CN103906579B - 一种预塌陷电容式微加工换能器单元及其制造方法 - Google Patents

一种预塌陷电容式微加工换能器单元及其制造方法 Download PDF

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Publication number
CN103906579B
CN103906579B CN201280052980.9A CN201280052980A CN103906579B CN 103906579 B CN103906579 B CN 103906579B CN 201280052980 A CN201280052980 A CN 201280052980A CN 103906579 B CN103906579 B CN 103906579B
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China
Prior art keywords
membrane
unit
substrate
film
layer
Prior art date
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CN201280052980.9A
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English (en)
Chinese (zh)
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CN103906579A (zh
Inventor
P·迪克森
R·德克尔
V·A·亨内肯
A·莱文斯泰因
B·马赛利斯
J·D·弗雷泽
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Koninklijke Philips NV
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Koninklijke Philips NV
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Classifications

    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/18—Methods or devices for transmitting, conducting or directing sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Pressure Sensors (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
  • Measuring Fluid Pressure (AREA)
CN201280052980.9A 2011-10-28 2012-10-15 一种预塌陷电容式微加工换能器单元及其制造方法 Active CN103906579B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161552485P 2011-10-28 2011-10-28
US61/552,485 2011-10-28
PCT/IB2012/055605 WO2013061204A2 (en) 2011-10-28 2012-10-15 Pre-collapsed capacitive micro-machined transducer cell with plug

Publications (2)

Publication Number Publication Date
CN103906579A CN103906579A (zh) 2014-07-02
CN103906579B true CN103906579B (zh) 2016-08-24

Family

ID=47227991

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280052980.9A Active CN103906579B (zh) 2011-10-28 2012-10-15 一种预塌陷电容式微加工换能器单元及其制造方法

Country Status (8)

Country Link
US (1) US9117438B2 (enExample)
EP (1) EP2747904B1 (enExample)
JP (1) JP5961697B2 (enExample)
CN (1) CN103906579B (enExample)
BR (1) BR112014009698A2 (enExample)
MX (1) MX343897B (enExample)
RU (1) RU2595800C2 (enExample)
WO (1) WO2013061204A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2771132B1 (en) * 2011-10-28 2018-08-29 Koninklijke Philips N.V. Pre-collapsed capacitive micro-machined transducer cell with stress layer
RU2607720C2 (ru) 2011-12-20 2017-01-10 Конинклейке Филипс Н.В. Устройство ультразвукового преобразователя и способ его изготовления
JP6553174B2 (ja) * 2014-09-11 2019-07-31 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 広帯域の体内通過超音波通信システム
WO2017001636A1 (en) * 2015-06-30 2017-01-05 Koninklijke Philips N.V. Ultrasound system and ultrasonic pulse transmission method
US10043903B2 (en) 2015-12-21 2018-08-07 Samsung Electronics Co., Ltd. Semiconductor devices with source/drain stress liner
WO2018100015A1 (en) * 2016-12-01 2018-06-07 Koninklijke Philips N.V. Cmut probe, system and method
RU2732839C1 (ru) * 2019-07-09 2020-09-23 Федеральное государственное бюджетное образовательное учреждение высшего образования "Пензенский государственный университет" (ФГБОУ ВО "ПГУ") Полупроводниковый преобразователь давления с повышенной точностью и чувствительностью
US11304005B2 (en) 2020-02-07 2022-04-12 xMEMS Labs, Inc. Crossover circuit
US11172300B2 (en) * 2020-02-07 2021-11-09 xMEMS Labs, Inc. Sound producing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194934A (ja) * 2004-06-03 2009-08-27 Olympus Corp 静電容量型超音波振動子および積層型静電容量型超音波振動子の製造方法
EP2145696A1 (en) * 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method
CN101896288A (zh) * 2007-12-14 2010-11-24 皇家飞利浦电子股份有限公司 包括经成型衬底的可以塌陷模式工作的cmut
CN101969856A (zh) * 2007-09-17 2011-02-09 皇家飞利浦电子股份有限公司 预塌陷的电容微机械超声传感器的制造及其应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4885779B2 (ja) * 2007-03-29 2012-02-29 オリンパスメディカルシステムズ株式会社 静電容量型トランスデューサ装置及び体腔内超音波診断システム
CN101772383B (zh) * 2007-07-31 2011-11-02 皇家飞利浦电子股份有限公司 具有高k电介质的cmut
EP2326432A2 (en) * 2008-09-16 2011-06-01 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasound transducer
CN102333485B (zh) * 2009-02-27 2014-12-10 皇家飞利浦电子股份有限公司 具有机械塌陷保持的预塌陷cmut

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194934A (ja) * 2004-06-03 2009-08-27 Olympus Corp 静電容量型超音波振動子および積層型静電容量型超音波振動子の製造方法
CN101969856A (zh) * 2007-09-17 2011-02-09 皇家飞利浦电子股份有限公司 预塌陷的电容微机械超声传感器的制造及其应用
CN101896288A (zh) * 2007-12-14 2010-11-24 皇家飞利浦电子股份有限公司 包括经成型衬底的可以塌陷模式工作的cmut
EP2145696A1 (en) * 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method

Also Published As

Publication number Publication date
JP5961697B2 (ja) 2016-08-02
MX2014004905A (es) 2014-05-28
US20140247698A1 (en) 2014-09-04
EP2747904A2 (en) 2014-07-02
WO2013061204A3 (en) 2013-09-12
WO2013061204A2 (en) 2013-05-02
BR112014009698A2 (pt) 2017-05-09
EP2747904B1 (en) 2020-04-08
CN103906579A (zh) 2014-07-02
US9117438B2 (en) 2015-08-25
RU2595800C2 (ru) 2016-08-27
MX343897B (es) 2016-11-28
JP2015504620A (ja) 2015-02-12
RU2014121503A (ru) 2015-12-10

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