CN103906419A - Heat dissipation component - Google Patents
Heat dissipation component Download PDFInfo
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- CN103906419A CN103906419A CN201410174100.6A CN201410174100A CN103906419A CN 103906419 A CN103906419 A CN 103906419A CN 201410174100 A CN201410174100 A CN 201410174100A CN 103906419 A CN103906419 A CN 103906419A
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- pedestal
- heat dissipation
- protuberance
- radiating subassembly
- recess
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Abstract
The invention provides a heat dissipation component which comprises bases, heat dissipation elements and elastic fixing pieces, wherein openings are formed in the bases, the heat dissipation elements are arranged on the bases and penetrate through the openings, the elastic fixing pieces are used for connecting the heat dissipation elements to the bases;the bases are of piece shapes, the first sides of the edges of the bases stretch outside to form convex parts, the second sides, opposite to the first side faces, of the edges of the bases are provided with concave parts which stretch inwards, and inner portion spaces for holding the convex parts are defined by the concave parts. The bases are many in number and can be mutually connected and combined freely. By means of the heat dissipation component, the heat dissipation effect is enhanced without affecting the circuit layout of a main board itself, the electronic elements are protected, and service life is prolonged.
Description
Technical field
The present invention relates to a kind of radiating subassembly, particularly a kind of for the radiating subassembly on the circuit board of electronic component is installed.
Background technology
In modern society, the application of computer is very general, and require also more and more higher to the processing speed of computer, what high processing speed was brought also has highly energy-consuming and high heat, processing speed and useful life to computer all have a great impact, therefore, computer main board and electronic component mounted thereto are dispelled the heat and become particularly important.
Owing to can be provided with many process chip on the motherboard of computer system simultaneously, often adopt at present the radiating module of air cooling heat radiation for the cooling mechanism of these process chip, and the fixed form of these radiating modules often utilizes the snap fit of radiating module to catch on the anchor shape works on motherboard, or utilizes Spring screws that radiating module is locked on motherboard.But when be provided with many process chip on motherboard and respectively process the distance of chip chamber when very near simultaneously, in the structure of fixing radiating module, just have different designs.For instance, if fall apart and remove the heat that each process chip produces with multiple radiators simultaneously, each radiator all needs to use the fixed mechanism such as snap fit or Spring screws to be assembled on motherboard, therefore on motherboard, just need to there be many corresponding anchor shape works or position, hole, there are many restriction blocks cannot place other parts and cause on motherboard, more can cause the problem of circuit layout, motherboard needs the more number of plies to carry out cabling, therefore can increase cost.Also have by multiple heat dissipation elements being mounted on a substrate, then substrate is mounted to and on motherboard, carries out head it off, but because the distributing position of electronic component on motherboard is uncertain, so the shape of substrate is just proposed to multiple requirement, if but substrate is crossed conference and is affected the setting that is installed on of miscellaneous part on motherboard, if the substrate of plurality of specifications is provided, its cost can increase greatly.Therefore how to design the good heat radiating mechanism that can simultaneously fall apart except heat that multiple thermal source produces, easy to assembly, the radiating subassembly that is applicable to polytype circuit board is extremely urgent.
Summary of the invention
For addressing the above problem, the invention provides a kind of radiating subassembly and comprise:
Pedestal, which is provided with perforate;
Heat dissipation element, it is installed on described pedestal one side and through described perforate, comprises the multiple radiating fins that contact the heat-conducting part of electronic component and be arranged at heat-conducting part top;
Flexible fastening piece, it has pars intermedia, spire and two stiff ends, and described pars intermedia fastens to described radiating fin, and described spire is arranged at the relative side of described fixed part, and described two stiff ends are fixedly connected with respectively described pedestal;
Wherein, described pedestal is sheet, and its edge first epitaxial lateral overgrowth stretches out protuberance, and the second side edge relative with the first side has the recess extending internally, and described recess limits the inner space for holding described protuberance.
Preferably, described pedestal secures on the circuit board that this electronic component is installed by fixture.
Preferably, on the 3rd lateral edges of described pedestal, be also provided with protuberance, on the four side edge relative with described the 3rd lateral edges, be provided with recess, described recess limits the inner space for holding described protuberance.
Preferably, described pedestal and described heat dissipation element are multiple, and described in one of them, the described protuberance of susceptor edges coordinates the described recess that inserts susceptor edges described in another, and multiple pedestals are linked into an integrated entity.
Preferably, the heat-conducting part of described heat dissipation element is through the perforate on described pedestal, electronic component described in close contact.
Preferably, the spire of described flexible fastening piece is two, and its cooperation is fastened on the above pars intermedia of described radiating fin and the described fixed part that is connected on described pedestal presses down described heat dissipation element, makes electronic component described in its close contact.
Preferably, the stiff end of described flexible fastening piece is fixed on the bottom surface of described pedestal by solder technology.
Preferably, the described protuberance of described pedestal and described recess are spherical.
Preferably, the described protuberance of described pedestal is strip, and its free end extends wing portion to both sides; The shape of described recess and described protuberance is identical.
Radiating subassembly of the present invention, it is simple in structure, easy for installation, and radiating effect is good.It can use separately, also can be connected and be used in combination with recess by the protuberance being arranged on described pedestal side, and can carry out combination in any by the distributing position on motherboard according to electronic component, simplify installation steps, save artificial and time, reduced assembly cost simultaneously.In addition, described heat dissipation element is connected to described substrate by flexible fastening piece, and described flexible fastening piece can form a pressure to described heat dissipation element, and its heat-conducting part is pressed to electronic component, improves heat transfer efficiency.
Accompanying drawing explanation
Fig. 1 is the package assembly schematic diagram of a kind of radiating subassembly described in one of them embodiment of the present invention;
Fig. 2 is the structural representation of a kind of radiating subassembly described in one of them embodiment of the present invention;
Fig. 3 is the base construction schematic diagram of a kind of radiating subassembly described in one of them embodiment of the present invention;
Fig. 4 is the base construction schematic diagram of a kind of radiating subassembly described in one of them embodiment of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail, to make those skilled in the art can implement according to this with reference to specification word.
Embodiment mono-
As shown in Figure 1 and Figure 2, radiating subassembly of the present invention comprises: pedestal 100, which is provided with perforate 101; Heat dissipation element 200, it is installed on described pedestal 100 1 sides and through described perforate 101, comprises the heat-conducting part 201 that contacts electronic component 400 and the multiple radiating fins 202 that are arranged at heat-conducting part top; Described pedestal 100 two ends have screwed hole 106, described pedestal 100 by fixture for example screw locking to installing on the circuit board 500 of described electronic component 400.The heat-conducting part 201 of described heat dissipation element 200 is through the perforate 101 on described pedestal 100, electronic component 400 described in close contact.
Described radiating subassembly also comprises flexible fastening piece 300, it has pars intermedia 301, two spires and two stiff ends 302,303, described pars intermedia 301 is arranged in the middle of described two spires, it fastens to described radiating fin 202, and described two stiff ends 302,303 are fixed on the bottom surface of described pedestal 100 by solder technology respectively.The spire of described flexible fastening piece 300 coordinates the described stiff end that is fastened on described radiating fin 202 the above pars intermedia 301 and be connected on described pedestal 100 to press down described heat dissipation element 200, makes electronic component 400 described in its close contact.
Wherein, described pedestal 100 is sheet, and its edge first epitaxial lateral overgrowth stretches out protuberance 102, and second side relative with described the first side has the recess 103 extending internally, and described recess 103 limits the inner space for holding described protuberance 102.Described protuberance 102 and described recess 103 are strip, and it cooperatively interacts and connects two adjacent pedestals 100.
When installation, the edge protuberance 102 of one of them pedestal 100 of the present invention is inserted to another susceptor edges recess 103, multiple pedestals 100 are linked into an integrated entity; Then described heat dissipation element 200 be mounted to a side of described pedestal 100 and pass described perforate 101, make electronic component 400 described in heat-conducting part 201 close contacts of 200, described heat radiation unit, the entirety that finally uses screw that multiple pedestals are connected into is fixed on circuit main board 500, radiating subassembly of the present invention can be according to electronic component the distributing position on circuit main board, independent assortment, is suitable for the circuit board of polytype and specification.
Embodiment bis-
As shown in Figure 1, Figure 2, Figure 3 shows, radiating subassembly of the present invention comprises: multiple pedestals 100, which is provided with perforate 101; Multiple heat dissipation elements 200, it is installed on described pedestal 100 1 sides and through described perforate 101, comprises the heat-conducting part 201 that contacts electronic component 400 and the multiple radiating fins 202 that are arranged at heat-conducting part top; Described pedestal 100 two ends have screwed hole 106, described pedestal 100 by fixture for example screw locking to installing on the circuit board 500 of described electronic component 400.The heat-conducting part 201 of described heat dissipation element 200 is through the perforate 101 on described pedestal 100, electronic component 400 described in close contact.
Described pedestal 100 is sheet, and its edge surrounding is respectively arranged with two recesses and two protuberances, and described recess limits the inner space for holding described protuberance.Described pedestal was inserted in described recess and is realized by described protuberance with being connected all of pedestal.Described in one of them, the described protuberance of pedestal side coordinates the described recess that inserts pedestal described in another, and multiple pedestals are linked into an integrated entity.
Described radiating subassembly also comprises flexible fastening piece 300, it has pars intermedia 301, two spires and two stiff ends 302,303, described pars intermedia 301 is arranged in the middle of described two spires, it fastens to described radiating fin 202, and described two stiff ends 302,303 are fixed on the bottom surface of described pedestal 100 by solder technology respectively.The spire of described flexible fastening piece 300 coordinates the described stiff end that is fastened on described radiating fin 202 the above pars intermedia 301 and be connected on described pedestal 100 to press down described heat dissipation element 200, makes electronic component 400 described in its close contact.Described protuberance and the described recess of described pedestal 100 are spherical.
When installation, the edge protuberance 102 of one of them pedestal 100 of the present invention is inserted to another susceptor edges recess 103, multiple pedestals 100 are linked into an integrated entity; Then described heat dissipation element 200 be mounted to a side of described pedestal 100 and pass described perforate 101, make electronic component 400 described in heat-conducting part 201 close contacts of 200, described heat radiation unit, the entirety that finally uses screw that multiple pedestals are connected into is fixed on circuit main board 500, radiating subassembly of the present invention can be according to electronic component the distributing position on circuit main board, independent assortment, is suitable for the circuit board of polytype and specification.
Embodiment tri-
As shown in Figure 1, Figure 2, Figure 4 shows, radiating subassembly of the present invention comprises: multiple pedestals 100, which is provided with perforate 101; Multiple heat dissipation elements 200, it is installed on described pedestal 100 1 sides and through described perforate 101, comprises the heat-conducting part 201 that contacts electronic component 400 and the multiple radiating fins 202 that are arranged at heat-conducting part top; Described pedestal 100 two ends have screwed hole 106, described pedestal 100 by fixture for example screw locking to installing on the circuit board 500 of described electronic component 400.The heat-conducting part 201 of described heat dissipation element 200 is through the perforate 101 on described pedestal 100, electronic component 400 described in close contact.
Described pedestal 100 is sheet, and its edge surrounding is respectively arranged with two recesses 102,104 and two protuberances 103,105, and described recess 103,105 limits the inner space for holding described protuberance 102,104.Described pedestal was inserted in described recess and is realized by described protuberance with being connected all of pedestal.Described in one of them, the described protuberance of pedestal side coordinates the described recess that inserts pedestal described in another, and multiple pedestals are linked into an integrated entity.
Described radiating subassembly also comprises flexible fastening piece 300, it has pars intermedia 301, two spires and two stiff ends 302,303, described pars intermedia 301 is arranged in the middle of described two spires, it fastens to described radiating fin 202, and described two stiff ends 302,303 are fixed on the bottom surface of described pedestal 100 by solder technology respectively.The spire of described flexible fastening piece 300 coordinates the described stiff end that is fastened on described radiating fin 202 the above pars intermedia 301 and be connected on described pedestal 100 to press down described heat dissipation element 200, makes electronic component 400 described in its close contact.
The described protuberance 102,104 of described pedestal 100 is strip, and its free end extends wing portion to both sides; Described recess 103,105 is identical with the shape of described protuberance 102,104.
When installation, the edge protuberance 102 of one of them pedestal 100 of the present invention is inserted to another susceptor edges recess 103, multiple pedestals 100 are linked into an integrated entity; Then described heat dissipation element 200 be mounted to a side of described pedestal 100 and pass described perforate 101, make electronic component 400 described in heat-conducting part 201 close contacts of 200, described heat radiation unit, the entirety that finally uses screw that multiple pedestals are connected into is fixed on circuit main board 500, radiating subassembly of the present invention can be according to electronic component the distributing position on circuit main board, independent assortment, is suitable for the circuit board of polytype and specification.
Although embodiment of the present invention are open as above, but it is not restricted to listed utilization in specification and execution mode, it can be applied to various applicable the field of the invention completely, for those skilled in the art, can easily realize other modification, therefore do not deviating under the universal that claim and equivalency range limit, the present invention is not limited to specific details and illustrates here and the legend of describing.
Claims (9)
1. a radiating subassembly, is characterized in that, comprising:
Pedestal, which is provided with perforate;
Heat dissipation element, it is installed on described pedestal one side and through described perforate, comprises the multiple radiating fins that contact the heat-conducting part of electronic component and be arranged at heat-conducting part top;
Flexible fastening piece, it has pars intermedia, spire and two stiff ends, and described pars intermedia fastens to described radiating fin, and described spire is arranged at the relative side of described fixed part, and described two stiff ends are fixedly connected with respectively described pedestal;
Wherein, described pedestal is sheet, and its edge first epitaxial lateral overgrowth stretches out protuberance, and the second side edge relative with the first side has the recess extending internally, and described recess limits the inner space for holding described protuberance.
2. radiating subassembly as claimed in claim 1, is characterized in that, described pedestal secures on the circuit board that this electronic component is installed by fixture.
3. radiating subassembly as claimed in claim 1, it is characterized in that, on the 3rd lateral edges of described pedestal, be also provided with protuberance, on the four side edge relative with described the 3rd lateral edges, be provided with recess, described recess limits the inner space for holding described protuberance.
4. the radiating subassembly for mainboard as claimed in claim 2, it is characterized in that, described pedestal and described heat dissipation element are multiple, and described in one of them, the described protuberance of susceptor edges coordinates the described recess that inserts susceptor edges described in another, and multiple pedestals are linked into an integrated entity.
5. the radiating subassembly for mainboard as claimed in claim 2, is characterized in that, the heat-conducting part of described heat dissipation element is through the perforate on described pedestal, electronic component described in close contact.
6. the radiating subassembly for mainboard as claimed in claim 1, it is characterized in that, the spire of described flexible fastening piece is two, its cooperation is fastened on the above pars intermedia of described radiating fin and the described fixed part that is connected on described pedestal presses down described heat dissipation element, makes electronic component described in its close contact.
7. the radiating subassembly for mainboard as claimed in claim 6, is characterized in that, the stiff end of described flexible fastening piece is fixed on the bottom surface of described pedestal by solder technology.
8. radiating subassembly as claimed in claim 1, is characterized in that, described protuberance and the described recess of described pedestal are spherical.
9. the radiating subassembly for mainboard as claimed in claim 1, is characterized in that, the described protuberance of described pedestal is strip, and its free end extends wing portion to both sides; The shape of described recess and described protuberance is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410174100.6A CN103906419B (en) | 2014-04-28 | 2014-04-28 | Heat dissipation component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410174100.6A CN103906419B (en) | 2014-04-28 | 2014-04-28 | Heat dissipation component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103906419A true CN103906419A (en) | 2014-07-02 |
| CN103906419B CN103906419B (en) | 2017-02-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410174100.6A Expired - Fee Related CN103906419B (en) | 2014-04-28 | 2014-04-28 | Heat dissipation component |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030116304A1 (en) * | 2001-12-20 | 2003-06-26 | Taiwan Da-Long Industrial Co., Ltd. | Structure for assembling a heat sink assembly |
| US6672379B1 (en) * | 2002-07-29 | 2004-01-06 | Waffer Technology Corp. | Positioning and buckling structure for use in a radiator |
| US6883591B2 (en) * | 2003-09-12 | 2005-04-26 | Chi Yuan Co., Ltd. | Stackable heat sink |
| CN1734395A (en) * | 2004-08-12 | 2006-02-15 | 威盛电子股份有限公司 | Expansive heat radiation device |
| CN101083888A (en) * | 2006-06-02 | 2007-12-05 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN202799527U (en) * | 2012-08-15 | 2013-03-13 | 河北冠泰电子技术有限公司 | Combined type radiator |
| CN203814120U (en) * | 2014-04-28 | 2014-09-03 | 周庆芬 | Heat radiation assembly |
-
2014
- 2014-04-28 CN CN201410174100.6A patent/CN103906419B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030116304A1 (en) * | 2001-12-20 | 2003-06-26 | Taiwan Da-Long Industrial Co., Ltd. | Structure for assembling a heat sink assembly |
| US6672379B1 (en) * | 2002-07-29 | 2004-01-06 | Waffer Technology Corp. | Positioning and buckling structure for use in a radiator |
| US6883591B2 (en) * | 2003-09-12 | 2005-04-26 | Chi Yuan Co., Ltd. | Stackable heat sink |
| CN1734395A (en) * | 2004-08-12 | 2006-02-15 | 威盛电子股份有限公司 | Expansive heat radiation device |
| CN101083888A (en) * | 2006-06-02 | 2007-12-05 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN202799527U (en) * | 2012-08-15 | 2013-03-13 | 河北冠泰电子技术有限公司 | Combined type radiator |
| CN203814120U (en) * | 2014-04-28 | 2014-09-03 | 周庆芬 | Heat radiation assembly |
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| Publication number | Publication date |
|---|---|
| CN103906419B (en) | 2017-02-15 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Chunfang Inventor after: Gao Yuyu Inventor before: Zhou Qingfen |
|
| COR | Change of bibliographic data | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20161101 Address after: No. 181, No. 4, West South Road, harbor district, Hebei, Qinhuangdao Applicant after: Liren College of Yanshan University Address before: 532201 the Guangxi Zhuang Autonomous Region Chongzuo Jiangzhou Taiping Road, No. 5 Applicant before: Zhou Qingfen |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170215 Termination date: 20180428 |
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| CF01 | Termination of patent right due to non-payment of annual fee |