CN103904193A - Method for manufacturing light emitting diode packaging structure - Google Patents
Method for manufacturing light emitting diode packaging structure Download PDFInfo
- Publication number
- CN103904193A CN103904193A CN201210577959.2A CN201210577959A CN103904193A CN 103904193 A CN103904193 A CN 103904193A CN 201210577959 A CN201210577959 A CN 201210577959A CN 103904193 A CN103904193 A CN 103904193A
- Authority
- CN
- China
- Prior art keywords
- colloid
- glue
- led
- package structure
- phosphor gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000000084 colloidal system Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims description 37
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 239000002223 garnet Substances 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 1
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a method for manufacturing a light emitting diode packaging structure. The method includes the following steps: a substrate is provided, and a light emitting diode chip is arranged on the substrate; colloid is dispensed on the substrate around the light diode chip, and the colloid is heated and solidified to from a plastic ring; colloid is dispensed again in an area surrounded by the plastic ring, then the colloid is solidified, and a packaging body covering the light emitting diode chip is formed. The method for manufacturing the packaging body of the light emitting diode in the invention uses the plastic ring formed by the colloid after solidification to replace a conventional baffle ring, can reduce costs and simplify a manufacturing process, and can improve luminous efficiency.
Description
Technical field
The present invention relates to a kind of manufacture method of package structure for LED.
Background technology
Nowadays, light-emitting diode, as a kind of novel light emitting source, is applied in the middle of each field more and more.In existing LED package process, after light-emitting diode chip for backlight unit paster completes, conventionally also can on light-emitting diode chip for backlight unit, form a packaging body, this packaging body is by mixed fluorescent powder in packaging plastic, then solidify to form.This packaging body can improve the light-emitting diode chip for backlight unit characteristics of luminescence.Refer to Fig. 1 to Fig. 3, the formation method of conventional package body is: first, on substrate 100, around 200 glue of light-emitting diode chip for backlight unit, form the fixing glue 300 of a corral around light-emitting diode chip for backlight unit 200; Then, fix the baffle ring 400 of a ring-type by these fixing glue 300 bondings, this baffle ring 400 is intended for a mould of subsequent point phosphor gel; Finally, dot fluorescent powder glue in the region surrounding at baffle ring 400, then solidifies phosphor gel and forms packaging body 500.
But the formation method of traditional packaging body has following defect: 1. need the extra baffle ring 400 of buying, can cause the waste of cost; 2. need extra some glue steps that increases, fix baffle ring 400, complex steps; 3. the light of light-emitting diode chip for backlight unit bottom side is easily blocked by baffle ring 400, can cause package structure for LED light extraction efficiency low.
Summary of the invention
The manufacture method of the package structure for LED that in view of this, is necessary to provide that a kind of cost is low, processing procedure simple, can improving extraction efficiency.
A manufacture method for package structure for LED, it comprises following step:
One substrate is provided, on this substrate, light-emitting diode chip for backlight unit is set;
On substrate, around colloid on light-emitting diode chip for backlight unit point, this colloid that is heating and curing forms a glue ring;
In the region surrounding at glue ring, again put colloid, then solidify this colloid, form the packaging body of covering luminousing diode chip.
In the manufacture method of above-mentioned package structure for LED, utilize colloid to solidify the rear glue ring forming and replace traditional baffle ring, therefore, without buying baffle ring, can reduce costs.And the step of also having saved the fixing baffle ring of some glue on processing procedure, can simplify processing procedure.In addition, the light that Light-Emitting Diode sides of chip is sent can see through glue ring and penetrate, so increased the lighting angle of light-emitting diode light encapsulating structure, has promoted luminous efficiency.
Brief description of the drawings
Fig. 1 is the package structure for LED sectional view that baffle ring is set of prior art.
Fig. 2 is the vertical view of the package structure for LED in Fig. 1.
Fig. 3 is the package structure for LED sectional view that forms packaging body in the baffle ring in Fig. 1.
Fig. 4 is the package structure for LED sectional view of the formation glue ring in embodiment of the present invention.
Fig. 5 is the vertical view of the package structure for LED in Fig. 4.
Fig. 6 is the package structure for LED sectional view that forms packaging body in the glue ring in Fig. 4.
Main element symbol description
| |
10、100 |
| Light-emitting diode chip for |
20、200 |
| |
30 |
| |
40 |
| |
50、500 |
| Dispensing |
41 |
| |
300 |
| |
400 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Refer to Fig. 4 to Fig. 6, the manufacture method of a kind of package structure for LED that embodiment of the present invention provides comprises following step:
Step 1, provides a substrate 10, patch light-emitting diode chip 20 on this substrate 10.In the present embodiment, described substrate 10 is sapphire substrate.
Step 2, on substrate 10, around colloid on 20 of light-emitting diode chip for backlight unit, the colloid that is heating and curing forms a glue ring 30.In the present embodiment, this colloid is phosphor gel, and the glue ring 30 of formation is phosphor gel ring, and described phosphor gel realizes a glue by point gum machine 40, and this point gum machine 40 comprises a dispensing needle head 41, and phosphor gel is injected on substrate 10 by this dispensing needle head.Described glue ring 30 is a circulus, and it is around light-emitting diode chip for backlight unit 20, for a mould as subsequent point glue.The overall dimension of described glue ring 30 can realize by the density of the diameter of control point needle head 41, plastic emitting time, plastic emitting pressure and phosphor gel.Described phosphor gel is to adopt sealing resin doping fluorescent powder to make, the mixing of the optional autovulcanization matter fluorescent powder of described fluorescent material, silicate fluorescent powder, Nitride phosphor, nitric oxide fluorescent powder, yttrium aluminium garnet fluorescent powder or above-mentioned fluorescent material.
Step 3, in the region surrounding at glue ring 30 again on colloid, then solidify this colloid, form the packaging body 50 of covering luminousing diode chip 20.In the present embodiment, the colloid on is again also phosphor gel.In the time of the interior dot fluorescent powder glue of glue ring 30, because phosphor gel exists surface tension, therefore its upper surface can form the spherical shape of an evagination, thereby the packaging body 50 forming is with regard to the shape of similar convex lens, this packaging body 50 can be dispersed the light that light-emitting diode chip for backlight unit 20 sends, make the bright dipping of package structure for LED wider, light angle is larger.And the part light that the side of light-emitting diode chip for backlight unit 20 sends can see through glue ring 30 and penetrate, and has further increased lighting angle, has promoted luminous efficiency.
In addition, the density of the phosphor gel adopting while putting glue is for the first time greater than the density of the phosphor gel adopting while putting glue for the second time, and the phosphor gel of large density can be denser, and mobility is poor, is therefore conducive to the moulding of glue ring 30 on substrate 10.
In the manufacture method of package structure for LED of the present invention, utilize colloid to solidify the rear glue ring 30 forming and replace traditional baffle ring, therefore, without buying baffle ring, can reduce costs.And the step of also having saved the fixing baffle ring of some glue on processing procedure, can simplify processing procedure.In addition, the light that Light-Emitting Diode sides of chip is sent can see through glue ring 30 and penetrate, so increased the lighting angle of light-emitting diode light encapsulating structure, has promoted luminous efficiency.
Be understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (7)
1. a manufacture method for package structure for LED, it comprises following step:
One substrate is provided, on this substrate, light-emitting diode chip for backlight unit is set;
On substrate, around colloid on light-emitting diode chip for backlight unit point, this colloid that is heating and curing forms a glue ring;
In the region surrounding at glue ring, again put colloid, then solidify this colloid, form the packaging body of covering luminousing diode chip.
2. the manufacture method of package structure for LED as claimed in claim 1, is characterized in that: described colloid is phosphor gel, and the glue ring of formation is phosphor gel ring.
3. the manufacture method of package structure for LED as claimed in claim 2, is characterized in that: described phosphor gel realizes a glue by point gum machine, and this point gum machine comprises a dispensing needle head, and phosphor gel is injected on substrate by this dispensing needle head.
4. the manufacture method of package structure for LED as claimed in claim 2, is characterized in that: described phosphor gel is to adopt sealing resin doping fluorescent powder to make.
5. the manufacture method of package structure for LED as claimed in claim 4, is characterized in that: described fluorescent material is selected from the mixing of sulphide fluorescent material, silicate fluorescent powder, Nitride phosphor, nitric oxide fluorescent powder, yttrium aluminium garnet fluorescent powder or above-mentioned fluorescent material.
6. the manufacture method of package structure for LED as claimed in claim 2, is characterized in that: in phosphor gel ring, when dot fluorescent powder glue, phosphor gel is due to surface tension, and upper surface forms the sphere of an evagination.
7. the manufacture method of package structure for LED as claimed in claim 2, is characterized in that: the density of the phosphor gel while putting glue is for the first time greater than the density of the phosphor gel while putting glue for the second time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210577959.2A CN103904193A (en) | 2012-12-27 | 2012-12-27 | Method for manufacturing light emitting diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210577959.2A CN103904193A (en) | 2012-12-27 | 2012-12-27 | Method for manufacturing light emitting diode packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103904193A true CN103904193A (en) | 2014-07-02 |
Family
ID=50995428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210577959.2A Pending CN103904193A (en) | 2012-12-27 | 2012-12-27 | Method for manufacturing light emitting diode packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103904193A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110216054A (en) * | 2019-06-17 | 2019-09-10 | 安徽芯瑞达科技股份有限公司 | A kind of technique and its rubber-coated mechanism being uniformly coated on fluorescent solutions on PCB |
| CN110964470A (en) * | 2019-11-20 | 2020-04-07 | 东莞市银亮电子科技有限公司 | Packaging adhesive for improving UV light efficiency and process thereof |
-
2012
- 2012-12-27 CN CN201210577959.2A patent/CN103904193A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110216054A (en) * | 2019-06-17 | 2019-09-10 | 安徽芯瑞达科技股份有限公司 | A kind of technique and its rubber-coated mechanism being uniformly coated on fluorescent solutions on PCB |
| CN110964470A (en) * | 2019-11-20 | 2020-04-07 | 东莞市银亮电子科技有限公司 | Packaging adhesive for improving UV light efficiency and process thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140702 |
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| RJ01 | Rejection of invention patent application after publication |