CN103904208A - Substrate structure - Google Patents
Substrate structure Download PDFInfo
- Publication number
- CN103904208A CN103904208A CN201210574291.6A CN201210574291A CN103904208A CN 103904208 A CN103904208 A CN 103904208A CN 201210574291 A CN201210574291 A CN 201210574291A CN 103904208 A CN103904208 A CN 103904208A
- Authority
- CN
- China
- Prior art keywords
- board structure
- pit
- structure according
- metal substrate
- insulating tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 32
- 239000003292 glue Substances 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 241000208340 Araliaceae Species 0.000 description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- 235000008434 ginseng Nutrition 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a substrate structure comprising multiple metal substrates and multiple insulating tapes which are arranged in a mutual spacing way. The upper surface of each metal substrate is provided with multiple recessed pits. The substrate structure also comprises LED crystal wafers which are embedded in the recessed pits. Each LED crystal wafer extends so that a lead wire is formed. The lead wires and the LED crystal wafers are respectively connected with two adjacent metal substrates which are isolated by the insulating tapes. In the substrate structure, the LED crystal wafers can be directly mounted in the recessed pits on the surfaces of the metal substrates without arrangement of heat-conducting glue between the LED crystal wafers and the metal substrates so that heat transfer paths from the LED crystal wafers to the metal substrates are reduced, heat radiation efficiency of the metal substrates to the LED crystal wafers is enhanced, and light emission efficiency and the service life of the whole LED lighting device are enhanced.
Description
Technical field
The present invention relates to LED lighting technical field, relate in particular to a kind of board structure of surface mount LED wafer.
Background technology
As everyone knows, LED lighting device generally includes substrate, supply unit and the case of LED wafer, surface mount LED wafer.Wherein, substrate generally includes: Copper Foil, the insulating barrier of isolation Copper Foil and the substrate of carrying Copper Foil and insulating barrier.In order to improve the radiating efficiency of substrate, conventionally at the back side of substrate, some fin are set, the heat being sent to transmit LED wafer simultaneously.
But insulating barrier of the prior art adopts the heat-conducting glue with certain heat-conducting effect to be made conventionally.But heat-conducting glue is for metal, and its thermal conductivity is still lower, thus cause the temperature of LED bottom of wafer and the temperature difference of substrate larger.Therefore, the heat that LED wafer cannot be produced is passed in substrate fully, thereby causes the excess Temperature of LED wafer, has reduced luminous efficiency and the useful life of LED wafer.
In view of this, be necessary board structure of the prior art to be improved, to address the above problem.
Summary of the invention
The object of the invention is to disclose a kind of board structure rational in infrastructure, in order to reduce from LED wafer the heat transfer path to substrate, improve the radiating efficiency of board structure to LED wafer, thus luminous efficiency and the useful life of improving whole LED lighting device.
For achieving the above object, the invention provides a kind of board structure, comprising:
Some metal substrates of arranging in space and some insulating tapes, the upper surface of described metal substrate is established some pits, and is embedded the LED wafer in pit;
Described LED wafer extends a lead-in wire, and this lead-in wire is connected respectively and is insulated two adjacent metal substrates that band is isolated with LED wafer.
As a further improvement on the present invention, the rectangular array arrangement of described pit, and cross over metal substrate and insulating tape.
As a further improvement on the present invention, described insulating tape passes through at least one pit.
As a further improvement on the present invention, described pit is circular, and bottom tool circular flat.
As a further improvement on the present invention, described insulating tape is through to the lower surface of metal substrate from the circular flat of pit.
As a further improvement on the present invention, the sidewall tool anchor ring of described pit.
As a further improvement on the present invention, the angle of the upper surface of described anchor ring and metal substrate is 30 degree.
As a further improvement on the present invention, described insulating tape runs through the side surface of described metal substrate.
As a further improvement on the present invention, described insulating tape is partial to a side setting of described pit.
As a further improvement on the present invention, described metal substrate is selected from aluminium base, copper base, and described insulating tape is selected from silica gel.
Compared with prior art, the invention has the beneficial effects as follows: in the present invention, LED wafer directly can be mounted in the pit of metallic substrate surfaces, and heat-conducting glue need to be set between LED wafer and metal substrate, thereby reduce the heat transfer path to metal substrate from LED wafer, improve the radiating efficiency of metal substrate to LED wafer, improved luminous efficiency and the useful life of whole LED lighting device.
Accompanying drawing explanation
Fig. 1 is the stereogram of a kind of board structure of the present invention;
Fig. 2 is the vertical view of the board structure shown in Fig. 1;
Fig. 3 is the cutaway view along A-A line in Fig. 2;
Fig. 4 is the partial enlarged drawing at B place in Fig. 3.
Embodiment
Below in conjunction with each execution mode shown in the drawings, the present invention is described in detail; but should be noted that; these execution modes are not limitation of the present invention; those of ordinary skills are according to these execution mode institute work energy, method or structural equivalent transformation or alternative, within all belonging to protection scope of the present invention.
A kind of embodiment of a kind of board structure of the present invention shown in please refer to the drawing 1 to Fig. 3.
In the present embodiment, a kind of board structure 100, comprising:
Some metal substrates 10 of arranging in space and some insulating tapes 20, the upper surface 101 of described metal substrate 10 is established some pits 11, and is embedded the LED wafer 30 in pit 11.The rectangular array arrangement of described pit 11, and cross over metal substrate 10 and insulating tape 20.
Shown in ginseng Fig. 4, described LED wafer 30 extends a lead-in wire 301, and this lead-in wire 301 is connected respectively and is insulated two adjacent metal substrates 10 of isolating with 20 with LED wafer 30.Described insulating tape 20 passes through at least one pit 11, concrete, and this insulating tape 20 passes through three pits 11.Wherein, be insulated with 20 two adjacent metal substrates 10 of isolating and form negative or positive electrode, and connect positive pole by lead-in wire 301, connect negative pole by LED wafer 30.Thereby form the cascaded structure that positive pole-negative pole-positive pole-negative pole is alternately arranged in this board structure 100.
Shown in ginseng Fig. 2, in the present embodiment, the upper surface 101 of this metal substrate 10 is established nine pits 11, and three insulating tapes 20 that are intervally arranged.Wherein, insulating tape 20 passes through three pits 11, forming parallel-connection structure between LED wafer 30a, 30b, 30c.Thereby all LED wafers 30 in this board structure 100 are formed to series parallel structure.
Again join shown in Fig. 1 and Fig. 3, described insulating tape 20 is through to the lower surface 102 of metal substrate 10 from the circular flat 111 of pit 11, and described insulating tape 20 runs through the side surface 103 of described metal substrate 10.Thereby prevent from being insulated the generation that causes short circuit phenomenon with 20 two adjacent metal substrates of isolating 10 directly connect.
Again join shown in Fig. 2 and Fig. 4, this pit 11 is circular, and this pit 11 also can be rectangle or ellipse certainly, and is preferably circle.In the present embodiment, the bottom tool circular flat 111 of this pit 11.The sidewall tool anchor ring 112 of described pit 11.Concrete, this anchor ring 112 is 30 degree with the angle of the upper surface 101 of metal substrate 10.Due to the sidewall tool anchor ring 112 of this pit 11, so this anchor ring 112 itself also can play certain optically focused effect, improve the illumination effect of LED wafer 30.
As preferred embodiment, this insulating tape 20 is partial to a side setting of described pit 11.Can reduce like this length of lead-in wire 301, reduce the manufacturing cost of whole board structure 100.Meanwhile, this metal substrate 10 is selected from aluminium base, copper base, and is preferably copper base.Described insulating tape 20 is selected from silica gel.
In the time manufacturing LED lighting device, can use transparent resin directly lead-in wire 301 and LED wafer 30 to be wrapped up and fill up pit 11, to form the lens (not shown) of tool optically focused effect, thus the illumination effect of raising LED lighting device.
Listed a series of detailed description is above only illustrating for feasibility execution mode of the present invention; they are not in order to limit the scope of the invention, all do not depart from the equivalent execution mode that skill spirit of the present invention does or change and all should be included in protection scope of the present invention within.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and in the situation that not deviating from spirit of the present invention or essential characteristic, can realize the present invention with other concrete form.Therefore, no matter from which point, all should regard embodiment as exemplary, and be nonrestrictive, scope of the present invention is limited by claims rather than above-mentioned explanation, is therefore intended to all changes that drop in the implication and the scope that are equal to important document of claim to include in the present invention.Any Reference numeral in claim should be considered as limiting related claim.
In addition, be to be understood that, although this specification is described according to execution mode, but be not that each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should make specification as a whole, and the technical scheme in each embodiment also can, through appropriately combined, form other execution modes that it will be appreciated by those skilled in the art that.
Claims (10)
1. a board structure (100), is characterized in that, comprising:
Some metal substrates (10) of arranging in space and some insulating tapes (20), the upper surface (101) of described metal substrate (10) is established some pits (11), and is embedded the LED wafer (30) in pit (11);
Described LED wafer (30) extends a lead-in wire (301), and this lead-in wire (301) is connected respectively and is insulated adjacent two metal substrates (10) that band (20) is isolated with LED wafer (30).
2. board structure according to claim 1, is characterized in that, the rectangular array arrangement of described pit (11), and cross over metal substrate (10) and insulating tape (20).
3. board structure according to claim 1, is characterized in that, described insulating tape (20) passes through at least one pit (11).
4. board structure according to claim 1, is characterized in that, described pit (11) is circular, and bottom tool circular flat (111).
5. board structure according to claim 1, is characterized in that, described insulating tape (20) is through to the lower surface (102) of metal substrate (10) from the circular flat (111) of pit (11).
6. board structure according to claim 4, is characterized in that, the sidewall tool anchor ring (112) of described pit (11).
7. board structure according to claim 6, is characterized in that, described anchor ring (112) is 30 degree with the angle of the upper surface (101) of metal substrate (10).
8. board structure according to claim 1, is characterized in that, described insulating tape (20) runs through the side surface (103) of described metal substrate (10).
9. board structure according to claim 1, is characterized in that, described insulating tape (20) is partial to a side setting of described pit (11).
10. board structure according to claim 1, is characterized in that, described metal substrate (10) is selected from aluminium base, copper base, and described insulating tape (20) is selected from silica gel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210574291.6A CN103904208A (en) | 2012-12-27 | 2012-12-27 | Substrate structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210574291.6A CN103904208A (en) | 2012-12-27 | 2012-12-27 | Substrate structure |
Publications (1)
Publication Number | Publication Date |
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CN103904208A true CN103904208A (en) | 2014-07-02 |
Family
ID=50995441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210574291.6A Pending CN103904208A (en) | 2012-12-27 | 2012-12-27 | Substrate structure |
Country Status (1)
Country | Link |
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CN (1) | CN103904208A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106641759A (en) * | 2016-12-21 | 2017-05-10 | 木林森股份有限公司 | PCB of LED and manufacturing method of PCB |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030193083A1 (en) * | 2002-04-15 | 2003-10-16 | Citizen Electronics Co., Ltd. | Substrate for light emitting diodes |
CN1855561A (en) * | 2005-04-30 | 2006-11-01 | 三星电机株式会社 | Method for manufacturing light emitting diode package |
CN102064246A (en) * | 2009-11-17 | 2011-05-18 | 斯坦雷电气株式会社 | Light emitting device and method for manufacturing the same |
CN202996908U (en) * | 2012-12-27 | 2013-06-12 | 宜兴市江旭节能技术有限公司 | Substrate structure |
-
2012
- 2012-12-27 CN CN201210574291.6A patent/CN103904208A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030193083A1 (en) * | 2002-04-15 | 2003-10-16 | Citizen Electronics Co., Ltd. | Substrate for light emitting diodes |
CN1855561A (en) * | 2005-04-30 | 2006-11-01 | 三星电机株式会社 | Method for manufacturing light emitting diode package |
CN102064246A (en) * | 2009-11-17 | 2011-05-18 | 斯坦雷电气株式会社 | Light emitting device and method for manufacturing the same |
CN202996908U (en) * | 2012-12-27 | 2013-06-12 | 宜兴市江旭节能技术有限公司 | Substrate structure |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106641759A (en) * | 2016-12-21 | 2017-05-10 | 木林森股份有限公司 | PCB of LED and manufacturing method of PCB |
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Application publication date: 20140702 |