CN103904205A - Packaging method and structure for preventing circuit disconnection of light emitting diode chip - Google Patents
Packaging method and structure for preventing circuit disconnection of light emitting diode chip Download PDFInfo
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- CN103904205A CN103904205A CN201210581335.8A CN201210581335A CN103904205A CN 103904205 A CN103904205 A CN 103904205A CN 201210581335 A CN201210581335 A CN 201210581335A CN 103904205 A CN103904205 A CN 103904205A
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- emitting diode
- conductive part
- diode chip
- light
- backlight unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention discloses a packaging method and structure for preventing circuit disconnection of a light emitting diode chip. The structure comprises a substrate, a safety ball, a conductive adhesive layer, the light emitting diode chip and an optical unit, wherein a first conductive portion and a second conductive portion are electrically arranged on the plane of the substrate, the safety ball is made of a conductive material and is molded on the plane of the first conductive portion, the conductive adhesive layer coats the plane of the first conductive portion and covers the safety ball, the light emitting diode chip is fixedly arranged at the first conductive portion through the conductive adhesive layer and is enabled to be electrically connected with the second conductive portion, the optical unit is molded on the substrate, and the first conductive portion, the second conductive portion, the safety ball, the conductive adhesive layer and the light emitting diode chip are covered by the optical unit, such that a delamination phenomenon generated after long-time use of the light emitting diode chip is prevented, and an electrical conduction state can still be effectively maintained.
Description
Technical field
The invention relates to a kind of method for packing and structure of the circuit broken string that prevents light-emitting diode chip for backlight unit, espespecially a kind of method and the structure of light-emitting diode chip for backlight unit because of delamination generation outage condition that prevent.
Background technology
Chip direct package is in the technology (COB of circuit substrate, chip on board), its way is that an exposed integrated circuit (IC) chip is directly binded on a circuit board or a substrate, and in conjunction with die bond, three basic technologies such as bonding wire and sealing, this technology is effectively by the packaging and testing step in ic core blade technolgy, be transferred to the circuit board assembling stage, this kind of encapsulation technology is generally used in light-emitting diode product, refer to Fig. 1, it shown in figure, is an existing LED luminous module, a light-emitting diode (LED) module 10 as shown in FIG., it mainly has a substrate 101, the plane of described substrate 101 is respectively equipped with one first conductive part 102 and one second conductive part 103, one light-emitting diode chip for backlight unit 104, be installed in via die bond operation in the plane of the first conductive part 102, through bonding wire, operation makes light-emitting diode chip for backlight unit 104 and the second conductive part 103 complete electric connection again, finally recycle sealing operation and above the first conductive part 102 and the second conductive part 103, be formed with an optical unit 105 (for example epoxy resin), light-emitting diode chip for backlight unit 104 can be covered by optical unit 105 with the electrical circuit in substrate 101 planes, reach whereby protection, the effects such as mixed light, please refer to again this figure, because light-emitting diode chip for backlight unit 104 input powers improve constantly, inside may be heated up 200 ° more than C, in the situation that internal temperature raises, cause between encapsulating material and chip or brilliant line thermal expansion coefficient difference excessive, and traditional epoxy resin (being optical unit) encapsulating material can cause stress dissipation poor (direction of arrow is as shown in FIG. the stress direction of optical unit) because hardness is high, make various composition materials in packaging body have brilliant thread breakage because the coefficient of expansion is different, also or cause that between light-emitting diode chip for backlight unit 104 and substrate 101, to separate (be delamination, Delamination) form the problems such as light-emitting diode chip for backlight unit power-off, therefore, high power LED package product has now gradually adopted the siloxanes that hardness is low (silicone) resin substituted epoxy resin, utilize the good protection chip of its stress dissipation characteristic, but the refractive index ratio epoxy resin of silicone resin is also low, to light-emitting diode chip for backlight unit 104, overall bright dipping has negative effect, and its adherence and refractive index deficiency, the protection deficiency of mechanical properties to assembly, be required to be multilayer encapsulation structure, therefore cause packaging cost too high, therefore be necessary to be improved.
Summary of the invention
Because above-mentioned problem, the inventor, according to the experience of being engaged in for many years the research and development of light-emitting diode Related product, studies and analyzes for the delamination problems producing between light-emitting diode chip for backlight unit and substrate, and the phase can be developed solution of the above problems; Therefore, main purpose of the present invention is to provide one can prevent that light-emitting diode chip for backlight unit is in the time that delamination occurs, and the circuit that still can maintain light-emitting diode chip for backlight unit is method for packing and the structure of conducting.
For reaching above-mentioned purpose, the technical solution used in the present invention is: a kind of structure of the circuit broken string that prevents light-emitting diode chip for backlight unit, and it comprises:
A substrate, is electrically laid with first conductive part and second conductive part in this base plan;
Safe ball, makes for the material of conduction, takes shape in the plane of this first conductive part;
A conductive adhesive layer, this conductive adhesive layer is coated in the plane of this first conductive part, also covers on described safe ball;
A light-emitting diode chip for backlight unit, this light-emitting diode chip for backlight unit is fixedly arranged on this first conductive part by conductive adhesive layer, and this light-emitting diode chip for backlight unit and this second conductive part are electrically connected; And
An optical unit, this optical unit is molded on this substrate, and this first conductive part, this second conductive part, described safe ball, this conductive adhesive layer and this light-emitting diode chip for backlight unit are subject to the covering of this optical unit.
Preferably, this first conductive part forms several described safe balls.
Preferably, this second conductive part of this light-emitting diode chip for backlight unit and this substrate completes electric connection by a bonding wire.
For reaching above-mentioned purpose, another technical solution used in the present invention is: a kind of method for packing of the circuit broken string that prevents light-emitting diode chip for backlight unit, and implementation step is as follows:
A safe ball forming step, in the plane of first conductive part on a substrate, the safe ball of moulding point-like;
A conductive adhesive layer forming step, in this first conductive part plane, is coated with a conductive adhesive layer with conduction effect;
One completes die bond job step, this light-emitting diode chip for backlight unit is sticked together on this first conductive part of this substrate by this conductive adhesive layer, to complete the electric connection between this light-emitting diode chip for backlight unit and this first conductive part, and sticking together in process of this light-emitting diode chip for backlight unit, by this conductive adhesive layer extruding, its bottom by this light-emitting diode chip for backlight unit is overflowed, and be further covered in described safe ball;
One completes the electric connection job step of light-emitting diode, and this light-emitting diode chip for backlight unit and this second conductive part are completed to electric connection operation; And
One completes packaging operation step, optical unit of moulding above this substrate, make this first conductive part, this second conductive part, this conductive adhesive layer, described safe ball and this light-emitting diode chip for backlight unit on this substrate by the complete covering of this optical unit, to complete packaging operation.
For reaching above-mentioned purpose, another technical scheme that the present invention adopts is: a kind of structure of the circuit broken string that prevents light-emitting diode chip for backlight unit, and it comprises:
A substrate, is electrically laid with first conductive part and second conductive part in this base plan;
Several safe balls of being made up of conductive material, are molded over respectively in the plane of this first conductive part and this second conductive part, and this first conductive part and this second conductive part are coated with respectively a conductive adhesive layer;
One has the light-emitting diode chip for backlight unit of two different electrical electrodes in one side, be fixedly arranged between this first conductive part and this second conductive part, these two different electrical electrodes complete electric connection with this first conductive part, this second conductive part respectively by two these conductive adhesive layers, be coated on two these conductive adhesive layers of this first conductive part and this second conductive part, cover respectively on contiguous described safe ball; And
An optical unit, takes shape on this substrate, makes this first conductive part, this second conductive part, two these conductive adhesive layers, described safe ball and this light-emitting diode chip for backlight unit be subject to the covering of this optical unit.
According to this, even if there is delamination between following light-emitting diode chip for backlight unit bottom and substrate, it still can be because of in the annexation of conductive adhesive layer, makes to maintain between the first conductive part and safe ball and the conducting relation of light-emitting diode chip for backlight unit, is electrically connected for the sustainable formation of light-emitting diode chip for backlight unit.
Accompanying drawing explanation
Fig. 1 is an existing LED luminous module.
Fig. 2 is contexture schematic diagram of the present invention ().
Fig. 3 is contexture schematic diagram of the present invention (two).
Fig. 4 is contexture schematic diagram of the present invention (three).
Fig. 5 is contexture schematic diagram of the present invention (four).
Fig. 6 is enforcement schematic diagram of the present invention.
Fig. 7 is method for packing block diagram of the present invention.
Fig. 8 is another embodiment of the present invention (one).
Fig. 9 is another embodiment of the present invention (two).
Figure 10 be embodiment (two) complete assembling schematic diagram.
[primary clustering symbol description]
10 light-emitting diode (LED) module 101 substrate 102 first conductive parts
103 second conductive part 104 light-emitting diode chip for backlight unit
105 optical units
20 prevent structure 201 substrates of the circuit broken string of light-emitting diode chip for backlight unit
202 safe ball 2,011 first conductive parts
204 light-emitting diode chip for backlight unit
2012 second conductive part 2013 electrical junctions
2013 ' electrical junction
203 conductive adhesive layer 205 optical units
301 safe ball forming step 302 conductive adhesive layer forming steps
303 complete die bond job step
304 complete the electric connection job step of light-emitting diode
305 complete packaging operation step
40 prevent the structure of the circuit broken string of light-emitting diode chip for backlight unit
401 substrate 402 safe ball 4,011 first conductive parts
402 ' safe ball 4,012 second conductive part 404 light-emitting diode chip for backlight unit
403 conductive adhesive layer 4041 electrode 403 ' conductive adhesive layers
4042 electrode 405 optical unit d spaces.
Embodiment
Refer to Fig. 2, it shown in figure, is contexture schematic diagram of the present invention (), the structure 20 of the circuit broken string of what the present invention was alleged prevent light-emitting diode chip for backlight unit, mainly there is a substrate 201, described substrate 201 can be a kind of metal substrate, for example aluminium base, and be laid with up one first conductive part 2011 and one second conductive part 2012, or be that the multilayer-type combined base plate that is laid with electrical circuit also can, again, substrate 201 belows or sidepiece are formed with an electrical junction (this figure does not show), make substrate 201 complete electric connection by electrical junction and another electrical circuit, the electrical circuit of a for example Luminous lamp base, moreover, the first conductive part 2011 of substrate 201 is by the mode of for example spot welding, form a safe ball 202, described safe ball 202 is conductive metal material, for example gold, silver, the materials such as tin.
Refer to Fig. 3, shown in figure, be contexture schematic diagram of the present invention (two), hold shown in Fig. 2, after safe ball 202 takes shape in the first conductive part 2011, further in the plane of the first conductive part 2011, be coated with a conductive adhesive layer 203, described conductive adhesive layer 203 has effect of conduction, please arrange in pairs or groups and consult Fig. 4 again, it shown in figure, is contexture schematic diagram of the present invention (three), from the above, one light-emitting diode chip for backlight unit 204 by die bond operation further to set firmly (sticking together) on the first conductive part 2011, and light-emitting diode chip for backlight unit 204 completes after die bond operation, synchronous and the first conductive part 2011 completes electric connection, and in the process of sticking together, and synchronously make the conductive adhesive layer 203 that the first conductive part 2011 is coated with in advance slightly be overflowed by light-emitting diode chip for backlight unit 204 surroundings, because of the glue amount process calculating in advance of conductive adhesive layer 203, therefore the part that conductive adhesive layer 203 overflows just can cover safe ball 202, please arrange in pairs or groups and consult Fig. 5 again, it shown in figure, is contexture schematic diagram of the present invention (four), hold, light-emitting diode chip for backlight unit 204 completes after die bond operation, make light-emitting diode chip for backlight unit 204 and the second conductive part 2012 complete electric connection by bonding wire operation again, and complete after electric connection with the first conductive part 2011 and the second conductive part 2012 respectively by light-emitting diode chip for backlight unit 204, can form a complete electrical loop, when the electrical junction (2013 that the first conductive part 2011 and the second conductive part 2012 connect respectively, 2013 ') complete after electric connection with another electrical circuit, can make light-emitting diode chip for backlight unit 204 be subject to current drives produces luminous, moreover, one optical unit 205 (for example making with epoxy resin) takes shape on substrate 201, make the first conductive part 2011 on substrate 201, the second conductive part 2012, safe ball 202, conductive adhesive layer 203, the covering that the members such as light-emitting diode chip for backlight unit 204 and electrically circuit are subject to optical unit 205 is to complete packaging operation, reach whereby protection, the effects such as mixed light.
Refer to Fig. 6, it shown in figure, is enforcement schematic diagram of the present invention, from the above, the structure 20 of the circuit broken string of what the present invention was alleged prevent light-emitting diode chip for backlight unit, in the process of implementing, the high temperature producing when luminous due to light-emitting diode chip for backlight unit 204, can make the temperature increase of optical unit 205 inside, thereby cause the thermal expansion coefficient difference between encapsulating material and chip excessive, in the time that the thermal stress of optical unit 205 is further pullled light-emitting diode chip for backlight unit 204, likely cause substrate 201 to produce with light-emitting diode chip for backlight unit 204 and separate (being delamination) to form a space d, please refer to again this figure, in the time of the unfortunate generation of delamination, (between light-emitting diode chip for backlight unit 204 and substrate 201, form space d), owing to forming and being electrically connected between conductive adhesive layer 203 and safe ball 202 and light-emitting diode chip for backlight unit 204, be with, light-emitting diode chip for backlight unit 204 can be by the traction relation of the conductive adhesive layer of edge remnants 203 and safe ball 202, still effectively maintain and the electric connection of the first conductive part 2011, so that light-emitting diode chip for backlight unit 204 still can regular event.
Referring to Fig. 7, is method for packing block diagram of the present invention shown in figure, please arrange in pairs or groups and consult Fig. 2 to Fig. 6, and implementation step is as follows:
(1) safe ball forming step 301: in the plane of the first conductive part 2011 of substrate 201, the safe ball 202 of moulding one point-like;
(2) conductive adhesive layer forming step 302: hold, in the plane of the first conductive part 2011 of moulding safe ball 202, be further coated with a conductive adhesive layer 203 with conduction effect;
(3) complete die bond job step 303: hold, light-emitting diode chip for backlight unit 204 is fixedly arranged on by die bond operation on the first conductive part 2011 of substrate 201, and light-emitting diode chip for backlight unit 204 is completing while setting firmly, further extruding conductive adhesive layer 203, its bottom by light-emitting diode chip for backlight unit 204 is overflowed, and further cover safe ball 202;
(4) complete the electric connection job step 304 of light-emitting diode: light-emitting diode chip for backlight unit 204 and the second conductive part 2012 are completed and be electrically connected operation (for example routing);
(5) complete packaging operation step 305: after above-mentioned steps completes, moulding one optical unit 205 above substrate 201, make the first conductive part 2011, the second conductive part 2012, safe ball 202, conductive adhesive layer 203, light-emitting diode chip for backlight unit 204 and electrical circuit by the complete covering of optical unit 205, to complete packaging operation.
Refer to Fig. 8, it shown in figure, is another embodiment of the present invention (), the present invention can further arrange multiple safe balls 202 on the first conductive part 2011, so, to increase the electric connection between conductive adhesive layer 203 and multiple safe ball 202, further guarantee the conductance of light-emitting diode chip for backlight unit 204 and substrate 201, for example, in the time that one of them safe ball 202 is broken string state completely with conductive adhesive layer 203, still there is other safe ball 202 to be still electric connection state with conductive adhesive layer 203.
Refer to Fig. 9, it shown in figure, is another embodiment of the present invention (two), the present invention is also applicable to the structure 40 of the circuit broken string that prevents light-emitting diode chip for backlight unit as shown in FIG., as figure, shown light-emitting diode chip for backlight unit 404 is a kind of light-emitting diode chip for backlight unit 404 in one side with two different electrical electrodes (4041,4042); Separately, one substrate 401 is electrically laid with one first conductive part 4011 and one second conductive part 4012, and two conductive parts form respectively a safe ball (402,402 ') on (4011,4012), and after safe ball (402,402 ') moulding, respectively at two conductive parts (4011,4012) upper coating one conductive adhesive layers (403,403 '), make again light-emitting diode chip for backlight unit 404 borrow two conductive adhesive layers (403,403 '), make two different electrical electrode (4041,4042) be fixedly arranged on respectively two conductive parts (4011,4012), electrically conduct to form; Above-mentioned member completes the aspect that group is established, as Figure 10, shown in figure for embodiment (two) complete assembling schematic diagram, hold, light-emitting diode chip for backlight unit 404 completes after die bond operation, the enterprising one-step shaping of substrate 401 has an optical unit 405; Hold, in the time that light-emitting diode chip for backlight unit 404 borrows conductive adhesive layer (403,403 ') to stick together at substrate 401, conductive adhesive layer (403,403 ') is synchronously pushed by light-emitting diode chip for backlight unit 404, and overflows toward chip surrounding, and further covers two safe balls (402,402 '); According to this, even if light-emitting diode chip for backlight unit 404 produces delamination because use causes having with substrate 401 in the future, it still can borrow the effect of safe ball (402,402 ') and conductive adhesive layer (403,403 ') to maintain electrically conducting between substrate 401, its mode, as aforementioned, will not repeat at this again.
Known from the above mentioned, method for packing and the structure of the circuit broken string of what the present invention was alleged prevent light-emitting diode chip for backlight unit, the conductive characteristic that it utilizes conductive adhesive layer to have, and complete after die bond operation at light-emitting diode chip for backlight unit, make conductive adhesive layer further cover the safe ball of moulding in advance, using as the conduction redundant of future in the time that light-emitting diode chip for backlight unit and substrate produce delamination, be with, in the time that delamination produces, between light-emitting diode chip for backlight unit and substrate, still can maintain the state of electrically conducting by the electrical connection of the safe ball of conductive adhesive layer, effectively prevent from producing the situation of circuit broken string as existing light-emitting diode chip for backlight unit because of delamination, according to this, the present invention after it implements according to this, really can reach and provide one can prevent that light-emitting diode chip for backlight unit is in the time that delamination occurs, and the circuit that still can maintain light-emitting diode chip for backlight unit is the method for packing of conducting and the object of structure.
Only, as described above, be only better embodiment of the present invention, not in order to limit scope of the invention process; Anyly have the knack of this skill person, change and modify not departing from the equalization of being done under the present invention's spirit and scope, all should be covered by the scope of the claims of the present invention.
Claims (5)
1. a structure that prevents the circuit broken string of light-emitting diode chip for backlight unit, is characterized in that, comprising:
A substrate, is electrically laid with first conductive part and second conductive part in this base plan;
Safe ball, makes for the material of conduction, takes shape in the plane of this first conductive part;
A conductive adhesive layer, this conductive adhesive layer is coated in the plane of this first conductive part, also covers on described safe ball;
A light-emitting diode chip for backlight unit, this light-emitting diode chip for backlight unit is fixedly arranged on this first conductive part by conductive adhesive layer, and this light-emitting diode chip for backlight unit and this second conductive part are electrically connected; And
An optical unit, this optical unit is molded on this substrate, and this first conductive part, this second conductive part, described safe ball, this conductive adhesive layer and this light-emitting diode chip for backlight unit are subject to the covering of this optical unit.
2. the structure of the circuit broken string that prevents light-emitting diode chip for backlight unit as claimed in claim 1, is characterized in that, this first conductive part forms several described safe balls.
3. the structure of the circuit broken string that prevents light-emitting diode chip for backlight unit as claimed in claim 1, is characterized in that, this second conductive part of this light-emitting diode chip for backlight unit and this substrate completes electric connection by a bonding wire.
4. a method for packing that prevents the circuit broken string of light-emitting diode chip for backlight unit, is characterized in that, implementation step is as follows:
A safe ball forming step, in the plane of first conductive part on a substrate, the safe ball of moulding point-like;
A conductive adhesive layer forming step, in this first conductive part plane, is coated with a conductive adhesive layer with conduction effect;
One completes die bond job step, this light-emitting diode chip for backlight unit is sticked together on this first conductive part of this substrate by this conductive adhesive layer, to complete the electric connection between this light-emitting diode chip for backlight unit and this first conductive part, and sticking together in process of this light-emitting diode chip for backlight unit, by this conductive adhesive layer extruding, its bottom by this light-emitting diode chip for backlight unit is overflowed, and be further covered in described safe ball;
One completes the electric connection job step of light-emitting diode, and this light-emitting diode chip for backlight unit and this second conductive part are completed to electric connection operation; And
One completes packaging operation step, optical unit of moulding above this substrate, make this first conductive part, this second conductive part, this conductive adhesive layer, described safe ball and this light-emitting diode chip for backlight unit on this substrate by the complete covering of this optical unit, to complete packaging operation.
5. a structure that prevents the circuit broken string of light-emitting diode chip for backlight unit, is characterized in that, comprising:
A substrate, is electrically laid with first conductive part and second conductive part in this base plan;
Several safe balls of being made up of conductive material, are molded over respectively in the plane of this first conductive part and this second conductive part, and this first conductive part and this second conductive part are coated with respectively a conductive adhesive layer;
One has the light-emitting diode chip for backlight unit of two different electrical electrodes in one side, be fixedly arranged between this first conductive part and this second conductive part, these two different electrical electrodes complete electric connection with this first conductive part, this second conductive part respectively by two these conductive adhesive layers, be coated on two these conductive adhesive layers of this first conductive part and this second conductive part, cover respectively on contiguous described safe ball; And
An optical unit, takes shape on this substrate, makes this first conductive part, this second conductive part, two these conductive adhesive layers, described safe ball and this light-emitting diode chip for backlight unit be subject to the covering of this optical unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210581335.8A CN103904205B (en) | 2012-12-28 | Prevent method for packing and structure that the circuit of light-emitting diode chip for backlight unit breaks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210581335.8A CN103904205B (en) | 2012-12-28 | Prevent method for packing and structure that the circuit of light-emitting diode chip for backlight unit breaks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103904205A true CN103904205A (en) | 2014-07-02 |
| CN103904205B CN103904205B (en) | 2016-11-30 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113659057A (en) * | 2021-08-10 | 2021-11-16 | 深圳莱特光学科技有限公司 | Semiconductor packaging method and semiconductor structure thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054860A (en) * | 2007-08-28 | 2009-03-12 | Citizen Electronics Co Ltd | Chip-type semiconductor device |
| CN201966250U (en) * | 2010-09-02 | 2011-09-07 | 深圳市海隆兴光电子有限公司 | LED (Light Emitting Diode) light emitting module with favorable heat radiation |
| CN102823084A (en) * | 2010-04-12 | 2012-12-12 | 索尼化学&信息部件株式会社 | Method of manufacturing light-emitting device |
| CN203134863U (en) * | 2012-12-28 | 2013-08-14 | 创巨光科技股份有限公司 | Structure for preventing circuit of light emitting diode chip from breaking |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054860A (en) * | 2007-08-28 | 2009-03-12 | Citizen Electronics Co Ltd | Chip-type semiconductor device |
| CN102823084A (en) * | 2010-04-12 | 2012-12-12 | 索尼化学&信息部件株式会社 | Method of manufacturing light-emitting device |
| CN201966250U (en) * | 2010-09-02 | 2011-09-07 | 深圳市海隆兴光电子有限公司 | LED (Light Emitting Diode) light emitting module with favorable heat radiation |
| CN203134863U (en) * | 2012-12-28 | 2013-08-14 | 创巨光科技股份有限公司 | Structure for preventing circuit of light emitting diode chip from breaking |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113659057A (en) * | 2021-08-10 | 2021-11-16 | 深圳莱特光学科技有限公司 | Semiconductor packaging method and semiconductor structure thereof |
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