CN103912898A - Ultrathin induction cooker with excellent heat dissipation effects - Google Patents
Ultrathin induction cooker with excellent heat dissipation effects Download PDFInfo
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- CN103912898A CN103912898A CN201410084764.3A CN201410084764A CN103912898A CN 103912898 A CN103912898 A CN 103912898A CN 201410084764 A CN201410084764 A CN 201410084764A CN 103912898 A CN103912898 A CN 103912898A
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Abstract
The invention discloses an ultrathin induction cooker with excellent heat dissipation effects, and belongs to the technical field of induction cooker. According to the ultrathin induction cooker, a thermal insulation board is used for separating coils from a main control circuit board; two heat dissipation fans are used to form two heat dissipation air channels in the ultrathin induction cooker so as to increase heat dissipation efficiency; heat energy dispersed by other heating electronic components on the main control circuit board is delivered by a first heat conductive device to a second heat dissipation fan so as to promote heat dissipation; and at the same time, a second heat conductive device is used for delivering heat energy generated by operation of IGBT and a bridge rectifier to a heat dissipation device; the second heat dissipation fan is capable of helping the heat dissipation device to disperse heat energy so as to reduce transferring heat resistance and increase heat dissipation efficiency; the IGBT and the bridge rectifier are arranged on one side of a PCB plate, and are not overlapped with each other, and the thickness of first heat conductive device and the thickness of the second heat conductive device are both reduced, so that the height of the induction cooker is reduced, and the induction cooker is ultrathin in thickness.
Description
Technical field
The application relates to electromagentic furnace technology field, particularly relates to a kind of Ultrathin electromagnetic furnace of good heat dissipation effect.
Background technology
The principle of electromagnetic oven is magnetic field induction eddy heating for heating, utilize electric current to produce magnetic field by coil, in the time that the magnetic line of force in magnetic field passes through the bottom of iron pot, the magnetic line of force is cut, thereby produce countless little eddy current, friction generates heat and directly calorify the food in pot to make the iron molecule High Rotation Speed collision of iron pot self.
Electromagnetic oven is in the time of work, itself does not produce naked light, the heat that pan produces in heating process can be transmitted to the structure such as drum or control circuit under body of heater, and meanwhile, the IGBT(of control circuit is insulated gate bipolar transistor) structure also can send a large amount of heat in when work.In order to ensure the normal work of electromagnetic oven, these caloric requirements that are created in body of heater are discharged in time.For this reason, the electromagnetic oven of prior art is typically provided with fan and inlet and outlet, and in traditional electromagnetic oven, all electronic components are all arranged on a control circuit board, are arranged in body of heater intricately.Therefore, cause electromagnetic oven local temperature too high, the temperature rise in electromagnetism furnace chamber is too high.And all electronic components concentrate and arrange, height is uneven, also causes electromagnetic oven temperature higher, comparatively heavy on the whole.
Ultrathin electromagnetic furnace is little with thickness, easy to use and enjoy wide market value, but that the greatest problem that Ultrathin electromagnetic furnace faces is exactly radiating effect is poor, life-span is short, for the heat dissipation problem that solves Ultrathin electromagnetic furnace is normally worked to guarantee each electronic component, the electromagnetic oven of prior art is generally directly placed in radiator fan on IGBT and bridge heap, this is for Ultrathin electromagnetic furnace, improve radiating effect, just essential advantage of sacrificing its thickness increases the service life, but this has run counter to again the meaning of Ultrathin electromagnetic furnace own, therefore, how to allow Ultrathin electromagnetic furnace accomplish thin and there is good heat dissipation effect simultaneously, the advantage that life-span is long, it is the problem of needing solution badly.
Summary of the invention
The application's object is to avoid weak point of the prior art and Ultrathin electromagnetic furnace that a kind of good heat dissipation effect is provided, the Ultrathin electromagnetic furnace of this good heat dissipation effect not only effectively reduces the whole height of the electromagnetic oven product of prior art, but also improve its integral heat sink efficiency simultaneously, make the direction stable development of electromagentic furnace technology to ultrathin.
The application's object is achieved through the following technical solutions:
A kind of Ultrathin electromagnetic furnace of good heat dissipation effect is provided, comprise electromagnetic oven chassis, electromagnetic oven chassis comprises coil area and circuit region, coil area is provided with coil, circuit region comprises main control board, the heat-generating electronic elements that main control board comprises pcb board and is electrically connected with pcb board, heat-generating electronic elements comprises IGBT, bridge heap and other heat-generating electronic elements;
In the application,
Between coil area and circuit region, be provided with thermal insulation board, coil area is provided with the first heat dissipation wind channel, described the first heat dissipation wind channel comprises the first radiator fan, described the first radiator fan is located at coil area, the first radiator fan is provided with the first wind inlet of fan and the first fan outlet, the first fan outlet faces coil, electromagnetic oven chassis is provided with the first air inlet and the first air outlet, and first air outlet on the first air inlet, the first wind inlet of fan, the first fan outlet and the electromagnetic oven chassis on electromagnetic oven chassis forms described the first heat dissipation wind channel;
Circuit region is provided with the second heat dissipation wind channel, described the second heat dissipation wind channel comprises the second radiator fan, described the second radiator fan is located at the side away from pcb board of IGBT and bridge heap, electromagnetic oven chassis is provided with the second air inlet and the second air outlet, other heat-generating electronic elements is provided with the first heat-transfer device of thin shape, IGBT and Qiao Dui are equipped with the second heat-transfer device of thin shape, the second radiator fan is provided with heat abstractor, the first heat-transfer device conducts to the second radiator fan for the heat that other heat-generating electronic elements is sent, the second heat-transfer device conducts to heat abstractor for the heat that IGBT and Qiao Dui are sent, second air inlet on electromagnetic oven chassis, the first heat-transfer device, the second heat-transfer device, the second radiator fan, second air outlet on heat abstractor and electromagnetic oven chassis forms described the second heat dissipation wind channel,
IGBT and Qiao Dui are positioned at a side of pcb board and not overlapping mutually, and other heat-generating electronic elements is positioned at pcb board top.
Wherein, described the first heat-transfer device comprises the first heat-conducting pad and PCB radiating fin, the first heat-conducting pad is attached at other heat-generating electronic elements upper end, PCB radiating fin is attached at above the first heat-conducting pad, and PCB radiating fin faces the setting party of second air inlet on electromagnetic oven chassis and the conduit of PCB radiating fin to identical with the wind direction through described conduit.
Wherein, the lower surface of described PCB radiating fin is plane.
Wherein, described the second heat-transfer device comprises the second heat-conducting pad, the 3rd heat-conducting pad, radiating copper sheet and heat pipe, and wherein, one end of heat pipe is fire end, and the other end of heat pipe is condensation end;
Described the second heat-conducting pad and the 3rd heat-conducting pad are attached at respectively the upper surface of described IGBT and bridge heap, described radiating copper sheet is attached at the upper surface of described the second heat-conducting pad and the 3rd heat-conducting pad, the fire end of described heat pipe be fixed on radiating copper sheet upper surface and be positioned at described IGBT and bridge heap directly over, the condensation end of described heat pipe extends to heat abstractor.
Wherein, described heat pipe is made as the flat-shaped heat pipe of three-dimensional bending, and the difference in height of the fire end of heat pipe and the condensation end of heat pipe is 0 to 20mm.
Wherein, described radiating copper sheet is provided with the groove of the fire end for placing heat pipe.
Wherein, described heat abstractor is made as the radiating fin of the second air outlet that faces electromagnetic oven chassis, and the condensation end of described heat pipe extends to the below of described radiating fin and is attached at radiating fin.
Wherein, described heat abstractor also comprises the second fan base plate and the second fan top board, the periphery downward bending of the second fan top board and the second fan base plate form confined space, described the second radiator fan and described radiating fin are located at described confined space, and described the second fan base plate and the second fan top board all offer the second radiator fan air inlet.
Wherein, described radiating fin is provided with two.
Wherein, second air outlet on described electromagnetic oven chassis is provided with two, respectively corresponding two described radiating fins.
The application's beneficial effect: the application is by using thermal insulation board that coil and main control board are separated, apply again two radiator fans and make two specific heat dissipation wind channels of the inner formation of electromagnetic oven, can reduce the heating of coil to the impact of main control board, improve radiating efficiency, additional the first heat-transfer device of other heat-generating electronic elements in main control board is conducted to the second radiator fan by heat and can strengthen heat radiation; Simultaneously, heat while applying the second heat-transfer device by IGBT and the work of bridge heap is transmitted to heat abstractor, and heat abstractor is fixed on the second fan outlet place, and the second radiator fan can assist heat abstractor that dissipation of heat is gone out, reduce transmission thermal resistance, improved radiating efficiency; By IGBT and Qiao Dui are located to a side of pcb board and not overlapping mutually, the first heat-transfer device that is attached at other heat-generating electronic elements is all made as to thin shape with the second heat-transfer device that is attached at IGBT and bridge heap, can reduce height, make electromagnetic oven can do thinlyyer.
Brief description of the drawings
Utilize accompanying drawing to be described further application, but embodiment in accompanying drawing does not form any restriction to the application, for those of ordinary skill in the art, is not paying under the prerequisite of creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the partial structurtes schematic diagram of the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect of the application.
Fig. 2 is the structural representation of the circuit region of the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect of the application.
Fig. 3 is the decomposition texture schematic diagram of Fig. 2.
Fig. 4 is the structural representation of heat pipe.
Fig. 5 is the another kind of structural representation of the circuit region of the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect of the application.
In figure, include:
1---electromagnetic oven chassis, 11---first air inlet, 12 on electromagnetic oven chassis---first air outlet, 13 on electromagnetic oven chassis---second air inlet, 14 on electromagnetic oven chassis---second air outlet, 15 on electromagnetic oven chassis---thermal insulation board;
2---coil area, 21---the first radiator fan, 211---the first wind inlet of fan, 212---first fan outlet, 213---shells;
3---circuit region, 32---pcb board, 33---electronic component, 331---IGBT, 332---bridge heap, 333---other heat-generating electronic elements, 34---the second radiator fan, 351---the first heat-conducting pad, 352---PCB radiating fin, 361---the second heat-conducting pad, 362---the 3rd heat-conducting pad, 363---radiating copper sheet, 364---heat pipe, 3641---fire end, 3642---condensation end, 37---radiating fin, 38---the second fan base plate, 39---the second fan top board,
4---heat pipe fixed head.
Detailed description of the invention
With the following Examples the application is further described.
embodiment 1.
The Ultrathin electromagnetic furnace of a kind of good heat dissipation effect of the present embodiment, as depicted in figs. 1 and 2, comprise electromagnetic oven chassis 1, electromagnetic oven chassis 1 comprises coil area 2 and circuit region 3, circle part in coil area 2 is used for arranging coil (figure indicates), circuit region 3 comprises main control board (not indicating in figure), main control board do not comprise in pcb board 32(Fig. 1 and Fig. 2 do not indicate) and heat-generating electronic elements 33(Fig. 1 of being electrically connected with pcb board 32 and Fig. 2 in do not indicate), heat-generating electronic elements 33 comprises IGBT331, bridge heap 332 and other heat-generating electronic elements 333;
In the present embodiment, between coil area 2 and circuit region 3, be provided with thermal insulation board 15, by thermal insulation board 15 is set, electromagnetic stove coil and main control board are separated to the impact of the temperature of the electronic component 33 of the heating that effectively reduces electromagnetic stove coil on main control board, the service life of improving electronic component 33.
Coil area 2 is provided with the first heat dissipation wind channel, it comprises the first radiator fan 21, concrete, the first radiator fan 21 is made as turbofan, the first radiator fan 21 is provided with the first wind inlet of fan 211 and the first fan outlet 212, the first radiator fan 21 is provided with shell 213, shell 213 just leaves the first fan outlet 212 to the position of coil, electromagnetic oven chassis 1 is provided with the first air inlet and the first air outlet, first air inlet 11 on electromagnetic oven chassis, the first wind inlet of fan 211, first air outlet 12 on the first fan outlet 212 and electromagnetic oven chassis forms the first heat dissipation wind channel.
When work, wind enters from first air inlet 11 on electromagnetic oven chassis, the first radiator fan 21 sucks wind from first wind inlet of fan 211 at top, dry facing to coil from the first fan outlet 212, the wind of process coil is because the heat of taking away coil forms hot blast, thereby hot blast is subject to the obstruct of thermal insulation board 15 to change direction to be distributed from first air outlet 12 on electromagnetic oven chassis, form the first heat dissipation wind channel, the effectively impact of the temperature of the electronic component 33 of the heating of minimizing electromagnetic stove coil on main control board, the service life of improving electronic component 33.
As shown in Figure 3, IGBT331 and bridge heap 332 are positioned at a side of pcb board 32 and not overlapping mutually, can reduce height, make electromagnetic oven can do thinlyyer.
Other heat-generating electronic elements 333 is positioned at pcb board 32 tops, and electromagnetic oven chassis 1 is provided with the second air inlet and the second air outlet.
Circuit region 3 is provided with the second heat dissipation wind channel, it comprises the second radiator fan 34, the second radiator fan 34 is located at the side away from pcb board 32 of IGBT331 and bridge heap 332, other heat-generating electronic elements 333 is provided with the first heat-transfer device of thin shape, IGBT331 and bridge heap 332 are equipped with the second heat-transfer device of thin shape, the second radiator fan 34 is provided with heat abstractor, the first heat-transfer device conducts to the second radiator fan 34 for the heat that other heat-generating electronic elements 333 is sent, the second heat-transfer device is for conducting to heat abstractor by IGBT331 and bridge heap 332 heats that send, second air inlet 13 on electromagnetic oven chassis, the first heat-transfer device, the second heat-transfer device, the second radiator fan 34, second air outlet 14 on heat abstractor and electromagnetic oven chassis forms the second heat dissipation wind channel.
Wherein, the height of the first heat-transfer device of thin shape is about 5mm to 15mm, and the height of the second heat-transfer device of thin shape is about 0.5mm to 3mm.
When work, the wind entering from second air inlet 13 on electromagnetic oven chassis, through the first heat-transfer device, the heat that other heat-generating electronic elements 333 is sent conducts to the second radiator fan 34, the second radiator fan 34 sheds heat by heat abstractor, and meanwhile, IGBT331 and bridge heap 332 heats that send are conducted to heat abstractor by the second heat-transfer device, the second radiator fan 34 auxiliary radiating devices shed heat, form the second heat dissipation wind channel.
Concrete, the first heat-transfer device comprises the first heat-conducting pad 351 and PCB radiating fin 352, the first heat-conducting pad 351 is attached at other heat-generating electronic elements 333 upper ends, PCB radiating fin 352 is attached at above the first heat-conducting pad 351, because the height of other heat-generating electronic elements 333 differs, for the manufacturing cost that reaches abundant heat radiation and save PCB radiating fin 352, therefore by the space between top and the PCB radiating fin 352 of the large electronic component 33 of the lower caloric value of the first heat-conducting pad 351 quasi-complement height, therefore, preferably way can be: the electronic component 33 that highly the highest caloric value is large can directly contact PCB radiating fin 352, without using the first heat-conducting pad 351.
PCB radiating fin 352 faces second air inlet 13 on electromagnetic oven chassis and the conduit direction of PCB radiating fin 352 is identical with the wind direction through described conduit, can improve radiating effect.
Concrete, by the large electronic component 33 of the caloric value for differing heights, adopt respectively elastic first heat-conducting pad 351 of differing heights, the PCB radiating fin 352 that the first heat-conducting pad 351 can be plane with lower surface is more fully contacted, the manufacturing cost that the lower surface of PCB radiating fin 352 is made as plane can save PCB radiating fin 352.
Concrete, the second heat-transfer device comprises the second heat-conducting pad 361, the 3rd heat-conducting pad 362, radiating copper sheet 363 and heat pipe 364, and wherein, one end of heat pipe 364 is fire end 3641, and the other end of heat pipe 364 is condensation end 3642;
Described the second heat-conducting pad 361 and the 3rd heat-conducting pad 362 are attached at respectively the upper surface of described IGBT331 and bridge heap 332, described radiating copper sheet 363 is attached at the upper surface of described the second heat-conducting pad 361 and the 3rd heat-conducting pad 362, the fire end 3641 of described heat pipe 364 be fixed on the upper surface of radiating copper sheet 363 and be positioned at described IGBT331 and bridge heap 332 directly over, the condensation end 3642 of described heat pipe 364 extends to heat abstractor, because IGBT331 and bridge heap 332 has certain difference in height, utilize the differing heights of the second heat-conducting pad 361 and the 3rd heat-conducting pad 362 to carry out this difference in height of quasi-complement, the effect that uses radiating copper sheet 363 is the heat transfer area that increases the second heat-conducting pad 361 and the 3rd heat-conducting pad 362, and the second heat-conducting pad 361 and the 3rd heat-conducting pad 362 have elasticity, can make and IGBT331, the contact of bridge heap 332 and radiating copper sheet 363 is more abundant.
Concrete, as shown in Figure 4, described heat pipe 364 is made as the flat-shaped heat pipe of three-dimensional bending 364, the benefit of the flat-shaped heat pipe 364 of three-dimensional bending is to increase the fire end 3641 of heat pipe 364 at the area of the projection of radiating copper sheet 363, can increase the condensation end 3642 of heat pipe 364 at the area of the projection of radiating fin 37 simultaneously, and then increase heat conduction or radiating effect, and in short transverse, more save space, be conducive to the design of Ultrathin electromagnetic furnace, the shape of heat pipe 364 bendings is as the criterion piling 332 heat conduction more fully and heat is conducted to heat abstractor more fully as IGBT331 and bridge.
The fire end 3641 of heat pipe 364 and the difference in height of the condensation end 3642 of heat pipe 364 are 0 to 20mm, the height of general radiator fan is directly proportional to its heat-sinking capability, the condensation end 3642 of heat pipe 364 is placed under the second radiator fan 34, and the fire end 3641 of heat pipe 364 is placed on radiating copper sheet 363, the condensation end 3642 of heat pipe 364 is lower than the height of the fire end of heat pipe 364 3641 is that condensation end in order to make full use of heat pipe 364 3642 clearance spaces is below (if the fire end of heat pipe 3641 is concordant with the height of condensation end 3642, and the second radiator fan 34 is placed on condensation end 3642, condensation end 3642 space below will be wasted so, increased the thickness of electromagnetic oven) simultaneously, making to apply radiator fan that the more excellent height of heat-sinking capability is higher does not affect again the height of electromagnetic oven.The fire end 3641 of heat pipe 364 and the difference in height of the condensation end 3642 of heat pipe 364 be 0 to 20mm be because the fire end 3641 of heat pipe 364 apart from the distance on electromagnetic oven chassis 1 probably within the scope of this, can realize the condensation end of heat pipe 364 3642 is placed under the second radiator fan 34, and the fire end 3641 of heat pipe 364 is placed in the object on heat pipe 364 location-plates, in improving radiating effect, can reduce the whole height of electromagnetic oven.
Concrete, as shown in Figure 3, described radiating copper sheet 363 is provided with the groove of the fire end 3641 for placing heat pipe 364, can fix better the fire end 3641 of heat pipe 364.
Concrete, heat abstractor is made as the radiating fin 37 of the second air outlet 14 that faces electromagnetic oven chassis, the condensation end 3642 of described heat pipe 364 extends to the below of described radiating fin 37 and is attached at radiating fin 37, the condensation end 3642 of heat pipe 364 can conduct to radiating fin 37 by the heat of the fire end of heat pipe 364 3641, then is assisted heat is dispelled the heat away by the second radiator fan 34.
Concrete, heat abstractor also comprises the second fan base plate 38 and the second fan top board 39, the periphery downward bending of the second fan top board 39 and the second fan base plate 38 form confined space, described the second radiator fan 34 and described radiating fin 37 are located at described confined space, can control better the heat dissipation direction in air channel and then improve radiating effect.
Because the second radiator fan 34 is turbofan, need be from the top of fan and bottom air draught, therefore described the second fan base plate 38 and the second fan top board 39 all offer the second radiator fan 34 air inlets.
Concrete, radiating fin 37 is provided with two, and second air outlet 14 on electromagnetic oven chassis is also provided with two, and corresponding two described radiating fins 37 respectively, can improve the Homogeneouslly-radiating of electromagnetic oven, and then extend the service life of electromagnetic oven.
The application is by using thermal insulation board 15 that coil and main control board are separated, apply again two radiator fans and make two specific heat dissipation wind channels of the inner formation of electromagnetic oven, can reduce the heating of coil to the impact of main control board, improve radiating efficiency, additional the first heat-transfer device of other heat-generating electronic elements 333 in main control board is conducted to the second radiator fan 34 by heat and can strengthen heat radiation; Simultaneously, heat while applying the second heat-transfer device by IGBT331 and 332 work of bridge heap is transmitted to heat abstractor, and heat abstractor is fixed on the second fan outlet place, and the second radiator fan 34 can assist heat abstractor that dissipation of heat is gone out, reduce transmission thermal resistance, improved radiating efficiency; By IGBT331 and bridge heap 332 are located to a side of pcb board 32 and not overlapping mutually, the first heat-transfer device that is attached at other heat-generating electronic elements 333 is all made as to thin shape with the second heat-transfer device that is attached at IGBT331 and bridge heap 332, can reduce height, make electromagnetic oven can do thinlyyer.
embodiment 2.
The Ultrathin electromagnetic furnace of a kind of good heat dissipation effect of the present embodiment, as shown in Figure 5, other structure is identical with embodiment 1, difference is: radiating fin 37 is provided with one, make air-out more concentrated and save cost.
In addition, radiating copper sheet 363 is not established groove, heat pipe fixed head 4 is sticked on radiating copper sheet 363, groove is located to heat pipe fixed head 4 simultaneously, utilize heat pipe fixed head 4 to fix the fire end 3641 of heat pipe 364, because heat pipe fixed head 4 can use other heat-conducting, such as aluminium, therefore, can reduce costs.
Finally should be noted that; above embodiment is only in order to illustrate the application's technical scheme; but not restriction to the application's protection domain; although the application has been done to explain with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement the application's technical scheme, and not depart from essence and the scope of present techniques scheme.
Claims (10)
1. the Ultrathin electromagnetic furnace of a good heat dissipation effect, comprise electromagnetic oven chassis, electromagnetic oven chassis comprises coil area and circuit region, coil area is provided with coil, circuit region comprises main control board, the heat-generating electronic elements that main control board comprises pcb board and is electrically connected with pcb board, heat-generating electronic elements comprises IGBT, bridge heap and other heat-generating electronic elements;
It is characterized in that:
Between coil area and circuit region, be provided with thermal insulation board, coil area is provided with the first heat dissipation wind channel, described the first heat dissipation wind channel comprises the first radiator fan, described the first radiator fan is located at coil area, the first radiator fan is provided with the first wind inlet of fan and the first fan outlet, the first fan outlet faces coil, electromagnetic oven chassis is provided with the first air inlet and the first air outlet, and first air outlet on the first air inlet, the first wind inlet of fan, the first fan outlet and the electromagnetic oven chassis on electromagnetic oven chassis forms described the first heat dissipation wind channel;
Circuit region is provided with the second heat dissipation wind channel, described the second heat dissipation wind channel comprises the second radiator fan, described the second radiator fan is located at the side away from pcb board of IGBT and bridge heap, electromagnetic oven chassis is provided with the second air inlet and the second air outlet, other heat-generating electronic elements is provided with the first heat-transfer device of thin shape, IGBT and Qiao Dui are equipped with the second heat-transfer device of thin shape, the second radiator fan is provided with heat abstractor, the first heat-transfer device conducts to the second radiator fan for the heat that other heat-generating electronic elements is sent, the second heat-transfer device conducts to heat abstractor for the heat that IGBT and Qiao Dui are sent, second air inlet on electromagnetic oven chassis, the first heat-transfer device, the second heat-transfer device, the second radiator fan, second air outlet on heat abstractor and electromagnetic oven chassis forms described the second heat dissipation wind channel,
IGBT and Qiao Dui are positioned at a side of pcb board and not overlapping mutually, and other heat-generating electronic elements is positioned at pcb board top.
2. the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect as claimed in claim 1, it is characterized in that: described the first heat-transfer device comprises the first heat-conducting pad and PCB radiating fin, the first heat-conducting pad is attached at other heat-generating electronic elements upper end, PCB radiating fin is attached at above the first heat-conducting pad, and PCB radiating fin faces the setting party of second air inlet on electromagnetic oven chassis and the conduit of PCB radiating fin to identical with the wind direction through described conduit.
3. the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect as claimed in claim 2, is characterized in that: the lower surface of described PCB radiating fin is plane.
4. the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect as claimed in claim 1, it is characterized in that: described the second heat-transfer device comprises the second heat-conducting pad, the 3rd heat-conducting pad, radiating copper sheet and heat pipe, wherein, one end of heat pipe is fire end, and the other end of heat pipe is condensation end;
Described the second heat-conducting pad and the 3rd heat-conducting pad are attached at respectively the upper surface of described IGBT and bridge heap, described radiating copper sheet is attached at the upper surface of described the second heat-conducting pad and the 3rd heat-conducting pad, the fire end of described heat pipe be fixed on radiating copper sheet upper surface and be positioned at described IGBT and bridge heap directly over, the condensation end of described heat pipe extends to heat abstractor.
5. the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect as claimed in claim 4, is characterized in that: described heat pipe is made as the flat-shaped heat pipe of three-dimensional bending, and the difference in height of the fire end of heat pipe and the condensation end of heat pipe is 0 to 20mm.
6. the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect as claimed in claim 4, is characterized in that: described radiating copper sheet is provided with the groove of the fire end for placing heat pipe.
7. the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect as claimed in claim 4, it is characterized in that: described heat abstractor is made as the radiating fin of the second air outlet that faces electromagnetic oven chassis, the condensation end of described heat pipe extends to the below of described radiating fin and is attached at radiating fin.
8. the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect as claimed in claim 7, it is characterized in that: described heat abstractor also comprises the second fan base plate and the second fan top board, the periphery downward bending of the second fan top board and the second fan base plate form confined space, described the second radiator fan and described radiating fin are located at described confined space, and described the second fan base plate and the second fan top board all offer the second radiator fan air inlet.
9. the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect as claimed in claim 7, is characterized in that: described radiating fin is provided with two.
10. the Ultrathin electromagnetic furnace of a kind of good heat dissipation effect as claimed in claim 9, is characterized in that: second air outlet on described electromagnetic oven chassis is provided with two, respectively corresponding two described radiating fins.
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| WO2017054228A1 (en) * | 2015-10-01 | 2017-04-06 | 史利利 | Induction stove |
| CN107666817A (en) * | 2016-07-29 | 2018-02-06 | 德昌电机(深圳)有限公司 | Controller assemblies, control box and blower fan |
| CN109549506A (en) * | 2018-11-30 | 2019-04-02 | 广东美的厨房电器制造有限公司 | Microwave oven |
| JP2021005440A (en) * | 2019-06-25 | 2021-01-14 | パナソニックＩｐマネジメント株式会社 | Induction heating cooker |
| CN114554640A (en) * | 2022-02-15 | 2022-05-27 | 广州市吉谷电器科技有限公司 | Heat radiation structure and electromagnetism stove |
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| CN201964478U (en) * | 2010-12-23 | 2011-09-07 | 浙江苏泊尔家电制造有限公司 | Electromagnetic oven |
| CN203240624U (en) * | 2012-12-29 | 2013-10-16 | 胡小庆 | Heat dissipation and air guide structure device of electromagnetic oven |
| CN203771483U (en) * | 2014-03-10 | 2014-08-13 | 广东新创意科技有限公司 | Ultra-thin induction cooker with good heat dissipation effect |
Cited By (7)
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|---|---|---|---|---|
| WO2017054228A1 (en) * | 2015-10-01 | 2017-04-06 | 史利利 | Induction stove |
| CN107666817A (en) * | 2016-07-29 | 2018-02-06 | 德昌电机(深圳)有限公司 | Controller assemblies, control box and blower fan |
| CN107666817B (en) * | 2016-07-29 | 2021-05-25 | 德昌电机(深圳)有限公司 | Controller subassembly, control box and fan |
| CN109549506A (en) * | 2018-11-30 | 2019-04-02 | 广东美的厨房电器制造有限公司 | Microwave oven |
| JP2021005440A (en) * | 2019-06-25 | 2021-01-14 | パナソニックＩｐマネジメント株式会社 | Induction heating cooker |
| JP7241259B2 (en) | 2019-06-25 | 2023-03-17 | パナソニックＩｐマネジメント株式会社 | induction cooker |
| CN114554640A (en) * | 2022-02-15 | 2022-05-27 | 广州市吉谷电器科技有限公司 | Heat radiation structure and electromagnetism stove |
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