CN103906419B - Heat dissipation component - Google Patents
Heat dissipation component Download PDFInfo
- Publication number
- CN103906419B CN103906419B CN201410174100.6A CN201410174100A CN103906419B CN 103906419 B CN103906419 B CN 103906419B CN 201410174100 A CN201410174100 A CN 201410174100A CN 103906419 B CN103906419 B CN 103906419B
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- CN
- China
- Prior art keywords
- pedestal
- heat dissipation
- protuberance
- recess
- radiating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat dissipation component which comprises bases, heat dissipation elements and elastic fixing pieces, wherein openings are formed in the bases, the heat dissipation elements are arranged on the bases and penetrate through the openings, the elastic fixing pieces are used for connecting the heat dissipation elements to the bases;the bases are of piece shapes, the first sides of the edges of the bases stretch outside to form convex parts, the second sides, opposite to the first side faces, of the edges of the bases are provided with concave parts which stretch inwards, and inner portion spaces for holding the convex parts are defined by the concave parts. The bases are many in number and can be mutually connected and combined freely. By means of the heat dissipation component, the heat dissipation effect is enhanced without affecting the circuit layout of a main board itself, the electronic elements are protected, and service life is prolonged.
Description
Technical field
The present invention relates to a kind of radiating subassembly, particularly to a kind of radiating for being provided with the circuit board of electronic component
Assembly.
Background technology
In modern society, the application of computer is extremely widespread, and the processing speed of computer is required with also more and more higher, high place
What reason speed was brought also has highly energy-consuming and high heat, and the processing speed and service life of computer is all had a great impact, therefore,
Carrying out radiating to computer main board and electronic component mounted thereto becomes particularly important.
Due to can be provided with many process chips on the motherboard of computer system simultaneously, currently for these process chips
The radiating module that cooling mechanism radiates frequently with air cooling, and this etc. radiating module fixed form often utilize radiating module snap fit
To catch on the anchor-shaped works on motherboard, or using Spring screwses, radiating module to be locked on motherboard.But work as
Be provided with motherboard simultaneously many process chips and each distance processing chip chamber close when, in the structure of fixing radiating module
On will have different designs.For example, if remove heat produced by each process chip using multiple radiators simultaneously,
Each radiator is both needed to be assembled on motherboard using fixed mechanisms such as snap fit or Spring screwses, is therefore accomplished by motherboard
There are many corresponding anchor-shaped works or hole position, and cause on motherboard, have many blocks that limit cannot place other parts, more
The problem of circuit layout can be caused, motherboard needs more numbers of plies to carry out cabling, therefore can increase cost.Also have by will be multiple
Heat dissipation element is attached on a substrate, then is attached to carry out on motherboard solving this problem by substrate, but due to
Distributing position on motherboard for the electronic component does not know, then just propose multiple requirements to the shape of substrate, but if
What substrate crossed that conference affects miscellaneous part on motherboard is installed on setting, provided that the substrate of plurality of specifications, its cost can be big
Big increase.Therefore how to design the good heat radiating mechanism that can simultaneously remove the produced heat of multiple thermals source, easy to assembly, it is suitable for
Extremely urgent in the radiating subassembly of polytype circuit board.
Content of the invention
For solving the above problems, the present invention provides a kind of radiating subassembly to include：
Pedestal, which is provided with perforate；
Heat dissipation element, it is installed on described pedestal side and passes through described perforate, including the heat-conducting part of contact electronic component
With the multiple radiating fins being arranged above heat-conducting part；
Flexible fastening piece, it has pars intermedia, spire and two fixing ends, and described pars intermedia snaps into described heat radiating fin
On piece, described spire is arranged at described fixed part opposite side, and described two fixing ends are respectively fixedly connected with described pedestal；
Wherein, described pedestal is sheet, and its edge first epitaxial lateral overgrowth stretches out protuberance, second side relative with first side
Edge has the recess extending internally, and described recess limits the inner space for accommodating described protuberance.
Preferably, described pedestal is secured to by fixture on the circuit board installing this electronic component.
Preferably, the 3rd lateral edges of described pedestal are also equipped with protuberance, relative with described 3rd lateral edges
Recess is provided with four side edge, described recess limits the inner space for accommodating described protuberance.
Preferably, described pedestal and described heat dissipation element are multiple, the described protuberance of one of described susceptor edges
The described recess of another described susceptor edges is inserted in cooperation, so that multiple pedestals is linked into an integrated entity.
Preferably, the heat-conducting part of described heat dissipation element passes through the perforate on described pedestal, is in close contact described electronic component.
Preferably, the spire of described flexible fastening piece is two, and its cooperation is fastened on described on described radiating fin
Pars intermedia and the described fixed part connecting to described pedestal push described heat dissipation element so as to be in close contact described electronics unit
Part.
Preferably, the fixing end of described flexible fastening piece is fixed on the bottom surface of described pedestal by solder technology.
Preferably, the described protuberance of described pedestal and described recess be spherical.
Preferably, the described protuberance of described pedestal is strip, and wing portion is extended to both sides in its free end；Described recess and
The shape of described protuberance is identical.
Radiating subassembly of the present invention, its structure is simple, and easy for installation, radiating effect is good.It can be used alone,
Can be combined using by the protuberance being arranged on described pedestal side and recess connection, and can be existed according to electronic component
Distributing position on motherboard is combined, and simplifies installation steps, saves the artificial and time, reduces simultaneously and be assembled into
This.In addition, described heat dissipation element is connected to described substrate by flexible fastening piece, described flexible fastening piece can be to described radiating
Element forms a pressure, and its heat-conducting part is pressed to electronic component, improves heat transfer efficiency.
Brief description
Fig. 1 is a kind of assembly structure diagram of radiating subassembly described in the one of embodiment of the present invention；
Fig. 2 is a kind of structural representation of radiating subassembly described in the one of embodiment of the present invention；
Fig. 3 is a kind of base construction schematic diagram of radiating subassembly described in the one of embodiment of the present invention；
Fig. 4 is a kind of base construction schematic diagram of radiating subassembly described in the one of embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples, to make those skilled in the art's reference
Specification word can be implemented according to this.
Embodiment one
As shown in Figure 1 and Figure 2, radiating subassembly of the present invention includes：Pedestal 100, which is provided with perforate 101；Heat dissipation element
200, it is installed on described pedestal 100 side and passes through described perforate 101, including heat-conducting part 201 He of contact electronic component 400
It is arranged at the multiple radiating fins 202 above heat-conducting part；Described pedestal 100 two ends have screwed hole, and described pedestal 100 passes through solid
Determine part such as screw locking to the circuit board 500 installing described electronic component 400.The heat-conducting part 201 of described heat dissipation element 200
Perforate 101 through on described pedestal 100, is in close contact described electronic component 400.
Described radiating subassembly also includes flexible fastening piece 300, and it has pars intermedia, two spires and two fixing ends
303, described pars intermedia is arranged in the middle of described two spires, and it snaps on described radiating fin 202, described two fixations
End 303 is fixed on the bottom surface of described pedestal 100 by solder technology respectively.The spire cooperation of described flexible fastening piece 300
The described pars intermedia being fastened on described radiating fin 202 and the described fixing end connecting to described pedestal 100 push described
Heat dissipation element 200 is so as to be in close contact described electronic component 400.
Wherein, described pedestal 100 is sheet, and its edge first epitaxial lateral overgrowth stretches out protuberance 102, with described first side phase
To the second side there is the recess 103 extending internally, the inside that described recess 103 limits for accommodating described protuberance 102 is empty
Between.Described protuberance 102 and described recess 103 are strip, and it cooperates and connects two adjacent pedestals 100.
During installation, the edge protuberance 102 of one of pedestal 100 of the present invention is inserted another susceptor edges recess
103, multiple pedestals 100 are linked into an integrated entity；Then described heat dissipation element 200 is attached to the side of described pedestal 100 and wears
Cross described perforate 101, make the described heat-conducting part 201 radiating 200, unit be in close contact described electronic component 400, finally using spiral shell
Nail is integrally attached to what multiple pedestals connected on circuit main board 500, and radiating subassembly of the present invention can be according to electronic component
Distributing position on circuit main board, independent assortment, it is suitable for the circuit board of polytype and specification.
Embodiment two
As shown in Figure 1, Figure 2, Figure 3 shows, radiating subassembly of the present invention includes：Multiple pedestals 100, which is provided with perforate 101；
Multiple heat dissipation elements 200, it is installed on described pedestal 100 side and passes through described perforate 101, including contact electronic component 400
Heat-conducting part 201 and be arranged at the multiple radiating fins 202 above heat-conducting part；Described pedestal 100 two ends have screwed hole, described
Pedestal 100 passes through fixture such as screw locking to the circuit board 500 installing described electronic component 400.Described heat dissipation element
200 heat-conducting part 201 passes through the perforate 101 on described pedestal 100, is in close contact described electronic component 400.
Described pedestal 100 is sheet, and its edge surrounding is respectively arranged with two recesses and two protuberances, and described recess limits
Go out the inner space for accommodating described protuberance.Described pedestal is all inserted in described recess by described protuberance with the connection of pedestal
Realize.The described recess of another described pedestal is inserted in the described protuberance cooperation of one of described pedestal side, makes multiple bases
Seat links into an integrated entity.
Described radiating subassembly also includes flexible fastening piece 300, and it has pars intermedia, two spires and two fixing ends
303, described pars intermedia is arranged in the middle of described two spires, and it snaps on described radiating fin 202, described two fixations
End 303 is fixed on the bottom surface of described pedestal 100 by solder technology respectively.The spire cooperation of described flexible fastening piece 300
The described pars intermedia being fastened on described radiating fin 202 and the described fixing end connecting to described pedestal 100 push described
Heat dissipation element 200 is so as to be in close contact described electronic component 400.The described protuberance of described pedestal 100 and described recess are ball
Shape.
During installation, the edge protuberance 102 of one of pedestal 100 of the present invention is inserted another susceptor edges recess
103, multiple pedestals 100 are linked into an integrated entity；Then described heat dissipation element 200 is attached to the side of described pedestal 100 and wears
Cross described perforate 101, make the described heat-conducting part 201 radiating 200, unit be in close contact described electronic component 400, finally using spiral shell
Nail is integrally attached to what multiple pedestals connected on circuit main board 500, and radiating subassembly of the present invention can be according to electronic component
Distributing position on circuit main board, independent assortment, it is suitable for the circuit board of polytype and specification.
Embodiment three
As shown in Figure 1, Figure 2, Figure 4 shows, radiating subassembly of the present invention includes：Multiple pedestals 100, which is provided with perforate 101；
Multiple heat dissipation elements 200, it is installed on described pedestal 100 side and passes through described perforate 101, including contact electronic component 400
Heat-conducting part 201 and be arranged at the multiple radiating fins 202 above heat-conducting part；Described pedestal 100 two ends have screwed hole, described
Pedestal 100 passes through fixture such as screw locking to the circuit board 500 installing described electronic component 400.Described heat dissipation element
200 heat-conducting part 201 passes through the perforate 101 on described pedestal 100, is in close contact described electronic component 400.
Described pedestal 100 be sheet, its edge surrounding be respectively arranged with 102,104 and two protuberances 103 of two recesses,
105, described recess 103,105 limits the inner space for accommodating described protuberance 102,104.Described pedestal and the company of pedestal
Connect all to insert in described recess by described protuberance and realize.The described protuberance cooperation insertion of one of described pedestal side is another
The described recess of individual described pedestal, makes multiple pedestals link into an integrated entity.
Described radiating subassembly also includes flexible fastening piece 300, and it has pars intermedia, two spires and two fixing ends
303, described pars intermedia is arranged in the middle of described two spires, and it snaps on described radiating fin 202, described two fixations
End 303 is fixed on the bottom surface of described pedestal 100 by solder technology respectively.The spire cooperation of described flexible fastening piece 300
The described pars intermedia being fastened on described radiating fin 202 and the described fixing end connecting to described pedestal 100 push described
Heat dissipation element 200 is so as to be in close contact described electronic component 400.
The described protuberance 102,104 of described pedestal 100 is strip, and wing portion is extended to both sides in its free end；Described recessed
Portion 103,105 is identical with the shape of described protuberance 102,104.
During installation, the edge protuberance 102 of one of pedestal 100 of the present invention is inserted another susceptor edges recess
103, multiple pedestals 100 are linked into an integrated entity；Then described heat dissipation element 200 is attached to the side of described pedestal 100 and wears
Cross described perforate 101, make the described heat-conducting part 201 radiating 200, unit be in close contact described electronic component 400, finally using spiral shell
Nail is integrally attached to what multiple pedestals connected on circuit main board 500, and radiating subassembly of the present invention can be according to electronic component
Distributing position on circuit main board, independent assortment, it is suitable for the circuit board of polytype and specification.
Although embodiment of the present invention is disclosed as above, it is not restricted to listed in specification and embodiment
With, it can be applied to various suitable the field of the invention completely, for those skilled in the art, can be easily
Realize other modification, therefore under the universal being limited without departing substantially from claim and equivalency range, the present invention does not limit
In specific details with shown here as the legend with description.
Claims (7)
1. a kind of radiating subassembly is it is characterised in that include：
Pedestal, which is provided with perforate；
Heat dissipation element, its be installed on described pedestal side and pass through described perforate, include contact electronic component heat-conducting part with set
It is placed in the multiple radiating fins above heat-conducting part；
Flexible fastening piece, it has pars intermedia, spire and two fixing ends, and described pars intermedia snaps into described radiating fin
On, described spire is arranged at described two fixing end opposite side, and described two fixing ends are respectively fixedly connected with described pedestal；
Wherein, described pedestal is sheet, and its edge first epitaxial lateral overgrowth stretches out protuberance, the second side edge relative with first side
There is the recess extending internally, described recess limits the inner space for accommodating described protuberance；Described pedestal passes through to fix
Part secures on the circuit board installing this electronic component；Be also equipped with protuberance on 3rd lateral edges of described pedestal, with described
Recess is provided with the relative four side edge of the 3rd lateral edges, the inside that described recess limits for accommodating described protuberance is empty
Between.
2. radiating subassembly as claimed in claim 1 it is characterised in that described pedestal and described heat dissipation element be multiple, its
In the described protuberance cooperation of described susceptor edges insert the described recess of another described susceptor edges, make multiple pedestals even
It is connected into one.
3. radiating subassembly as claimed in claim 1 is it is characterised in that the heat-conducting part of described heat dissipation element passes through on described pedestal
Perforate, be in close contact described electronic component.
4. it is characterised in that the spire of described flexible fastening piece is two, it joins radiating subassembly as claimed in claim 1
The described pars intermedia that conjunction is fastened on described radiating fin and the described two fixing ends connecting to described pedestal push described
Heat dissipation element is so as to be in close contact described electronic component.
5. radiating subassembly as claimed in claim 4 is it is characterised in that two fixing ends of described flexible fastening piece pass through welding
Technology is fixed on the bottom surface of described pedestal.
6. radiating subassembly as claimed in claim 1 is it is characterised in that the described protuberance of described pedestal and described recess are ball
Shape.
7., it is characterised in that the described protuberance of described pedestal is strip, it is freely for radiating subassembly as claimed in claim 1
Hold and extend wing portion to both sides；Described recess is identical with the shape of described protuberance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410174100.6A CN103906419B (en) | 2014-04-28 | 2014-04-28 | Heat dissipation component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410174100.6A CN103906419B (en) | 2014-04-28 | 2014-04-28 | Heat dissipation component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103906419A CN103906419A (en) | 2014-07-02 |
| CN103906419B true CN103906419B (en) | 2017-02-15 |
Family
ID=50997495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410174100.6A Expired - Fee Related CN103906419B (en) | 2014-04-28 | 2014-04-28 | Heat dissipation component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103906419B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW543833U (en) * | 2001-12-20 | 2003-07-21 | Datech Technology Co Ltd | Improvement of heat dissipation body structure |
| US6672379B1 (en) * | 2002-07-29 | 2004-01-06 | Waffer Technology Corp. | Positioning and buckling structure for use in a radiator |
| US6883591B2 (en) * | 2003-09-12 | 2005-04-26 | Chi Yuan Co., Ltd. | Stackable heat sink |
| CN1734395A (en) * | 2004-08-12 | 2006-02-15 | 威盛电子股份有限公司 | Expansive heat radiation device |
| CN100518475C (en) * | 2006-06-02 | 2009-07-22 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN202799527U (en) * | 2012-08-15 | 2013-03-13 | 河北冠泰电子技术有限公司 | Combined type radiator |
| CN203814120U (en) * | 2014-04-28 | 2014-09-03 | 周庆芬 | Heat radiation assembly |
-
2014
- 2014-04-28 CN CN201410174100.6A patent/CN103906419B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103906419A (en) | 2014-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Chunfang Inventor after: Gao Yuyu Inventor before: Zhou Qingfen |
|
| COR | Change of bibliographic data | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20161101 Address after: No. 181, No. 4, West South Road, harbor district, Hebei, Qinhuangdao Applicant after: Liren College of Yanshan University Address before: 532201 the Guangxi Zhuang Autonomous Region Chongzuo Jiangzhou Taiping Road, No. 5 Applicant before: Zhou Qingfen |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170215 Termination date: 20180428 |