CN106641759A - PCB of LED and manufacturing method of PCB - Google Patents
PCB of LED and manufacturing method of PCB Download PDFInfo
- Publication number
- CN106641759A CN106641759A CN201611191249.0A CN201611191249A CN106641759A CN 106641759 A CN106641759 A CN 106641759A CN 201611191249 A CN201611191249 A CN 201611191249A CN 106641759 A CN106641759 A CN 106641759A
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- Prior art keywords
- unit
- connection unit
- pcb board
- line
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000009413 insulation Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000011324 bead Substances 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 238000000926 separation method Methods 0.000 claims abstract 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000002459 sustained effect Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000262 chemical ionisation mass spectrometry Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000013268 sustained release Methods 0.000 description 1
- 239000012730 sustained-release form Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a PCB of an LED. The PCB comprises at least two isolated line units, and further comprises a connection unit which is located at an adjacent position of every two adjacent line units and is used for connecting the two adjacent line units, wherein each connection unit can isolate every two adjacent line units in an insulating manner; peripheral LED beads are mounted on the top surfaces of every two adjacent line units; and the connection units do not cover the bottom surfaces of the line units. Compared with the prior art, the PCB of the LED adopts the independent connection units to connect and fix conductive sheets in sequence to form a whole light bar; the connection units achieve the effects of separation and insulation; on the basis of meeting power supply of the line units, the conductive sheets can achieve a good heat dissipation effect; and as no insulating plates and no heat dissipation plates are arranged on the bottom surfaces of the conductive sheets, consumption of materials is reduced, and the cost can be greatly reduced. According to a manufacturing method of the PCB, the technological process is relatively simple, and the actual operation is relatively convenient.
Description
Technical field
The present invention relates to LED technology field, and in particular to a kind of pcb board and its manufacture method of LED.
Background technology
With the development of electronic semi-conductor's technology, increasing illumination occasion replaces traditional lighting using LED lamp
Light fixture.LED lamp is a kind of light-emitting component of suitable energy saving, and with life-span length, the pollution without poisonous metal to environment
The advantages of, gradually replace legacy power save bulb, fluorescent lamp, incandescent lamp, fluorescent lamp etc. at present, become the photograph in daily life
Mingguang City source.But at present LED bulbs or fluorescent tube still have the shortcomings that radiating is difficult and manufacturing cost is higher, such as existing LED
The pcb board of lamp bar, as shown in figure 5, including heat sink 6, insulation board 7 and line unit 8, wherein insulation board 7 is layered on heat sink 6
Top surface, line unit 8 is spaced apart and arranged in the top surface of insulation board 7 or inlays and is fixed on insulation board 7, LEDs when using
Lamp bead unit 9 is placed on adjacent two pieces of line units, and line unit 8 supplies electricity to LED lamp bead unit 9 so that it is luminous, wherein,
Heat sink 6 acts primarily as the effect of radiating, and insulation board 7 acts primarily as the effect of insulation, and insulation board 7 has connected each piece of line unit 8,
So as to form a complete LED lamp bar.But during such pcb board structure radiating, most heat will be down through line
Heat sink 6 is reached after road unit 8 and insulation board 7 to be sustained, heat dispersion is dissatisfactory, and such pcb board
Structure is more complicated, needs to consume substantial amounts of heat sink and insulating materials during batch micro operations, and manufacturing cost is higher.
The content of the invention
There is above-mentioned technical problem for prior art, the present invention provides a kind of heat dispersion well, reduces manufacturing
The pcb board and its manufacture method of the LED of cost.
For achieving the above object, the present invention provides technical scheme below：
A kind of pcb board of LED, including at least two line units for separating are provided, also including being located therein adjacent two panels circuit
The connection unit of the adjacent of unit is used to connect adjacent two line unit, and the connection unit insulated can separate
Two adjacent line units, peripheral LED lamp bead is arranged on the top surface of adjacent two pieces of line units, and the connection unit is not coated
The bottom surface of the line unit.
Wherein, the line unit is provided with connection through hole, and the connection unit includes crossbeam, and the both ends of crossbeam are arranged
There is the projection being engaged with the connection through hole, in the projection insertion connection through hole, separating part is provided with the middle part of crossbeam, it is described
In the gap that separating part is absorbed between adjacent two pieces of line units.
Wherein, the crossbeam, projection and separating part integrated injection molding.
Wherein, the both sides of line unit are provided with connection unit.
Wherein, the pcb board also includes the middleware of insulation, and corresponding two connections are single between two adjacent line units
Unit is by the middleware come being connected structure.
Wherein, the line unit is the one kind in aluminium flake, iron plate, copper sheet.
Wherein, the line unit is fenestral fabric.
The manufacture method of above-mentioned any one pcb board, comprises the following steps：
Material preparation step：Get out the line unit base material of default specification；
Sidepiece punch steps：The groove being spaced apart along the length direction of line unit base material, and groove are stamped out on base material
Place leaves connecting portion so that line unit base material is uninterrupted, and the base material between two neighboring groove is used as a line unit；
Injection step：Injection mo(u)lding connection unit is so as to connect and insulated separates two neighboring line unit；
Middle part punch steps：The connecting portion between two line units is washed out, so that two adjacent line unit mutually insulateds.
Wherein, in sidepiece punch steps, each groove includes left groove and right groove, and left groove and right groove are rushed respectively
The molded both sides in line unit base material, connecting portion is in doing between left groove and right groove；Connection unit includes left company
The first and right connection unit of order, left connection unit is moulded at left groove, and right connection unit is moulded at right groove.
Wherein, connecting portion be washed out after formed space, in the space injection mo(u)lding middleware so that left connection unit and
Right connection unit is linked to be one.
Beneficial effects of the present invention：
Compared with prior art, a kind of pcb board of LED of the invention, employs independent connection unit in turn circuit list
Unit is connected, and forms lamp bar entirety, and connection unit plays a part of to separate, insulate to two neighboring line unit, because
This can remove heat sink and insulation board in traditional PCB plate, reduce the consumption of heat sink material and insulating materials, manufacture production
Cost can be greatly reduced.Because connection unit does not coat the bottom surface of the line unit, the heat that LED lamp bead unit sheds
Downwards during sustained release, will not be blocked, therefore with good radiating effect.A kind of manufacture method of pcb board of the present invention, technique
Process CIMS is simple, and practical operation is also more convenient.
Description of the drawings
Fig. 1 is a kind of partial perspective view of the pcb board of the LED in embodiment.
Fig. 2 is a kind of structural decomposition diagram of the pcb board of the LED in embodiment.
Fig. 3 is a kind of stereogram of two connection units integration of the pcb board of the LED in embodiment.
Fig. 4 by embodiment in a kind of pcb board manufacture method in the structure of conducting strip that is molded of sidepiece punch steps
Schematic diagram.
Fig. 5 is the structural representation of the pcb board of existing LED lamp bar.
Reference：
LED lamp bead unit 1；Conducting strip 2, connection through hole 21；
Connection unit 3, crossbeam 31, projection 32, separating part 33, left connection unit 34, right connection unit 35, middleware 36；
Groove 4, left groove 41, fluted 42；Connecting portion 5.
In Fig. 5：Heat sink 6, insulation board 7, line unit 8, LED lamp bead unit 9.
Specific embodiment
Below in conjunction with specific embodiment and accompanying drawing, the present invention is described in detail.
A kind of pcb board of LED of the present embodiment, as shown in Figures 2 and 3, its structure separates leading for arrangement including several
Electric piece 2（Conducting strip 2 is used as line unit）, the both sides of each conducting strip 2 are provided with connection through hole 21, and the pcb board also includes
The connection unit 3 of the both sides of the adjacent of adjacent two panels conducting strip 2 is located therein respectively, and connection unit 3 is used to connect simultaneously
Two conducting strips 2 of insulated space between adjacent, connection unit 3 uses the plastic material of high-temperature insulation.Specifically, each
Connection unit 3 includes crossbeam 31, and the both ends of crossbeam 31 are provided with and are connected the projection 32 that through hole 21 is engaged, and raised 32 insert
In connection through hole 21, raised 32 can be and be connected the interference fit of through hole 21, strengthen consolidating between two neighboring conducting strip 2
It is fixed.The middle part of crossbeam 31 is provided with separating part 33, in the gap that separating part 33 is absorbed between adjacent two pieces of conducting strips 2, so as to every
Open adjacent two conducting strip 2.Crossbeam 31, raised 32 and the integrated injection molding of separating part 33, it is easy to process.Connection unit 3
The not bottom surface of coated with conductive piece 2, peripheral LED lamp bead unit 1 is arranged on the top surface of adjacent two pieces of conducting strips 2, forms as shown in Figure 1
Structure.Compared with prior art, the pcb board of the present embodiment employs independent multiple connection units 3 in turn multiple
Conducting strip 2 is connected, and forms a lamp bar entirety, and connection unit 3 simultaneously plays a part of to separate, insulate.Therefore, it is possible to
The heat sink 6 and insulation board 7 in traditional PCB plate as shown in Figure 5 is removed, the consumption of heat sink material and insulating materials is reduced, batch
Amount manufacture production cost can be greatly reduced.Bottom surface of the connection unit 3 without coated with conductive piece 2, LED lamp bead unit sheds
When heat is sustained downwards, heat will not be connected unit 2 to be stopped, without through tradition insulation board 6 as shown in Figure 5 and radiating
Plate 7, therefore the radiating effect of the pcb board is good.Conducting strip 2 on the basis of the demand powered as line unit is met, piece
The conducting strip 2 of shape itself can just play good radiating effect.Due to without the need for arranging insulation board and radiating in the bottom surface of conducting strip 2
Plate, the thickness of pcb board is also largely thinning, and by original 10 millimeters about 2 millimeters are thinned to.
In the present embodiment, the pcb board also includes the middleware 36 of insulation, corresponding two between two adjacent conducting strips 2
By the middleware 36 come being connected structure, the both sides stress of such conducting strip 2 connects individual connection unit 3 than more uniform
3 integral structures of order unit are compact, are connected more stable.
Preferably, conducting strip 2 is aluminium flake, and the conducting strip 2 of aluminium material radiates well, and easy to process.Not preferred, lead
Electric piece 2 selects iron plate or copper sheet, either non-preferentially from any one in iron plate, copper sheet or any two kinds of group
Close, the radiating effect of copper or iron is not good enough, and punch process difficulty, than larger, cost is also relatively high.Therefore it is conductive
Piece 2 is optimal selection from aluminium material.
In addition, conducting strip 2 could be arranged to fenestral fabric, radiating effect is more significantly.
In actual manufacture, the technical scheme adjacent two panels conducting strip 2 coupled together using independent connection unit 3 is not only
Only it is suitable in the lamp bar of strip, is also suitable in bulb lamp,（Ball bulb lamp structure is not shown in figure）Specially in the shell of bulb lamp
Multiple conducting strips are installed in inside, and conducting strip is also to be coupled together with independent connection unit, and it is exhausted that connection unit needs high temperature resistant
The performance of edge.Then mounted LED lamp bulb in the same manner, will not be described here.When this bulb lamp uses the technical scheme, by
More much larger than the area of the conducting strip of lamp bar in the area of conducting strip, cancellated conducting strip seems more on heat dispersion
It is important.
The manufacture method of above-mentioned pcb board, comprises the following steps：
1st, material preparation step：Get out the conductive plate substrate of the aluminum of the strip of default specification；
2nd, sidepiece punch steps：The multiple grooves 4 being spaced apart along the length direction of conductive plate substrate are stamped out on base material, such as
Shown in Fig. 4, and connecting portion 5 is left at each groove 4 so that conductive plate substrate is uninterrupted, the base material between two neighboring groove 4
As a conducting strip 2, and the punch forming connection through hole 21 on conducting strip 2；Wherein each groove 4 includes left groove 41 and the right side
Groove 42, left groove 41 and right groove 42 are stamped are molded over the both sides of conductive plate substrate respectively, and connecting portion 5 is located at and does left recessed
Between groove 41 and right groove 42, structure as shown in Figure 4 is formed.Stamped recess 4 can be from the top of the top surface of conducting strip 2 by
On stamp out downwards groove 4, or from the left and right sides of the base material of conducting strip 2 towards the base material of conducting strip 2 middle part punch forming
Groove 4.
3rd, injection step：Injection mo(u)lding connection unit 3 is so as to connect and separates two neighboring conducting strip 2；See Fig. 3 and Tu
4, correspondence left groove 41 is molded with left connection unit 34, and at correspondence right groove 42 right connection unit 35 is molded with.
4th, middle part punch steps：The connecting portion 5 between two conducting strips 2 is washed out, so that two adjacent conducting strips 2 are mutual
Insulation.Connecting portion 5 forms space after being washed out, in the space mould filling so that left connection unit 34 and right connection unit 35
It is integrally formed.Certainly, the space be not filled with can also, LED lamp bead unit 1 produce heat can be sustained by the gap, root
Decide whether filling according to actual demand.
The technological process of above-mentioned pcb board manufacture method is fairly simple, and practical operation is also more convenient.
Finally it should be noted that above example is only illustrating technical scheme, rather than to present invention guarantor
The restriction of shield scope, although having made to explain to the present invention with reference to preferred embodiment, one of ordinary skill in the art should
Work as understanding, technical scheme can be modified or equivalent, without deviating from the reality of technical solution of the present invention
Matter and scope.
Claims (10)
1. a kind of pcb board of LED, is characterized in that：Including at least two line units for separating, also including being located therein adjacent two
The connection unit of the adjacent of piece line unit is used to connect adjacent two line unit, and the connection unit can insulate
Two line units of ground space between adjacent, peripheral LED lamp bead is arranged on the top surface of adjacent two pieces of line units, the connection unit
The bottom surface of the line unit is not coated.
2. a kind of pcb board of LED according to claim 1, is characterized in that：The line unit is provided with connection through hole,
The connection unit includes crossbeam, and the both ends of crossbeam are provided with the projection being engaged with the connection through hole, the projection insertion
In connection through hole, separating part is provided with the middle part of crossbeam, in the gap that the separating part is absorbed between adjacent two pieces of line units.
3. a kind of pcb board of LED according to claim 1, is characterized in that：The crossbeam, projection and separation integrally
Injection mo(u)lding.
4. a kind of pcb board of LED according to claim 1, is characterized in that：The both sides of line unit are provided with connection
Unit.
5. a kind of pcb board of LED according to claim 4, is characterized in that：The pcb board also includes the middleware of insulation, phase
Between two adjacent line units corresponding two connection units by the middleware come being connected structure.
6. a kind of pcb board of LED according to claim 1, is characterized in that：The line unit is aluminium flake, iron plate, copper sheet
In one kind.
7. a kind of pcb board of LED according to claim 1, is characterized in that：The line unit is fenestral fabric.
8. the manufacture method of claim 1 any one pcb board into claim 6, is characterized in that：Comprise the following steps：
Material preparation step：Get out the line unit base material of default specification；
Sidepiece punch steps：The groove being spaced apart along the length direction of line unit base material, and groove are stamped out on base material
Place leaves connecting portion so that line unit base material is uninterrupted, and the base material between two neighboring groove is used as a line unit；
Injection step：Injection mo(u)lding connection unit is so as to connect and insulated separates two neighboring line unit；
Middle part punch steps：The connecting portion between two line units is washed out, so that two adjacent line unit mutually insulateds.
9. a kind of manufacture method of pcb board according to claim 8, is characterized in that：In sidepiece punch steps, each is recessed
Groove includes left groove and right groove, and left groove and right groove distinguish punch forming in the both sides of line unit base material, connecting portion
Positioned at doing between left groove and right groove；Connection unit includes left connection unit and right connection unit, and left connection unit is moulded in
At left groove, right connection unit is moulded at right groove.
10. a kind of manufacture method of pcb board according to claim 8 or claim 9, is characterized in that：Connecting portion be washed out after shape
Into space, in the space injection mo(u)lding middleware so that left connection unit and right connection unit are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611191249.0A CN106641759A (en) | 2016-12-21 | 2016-12-21 | PCB of LED and manufacturing method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611191249.0A CN106641759A (en) | 2016-12-21 | 2016-12-21 | PCB of LED and manufacturing method of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106641759A true CN106641759A (en) | 2017-05-10 |
Family
ID=58834481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611191249.0A Pending CN106641759A (en) | 2016-12-21 | 2016-12-21 | PCB of LED and manufacturing method of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106641759A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064246A (en) * | 2009-11-17 | 2011-05-18 | 斯坦雷电气株式会社 | Light emitting device and method for manufacturing the same |
| CN202189904U (en) * | 2011-06-08 | 2012-04-11 | 苏州东山精密制造股份有限公司 | LED lamp bar connector |
| CN103904208A (en) * | 2012-12-27 | 2014-07-02 | 宜兴市江旭节能技术有限公司 | Substrate structure |
| CN204554503U (en) * | 2014-12-08 | 2015-08-12 | 吴运金 | Syndeton between the hard lamp bar of a kind of modularized limit emitting diode (LED) and lamp bar |
| CN205283924U (en) * | 2015-11-23 | 2016-06-01 | 昆山铨莹电子有限公司 | Good aluminium base board dispels heat |
-
2016
- 2016-12-21 CN CN201611191249.0A patent/CN106641759A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064246A (en) * | 2009-11-17 | 2011-05-18 | 斯坦雷电气株式会社 | Light emitting device and method for manufacturing the same |
| CN202189904U (en) * | 2011-06-08 | 2012-04-11 | 苏州东山精密制造股份有限公司 | LED lamp bar connector |
| CN103904208A (en) * | 2012-12-27 | 2014-07-02 | 宜兴市江旭节能技术有限公司 | Substrate structure |
| CN204554503U (en) * | 2014-12-08 | 2015-08-12 | 吴运金 | Syndeton between the hard lamp bar of a kind of modularized limit emitting diode (LED) and lamp bar |
| CN205283924U (en) * | 2015-11-23 | 2016-06-01 | 昆山铨莹电子有限公司 | Good aluminium base board dispels heat |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20170510 |