CN103913486A - Method for preparing AuNPs-PDMS composite micro film biosensor - Google Patents
Method for preparing AuNPs-PDMS composite micro film biosensor Download PDFInfo
- Publication number
- CN103913486A CN103913486A CN201410144773.7A CN201410144773A CN103913486A CN 103913486 A CN103913486 A CN 103913486A CN 201410144773 A CN201410144773 A CN 201410144773A CN 103913486 A CN103913486 A CN 103913486A
- Authority
- CN
- China
- Prior art keywords
- pdms
- film
- solution
- aunps
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004205 dimethyl polysiloxane Substances 0.000 title claims abstract description 68
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 title claims abstract description 68
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000002131 composite material Substances 0.000 title abstract description 10
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 38
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000002360 preparation method Methods 0.000 claims abstract description 24
- 238000004544 sputter deposition Methods 0.000 claims abstract description 13
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims abstract description 8
- 239000008103 glucose Substances 0.000 claims abstract description 8
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims abstract description 6
- 235000015497 potassium bicarbonate Nutrition 0.000 claims abstract description 6
- 239000011736 potassium bicarbonate Substances 0.000 claims abstract description 6
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims abstract description 6
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 3
- 239000010408 film Substances 0.000 claims description 45
- 239000010409 thin film Substances 0.000 claims description 31
- 239000011521 glass Substances 0.000 claims description 30
- 150000001875 compounds Chemical class 0.000 claims description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- 239000008367 deionised water Substances 0.000 claims description 14
- 229910021641 deionized water Inorganic materials 0.000 claims description 14
- 238000004528 spin coating Methods 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 229920002120 photoresistant polymer Polymers 0.000 claims description 13
- 229910052804 chromium Inorganic materials 0.000 claims description 11
- 239000011651 chromium Substances 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 230000001133 acceleration Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 claims description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000002444 silanisation Methods 0.000 claims description 4
- 239000007858 starting material Substances 0.000 claims description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 4
- 238000001291 vacuum drying Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 2
- 229910002651 NO3 Inorganic materials 0.000 claims description 2
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 230000001476 alcoholic effect Effects 0.000 claims description 2
- 229910052740 iodine Inorganic materials 0.000 claims description 2
- 239000011630 iodine Substances 0.000 claims description 2
- 239000005051 trimethylchlorosilane Substances 0.000 claims 1
- 239000010931 gold Substances 0.000 abstract description 16
- 229910052737 gold Inorganic materials 0.000 abstract description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 10
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000035945 sensitivity Effects 0.000 abstract description 2
- 239000002253 acid Substances 0.000 abstract 2
- 239000003638 chemical reducing agent Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000010923 batch production Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 12
- 238000001514 detection method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 239000012491 analyte Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- SJUCACGNNJFHLB-UHFFFAOYSA-N O=C1N[ClH](=O)NC2=C1NC(=O)N2 Chemical compound O=C1N[ClH](=O)NC2=C1NC(=O)N2 SJUCACGNNJFHLB-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003905 agrochemical Substances 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011540 sensing material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Abstract
The invention discloses a method for preparing AuNPs (nanogold)-PDMS (polydimethylsiloxane) composite micro film surface stress biosensor. The method comprises the following steps: by taking a PDMS film as a substrate and using a chloroauric acid solution as a first-step reducing agent, reducing to generate a gold seed; by utilizing the gold seed generated on the film and taking glucose and potassium bicarbonate as auxiliary reducing agents, performing second-step reduction on the composite film by using the chloroauric acid; by utilizing an AuNPs-PDMS composite film as a sensitive element of the sensor and taking PDMS as a substrate, preparing a gold electrode of the sensor by adopting a sputtering technology, and finishing preparation of the sensor. The electric conductivity of the AuNPs-PDMS composite film generated by the method is obviously improved, so that the sensitivity of the sensor is improved. Moreover, the preparation method is simple, and possibility is provided for miniature, low-cost batch production.
Description
Technical field
The present invention relates to field of biosensors, specifically the preparation method of the compound mems thin film surface stress of a kind of AuNPs-PDMS biology sensor.
Background technology
Surface stress biology sensor can be converted into measurable optical, electrical or mechanical signal as the novel sensor of a class by the combination of intermolecular chemical bond, and then realizes sensing detection.The method can be carried out detection analysis to analyte from molecular level, has higher detection analysis precision, and this provides a good technical support for realizing high-precision disease detection, food agricultural chemicals or heavy metal pollution detection, biochemical pollution detection etc.
The sensitive element of sensor plays an important role in whole sensing system.At present, micro-cantilever and mems thin film are two kinds of sensitive elements based on surface stress biology sensor.Wherein, micro-cantilever type surface stress biology sensor has a large amount of research before this, but this structure has certain limitation, as non-specific adsorption.Comparatively speaking, no matter mems thin film is to have its advantage aspect signal transmission or analyte absorption.But, the structure processed complex of existing thin film capacitor type sensor, and output differential capacitance only have several volts, greatly increased the complexity of testing circuit.
Summary of the invention
The subject matter that the present invention exists in order to solve current surface stress biology sensor, as problems such as the processed complex degree of the non-Characteristic Adsorption of cantilever beam structure, thin film capacitor type sensor construction, provide the preparation method of the compound mems thin film surface stress of a kind of AuNPs-PDMS biology sensor.
The present invention adopts following technical scheme to realize:
A preparation method for the compound mems thin film biology sensor of AuNPs-PDMS, comprises the steps:
(1), clean glass sheet, and glass sheet is carried out to silanization processing with TMCS, for subsequent use;
(2), preparation PDMS solution;
(3), getting the upper surface spin coating PDMS solution of glass sheet ready, formation PDMS film after solidifying;
(4), step (3) gained glass sheet is immersed in to HAuCl
4in solution 20～24 hours, reduce for the first time;
(5), use HAuCl
4solution, glucose solution and potassium bicarbonate solution configuration reducing solution, be immersed in reducing solution 20～24 hours by step (4) gained glass sheet, reduces for the second time;
(6), preparation PDMS solution, then PDMS soln using mould is prepared sensor base, the upper surface middle part of described sensor base is formed with cavity;
(7) around the cavity of sensor base upper surface, be coated with PDMS solution, the PDMS film on step (5) gained glass sheet is peeled from glass sheet, be attached to the upper surface of sensor base and hide cavity completely;
(8) at the upper surface sputtered metal film of sensor base;
(9) spin coating photoresist on metallic film, after exposure and development photoresist, wet etching metallic film, goes after photoresist, form two independently electrode structures, described each electrode structure is positioned in the PDMS film edge of sensor base upper surface at least partly.
PDMS(dimethyl silicone polymer) as a kind of novel film material, there is good biological fitness.Compared with other typical thin films materials (silicon, monox, aluminium nitride, PMMA, SU8 etc.), there is relatively little Young modulus (12kPa-2.5Mpa).AuNPs is the important nano material of a class, and preparation is simple, has high stability, small-size effect, surface effect, quantum effect, macro quanta tunnel effect and biocompatibility, is easy to carry out surface chemical modification.
In said method, select to adopt twice reducing process, first in step (4), use HAuCl
4solution reduces for the first time, and some nano Au particles reduce on PDMS film as seed.Then use HAuCl
4the ratio preparation reducing solution that solution, glucose solution, potassium bicarbonate solution are 2:1:1 according to volume ratio, again the PDMS film that contains gold particle is reduced for the second time, golden nanometer particle is further deposited on around gold seeds, thereby prepared, electric conductivity is good, the compound mems thin film of AuNPs-PDMS of even thickness,, the shortcoming such as film conductivity bad very few such as golden nanometer particle on composite membrane that have overcome that additive method (as a stage reduction method, Physical etc.) exists.The compound mems thin film of AuNPs-PDMS forming of being combined with golden nanometer particle based on PDMS possesses the two-fold advantage of bi-material; have the advantages such as satisfactory electrical conductivity, bioaffinity and the super-hydrophobicity of dimethyl silicone polymer and nm of gold concurrently, be widely used in bio-sensing, Biofunctional materials, environmental protection, the field such as micro-fluidic.
The compound mems thin film of AuNPs-PDMS deflects under surface stress effect, can cause nano Au particle average particle spacing to increase, thereby the electricity that causes thin film system is led and is changed, experimental results show that this class formation is compared with traditional metal or semiconductor pressure resistance sensing material, its sensitivity has exceeded about two orders of magnitude.
Therefore, when use, by the compound mems thin film of AuNPs-PDMS is modified, surface stress causes the compound mems thin film generation of AuNPs-PDMS strain, cavity on pedestal provides the space of strain for the compound mems thin film of AuNPs-PDMS, and then by two electrode structures independently on sensor, the conductivity variations of the compound mems thin film of monitoring AuNPs-PDMS, carry out bio-sensing detection, there is the advantages such as highly sensitive, reproducible, good biocompatibility and high integration.
The present invention is reasonable in design, the compound mems thin film conductance type of highly sensitive AuNPs-PDMS surface stress biology sensor is prepared in processing, this sensor can solve the subject matter that current surface stress biology sensor exists, as the non-Characteristic Adsorption of cantilever beam structure, the processed complex degree of thin film capacitor type structure etc.
Brief description of the drawings
Fig. 1 is the schematic diagram after step (3).
Fig. 2 is the schematic diagram after step (4).
Fig. 3 is the schematic diagram after step (5).
Fig. 4 is the schematic diagram of the sensor base prepared of step (6).
Fig. 5 is the schematic diagram after step (7).
Fig. 6 is the schematic diagram after step (8).
Fig. 7 is the schematic diagram after step (9).
Fig. 8 is the vertical view of Fig. 7.
In figure, 1-PDMS film, 2-glass sheet, 3-Au particle, the Au particle of 4-secondary reduction, 5-sensor base, 6-cavity, 7-AuNPs-PDMS composite membrane, 8-gold film, 9-chromium film, 10-hearth electrode, the 11-electrode that goes between.
Embodiment
Below in conjunction with accompanying drawing, specific embodiments of the invention are elaborated.
A preparation method for the compound mems thin film surface stress of AuNPs-PDMS biology sensor, comprises the steps:
(1), clean glass sheet 2, and glass sheet is carried out to silanization processing with TMCS; Concrete grammar is as follows:
Prepare glass sheet size 1.3cm × 1.3cm.Be equipped with cleaning fluid according to volume ratio (concentrated sulphuric acid: hydrogen peroxide=4:1), glass sheet is put into.Use cleaning machine to clean at normal temperatures 15min, clean and finish rear use deionized water rinsing glass sheet, and dry up with nitrogen.Prepare silylating reagent TMCS, glass sheet is put into double dish, splash into a certain amount of silylating reagent, cover double dish lid, after 20 minutes, after deionized water rinsing, dry up with nitrogen.So far glass sheet silanization completes, and its surface is with methyl, and hydrophobicity strengthens.
(2), prepare 5g dimethyl silicone polymer solution taking Sylgard184 as starting material; Concrete grammar is as follows:
Comprise one bottle of base fluid and one bottle of hardening agent taking Sylgard184(Sygard184) as starting material, according to the dimethyl silicone polymer solution of the proportional arrangement 5g of volume ratio (base fluid: hardening agent=9:1), mix to bubble and be evenly distributed in solution with stirrer, then vacuumize with vacuum drying chamber, repeat five to six times until exist without bubble in solution.
(3), getting the thick dimethyl silicone polymer film 1 of upper surface spin coating 10 μ m of glass sheet ready, as shown in Figure 1; Concrete grammar is as follows:
Use spin coating instrument to carry out spin coating, process is divided into three phases: first stage rotating speed is from 0～1500rpm, and the acceleration time is 6s, enters for the 2nd stage; The 2nd stage rotating speed maintains 1500rpm, maintains 60s; The 3rd stage rotating speed is from 1500～0rpm, and deceleration time is to stop after 6s.Taking out glass sheet, to be placed on temperature be on the baking platform of 70 DEG C, to carry out solidifying of dimethyl silicone polymer mems thin film, and the time is 2 hours, and obtaining homogeneous, thickness is the dimethyl silicone polymer mems thin film of 10 μ m.
(4), at the HAuCl of 0.01g/ml
4in solution, PDMS film is reduced for the first time, wherein, the curing agent component in PDMS film, as reductive agent, reduces gold particle on PDMS film, as shown in Figure 2; Concrete grammar is as follows:
Get the HAuCl of 0.01g/ml ready
4solution, puts into measuring cup by PDMS film, adds chlorauric acid solution 1ml, soaks 20-24 hour.
(5) use HAuCl
4, the reducing solution for preparing of glucose, saleratus reduces for the second time to film, as shown in Figure 3; Concrete grammar is as follows:
Get the HAuCl of 0.01g/ml
4the potassium bicarbonate solution 1250 μ l of solution 2500 μ l, 0.2g/ml and the glucose solution of 0.02g/ml 1250 μ l preparation reducing solutions, be immersed in step (4) gained glass sheet in the reducing solution preparing, and soaks 20-24 hour.Wherein, glucose solution provides a kind of reductive agent, and saleratus provides a kind of alkaline environment, and the PDMS film that contains gold particle is reduced for the second time, nano Au particle is further deposited on around gold seeds, thereby prepared, electric conductivity is good, the AuNPs-PDMS composite membrane 7 of even thickness.
(6), taking PDMS as material, in sensor die, make sensor base, as shown in Figure 4; Concrete grammar is as follows:
Comprise one bottle of base fluid and one bottle of hardening agent taking Sylgard184(Sygard184) as starting material, according to the dimethyl silicone polymer solution of the proportional arrangement 20g of volume ratio (base fluid: hardening agent=9:1), mix to bubble and be evenly distributed in solution with stirrer, then vacuumize with vacuum drying chamber, repeat five to six times until exist without bubble in solution.PDMS solution is poured in sensor die, then mould is put into vacuum drying chamber, under 150 degrees Celsius, heat 1 hour, solidify PDMS.Sensor base is taken out from mould.Those skilled in the art can prepare difform mould according to actual requirement, easily realize, and again repeat no more.
The upper surface middle part of described sensor base 5 is formed with cavity 6; In the present embodiment, sensor base 5 is cylindric, and it is cylindric that cavity 6 is also.
(7), around the cavity 6 of sensor base 5 upper surfaces, be coated with trace P DMS solution, the AuNPs-PDMS composite membrane 7 making is peeled from glass sheet 2, be attached to the upper surface of sensor base 5 and hide cavity 6 completely, as shown in Figure 5.
(8), in the ready-made structure of step (7) sputter gold film 8 and chromium film 9, as shown in Figure 6; Concrete grammar is as follows:
First, sputter chromium film 9 in AuNPs-PDMS composite membrane and sensor base, technical parameter is: base vacuum: 1.0 × 10-3Pa, argon flow amount: 60sccm, sputtering pressure: 0.15Pa, sputtering power: 300W, radio-frequency match (C2/C1): 550/120, sputtering time: 19s, self-bias: 130V.
Then, the thick golden film 8 of sputter 50nm on chromium film 9, technical parameter is: base vacuum: 1.0 × 10-3Pa, argon flow amount: 60sccm, sputtering pressure: 0.2Pa, sputtering power: 300W, radio-frequency match (C2/C1): 600/110, sputtering time: 20s, self-bias: 130V.
(9), spin coating photoresist on metal film, after exposure and development photoresist, wet etching metal film, go structurally to form two absolute electrode structures that are symmetric after photoresist, described electrode structure comprises hearth electrode 10 and connected lead-in wire electrode 11, described hearth electrode 10 is positioned in the PDMS film edge of sensor base 5 upper surfaces, and described lead-in wire electrode 11 is positioned at sensor base 5 upper surfaces, as shown in Figure 7,8.The diameter of described circular base electrode is 500 μ m; Concrete grammar is as follows:
First, on golden film, spin coating model is that EPI680, thickness are the positive photoresist of 2.5 μ m.Spin coating process is divided into 4 stages.The 1st stage rotating speed is from 0～100rpm, and the acceleration time is 7s, enters for the 2nd stage after maintaining 10s; The 2nd stage rotating speed is from 100～200rpm, and the acceleration time is 7s, does not stop and directly enters for the 3rd stage; The 3rd stage rotating speed is from 200～3200rpm, and the acceleration time is 8s, maintains 32s.The 4th stage rotating speed is from 3200～0rpm, deceleration time 15s, rotating speed reduces to zero rear gluing to be finished.
After completing, on the baking platform of 100 DEG C, dry, the time is 120s.The mask plate that in the present embodiment, exposure is used is bright version.After having exposed, glass sheet is put into the 55s that develops in the developer solution that model is TMAH, after deionized water rinsing, dried up with nitrogen.
Glass sheet is immersed in golden corrosive liquid to approximately 5～6s, after deionized water rinsing, dry up with nitrogen, wherein, golden corrosive liquid is according to iodine: the ratio of potassium iodide: deionized water=65g:113g:200ml is equipped with.
Glass sheet is immersed to approximately 10～12s of chromium corrosive liquid again, after deionized water rinsing, dry up with nitrogen, wherein, chromium corrosive liquid is according to ammonium ceric nitrate: acetic acid: the ratio of deionized water=22g:8 ml:70 ml is equipped with.
Afterwards, in acetone soln, soak photoresist is washed away, in alcoholic solution, soak acetone is washed away, after deionized water rinsing, dry up with nitrogen, two absolute electrode structures complete.
So far, prepared by the compound mems thin film surface stress of AuNPs-PDMS biology sensor.
Claims (8)
1. a preparation method for the compound mems thin film biology sensor of AuNPs-PDMS, is characterized in that: comprise the steps:
(1), clean glass sheet (2), and use TMCS(trimethyl chlorosilane) glass sheet is carried out to silanization processing, for subsequent use;
(2), preparation PDMS solution;
(3), getting the upper surface spin coating PDMS solution of glass sheet (2) ready, formation PDMS film (1) after solidifying;
(4), step (3) gained glass sheet is immersed in to HAuCl
4in solution 20～24 hours, reduce for the first time;
(5), use HAuCl
4solution, glucose solution and potassium bicarbonate solution configuration reducing solution, be immersed in reducing solution 20～24 hours by step (4) gained glass sheet, reduces for the second time;
(6), preparation PDMS solution, then PDMS soln using mould is prepared sensor base (5), the upper surface middle part of described sensor base (5) is formed with cavity (6);
(7) around the cavity (6) of sensor base (5) upper surface, be coated with PDMS solution, the PDMS film on step (5) gained glass sheet is peeled from glass sheet, be attached to the upper surface of sensor base (5) and hide cavity (6) completely;
(8) at the upper surface sputtered metal film of sensor base (5);
(9) spin coating photoresist on metallic film, after exposure and development photoresist, wet etching metallic film, goes after photoresist, form two independently electrode structures, described each electrode structure is positioned in the PDMS film edge of sensor base upper surface at least partly.
2. the preparation method of the compound mems thin film biology sensor of AuNPs-PDMS according to claim 1, it is characterized in that: in step (9), two absolute electrode structures of preparation are symmetric, described electrode structure comprises hearth electrode (10) and connected lead-in wire electrode (11), described hearth electrode (10) is positioned in the PDMS film edge of sensor base (5) upper surface, and described lead-in wire electrode (11) is positioned at sensor base (5) upper surface.
3. the preparation method of the compound mems thin film biology sensor of AuNPs-PDMS according to claim 1 and 2, is characterized in that: in step (8), at upper surface sputter chromium film (9) and the golden film (8) successively of sensor base (5).
4. the preparation method of the compound mems thin film biology sensor of AuNPs-PDMS according to claim 3, it is characterized in that: in step (8), first, at sensor base (5) upper surface sputter chromium film (9), technical parameter is: base vacuum: 1.0 × 10-3Pa, argon flow amount: 60sccm, sputtering pressure: 0.15Pa, sputtering power: 300W, radio-frequency match (C2/C1): 550/120, sputtering time: 19s, self-bias: 130V;
Then, at the upper thick golden film (8) of sputter 50nm of chromium film (9), technical parameter is: base vacuum: 1.0 × 10-3Pa, argon flow amount: 60sccm, sputtering pressure: 0.2Pa, sputtering power: 300W, radio-frequency match (C2/C1): 600/110, sputtering time: 20s, self-bias: 130V.
5. the preparation method of the compound mems thin film biology sensor of AuNPs-PDMS according to claim 4, is characterized in that: the concrete grammar of step (9) is as follows:
First, be that EPI680, thickness are the positive photoresist of 2.5 μ m in the upper spin coating model of golden film (8), spin coating process is divided into 4 stages: the 1st stage rotating speed is from 0～100rpm, and the acceleration time is 7s, enters for the 2nd stage after maintaining 10s; The 2nd stage rotating speed is from 100～200rpm, and the acceleration time is 7s, does not stop and directly enters for the 3rd stage; The 3rd stage rotating speed is from 200～3200rpm, and the acceleration time is 8s, maintains 32s; The 4th stage rotating speed is from 3200～0rpm, deceleration time 15s, rotating speed reduces to zero rear gluing to be finished; After completing, on the baking platform of 100 DEG C, dry, the time is 120s;
Then expose, after having exposed, put into the 55s that develops in the developer solution that model is TMAH, after deionized water rinsing, dry up with nitrogen;
Afterwards, immerse 5～6s in golden corrosive liquid, after deionized water rinsing, dry up with nitrogen, wherein, golden corrosive liquid is according to iodine: the ratio of potassium iodide: deionized water=65g:113g:200ml is equipped with;
Afterwards, immerse chromium corrosive liquid 10～12s, after deionized water rinsing, dry up with nitrogen, wherein, chromium corrosive liquid is according to ammonium ceric nitrate: the ratio of acetic acid: deionized water=22g:8ml:70ml is equipped with;
Finally, in acetone soln, soak photoresist is washed away, in alcoholic solution, soak acetone is washed away, after deionized water rinsing, dry up with nitrogen, electrode structure completes.
6. the preparation method of the compound mems thin film biology sensor of AuNPs-PDMS according to claim 5, it is characterized in that: in step (2) and step (6), the preparation method of PDMS solution is as follows: taking Sylgard184 as starting material, Sygard184 comprises base fluid and hardening agent, be the proportional arrangement dimethyl silicone polymer solution of base fluid: hardening agent=9:1 according to volume ratio, mix to bubble and be evenly distributed in solution with stirrer, then repeat to vacuumize with vacuum drying chamber, until exist without bubble in solution.
7. the preparation method of the compound mems thin film biology sensor of AuNPs-PDMS according to claim 6, is characterized in that: in step (3), the thickness of PDMS film is 10 μ m; Concrete grammar is as follows: use spin coating instrument to carry out spin coating, process is divided into three phases: the 1st stage rotating speed is from 0～1500rpm, and the acceleration time is 6s, enters for the 2nd stage; The 2nd stage rotating speed maintains 1500rpm, maintains 60s; The 3rd stage rotating speed is from 1500～0rpm, and deceleration time is to stop after 6s; Afterwards, taking out glass sheet, to be placed on temperature be on the baking platform of 70 DEG C, to carry out solidifying of PDMS film, and the time is 2 hours, and obtaining thickness is the PDMS film of 10 μ m.
8. the preparation method of the compound mems thin film biology sensor of AuNPs-PDMS according to claim 7, is characterized in that: in step (5), and described HAuCl
4the volume ratio of solution, glucose solution and potassium bicarbonate solution is that 2:1:1, concentration ratio are 1:20:2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410144773.7A CN103913486B (en) | 2014-04-12 | 2014-04-12 | The preparation method of AuNPs-PDMS compound mems thin film biosensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410144773.7A CN103913486B (en) | 2014-04-12 | 2014-04-12 | The preparation method of AuNPs-PDMS compound mems thin film biosensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103913486A true CN103913486A (en) | 2014-07-09 |
| CN103913486B CN103913486B (en) | 2016-06-08 |
Family
ID=51039326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410144773.7A Active CN103913486B (en) | 2014-04-12 | 2014-04-12 | The preparation method of AuNPs-PDMS compound mems thin film biosensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103913486B (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104257359A (en) * | 2014-09-16 | 2015-01-07 | 苏州能斯达电子科技有限公司 | Wearable flexible sensor for monitoring wrist pulse and preparation method thereof |
| CN104257366A (en) * | 2014-09-16 | 2015-01-07 | 苏州能斯达电子科技有限公司 | Wearable physiological sign detection sensor, preparation method and monitoring system |
| CN104281261A (en) * | 2014-09-16 | 2015-01-14 | 苏州能斯达电子科技有限公司 | Wearable tension sensor for gesture interaction system and preparation method thereof |
| CN104287739A (en) * | 2014-09-16 | 2015-01-21 | 苏州能斯达电子科技有限公司 | Flexible wearable sensor for detecting foot movements and manufacturing method thereof |
| CN104287698A (en) * | 2014-09-16 | 2015-01-21 | 苏州能斯达电子科技有限公司 | Flexible and attachable sensor used for neck pulse detection and manufacturing method of flexible and attachable sensor used for neck pulse detection |
| CN104523368A (en) * | 2014-11-25 | 2015-04-22 | 苏州能斯达电子科技有限公司 | Wearable flexible electronic adhesive bandage and human body health monitoring system |
| CN105067807A (en) * | 2015-04-30 | 2015-11-18 | 珠海丽珠试剂股份有限公司 | Immunodetection nanometer colloidal gold preparation method |
| CN106693077A (en) * | 2017-01-22 | 2017-05-24 | 包磊 | Electronic skin base, preparation method thereof and electronic skin |
| CN106950267A (en) * | 2017-02-24 | 2017-07-14 | 首都师范大学 | A kind of flexible electrode preparation method and flexible electrode |
| CN108225620A (en) * | 2017-12-22 | 2018-06-29 | 江苏大学 | A kind of flexible touch sensation sensor with multi-layer structure and preparation method thereof |
| CN108369218A (en) * | 2015-12-08 | 2018-08-03 | 国立研究开发法人物质材料研究机构 | Using the particle of alkyl modification as the fuel oil identification sensor of receptive layers and fuel oil recognition methods |
| CN108593160A (en) * | 2018-05-23 | 2018-09-28 | 太原理工大学 | A kind of manufacturing method of diaphragm type cantilever beam surface stress biosensor |
| CN112816106A (en) * | 2020-12-24 | 2021-05-18 | 太原理工大学 | Tb-Dy-Fe flexible magnetoelastic film biosensor and preparation method thereof |
| CN113295667A (en) * | 2021-04-30 | 2021-08-24 | 华东师范大学 | Detect Cu simultaneously+And Cu2+Surface-enhanced Raman spectrum probe and preparation method and application thereof |
| CN114018301A (en) * | 2021-11-04 | 2022-02-08 | 中国工程物理研究院激光聚变研究中心 | Micro-nano optical fiber multifunctional sensor and preparation method and application thereof |
| CN114264275A (en) * | 2021-12-28 | 2022-04-01 | 中国建筑材料科学研究总院有限公司 | Nondestructive testing method for surface roughness of micro-nano grating |
| CN114571822A (en) * | 2022-04-29 | 2022-06-03 | 太原理工大学 | Bionic super-hydrophobic paper-based magnetoelectric composite film and preparation method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02213757A (en) * | 1989-02-15 | 1990-08-24 | Seiko Instr Inc | Piezoelectric element gas sensor system |
| CN101509130A (en) * | 2009-03-12 | 2009-08-19 | 浙江大学 | Method for producing film metal fine device on PDMS surface |
| CN101748055A (en) * | 2008-12-16 | 2010-06-23 | 盐城工学院 | Micro enzyme reactor of polydimethylsiloxane-nano-Au composite |
| CN102502478A (en) * | 2011-11-08 | 2012-06-20 | 太原理工大学 | Manufacturing method for polydimethylsiloxane microfilm biosensor based on surface stress |
| CN103105423A (en) * | 2013-01-25 | 2013-05-15 | 中国人民解放军国防科学技术大学 | Interdigital electrode with nano-dot array, and preparation method and application thereof |
| CN103231518A (en) * | 2013-03-22 | 2013-08-07 | 南京航空航天大学 | Polydimethylsiloxane array micropore film preparation method |
| CN103571738A (en) * | 2013-07-02 | 2014-02-12 | 中国人民解放军第三军医大学 | Micro-fluidic chip device based on chemotactic factor enriching effect and preparation method thereof |
| CN103645229A (en) * | 2013-12-12 | 2014-03-19 | 复旦大学 | Array type multi-electrochemical isothermal amplification chip for detecting bacteria and preparation method thereof |
-
2014
- 2014-04-12 CN CN201410144773.7A patent/CN103913486B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02213757A (en) * | 1989-02-15 | 1990-08-24 | Seiko Instr Inc | Piezoelectric element gas sensor system |
| CN101748055A (en) * | 2008-12-16 | 2010-06-23 | 盐城工学院 | Micro enzyme reactor of polydimethylsiloxane-nano-Au composite |
| CN101509130A (en) * | 2009-03-12 | 2009-08-19 | 浙江大学 | Method for producing film metal fine device on PDMS surface |
| CN102502478A (en) * | 2011-11-08 | 2012-06-20 | 太原理工大学 | Manufacturing method for polydimethylsiloxane microfilm biosensor based on surface stress |
| CN103105423A (en) * | 2013-01-25 | 2013-05-15 | 中国人民解放军国防科学技术大学 | Interdigital electrode with nano-dot array, and preparation method and application thereof |
| CN103231518A (en) * | 2013-03-22 | 2013-08-07 | 南京航空航天大学 | Polydimethylsiloxane array micropore film preparation method |
| CN103571738A (en) * | 2013-07-02 | 2014-02-12 | 中国人民解放军第三军医大学 | Micro-fluidic chip device based on chemotactic factor enriching effect and preparation method thereof |
| CN103645229A (en) * | 2013-12-12 | 2014-03-19 | 复旦大学 | Array type multi-electrochemical isothermal amplification chip for detecting bacteria and preparation method thereof |
Non-Patent Citations (8)
| Title |
|---|
| KEISUKE SAITO，等: "Fabrication of curved PDMS microstructures on silica glass by proton beam writing aimed for micro-lens arrays on transparent substrates", 《NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH B》 * |
| MA WEN-ZHE，等: "Recent progress in the preparation of AuNPs-PDMS composite membranes", 《JOURNAL OF MEASUREMENT SCIENCE AND INSTRUMENTATION》 * |
| SANG SHENGBO，等: "Design and Fabrication of Sensitive Element of Surface Stress-Based Biosensors", 《纳米技术与精密工程》 * |
| SHENGBO SANG • HARTMUT WITTE: "Fabrication of a surface stress-based PDMS micro-membrane biosensor", 《MICROSYST TECHNOL》 * |
| SRINATH SATYANARAYANA，等: "Parylene micro membrane capacitive sensor array for chemical and biological sensing", 《SENSORS AND ACTUATORS B》 * |
| 孙楫舟，等: "基于免疫微传感器的微流体系统", 《微纳电子技术》 * |
| 石强，等: "薄膜电容式表面应力生物传感器设计与优化", 《电子元件与材料》 * |
| 马文哲，等: "聚二甲基硅氧烷薄膜的衬底硅烷化及测试分析", 《现代化工》 * |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104257366B (en) * | 2014-09-16 | 2016-06-01 | 苏州能斯达电子科技有限公司 | A kind of wearable physiology sign detecting sensor, preparation method and Monitoring systems thereof |
| CN104257366A (en) * | 2014-09-16 | 2015-01-07 | 苏州能斯达电子科技有限公司 | Wearable physiological sign detection sensor, preparation method and monitoring system |
| CN104281261A (en) * | 2014-09-16 | 2015-01-14 | 苏州能斯达电子科技有限公司 | Wearable tension sensor for gesture interaction system and preparation method thereof |
| CN104287739A (en) * | 2014-09-16 | 2015-01-21 | 苏州能斯达电子科技有限公司 | Flexible wearable sensor for detecting foot movements and manufacturing method thereof |
| CN104287698A (en) * | 2014-09-16 | 2015-01-21 | 苏州能斯达电子科技有限公司 | Flexible and attachable sensor used for neck pulse detection and manufacturing method of flexible and attachable sensor used for neck pulse detection |
| CN104257359A (en) * | 2014-09-16 | 2015-01-07 | 苏州能斯达电子科技有限公司 | Wearable flexible sensor for monitoring wrist pulse and preparation method thereof |
| CN104281261B (en) * | 2014-09-16 | 2018-04-13 | 苏州能斯达电子科技有限公司 | A kind of wearable tension sensor for gesture interaction system and preparation method thereof |
| CN104523368A (en) * | 2014-11-25 | 2015-04-22 | 苏州能斯达电子科技有限公司 | Wearable flexible electronic adhesive bandage and human body health monitoring system |
| CN104523368B (en) * | 2014-11-25 | 2018-07-31 | 苏州能斯达电子科技有限公司 | A kind of wearable flexible electronic adhesive bandage and human health detection system |
| CN105067807A (en) * | 2015-04-30 | 2015-11-18 | 珠海丽珠试剂股份有限公司 | Immunodetection nanometer colloidal gold preparation method |
| CN108369218A (en) * | 2015-12-08 | 2018-08-03 | 国立研究开发法人物质材料研究机构 | Using the particle of alkyl modification as the fuel oil identification sensor of receptive layers and fuel oil recognition methods |
| CN106693077A (en) * | 2017-01-22 | 2017-05-24 | 包磊 | Electronic skin base, preparation method thereof and electronic skin |
| CN106950267A (en) * | 2017-02-24 | 2017-07-14 | 首都师范大学 | A kind of flexible electrode preparation method and flexible electrode |
| CN106950267B (en) * | 2017-02-24 | 2020-02-18 | 首都师范大学 | Flexible electrode preparation method and flexible electrode |
| CN108225620B (en) * | 2017-12-22 | 2020-06-26 | 江苏大学 | Flexible touch sensor with multilayer structure and manufacturing method thereof |
| CN108225620A (en) * | 2017-12-22 | 2018-06-29 | 江苏大学 | A kind of flexible touch sensation sensor with multi-layer structure and preparation method thereof |
| CN108593160A (en) * | 2018-05-23 | 2018-09-28 | 太原理工大学 | A kind of manufacturing method of diaphragm type cantilever beam surface stress biosensor |
| CN112816106A (en) * | 2020-12-24 | 2021-05-18 | 太原理工大学 | Tb-Dy-Fe flexible magnetoelastic film biosensor and preparation method thereof |
| CN112816106B (en) * | 2020-12-24 | 2022-03-22 | 太原理工大学 | Tb-Dy-Fe flexible magnetoelastic film biosensor and preparation method thereof |
| CN113295667A (en) * | 2021-04-30 | 2021-08-24 | 华东师范大学 | Detect Cu simultaneously+And Cu2+Surface-enhanced Raman spectrum probe and preparation method and application thereof |
| CN114018301A (en) * | 2021-11-04 | 2022-02-08 | 中国工程物理研究院激光聚变研究中心 | Micro-nano optical fiber multifunctional sensor and preparation method and application thereof |
| CN114264275A (en) * | 2021-12-28 | 2022-04-01 | 中国建筑材料科学研究总院有限公司 | Nondestructive testing method for surface roughness of micro-nano grating |
| CN114571822A (en) * | 2022-04-29 | 2022-06-03 | 太原理工大学 | Bionic super-hydrophobic paper-based magnetoelectric composite film and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103913486B (en) | 2016-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103913486A (en) | Method for preparing AuNPs-PDMS composite micro film biosensor | |
| CN103713022B (en) | Polydimethylsiloxanemicro-thin micro-thin film capacitive biosensor preparation method | |
| US10989685B2 (en) | Method of using biochip with biosensors | |
| CN104807869B (en) | Manufacturing and integration method for two-dimensional nanomaterial-based biosensor | |
| CN101592627B (en) | Method for manufacturing and integrating multichannel high-sensitive biosensor | |
| Brodoceanu et al. | Dense arrays of uniform submicron pores in silicon and their applications | |
| CN108917995A (en) | A kind of flexibility piezoresistance sensor | |
| CN103199020A (en) | Preparing method and detecting method of liquid grid type grapheme field-effect tube based on polyimide (PI) | |
| McKnight et al. | Microarrays of vertically-aligned carbon nanofiber electrodes in an open fluidic channel | |
| Baraket et al. | A flexible electrochemical micro lab-on-chip: application to the detection of interleukin-10 | |
| CN103163187A (en) | Film rubbed by C-reactive protein with fixed phase and application thereof in sensing chip system | |
| Dena et al. | Surface-imprinted polymers (SIPs): advanced materials for bio-recognition | |
| CN112630282A (en) | Preparation of array electrode chip combined with micro-fluidic clamp and construction method of electrochemical immunosensor | |
| CN109445248A (en) | Utilize the method and application of capillarity coining metal nanometer line | |
| CN112345510A (en) | Manufacturing process and application of flexible Raman enhanced intelligent sensing device suitable for rape crops | |
| CN102502478A (en) | Manufacturing method for polydimethylsiloxane microfilm biosensor based on surface stress | |
| CN208366907U (en) | Flexible ion transducer based on two tungsten selenides | |
| Erkmen et al. | Layer-by-layer modification strategies for electrochemical detection of biomarkers | |
| CN110170342A (en) | Molybdenum disulfide self-assembled film micro-fluidic chip and preparation method layer by layer | |
| US10690647B2 (en) | Chemical sensor for heavy metal detection | |
| KR100727533B1 (en) | Plate-shaped covering structure for field effect transistor type sensor system and field effect transistor sensor system formed of the same | |
| Mujeeb-U-Rahman et al. | Fabrication of patterned integrated electrochemical sensors | |
| CN107543924A (en) | Biology sensor detection myeloperoxidase based on copper palladium platinum mesh nanometer material | |
| CN107976277A (en) | Vacuum transducer based on graphene oxide and preparation method and application | |
| Jorsch et al. | Implantable biomedical sensor array with biocompatible hermetic encapsulation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20140709 Assignee: Shanxi Legrand Technology Co.,Ltd. Assignor: Taiyuan University of Technology Contract record no.: X2024140000003 Denomination of invention: Preparation method of AuNPs PDMS composite micro film biosensor Granted publication date: 20160608 License type: Common License Record date: 20240115 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20140709 Assignee: Shanxi Liuwei artificial intelligence Biomedical Research Institute Assignor: Taiyuan University of Technology Contract record no.: X2024140000006 Denomination of invention: Preparation method of AuNPs PDMS composite micro film biosensor Granted publication date: 20160608 License type: Common License Record date: 20240115 Application publication date: 20140709 Assignee: Shanxi Huadian Technology Co.,Ltd. Assignor: Taiyuan University of Technology Contract record no.: X2024140000005 Denomination of invention: Preparation method of AuNPs PDMS composite micro film biosensor Granted publication date: 20160608 License type: Common License Record date: 20240115 Application publication date: 20140709 Assignee: Shanxi Jugu Intelligent Technology Co.,Ltd. Assignor: Taiyuan University of Technology Contract record no.: X2024140000004 Denomination of invention: Preparation method of AuNPs PDMS composite micro film biosensor Granted publication date: 20160608 License type: Common License Record date: 20240115 |