CN209434151U - Boiler tube board cooling device - Google Patents
Boiler tube board cooling device Download PDFInfo
- Publication number
- CN209434151U CN209434151U CN201822241619.8U CN201822241619U CN209434151U CN 209434151 U CN209434151 U CN 209434151U CN 201822241619 U CN201822241619 U CN 201822241619U CN 209434151 U CN209434151 U CN 209434151U
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- China
- Prior art keywords
- silicon wafer
- cooling
- boiler tube
- temporary storage
- cooling device
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Abstract
The utility model discloses a kind of boiler tube board cooling devices, comprising: silicon wafer apparatus for temporary storage, the silicon wafer are transmitted to the silicon wafer apparatus for temporary storage after furnace process, and the silicon wafer apparatus for temporary storage, which is used to store, needs cooling silicon wafer；Cooling system, the cooling system are used for the silicon wafer on silicon wafer apparatus for temporary storage is cooling.The utility model sheet increases cooling device newly by improving to boiler tube board, in loading area, and silicon wafer passes to cooled region and cools down after Product Process, and board can continue next furnace technology, substantially reduces temperature fall time to improve board production capacity.
Description
Technical field
The utility model relates to IC manufacturing field, especially a kind of boiler tube board cooling device.
Background technique
In semiconductor fabrication, semiconductor device design is rapidly developed to the direction of high density, high integration, to semiconductor
Integrated circuit new process, new technology, new equipment propose increasingly higher demands.
Boiler tube (Furnace) is a kind of high temperature process, can add a tunic (film) on the silicon wafer surface (wafer), such as
Oxidation, deposition and doping, or change chemical state (alloy) or physical state (annealing, diffusion of silicon wafer (wafer) material
Flow again), comprising: oxidation, deposition, annealing and alloying.Since oxidation is determined by temperature, so the oxidation film of boiler tube
Growth then needs 800 ° or more of temperature；In addition oxide growth is a furnace mostly simultaneously into the silicon wafer of same process is by together
It is attached in stove, is oxidized simultaneously there.Boiler tube is mainly used in the fields such as semiconductor, solar panel, liquid crystal display,
It is one of indispensable module in semiconductor process flow.
When operation, multiple silicon wafer horizontals are loaded in cassette, cassette can from the preloaded area below boiler tube vertically into
Enter boiler tube, silicon wafer is made to receive technique in boiler tube, and after technique silicon wafer is transferred to loading area again and cooled down.The nitrogen of boiler tube
The loading area below boiler tube is arranged in air cooling system (NBS), for completing to operation but still in the silicon wafer and cassette of high temperature
It is cooled down.
The loading area below boiler tube is arranged in the cooling device NBS of existing boiler tube, is located at cassette side.When silicon wafer work
Cassette is down to loading area after skill, opens NBS, the heat of silicon wafer and cassette is taken away by nitrogen, achievees the effect that cooling.
However, silicon wafer occupies cassette when due to cooling, next furnace operation can not be continued, only silicon wafers cooling is waited to finish, passed
Next furnace technology could be continued by returning silicon wafer feeder (FOUP).
Summary of the invention
The technical problems to be solved in the utility model is to provide a kind of boiler tube board cooling device, while cooling without accounting for
With cassette, achieve the effect that shorten temperature fall time to improve board production capacity.
In order to solve the above technical problems, the utility model provides a kind of boiler tube board cooling device, comprising: the temporary dress of silicon wafer
It sets, the silicon wafer is transmitted to the silicon wafer apparatus for temporary storage after furnace process, and the silicon wafer apparatus for temporary storage is needed for storing
The silicon wafer to be cooled down；Cooling system, the cooling system are used for the silicon wafer on silicon wafer apparatus for temporary storage is cooling.
Preferably, further includes: removable insulated door, to completely cut off after silicon wafer cooling finishes and is transmitted to next process area
Heat transmitting between silicon wafer and loading area.
Preferably, the silicon wafer apparatus for temporary storage includes: pedestal；At least two with the vertically disposed bracket of the pedestal；?
The even item that draws being set on the inside of each bracket, it is adjacent it is described draw guiding groove is constituted on the inside of item and bracket, for placing silicon
The diameter of distance and silicon wafer between bracket described in piece and two of them is adapted.
Preferably, the quantity of drawing of the silicon wafer apparatus for temporary storage is 50-143.
Preferably, it is arc that the silicon wafer apparatus for temporary storage, which draws strip,.
Preferably, the material of the silicon wafer apparatus for temporary storage is silicon carbide.
Preferably, the cooling system includes cooling line, and the input terminal of the cooling line connects air supply system, described
Cooling tube is arranged in the output end of cooling line, and the tube wall of cooling tube is equipped with multiple ventholes for spraying cooling gas.
Preferably, the cooling gas is nitrogen.
Preferably, the stomata on the cooling tube is corresponding with silicon wafer.
The utility model sheet increases cooling device, Product Process knot newly by improving to boiler tube board, in loading area
Silicon wafer passes to cooled region and cools down after beam, and board can continue next furnace technology, substantially reduces temperature fall time to mention
High board production capacity.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the utility model, below to the required attached drawing of the utility model
It is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, general for this field
For logical technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the main view of the silicon wafer apparatus for temporary storage of the boiler tube board cooling device of the utility model.
Fig. 2 is the side view of the silicon wafer apparatus for temporary storage of the boiler tube board cooling device of the utility model.
Fig. 3 is the top view of the silicon wafer apparatus for temporary storage of the boiler tube board cooling device of the utility model.
Fig. 4 is the cooling tube schematic diagram of the cooling system of the boiler tube board cooling device of the utility model.
The reference numerals are as follows in figure:
10 silicon wafer apparatus for temporary storage, 11 pedestal
12 brackets 13 draw item
14 guiding grooves
20 cooling system, 21 cooling tube
22 ventholes
Specific embodiment
Below in conjunction with attached drawing, clear, complete description is carried out to the technical solution in the utility model, it is clear that retouched
The embodiment stated is a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ability
Domain those of ordinary skill all other embodiment obtained without making creative work belongs to practical
Novel protected range.
The boiler tube board cooling device of the utility model includes silicon wafer apparatus for temporary storage 10 and cooling system 20, the temporary dress of silicon wafer
It sets 10 and needs cooling silicon wafer for storing；Cooling system 20 is used for the silicon wafer on silicon wafer apparatus for temporary storage is cooling.In use,
The silicon wafer in chip feeder (FOUP) is sent in cassette first, the cassette for being mounted with silicon wafer is then placed in furnace tube device
Processing chamber housing in, then reaction gas is passed through in high temperature furnace pipe, so that reaction gas is in the processing chamber housing of furnace tube device
It chemically reacts, precipitates thin film on the surface of silicon wafer, then take out cassette from reaction chamber.Cassette is down to loading
Region.Then by the silicon wafer apparatus for temporary storage 10 in the boiler tube board cooling device of chip transmission to the utility model, and this is used
The cooling system 20 of utility model cools down, and boiler tube board can continue next furnace technology at the same time, in this way can be big
The temperature fall time of product is reduced greatly, to achieve the purpose that promote board production capacity.
Embodiment one
The silicon wafer apparatus for temporary storage 10 of the boiler tube board cooling device of the embodiments of the present invention one includes: pedestal 11；Extremely
Few two and the vertically disposed bracket 12 of the pedestal；It is uniformly arranged on the inside of each bracket and draws item 13, adjacent institute
It states to draw and constitutes guiding groove 14 on the inside of item and bracket.
The quantity of the bracket 12 is two, and the distance between bracket 12 described in two of them and the diameter of silicon wafer are mutually fitted
It answers, so that under silicon wafer and the guiding groove 14 that silicon wafer can smoothly be placed in guiding groove 14, and be put into guiding groove 14
Each of side is described to draw the contact of item 13.
The pedestal 11 is used to keep the center of gravity of silicon wafer apparatus for temporary storage 10.The material of the pedestal 11 may include polysilicon
Or silicon carbide.In the embodiments of the present invention, the material of the pedestal 11 includes silicon carbide, and considers silicon wafer apparatus for temporary storage
The particular surroundings faced needed for 10, the material of the pedestal 11 further include the corrosion-resistant and high-temperature resistant coated on the silicon carbide
Material.
The bracket 12 and the main body for drawing item 13 as silicon wafer apparatus for temporary storage 10, play the role of supporting silicon chip.Its
In, the bracket 12 is arranged perpendicular to 11 surface of pedestal.In the embodiments of the present invention, the number of the bracket 12 is
Two, it is each perpendicular to pedestal 11, i.e., perpendicular to horizontal plane, when in subsequent placement silicon wafer to silicon wafer apparatus for temporary storage 10, it can be ensured that put
Enter that each of silicon wafer in guiding groove 14 and 14 lower section of guiding groove are described to be drawn item 13 and contact.
In two brackets 12, the diameter of distance and silicon wafer between bracket 12 described in two of them is adapted, so that
Obtaining silicon wafer can smoothly be placed in guiding groove 14.The diameter of distance and silicon wafer between described two brackets 12 is adapted, and is referred to
Distance between the two is equal or described two brackets 12 is slightly less than the diameter of silicon wafer.It is described in the embodiments of the present invention
Distance between two brackets 12 is slightly less than the diameter of silicon wafer, so that silicon wafer can be smoothly placed in guiding groove 14.
The material of the bracket 12 includes polysilicon or silicon carbide.In the embodiments of the present invention, the bracket 12
Material include silicon carbide, and the corrosion-resistant and high-temperature resistant material coated on the silicon carbide.
The inside drawn item 13 and be set to the bracket 12.The item 13 that draws has multiple, is uniformly arranged on each described
The inside of bracket 12, to form guiding groove 14, for placing silicon wafer.On same bracket 12 it is adjacent it is described draw it is mutually flat between item 13
Row, so as to be parallel to each other between adjacent silicon wafer.Drawing quantity described in the present embodiment is 50-143.It should be noted that
This draws the quantity of item depending on board technological ability, or more.
During transportation, silicon wafer is possible silicon wafer slot and is very important.If silicon wafer is not by accurately right
Eka-silicon piece slot, chip may be scraped off even fragmentation, and the fragmentation of fragmentation will pollute the every other silicon wafer of this batch, silicon wafer
Feeder itself, silicon wafer conveyor module, silicon wafer transportation system itself and relevant semiconductor processing equipment.Therefore this implementation
The item that draws in example is preferably arc, so that silicon wafer is possible silicon wafer approaching channel.
The material for drawing item 13 is identical as the bracket 12, pedestal 11, includes carbofrax material.And the utility model
Embodiment in, the material for drawing item 13 further includes the corrosion-resistant and high-temperature resistant material coated on the silicon carbide.
Embodiment two
The cooling system 20 of the boiler tube board cooling device of the embodiments of the present invention one, is arranged in the dress below boiler tube
Carry area comprising: the input terminal of cooling line, the cooling line connects air supply system, and the output end of the cooling line is set
Cooling tube 21 is set, the tube wall of cooling tube is equipped with multiple ventholes 22 for spraying cooling gas.
The cooling gas in the present embodiment is nitrogen.But other cooling gas also can be used, this is practical new
Type is without being limited thereto.
The end of cooling line is arranged in cooling tube 21, and the nitrogen imported by air supply system flows into cold after cooling line
But it manages, is then sprayed by the venthole 22 on cooling tube wall, silicon wafer is cooled down.In embodiment, cooling tube 21 is three
Root is also possible to two or four.
The tube wall 21 of cooling tube is machined with the multiple ventholes 22 being distributed up and down, and venthole is towards the silicon wafer for needing to be cooled
Setting.In the present embodiment, the setting of venthole 22 and every layer of position of silicon wafer in silicon wafer apparatus for temporary storage 10 are corresponded.Each go out
Stomata 22 is responsible for blowing out gas to one piece of silicon wafer of corresponding layer, and forms the temporary dress of radiation silicon wafer by whole ventholes
Set about 10 uniform cooling air fluid layer.
In this way, silicon wafer is just not necessarily to occupy cassette after furnace process, be cooled system in silicon wafer apparatus for temporary storage 10
20 carry out cooling.
Embodiment three
On the basis of embodiment one, two, the utility model is also provided with removable insulated door, has cooled down in silicon wafer
Finish after being transmitted to next process area to completely cut off heat transmitting between silicon wafer and loading area.
The utility model sheet increases cooling device, Product Process knot newly by improving to boiler tube board, in loading area
Silicon wafer passes to cooled region and cools down after beam, and board can continue next furnace technology, substantially reduces temperature fall time to mention
High board production capacity.
The above is only preferred embodiment of the present application, it is not used to limit the application.Come for those skilled in the art
It says, various changes and changes are possible in this application.Within the spirit and principles of this application, made any modification, equivalent
Replacement, improvement etc., should be included within the scope of protection of this application.
Claims (9)
1. a kind of boiler tube board cooling device characterized by comprising
Silicon wafer apparatus for temporary storage, the silicon wafer are transmitted to the silicon wafer apparatus for temporary storage after furnace process, and the silicon wafer is temporary
Device, which is used to store, needs cooling silicon wafer；
Cooling system, the cooling system are used for the silicon wafer on silicon wafer apparatus for temporary storage is cooling.
2. boiler tube board cooling device as described in claim 1, which is characterized in that further include:
Removable insulated door, to completely cut off between silicon wafer and loading area after silicon wafer cooling finishes and is transmitted to next process area
Heat transmitting.
3. boiler tube board cooling device as described in claim 1, which is characterized in that the silicon wafer apparatus for temporary storage includes:
Pedestal；
At least two with the vertically disposed bracket of the pedestal；
The item that draws being uniformly arranged on the inside of each bracket, it is adjacent it is described draw guiding groove is constituted on the inside of item and bracket, be used for
The diameter for placing distance and silicon wafer between bracket described in silicon wafer and two of them is adapted.
4. boiler tube board cooling device as claimed in claim 3, which is characterized in that the silicon wafer apparatus for temporary storage draws quantity
It is 50-143.
5. boiler tube board cooling device as claimed in claim 3, which is characterized in that the silicon wafer apparatus for temporary storage draws strip and is
Arc.
6. boiler tube board cooling device as claimed in claim 3, which is characterized in that the material of the silicon wafer apparatus for temporary storage is carbon
SiClx.
7. boiler tube board cooling device as described in claim 1, which is characterized in that the cooling system includes cooling line,
The input terminal of the cooling line connects air supply system, and cooling tube, the tube wall of cooling tube is arranged in the output end of the cooling line
Multiple ventholes are equipped with for spraying cooling gas.
8. boiler tube board cooling device as claimed in claim 7, which is characterized in that the cooling gas is nitrogen.
9. boiler tube board cooling device as claimed in claim 7, which is characterized in that stomata and silicon wafer phase on the cooling tube
It is corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822241619.8U CN209434151U (en) | 2018-12-29 | 2018-12-29 | Boiler tube board cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822241619.8U CN209434151U (en) | 2018-12-29 | 2018-12-29 | Boiler tube board cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209434151U true CN209434151U (en) | 2019-09-24 |
Family
ID=67974536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822241619.8U Active CN209434151U (en) | 2018-12-29 | 2018-12-29 | Boiler tube board cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209434151U (en) |
-
2018
- 2018-12-29 CN CN201822241619.8U patent/CN209434151U/en active Active
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