成的片状熔体通过激冷辊及风淋室冷却定型后制得铸片,依次进行纵向拉伸、横向拉伸、粗化面电晕处理;
(3)收卷、第一次时效处理、第二次时效处理;
(4)真空蒸发金属化膜,粗化面形成金属化层。
本发明实施例的金属化薄膜的技术指标如下:
(1)横向收缩率≤0.2%、纵向收缩率≤2.5%
(2)横向拉伸强度≥13Mpa、纵向拉伸强度≥16Mpa;
(3)最小击穿电压613Vv/um。
Claims (1)
1.一种电容器金属化薄膜,其特征在于,由下列重量份的原料制成:等规聚丙烯200、无规共聚聚丙烯30-34、癸二酸二丁酯3-4、苯乙烯化苯酚1-2、交联剂TAIC1-2、丁酸异戊酯2-3、邻苯二甲酸二丁酯6-8、促进剂DTDM0.5-1.0、硅烷偶联剂KH-5600.5-1.0、助剂5-6;所述助剂由下列重量份的原料制成:茂金属线性低密度聚乙烯12-15、苯甲酸钠1-2、当归油1-2、聚异丁烯3-4、硅烷偶联剂KH5501-2、椴木灰烬1-2、亚硒酸钠1-2、纳米玉石粉0.3-0.4、玫瑰精油0.1-0.2;该助剂的制备方法是将茂金属线性低密度聚乙烯加热至熔融状态,然后,加入纳米玉石粉、椴木灰烬搅拌10-15分钟,最后加入其它成分,搅拌分散均匀,冷却,造粒,即得;
所述电容器金属化薄膜,由以下具体步骤制成:
(1)将等规聚丙烯、无规共聚聚丙烯、癸二酸二丁酯、苯乙烯化苯酚混合加热熔融,再加入助剂以及其余剩余成分充分搅拌,送入挤出机熔融、过滤,然后再通过挤出机挤出片状熔体,过滤>1200目,所述挤出机的温度为220-260℃;
(2)将步骤(1)制成的片状熔体通过激冷辊及风淋室冷却定型后制得铸片,依次进行纵向拉伸、横向拉伸、粗化面电晕处理;
(3)收卷、第一次时效处理、第二次时效处理;
(4)真空蒸发金属化膜,粗化面形成金属化层。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410141920.5A CN103923385B (zh) | 2014-04-10 | 2014-04-10 | 一种高牢度电容器金属化薄膜及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410141920.5A CN103923385B (zh) | 2014-04-10 | 2014-04-10 | 一种高牢度电容器金属化薄膜及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103923385A CN103923385A (zh) | 2014-07-16 |
CN103923385B true CN103923385B (zh) | 2016-04-06 |
Family
ID=51141793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410141920.5A Active CN103923385B (zh) | 2014-04-10 | 2014-04-10 | 一种高牢度电容器金属化薄膜及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103923385B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04243110A (ja) * | 1991-01-17 | 1992-08-31 | Matsushita Electric Ind Co Ltd | 金属化プラスチックフィルムコンデンサ |
CA1336158C (en) * | 1985-09-11 | 1995-07-04 | Edward Norman Biel | Low temperature impact and puncture resistant termoplastic films and bags therefrom |
CN1223198A (zh) * | 1997-12-26 | 1999-07-21 | 东丽株式会社 | 金属化用双轴取向聚丙烯薄膜、金属化双轴取向聚丙烯薄膜及使用它的叠层体 |
CN1532248A (zh) * | 2003-02-07 | 2004-09-29 | ���з��ɹ�˾ | 金属化的多层膜 |
CN101906228A (zh) * | 2009-06-04 | 2010-12-08 | 王子制纸株式会社 | 电容器用双轴拉伸聚丙烯薄膜、金属化薄膜和流延生坯片 |
CN102939326A (zh) * | 2010-06-09 | 2013-02-20 | 埃克森美孚石油公司 | 薄膜组合物及其制备方法 |
-
2014
- 2014-04-10 CN CN201410141920.5A patent/CN103923385B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1336158C (en) * | 1985-09-11 | 1995-07-04 | Edward Norman Biel | Low temperature impact and puncture resistant termoplastic films and bags therefrom |
JPH04243110A (ja) * | 1991-01-17 | 1992-08-31 | Matsushita Electric Ind Co Ltd | 金属化プラスチックフィルムコンデンサ |
CN1223198A (zh) * | 1997-12-26 | 1999-07-21 | 东丽株式会社 | 金属化用双轴取向聚丙烯薄膜、金属化双轴取向聚丙烯薄膜及使用它的叠层体 |
CN1532248A (zh) * | 2003-02-07 | 2004-09-29 | ���з��ɹ�˾ | 金属化的多层膜 |
CN101906228A (zh) * | 2009-06-04 | 2010-12-08 | 王子制纸株式会社 | 电容器用双轴拉伸聚丙烯薄膜、金属化薄膜和流延生坯片 |
CN102939326A (zh) * | 2010-06-09 | 2013-02-20 | 埃克森美孚石油公司 | 薄膜组合物及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103923385A (zh) | 2014-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103112169B (zh) | 一种电磁炉电容器金属化膜的制备方法 | |
CN103951886A (zh) | 一种耐热耐击穿电容器金属化薄膜及其制备方法 | |
CN103937104B (zh) | 一种阻燃抗击穿等规聚丙烯电容器用金属化薄膜及其制备方法 | |
CN103937098B (zh) | 一种综合性能优良的电容器用金属化薄膜及其制备方法 | |
CN103923385B (zh) | 一种高牢度电容器金属化薄膜及其制备方法 | |
CN103937105B (zh) | 一种成本低成膜性好的电容器金属化薄膜及其制备方法 | |
CN103937102B (zh) | 一种阻燃等规聚丙烯电容器金属化薄膜及其制备方法 | |
CN103951879B (zh) | 一种复合等规聚丙烯电容器金属化薄膜及其制备方法 | |
CN103937103A (zh) | 一种质量均一耐热的电容器金属化薄膜及其制备方法 | |
CN103937100B (zh) | 一种机械强度良好的电容器用聚丙烯金属化薄膜及其制备方法 | |
CN103951878B (zh) | 一种等规聚丙烯改性电容器金属化薄膜及其制备方法 | |
CN103724845A (zh) | 一种体积小耐压强度大的复合聚烯烃电容器金属化膜及其制备方法 | |
CN103762077A (zh) | 一种抗氧化抗击穿电容器金属化薄膜及其制备方法 | |
CN103724805A (zh) | 一种综合性能优良的电容器用金属化薄膜及其制备方法 | |
CN103834103B (zh) | 一种自愈能力改性等规聚丙烯电容器金属化膜及其制备方法 | |
CN103951887B (zh) | 一种等规聚丙烯改性电容器金属化薄膜及其制备方法 | |
CN103923386B (zh) | 一种改性聚丙烯电容器金属化薄膜及其制备方法 | |
CN103951885B (zh) | 一种抗粘连耐热电容器金属化薄膜及其制备方法 | |
CN103951881B (zh) | 一种耐高压抗击穿电容器用金属化薄膜及其制备方法 | |
CN103756140A (zh) | 一种自愈能力强的电容器金属化薄膜及其制备方法 | |
CN103951883B (zh) | 一种电容器用阻燃改性等规聚丙烯金属化薄膜及其制备方法 | |
CN103951884B (zh) | 一种高温稳定的电容器用金属化薄膜及其制备方法 | |
CN103937099B (zh) | 一种无卤阻燃耐高温电容器金属化薄膜及其制备方法 | |
CN103804785A (zh) | 一种电容器用等规聚丙烯金属化薄膜及其制备方法 | |
CN103804791A (zh) | 一种超薄改性等规划聚丙烯电容器金属化膜及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |