CN103904010A

CN103904010A - Wafer conveying device

Info

Publication number: CN103904010A
Application number: CN201410106592.5A
Authority: CN
Inventors: 秦贵明; 俞玮; 张瑜
Original assignee: Shanghai Huali Microelectronics Corp
Current assignee: Shanghai Huali Microelectronics Corp
Priority date: 2014-03-20
Filing date: 2014-03-20
Publication date: 2014-07-02
Anticipated expiration: 2034-03-20
Also published as: CN103904010B

Abstract

The invention provides a wafer conveying device. The wafer conveying device comprises a conveying fork. A plurality of gas spraying holes are formed in the wafer conveying fork. When the wafer conveying device stretches into a diffusion furnace, all the gas spray holes face different wafer boat angles respectively. The wafer conveying device has the purging function which a traditional wafer conveying device does not have, when high-density particles caused by a rod map appear or do not appear in a machine, automatic purging can be realized, and loading operated manually is reduced, oxygen exchanging does not need to be conducted by opening a rear door, the processing time is saved and the operating time of the machine is prolonged.

Description

A kind of wafer handler

Technical field

The present invention relates to field of semiconductor manufacture, relate in particular to a kind of wafer handler, be applied in the diffusion furnace at the some brilliant boats of tool angle.

Background technology

Along with scientific and technological progress, semiconductor electronic product has been applied to the every field of social life, and these semiconductor products all have semiconductor wafer, and as can be seen here, semiconductor eyeglass has significant importance in current life.

But in the manufacture of semiconductor device and integrated circuit, there is several factors to cause semiconductor eyeglass to go wrong.

Wherein, diffusion furnace is one of important technological equipment of operation before semiconductor production line, is normally used for the techniques such as diffusion, oxidation, annealing, alloy and sintering, as thermal annealing, the deposition of film etc. of silicon face after the formation of grid oxygen, Implantation.

Diffusion furnace has two types, vertical diffusion furnace (vertical) and horizontal proliferation stove (horizontal).Vertical diffusion furnace be quartz boat perpendicular to horizontal plane, be more conducive to manipulator and transmit silicon chip, technological parameter consistency is better in sheet.Horizontal proliferation stove is that quartz boat is parallel to horizontal plane, and one can 4 or 4 above technique boiler tubes, and average boiler tube floor space is less, and the technological parameter between sheet is better compared with vertical diffusion furnace.

But diffusion furnace in use, is easy to, at the upper particle that generates of brilliant boat pole (boat rod), conventionally be produced by following reason:

One, the rubbing action between wafer and brilliant boat, under general wafer conveyer, when heating, wafer thermal expansion and flexion occurs, simultaneously, may be in off-normal position between wafer and brilliant boat, wafer and brilliant boat rub, and in the process of loading or unloading, the wafer deformation inhomogeneous and that cause of being heated, produce particle in brilliant Zhou Jiao position thereby cause, as shown in Fig. 1 a and Fig. 1 b.

Two, the quality of brilliant boat itself, tend to plate one deck silicon nitride film on the surface of brilliant boat, in serialization is produced, for the safeguard work time, regularly need to clean brilliant boat, generally clean brilliant boat is for rinsing, and silicon nitride film is easy to peel off, produce particle in brilliant boat (boat) position, angle, as shown in Figure 2.

Be accumulated to certain degree to particle, can form the high density granular (particle high) on the boat bar figure (rod map) as shown in Fig. 3 a and 3b, if do not add processing, can cause the Quality Down of wafer, and then cause follow-up manufacturing process normally not carry out, affect the yields of product.

In prior art, process the high density granular (particle high) that causes of boat bar figure (rod map) and be and board is unloaded to (down) and open back door nitrogen gun and manually boat bar (boat rod) position is purged.The method relatively wastes time and energy, and must carry out loading place (loading area) nitrogen N before and after purging ₂displacement, after closing back door, must wait in loading place oxygen concentration normal need 1 hour, has a strong impact on the running time (uptime) of board.

Summary of the invention

In view of the above problems, the invention provides a kind of wafer handler, be applied in the diffusion furnace at the some brilliant boats of tool angle.

The technical scheme that technical solution problem of the present invention adopts is:

A kind of wafer handler for diffusion furnace, be applied in the diffusion furnace at the some brilliant boats of tool angle, described device comprises that wafer transmits fork, described wafer transmits on fork and is provided with some fumaroles, in the time that described wafer handler stretches in described diffusion furnace, each described fumarole towards pointing to respectively different brilliant boat angles.

Wherein, described some fumaroles are arranged at described wafer and transmit the one end not contacting with wafer on fork, for example, transmit upper end, lower end or the rear end of fork.

Preferably, described some fumaroles comprise some the first fumaroles and some the second fumaroles, and described some the first fumaroles are all arranged at described wafer and transmit the top of pitching, and described some the second fumaroles are all arranged at described wafer and transmit the bottom of pitching.

In a preferred embodiment of the invention, the quantity of some described the first fumaroles equates with the quantity of some described the second fumaroles, and quantity is 3.

Preferably, described some fumaroles are N ₂fumarole.

Wherein, each described fumarole is all connected with flow monitor, detects the size of gas flow.

Preferably, each described fumarole is provided with valve, and described valve can be operated pneumatic valve, electrically operated valve, adjuster valve, electromagnetically operated valve, and electromagnetically operated valve more preferably.Described valve can be at the opening part of fumarole, also can be in inside, fumarole duct.

Described valve is connected with microcontroller, for the switch of by-pass valve control or regulate the size of air-flow.

For addressing the above problem, the present invention also provides a kind of diffusion furnace that comprises above-mentioned wafer handler.Described diffusion furnace is preferably vertical diffusion furnace.

Technique scheme tool has the following advantages or beneficial effect:

By the wafer handler for diffusion furnace of the present invention, there is the purging function that traditional wafer handler does not possess, can be to brilliant boat angle automatic blowing, reduce the loading (loading) of manual operation, without the replacement of oxygen of practicing backdoorism, save the processing time, improve the running time of board.

Brief description of the drawings

With reference to appended accompanying drawing, to describe more fully embodiments of the invention.But appended accompanying drawing only, for explanation and elaboration, does not form limitation of the scope of the invention.

Fig. 1 a is the schematic diagram that particle forms reason one;

Fig. 1 b is the schematic diagram that particle forms reason one;

Fig. 2 is the schematic diagram that particle forms reason two;

Fig. 3 a is the schematic diagram of a high density granular (particle high);

Fig. 3 b is the schematic diagram of another high density granular;

Fig. 4 a is the plan structure schematic diagram for the wafer handler of diffusion furnace in the present invention;

Fig. 4 b is the side-looking structural representation for the wafer handler of diffusion furnace in the present invention;

Fig. 5 is the wafer handler partial structurtes schematic diagram of structure of the present invention for diffusion furnace.

Embodiment

The invention provides a kind of wafer handler for diffusion furnace, can be applicable in technique that technology node is 65/55nm.

As shown in Figs. 4a and 4b, in this embodiment for the wafer handler of the vertical diffusion furnace at the some brilliant boats of tool angle, comprise wafer and transmit fork 6, the rear end of transmitting fork 6 at wafer is provided with the fumarole 7 towards the direction 9 at brilliant boat angle 8, wherein, the rear end that above-mentioned rear end is not limited to wafer transmits fork, only otherwise the one end contacting with wafer.Fumarole can spray N ₂or the gas of other required uses.Fumarole 7 comprises that being arranged at wafer transmits first fumarole and the second fumarole that is arranged at wafer transmission fork bottom on fork top, the first fumarole and the second fumarole quantity are respectively 3, certainly according to the quantity at brilliant boat angle in different diffusion furnaces, can be also other quantity.

As shown in Figure 5, on described fumarole, be connected with flow monitor, for detection of the size of gas flow.Can also on fumarole, be provided with valve, as operated pneumatic valve, electrically operated valve, adjuster valve, electromagnetically operated valve, and electromagnetically operated valve valve more preferably.Flow monitor is all connected a microcontroller with valve, and the switch that microcontroller can by-pass valve control meanwhile, receives the signal of flow monitor the size of adjust flux.

Gas flow carrys out setup control by microcontroller, and there is a switch on corresponding this road of valve control, need to purge time, brilliant boat is in initial (home) position, transmit and pitch the wafer crawl position that enters negative crystal boat, then along the reciprocal vertical up-or-down movement of brilliant boat, complete the automatic blowing to brilliant boat angle by six nitrogen fumaroles that are arranged in upper and lower surface

In sum, the present invention is for the wafer handler of diffusion furnace, there is the purging function that traditional wafer handler does not possess, in the time that high density granular that boat bar figure causes does not occur board, can freely be set to operation or by being accumulated to certain thickness to brilliant boat angle automatic blowing; Cause at board generation boat bar figure high density granular time also can automatic blowing, reduce the loading of manual operation, without the replacement of oxygen of practicing backdoorism, save the processing time, improve the running time of board.

For a person skilled in the art, read after above-mentioned explanation, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should be regarded whole variations and the correction of containing true intention of the present invention and scope as.Within the scope of claims, scope and the content of any and all equivalences, all should think and still belong to the intent and scope of the invention.

Claims

1. a wafer handler, be applied in the diffusion furnace at the some brilliant boats of tool angle, described device comprises that wafer transmits fork, it is characterized in that, described wafer transmits on fork and is provided with some fumaroles, in the time that described wafer handler stretches in described diffusion furnace, each described fumarole towards pointing to respectively different brilliant boat angles.

2. wafer handler as claimed in claim 1, is characterized in that, described some fumaroles are arranged at described wafer and transmit the one end not contacting with wafer on fork.

3. wafer handler as claimed in claim 2, is characterized in that, described some fumaroles comprise some the first fumaroles and some the second fumaroles;

Described some the first fumaroles are all arranged at described wafer and transmit the top of pitching;

Described some the second fumaroles are all arranged at described wafer and transmit the bottom of pitching.

4. wafer handler as claimed in claim 3, is characterized in that, the quantity of some described the first fumaroles equates with the quantity of some described the second fumaroles.

5. wafer handler as claimed in claim 4, is characterized in that, the quantity of some described the first fumaroles is 3, and the quantity of some described the second fumaroles is 3.

6. wafer handler as claimed in claim 1, is characterized in that, described some fumaroles are N ₂fumarole.

7. wafer handler as claimed in claim 1, is characterized in that, each described fumarole is all connected with flow sensor.

8. wafer handler as claimed in claim 7, is characterized in that, on each described fumarole, is provided with valve.

9. wafer handler as claimed in claim 8, is characterized in that, described valve is electromagnetically operated valve.