CN103904010A - Wafer conveying device - Google Patents
Wafer conveying device Download PDFInfo
- Publication number
- CN103904010A CN103904010A CN201410106592.5A CN201410106592A CN103904010A CN 103904010 A CN103904010 A CN 103904010A CN 201410106592 A CN201410106592 A CN 201410106592A CN 103904010 A CN103904010 A CN 103904010A
- Authority
- CN
- China
- Prior art keywords
- wafer
- fumaroles
- conveying device
- wafer conveying
- fumarole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer conveying device. The wafer conveying device comprises a conveying fork. A plurality of gas spraying holes are formed in the wafer conveying fork. When the wafer conveying device stretches into a diffusion furnace, all the gas spray holes face different wafer boat angles respectively. The wafer conveying device has the purging function which a traditional wafer conveying device does not have, when high-density particles caused by a rod map appear or do not appear in a machine, automatic purging can be realized, and loading operated manually is reduced, oxygen exchanging does not need to be conducted by opening a rear door, the processing time is saved and the operating time of the machine is prolonged.
Description
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to a kind of wafer handler, be applied in the diffusion furnace at the some brilliant boats of tool angle.
Background technology
Along with scientific and technological progress, semiconductor electronic product has been applied to the every field of social life, and these semiconductor products all have semiconductor wafer, and as can be seen here, semiconductor eyeglass has significant importance in current life.
But in the manufacture of semiconductor device and integrated circuit, there is several factors to cause semiconductor eyeglass to go wrong.
Wherein, diffusion furnace is one of important technological equipment of operation before semiconductor production line, is normally used for the techniques such as diffusion, oxidation, annealing, alloy and sintering, as thermal annealing, the deposition of film etc. of silicon face after the formation of grid oxygen, Implantation.
Diffusion furnace has two types, vertical diffusion furnace (vertical) and horizontal proliferation stove (horizontal).Vertical diffusion furnace be quartz boat perpendicular to horizontal plane, be more conducive to manipulator and transmit silicon chip, technological parameter consistency is better in sheet.Horizontal proliferation stove is that quartz boat is parallel to horizontal plane, and one can 4 or 4 above technique boiler tubes, and average boiler tube floor space is less, and the technological parameter between sheet is better compared with vertical diffusion furnace.
But diffusion furnace in use, is easy to, at the upper particle that generates of brilliant boat pole (boat rod), conventionally be produced by following reason:
One, the rubbing action between wafer and brilliant boat, under general wafer conveyer, when heating, wafer thermal expansion and flexion occurs, simultaneously, may be in off-normal position between wafer and brilliant boat, wafer and brilliant boat rub, and in the process of loading or unloading, the wafer deformation inhomogeneous and that cause of being heated, produce particle in brilliant Zhou Jiao position thereby cause, as shown in Fig. 1 a and Fig. 1 b.
Two, the quality of brilliant boat itself, tend to plate one deck silicon nitride film on the surface of brilliant boat, in serialization is produced, for the safeguard work time, regularly need to clean brilliant boat, generally clean brilliant boat is for rinsing, and silicon nitride film is easy to peel off, produce particle in brilliant boat (boat) position, angle, as shown in Figure 2.
Be accumulated to certain degree to particle, can form the high density granular (particle high) on the boat bar figure (rod map) as shown in Fig. 3 a and 3b, if do not add processing, can cause the Quality Down of wafer, and then cause follow-up manufacturing process normally not carry out, affect the yields of product.
In prior art, process the high density granular (particle high) that causes of boat bar figure (rod map) and be and board is unloaded to (down) and open back door nitrogen gun and manually boat bar (boat rod) position is purged.The method relatively wastes time and energy, and must carry out loading place (loading area) nitrogen N before and after purging
2displacement, after closing back door, must wait in loading place oxygen concentration normal need 1 hour, has a strong impact on the running time (uptime) of board.
Summary of the invention
In view of the above problems, the invention provides a kind of wafer handler, be applied in the diffusion furnace at the some brilliant boats of tool angle.
The technical scheme that technical solution problem of the present invention adopts is:
A kind of wafer handler for diffusion furnace, be applied in the diffusion furnace at the some brilliant boats of tool angle, described device comprises that wafer transmits fork, described wafer transmits on fork and is provided with some fumaroles, in the time that described wafer handler stretches in described diffusion furnace, each described fumarole towards pointing to respectively different brilliant boat angles.
Wherein, described some fumaroles are arranged at described wafer and transmit the one end not contacting with wafer on fork, for example, transmit upper end, lower end or the rear end of fork.
Preferably, described some fumaroles comprise some the first fumaroles and some the second fumaroles, and described some the first fumaroles are all arranged at described wafer and transmit the top of pitching, and described some the second fumaroles are all arranged at described wafer and transmit the bottom of pitching.
In a preferred embodiment of the invention, the quantity of some described the first fumaroles equates with the quantity of some described the second fumaroles, and quantity is 3.
Preferably, described some fumaroles are N
2fumarole.
Wherein, each described fumarole is all connected with flow monitor, detects the size of gas flow.
Preferably, each described fumarole is provided with valve, and described valve can be operated pneumatic valve, electrically operated valve, adjuster valve, electromagnetically operated valve, and electromagnetically operated valve more preferably.Described valve can be at the opening part of fumarole, also can be in inside, fumarole duct.
Described valve is connected with microcontroller, for the switch of by-pass valve control or regulate the size of air-flow.
For addressing the above problem, the present invention also provides a kind of diffusion furnace that comprises above-mentioned wafer handler.Described diffusion furnace is preferably vertical diffusion furnace.
Technique scheme tool has the following advantages or beneficial effect:
By the wafer handler for diffusion furnace of the present invention, there is the purging function that traditional wafer handler does not possess, can be to brilliant boat angle automatic blowing, reduce the loading (loading) of manual operation, without the replacement of oxygen of practicing backdoorism, save the processing time, improve the running time of board.
Brief description of the drawings
With reference to appended accompanying drawing, to describe more fully embodiments of the invention.But appended accompanying drawing only, for explanation and elaboration, does not form limitation of the scope of the invention.
Fig. 1 a is the schematic diagram that particle forms reason one;
Fig. 1 b is the schematic diagram that particle forms reason one;
Fig. 2 is the schematic diagram that particle forms reason two;
Fig. 3 a is the schematic diagram of a high density granular (particle high);
Fig. 3 b is the schematic diagram of another high density granular;
Fig. 4 a is the plan structure schematic diagram for the wafer handler of diffusion furnace in the present invention;
Fig. 4 b is the side-looking structural representation for the wafer handler of diffusion furnace in the present invention;
Fig. 5 is the wafer handler partial structurtes schematic diagram of structure of the present invention for diffusion furnace.
Embodiment
The invention provides a kind of wafer handler for diffusion furnace, can be applicable in technique that technology node is 65/55nm.
As shown in Figs. 4a and 4b, in this embodiment for the wafer handler of the vertical diffusion furnace at the some brilliant boats of tool angle, comprise wafer and transmit fork 6, the rear end of transmitting fork 6 at wafer is provided with the fumarole 7 towards the direction 9 at brilliant boat angle 8, wherein, the rear end that above-mentioned rear end is not limited to wafer transmits fork, only otherwise the one end contacting with wafer.Fumarole can spray N
2or the gas of other required uses.Fumarole 7 comprises that being arranged at wafer transmits first fumarole and the second fumarole that is arranged at wafer transmission fork bottom on fork top, the first fumarole and the second fumarole quantity are respectively 3, certainly according to the quantity at brilliant boat angle in different diffusion furnaces, can be also other quantity.
As shown in Figure 5, on described fumarole, be connected with flow monitor, for detection of the size of gas flow.Can also on fumarole, be provided with valve, as operated pneumatic valve, electrically operated valve, adjuster valve, electromagnetically operated valve, and electromagnetically operated valve valve more preferably.Flow monitor is all connected a microcontroller with valve, and the switch that microcontroller can by-pass valve control meanwhile, receives the signal of flow monitor the size of adjust flux.
Gas flow carrys out setup control by microcontroller, and there is a switch on corresponding this road of valve control, need to purge time, brilliant boat is in initial (home) position, transmit and pitch the wafer crawl position that enters negative crystal boat, then along the reciprocal vertical up-or-down movement of brilliant boat, complete the automatic blowing to brilliant boat angle by six nitrogen fumaroles that are arranged in upper and lower surface
In sum, the present invention is for the wafer handler of diffusion furnace, there is the purging function that traditional wafer handler does not possess, in the time that high density granular that boat bar figure causes does not occur board, can freely be set to operation or by being accumulated to certain thickness to brilliant boat angle automatic blowing; Cause at board generation boat bar figure high density granular time also can automatic blowing, reduce the loading of manual operation, without the replacement of oxygen of practicing backdoorism, save the processing time, improve the running time of board.
For a person skilled in the art, read after above-mentioned explanation, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should be regarded whole variations and the correction of containing true intention of the present invention and scope as.Within the scope of claims, scope and the content of any and all equivalences, all should think and still belong to the intent and scope of the invention.
Claims (9)
1. a wafer handler, be applied in the diffusion furnace at the some brilliant boats of tool angle, described device comprises that wafer transmits fork, it is characterized in that, described wafer transmits on fork and is provided with some fumaroles, in the time that described wafer handler stretches in described diffusion furnace, each described fumarole towards pointing to respectively different brilliant boat angles.
2. wafer handler as claimed in claim 1, is characterized in that, described some fumaroles are arranged at described wafer and transmit the one end not contacting with wafer on fork.
3. wafer handler as claimed in claim 2, is characterized in that, described some fumaroles comprise some the first fumaroles and some the second fumaroles;
Described some the first fumaroles are all arranged at described wafer and transmit the top of pitching;
Described some the second fumaroles are all arranged at described wafer and transmit the bottom of pitching.
4. wafer handler as claimed in claim 3, is characterized in that, the quantity of some described the first fumaroles equates with the quantity of some described the second fumaroles.
5. wafer handler as claimed in claim 4, is characterized in that, the quantity of some described the first fumaroles is 3, and the quantity of some described the second fumaroles is 3.
6. wafer handler as claimed in claim 1, is characterized in that, described some fumaroles are N
2fumarole.
7. wafer handler as claimed in claim 1, is characterized in that, each described fumarole is all connected with flow sensor.
8. wafer handler as claimed in claim 7, is characterized in that, on each described fumarole, is provided with valve.
9. wafer handler as claimed in claim 8, is characterized in that, described valve is electromagnetically operated valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410106592.5A CN103904010B (en) | 2014-03-20 | 2014-03-20 | A kind of wafer handler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410106592.5A CN103904010B (en) | 2014-03-20 | 2014-03-20 | A kind of wafer handler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103904010A true CN103904010A (en) | 2014-07-02 |
| CN103904010B CN103904010B (en) | 2017-01-04 |
Family
ID=50995274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410106592.5A Active CN103904010B (en) | 2014-03-20 | 2014-03-20 | A kind of wafer handler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103904010B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105689330A (en) * | 2016-03-29 | 2016-06-22 | 上海华力微电子有限公司 | Device and method for improving condition of particles of boat slot pins of furnace tube |
| CN105789102A (en) * | 2015-01-13 | 2016-07-20 | 株式会社迪思科 | Conveying Apparatus |
| CN105845612A (en) * | 2016-04-07 | 2016-08-10 | 上海华力微电子有限公司 | Mechanical arm and method utilizing mechanical arm to reduce particle defect |
| CN107346757A (en) * | 2016-05-04 | 2017-11-14 | 北京北方华创微电子装备有限公司 | Transmission chamber and semiconductor processing equipment |
| JP2019110184A (en) * | 2017-12-18 | 2019-07-04 | 株式会社日立ハイテクマニファクチャ＆サービス | Handling arm, transfer device, and local cleaning device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060104750A1 (en) * | 2003-02-25 | 2006-05-18 | Lee Kun-Hyung | Apparatus and method for processing wafers |
| CN102427047A (en) * | 2011-09-28 | 2012-04-25 | 上海华力微电子有限公司 | Wafer back cleaning equipment and wafer back cleaning method |
| CN102941201A (en) * | 2012-10-12 | 2013-02-27 | 上海华力微电子有限公司 | Automatic machine transmission part washing method and machine transmission part |
-
2014
- 2014-03-20 CN CN201410106592.5A patent/CN103904010B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060104750A1 (en) * | 2003-02-25 | 2006-05-18 | Lee Kun-Hyung | Apparatus and method for processing wafers |
| CN102427047A (en) * | 2011-09-28 | 2012-04-25 | 上海华力微电子有限公司 | Wafer back cleaning equipment and wafer back cleaning method |
| CN102941201A (en) * | 2012-10-12 | 2013-02-27 | 上海华力微电子有限公司 | Automatic machine transmission part washing method and machine transmission part |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789102A (en) * | 2015-01-13 | 2016-07-20 | 株式会社迪思科 | Conveying Apparatus |
| CN105789102B (en) * | 2015-01-13 | 2020-11-24 | 株式会社迪思科 | Conveying device |
| CN105689330A (en) * | 2016-03-29 | 2016-06-22 | 上海华力微电子有限公司 | Device and method for improving condition of particles of boat slot pins of furnace tube |
| CN105845612A (en) * | 2016-04-07 | 2016-08-10 | 上海华力微电子有限公司 | Mechanical arm and method utilizing mechanical arm to reduce particle defect |
| CN107346757A (en) * | 2016-05-04 | 2017-11-14 | 北京北方华创微电子装备有限公司 | Transmission chamber and semiconductor processing equipment |
| CN107346757B (en) * | 2016-05-04 | 2020-03-31 | 北京北方华创微电子装备有限公司 | Transmission chamber and semiconductor processing equipment |
| JP2019110184A (en) * | 2017-12-18 | 2019-07-04 | 株式会社日立ハイテクマニファクチャ＆サービス | Handling arm, transfer device, and local cleaning device |
| JP7002315B2 (en) | 2017-12-18 | 2022-01-20 | 株式会社日立ハイテク | Handling arm, transport device and local cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103904010B (en) | 2017-01-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103904010A (en) | Wafer conveying device | |
| CN108022861A (en) | Substrate board treatment, substrate processing method using same and storage medium | |
| CN108074840A (en) | Substrate board treatment, substrate processing method using same and storage medium | |
| CN105849859B (en) | The printing manufacture system of electronic device | |
| CN101254859B (en) | Roller train for conveying thin sheet panel and method for chemical treatment thereby | |
| CN205220024U (en) | Solar cell screen printing feeding conveyor | |
| TW201727715A (en) | Object to be processed transport device, semiconductor manufacturing device, and object to be processed transport method | |
| CN103745920A (en) | Method for controlling cooling of wafer in semiconductor process | |
| CN108091588A (en) | A kind of annealing process, processing chamber and annealing device | |
| CN105855219A (en) | Feeding device of cleaning equipment | |
| CN103367211B (en) | A kind of LED chip cleans hand basket | |
| CN207511376U (en) | A kind of connection machine | |
| CN207407667U (en) | Furnace for expanding perlite | |
| CN211261471U (en) | Hot ball rapid cooling device for production | |
| TWI724350B (en) | An etching device | |
| JP2012248789A (en) | Manufacturing method of solar cells | |
| CN201918372U (en) | Wafer box | |
| CN204696087U (en) | For carrying load port and the front equipment end device of Foup | |
| CN104241173A (en) | Low-temperature polycrystalline silicon thin film manufacturing mechanism and method | |
| CN209434151U (en) | Boiler tube board cooling device | |
| CN102560442B (en) | Method and device for generating offset | |
| CN206033802U (en) | Prevent work piece and walk inclined to one side stepping hardening furnace | |
| CN102983071B (en) | Back damage processing method for monocrystalline silicon wafer using common sand | |
| CN105689330A (en) | Device and method for improving condition of particles of boat slot pins of furnace tube | |
| CN201153117Y (en) | Improvement mechanism of semiconductor machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |