CN103902779B - A kind of method of PCB devices encapsulation storehouse pin silk-screen mark - Google Patents
A kind of method of PCB devices encapsulation storehouse pin silk-screen mark Download PDFInfo
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- CN103902779B CN103902779B CN201410136568.6A CN201410136568A CN103902779B CN 103902779 B CN103902779 B CN 103902779B CN 201410136568 A CN201410136568 A CN 201410136568A CN 103902779 B CN103902779 B CN 103902779B
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000000605 extraction Methods 0.000 claims abstract description 9
- 230000004069 differentiation Effects 0.000 claims abstract description 4
- 230000001174 ascending effect Effects 0.000 claims description 11
- 230000007423 decrease Effects 0.000 claims description 6
- 238000011156 evaluation Methods 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims description 3
- 238000005457 optimization Methods 0.000 abstract description 2
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Abstract
The present invention discloses a kind of method of PCB devices encapsulation storehouse pin silk-screen mark, comprises the following steps：Characteristic information by extracting different type device differentiates the species of device；For every a kind of device, extraction pin sequence number, pad type, pad size, pad coordinate；The various directions of differentiation device, pitch, size, pin order, and be converted to the position for needing placement silk-screen mark, direction, attribute.The present invention can be rapidly completed the addition of mark, it is simple to operate, and accuracy rate and efficiency high, it has been greatly shortened in PCB industries and the establishment in storehouse and the time of optimization is encapsulated to integrated chip package storehouse and connector, encapsulation library management task efficiency is improved, mitigates work load.
Description
Technical field
The present invention relates to silk-screen identification technology field, more particularly to a kind of side of PCB devices encapsulation storehouse pin silk-screen mark
Method.
Background technology
In the epoch that the Age of Technology and Distributed Calculation of high integration develop, integrated chip and more pin high speed connectors
Use the establishment that further frequently, encapsulates storehouse to integrated chip package storehouse and connector in PCB (printed circuit board) industry and excellent
It has not been peanut to change the shared time, has become agreement custom for integrated device encapsulation, connector encapsulation addition silk-screen mark
Into rule, silk-screen mark PCB design, PCB check, device welding, hardware debugging play a part of it is non-negligible.But
Without this function in existing main software, designer can only be device addition mark by way of placing by hand, for one
20x20pins BGA device addition character mark need to spend 3-4 minutes, and 2- is needed for 208pin QFP devices addition silk-screen mark
3 minutes, 2-3 minutes need to be spent by adding character mark for a LRM connector, and cumbersome, efficiency is low.
The content of the invention
It is an object of the invention to encapsulate the method for storehouse pin silk-screen mark by a kind of PCB devices, carried on the back to solve the above
The problem of scape technology segment is mentioned.
To use following technical scheme up to this purpose, the present invention：
A kind of method of PCB devices encapsulation storehouse pin silk-screen mark, it comprises the following steps：
Characteristic information by extracting different type device differentiates the species of device；
For every a kind of device, extraction pin sequence number, pad type, pad size, pad coordinate；
Differentiate the various directions of device, pitch, size, pin order, and be converted to need to place silk-screen mark position,
Direction, attribute.
Especially, if device to be identified is BGA, LGA, PGA, CGA device, the detailed process of silk-screen mark is as follows：
A1, parsing current encapsulation place have pad coordinate, pad sequence number, pad type, preserve to structure, then side by side
Perform step A2, step A3, step A4；
A2, parsing pad coordinate, determine pitch；According to bond pad shapes, type of device is judged, then directly perform step
A6；
A3, the pin serial number numeral array for separating pad and alphabetical array, then directly perform step A5；
A4, parsing silk-screen coordinate, determine device size；It is determined that numeral, the pitch of letter and position；Number is adjusted according to pitch
Word, alphabet size and judge whether silk-screen character is staggeredly placed, then directly perform step A8；
A5, the incremental direction for determining numeral and letter, are divided into positive and negative incremental；Coordinatograph ascending numerical direction and letter are incremented by
Direction, it is the vector that mould is 2 to define letter to be incremented by direction, and ascending numerical direction is the vector that mould is 1；Then, step A6 is performed；
A6, the type according to device, alphabetical coordinate value subtract the coordinate value of numeral, then perform step A7；
A7, Comprehensive Evaluation difference, BGA, CGA, PGA device direction of rotation and LGA devices direction of rotation are obtained, then performs step
Rapid A8；
A8, call Character mother plate and create silk-screen character, it is determined that placing.
Especially, judge type of device according to bond pad shapes in the step A2, specifically include：In a manner of random value
Sampled in structure, if bond pad shapes are square plate, be judged as LGA devices, be otherwise BGA, CGA, PGA device.
Especially, the step A3 is specifically included：Pin serial number numeral and letter, the extraction for separating pad are unduplicated
Numeral and letter simultaneously establish digital array and alphabetical array.
Especially, the incremental direction of numeral and letter is determined in the step A5, is divided into positive and negative incremental, is specifically included：Root
According to the less pad of pin sequence number in the digital array of structure and alphabetical array difference mating structure body, by digital array and letter
Array builds one with numeral or letter as key word with the pad that the match is successful, using x coordinate and y-coordinate as the hash being worth；Respectively
Digital hash and letter hass are sorted according to the incremental order of key word, and define the incremental direction of numeral and letter：It is positive and negative to pass
Increase.
Especially, the incremental direction of numeral and letter is determined in the step A5, is divided into positive and negative incremental, is specifically included：
After having determined that numeral and the incremental direction of letter, digital hash is defined as the vector that a mould is 1, letter hass is defined as one
Individual mould is 2 vector.
Especially, if device to be identified is QFP, QFN, LCC, SOP device, the detailed process of silk-screen mark is as follows：
B1, parsing current encapsulation place have pad coordinate, pad sequence number, filter non-standard sequence number；Extract the pin of pad
Sequence number, coordinate build an one-dimension array, wherein, the element of array includes pin sequence number, x coordinate, y-coordinate；
B2, the pad on x directions and y directions is sorted out respectively；It is ranked up according to the x coordinate of array element, judges have
There is the columns of the pad of identical x coordinate, judge the columns of the pad with identical y-coordinate；
B3, pass through ranks number and general layout differentiation QFP, QFN, LCC device encapsulation and the encapsulation of SOP devices；And according to No. 1 pin
X, y relative coordinate values judge QFP, QFN device encapsulation and the encapsulation of LCC devices；
B4, the direction for judging according to the orientation of No. 1 pad the encapsulation of QFP, QFN, LCC, SOP device；In QFP, QFN device
Sort ascending is carried out to the one-dimension array of structure according to pin sequence number, if the x coordinate of preceding 1/4 element is constant, y successively decreases, then sentences
Break as 0 degree of rotation；X coordinate is incremented by, and y is constant, then judges 90 degree of rotations；X coordinate is constant, and y is incremental, then is judged as that 180 degree rotates；
X coordinate successively decreases, and y is constant, then is judged as 270 degree of rotations；Wherein, the encapsulation of LCC devices, SOP encapsulation are also differentiated using the above method；
B5, parsing pad coordinate, determine pitch；Silk-screen coordinate is parsed, determines device size；
B6, calibration, alignment are simultaneously placed.
Especially, if device to be identified is more pin connectors, the detailed process of silk-screen mark is as follows：
C1, selection need the pad marked, extract pin sequence number sample, place corresponding character；
C2, according to pin sequence number judge whether to need to separate letter and number；
C3, the pad each to extract build sequence number, coordinate frame body；
C4, user configuration place require, this require to include layer not, pitch, letter, numeral；
C5, call Character mother plate and create silk-screen character, it is determined that placing.
Especially, the step C2 is specifically included：Numeral is separated with the pin sequence number of monogram as needed, according to
Coordinate value builds one and includes digital pin sequence number, alphabetical pin sequence number, pad x coordinate, the one-dimension array of pad y-coordinate.
Especially, the step C4 is specifically included：Pad pitch is extracted according to coordinate, may be selected to place No. 1 pin, 5
The pin of multiple, or all digital pins, or all alphabetical pins.
The method of PCB devices encapsulation storehouse pin silk-screen mark provided by the invention can be rapidly completed the addition of mark, behaviour
Make simply, and accuracy rate and efficiency high, it has been greatly shortened in PCB industries and storehouse is encapsulated to integrated chip package storehouse and connector
The time for creating and optimizing, encapsulation library management task efficiency is improved, mitigates work load.
Brief description of the drawings
Fig. 1 is the method flow diagram that PCB devices provided in an embodiment of the present invention encapsulate storehouse pin silk-screen mark.
Embodiment
The invention will be further described with reference to the accompanying drawings and examples.It is understood that tool described herein
Body embodiment is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that for the ease of retouching
State, part related to the present invention rather than full content are illustrate only in accompanying drawing.
It refer to shown in Fig. 1, Fig. 1 is the method that PCB devices provided in an embodiment of the present invention encapsulate storehouse pin silk-screen mark
Flow chart.
The method of PCB devices encapsulation storehouse pin silk-screen mark specifically comprises the following steps in the present embodiment：First, extraction is passed through
The characteristic information of different type device differentiates the species of device；2nd, for every a kind of device, extraction pin sequence number, pad type,
Pad size, pad coordinate；3rd, differentiate the various directions of device, pitch, size, pin order, and be converted to and need to place silk
The position of marking knowledge, direction, attribute.
The silk-screen identification method of three class devices is described in detail separately below.
If device to be identified is BGA (ball-shaped grid array encapsulation), LGA (Land Grid Array encapsulation), PGA (pin types
Array pin encapsulates), CGA (column Background Grid array packages) device, such devices need to add in the less side of device pin sequence number
Add alphabetical sequence number sum word sequence number, it is as follows in the silk-screen identification procedure of the present embodiment such device：
S101, parsing current encapsulation place have pad coordinate, pad sequence number, pad type, and preserved to structure.
Effective pad (the pin sequence number of pad meets the standard of such devices) that selection encapsulation place has, and structure includes
Pin sequence number, coordinate, the structure of pad type.
Step S102, pad coordinate is parsed, determines pitch；According to bond pad shapes, judge type of device, then perform step
S108。
To avoid the unconventional pad of small probability, sampled and (extracted in structure in structure in a manner of random value
A small amount of sample is simultaneously analyzed), if bond pad shapes are square plate, it is judged as LGA devices, is otherwise BGA, CGA, PGA device.LGA devices
The pad of part is usually square plate, and other are then disk.The frame of extraction device silk-screen or border are determining the size of device.
Step S103, the pin serial number numeral array of pad and alphabetical array are separated, then performs step S106.
Separate pad pin serial number numeral and letter, extract it is unduplicated numeral and letter and establish digital array and
Alphabetical array.
Step S104, silk-screen coordinate is parsed, determines device size；It is determined that numeral, the pitch of letter and position.Extraction device
The frame of silk-screen or border are determining the size of device.
Step S105, numeral, alphabet size are adjusted according to pitch and judges whether silk-screen character is staggeredly placed, then performed
Step S1010.
Step S106, the incremental direction of numeral and letter is determined, is divided into positive and negative incremental.
According to the less pad of pin sequence number in the digital array of structure and alphabetical array difference mating structure body, by numeral
Array and alphabetical array and the pad that the match is successful build one with numeral or letter as key word, using x coordinate and y-coordinate as value
Hash, such as { (A, (- 120,335)), (B, (- 120,385)), (C, (- 120,435)) }；Digital hash and letter are dissipated respectively
Row sort according to the incremental order of key word, and define the incremental direction of numeral and letter：It is positive and negative incremental.The section of pad is determined simultaneously
Away from such as { (A, (- 120,335)), (B, (- 120,385)), (C, (- 120,435)) }, the y directions pitch of its pad is 50 lists
Position.
Step S107, coordinatograph ascending numerical direction and letter be incremented by direction, define letter be incremented by direction be mould be 2 to
Amount, ascending numerical direction are the vector that mould is 1.
After numeral and the incremental direction of letter is had determined that, digital hash is defined as the vector that a mould is 1, letter is dissipated
Row are defined as the vector that a mould is 2.
Step S108, according to the type of device, alphabetical coordinate value subtracts the coordinate value of numeral.
Step S109, Comprehensive Evaluation difference, BGA, CGA, PGA device direction of rotation and LGA devices direction of rotation are obtained.
With going the constant value of digital hash to judge BGA, CGA, PGA direction before the constant value of letter hass, LGA then phases
Instead, BGA, CGA, PGA direction are judged with fol-lowing values：- 3-0 degree of rotation is obtained, obtains-1-90 degree of rotations, obtains the rotation of 3-180 degree,
Obtain 1-270 degree rotations.LGA direction is judged with fol-lowing values：3-0 degree rotation is obtained, 1-90 degree rotations is obtained, obtains-3-180 degree and revolve
Turn, obtain-1-270 degree of rotations.
Step S1010, call Character mother plate and create silk-screen character, it is determined that placing.
Size, direction, character direction of rotation, the spacing of pad of comprehensive descision device add word for this class wrapper storehouse
Accord with silk-screen.In addition, the size template of character silk-screen is set by User Defined.
If device to be identified is FP (four side pin flat packages), QFN (quad flat non-pin package), LCC (no pins
Chip carrier packages), SOP (small outline dual pin package) device, such devices need to add 5 and 10 mark on the outside of device pin
Know, pin sequence number is that 5 odd-multiple then adds short-term, and pin sequence number is that 5 even-multiple adds elongated line, and pin sequence number is 1 and added
Add circle or triangle.It is as follows in the silk-screen identification procedure of the present embodiment such device：
Step S201, parsing current encapsulation place has pad coordinate, pad sequence number, filters non-standard sequence number；Extract pad
Pin sequence number, coordinate build an one-dimension array, the element of array includes pin sequence number, x coordinate, y-coordinate.
Step S202, the pad on x directions and y directions is sorted out respectively；It is ranked up according to the x coordinate of array element,
Judge the columns of the pad with identical x coordinate, judge the columns of the pad with identical y-coordinate.
Step S203, differentiate that the encapsulation of QFP, QFN, LCC device and SOP devices encapsulate by ranks number and general layout；And according to 1
Number pin x, y relative coordinate values judge QFP, QFN device encapsulation and the encapsulation of LCC devices.
The encapsulation of QFP, QFN, LCC device is four side pins, the encapsulation for possessing the row pad of 2 row 2, and SOP is 2 rows or 2 row welderings
The encapsulation of disk.And LCC is encapsulated in the arrangement of pin sequence number and is different from QFP and QFN, its No. 1 pad is in the centre of row or column.
Step S204, the direction of QFP, QFN, LCC, SOP device encapsulation is judged according to the orientation of No. 1 pad；In QFP, QFN
Sort ascending is carried out to the one-dimension array of structure according to pin sequence number in device, if the x coordinate of preceding 1/4 element is constant, y is passed
Subtract, be then judged as 0 degree of rotation；X coordinate is incremented by, and y is constant, then judges 90 degree of rotations；X coordinate is constant, and y is incremental, then is judged as 180
Degree rotation；X coordinate successively decreases, and y is constant, then is judged as 270 degree of rotations；Wherein, the encapsulation of LCC devices, SOP encapsulation also use above-mentioned side
Method differentiates；
Step S205, pad coordinate is parsed, determines pitch；Silk-screen is parsed, determines device size.
Step S206, calibration, alignment and place.According to the full-size of pad outer rim, the pitch of pad, No. 1 pad
Position, place 1,5,10 mark.
If device to be identified is more pin connectors, the package type of more pin connectors is various, and pin number is huge, bag
Digital number pin, alphabetical sequence number pin, alphanumeric pin are included, such devices usually require that near pad or profile
The outer Digital ID for placing 5,10 or placement letter mark.The position uncertain factor of placement is too many, therefore the present invention proposes hand
Dynamic to select and confirm to place mark, software realizes the screening of character, places type, the inferior information of character layer.It is more in the present embodiment
The silk-screen identification procedure of pin connectors specifically includes：
Step S301, the pad that selection needs to mark is manually selected, pin sequence number sample is extracted, places corresponding character.
Step S302, judge whether to need to separate letter and number according to pin sequence number.
Numeral is separated with the pin sequence number of monogram as needed, building one according to coordinate value includes digital pin
Sequence number, alphabetical pin sequence number, pad x coordinate, the one-dimension array of pad y-coordinate (pin sequence number can be default one).
Step S303, the pad each to extract builds sequence number, coordinate frame body.
Step S304, user configuration place require, this require to include layer not, pitch, letter, numeral.
Pad pitch is extracted according to coordinate, may be selected to place No. 1 pin, the pin of 5 multiple, or all digital pins,
Or all alphabetical pins.
Step S305, call Character mother plate and create silk-screen character, select placement location, it is determined that placing, complete character and add
Add.
Technical scheme can be rapidly completed the addition of mark, simple to operate, and accuracy rate and efficiency high, significantly
Degree shortens in PCB industries and encapsulates the establishment in storehouse and the time of optimization to integrated chip package storehouse and connector, improves encapsulation
Library management task efficiency, mitigate work load.
Pay attention to, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious changes,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although being carried out by above example to the present invention
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
Other more equivalent embodiments can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (9)
- A kind of 1. method of PCB devices encapsulation storehouse pin silk-screen mark, it is characterised in that comprise the following steps：Characteristic information by extracting different type device differentiates the species of device；For every a kind of device, extraction pin sequence number, pad type, pad size, pad coordinate；The various directions of differentiation device, pitch, size, pin order, and be converted to position, the side for needing to place silk-screen mark To, attribute；Specifically, if device to be identified is BGA, LGA, PGA, CGA device, the detailed process of silk-screen mark is as follows：A1, parsing current encapsulation place have pad coordinate, pad sequence number, pad type, preserve to structure, then perform side by side Step A2, step A3, step A4；A2, parsing pad coordinate, determine pitch；According to bond pad shapes, type of device is judged, then directly perform step A6；A3, the pin serial number numeral array for separating pad and alphabetical array, then directly perform step A5；A4, parsing silk-screen coordinate, determine device size；It is determined that numeral, the pitch of letter and position；According to pitch adjustment numeral, Alphabet size and judge whether silk-screen character is staggeredly placed, then directly execution step A8；A5, the incremental direction for determining numeral and letter, are divided into positive and negative incremental；Coordinatograph ascending numerical direction and letter are incremented by side To it is the vector that mould is 2 to define letter to be incremented by direction, and ascending numerical direction is the vector that mould is 1；Then, step A6 is performed；A6, the type according to device, alphabetical coordinate value subtract the coordinate value of numeral, then perform step A7；A7, Comprehensive Evaluation difference, BGA, CGA, PGA device direction of rotation and LGA devices direction of rotation are obtained, then performs step A8；A8, call Character mother plate and create silk-screen character, it is determined that placing.
- 2. the method for PCB devices encapsulation storehouse pin silk-screen mark according to claim 1, it is characterised in that the step According to bond pad shapes in A2, type of device is judged, specifically include：Sampled in a manner of random value in structure, if pad shape Shape is square plate, then is judged as LGA devices, is otherwise BGA, CGA, PGA device.
- 3. the method for PCB devices encapsulation storehouse pin silk-screen mark according to claim 2, it is characterised in that the step A3 is specifically included：The pin serial number numeral and letter of pad are separated, unduplicated numeral and letter is extracted and establishes digital number Group and alphabetical array.
- 4. the method for PCB devices encapsulation storehouse pin silk-screen mark according to claim 3, it is characterised in that the step The incremental direction of numeral and letter is determined in A5, is divided into positive and negative incremental, specifically includes：According to the digital array of structure and alphabetical number The group less pad of pin sequence number in mating structure body respectively, digital array and alphabetical array are built with the pad that the match is successful One with numeral or letter for key word, using x coordinate and y-coordinate as the hash being worth；Respectively to digital hash and letter hass according to The incremental order sequence of key word, and define the incremental direction of numeral and letter：It is positive and negative incremental.
- 5. the method for PCB devices encapsulation storehouse pin silk-screen mark according to claim 4, it is characterised in that the step In A5 coordinatograph ascending numerical direction and letter be incremented by direction, define letter be incremented by direction be mould be 2 vector, ascending numerical side Xiang Weimo is 1 vector, is specifically included：After numeral and the incremental direction of letter is had determined that, digital hash is defined as a mould For 1 vector, letter hass is defined as the vector that a mould is 2.
- 6. the method for PCB devices encapsulation storehouse pin silk-screen mark according to claim 1, it is characterised in that if to be identified Device is QFP, QFN, LCC, SOP device, then the detailed process of silk-screen mark is as follows：B1, parsing current encapsulation place have pad coordinate, pad sequence number, filter non-standard sequence number；The pin sequence number of extraction pad, Coordinate builds an one-dimension array, wherein, the element of array includes pin sequence number, x coordinate, y-coordinate；B2, the pad on x directions and y directions is sorted out respectively；It is ranked up according to the x coordinate of array element, judgement has phase With the columns of the pad of x coordinate, judge that there is the columns of the pad of identical y-coordinate；B3, pass through ranks number and general layout differentiation QFP, QFN, LCC device encapsulation and the encapsulation of SOP devices；Encapsulated if SOP devices, Then perform step B5；Encapsulated if QFP, QFN, LCC device, then judge QFP, QFN device according to No. 1 pin x, y relative coordinate values Part encapsulates and the encapsulation of LCC devices；B4, the direction for judging according to the orientation of No. 1 pad the encapsulation of QFP, QFN, LCC device；According to pin in QFP, QFN device Sequence number carries out sort ascending to the one-dimension array of structure, if the x coordinate of preceding 1/4 element is constant, y successively decreases, then is judged as 0 degree of rotation Turn；X coordinate is incremented by, and y is constant, then judges 90 degree of rotations；X coordinate is constant, and y is incremental, then is judged as that 180 degree rotates；X coordinate is passed Subtract, y is constant, then is judged as 270 degree of rotations；Carry out incremental row to the one-dimension array of structure according to pin sequence number in LCC devices Sequence, if the x coordinate of preceding 1/4 element is constant, y successively decreases, then is judged as 0 degree of rotation；X coordinate is incremented by, and y is constant, then judges 90 degree Rotation；X coordinate is constant, and y is incremental, then is judged as that 180 degree rotates；X coordinate successively decreases, and y is constant, then is judged as 270 degree of rotations；B5, parsing pad coordinate, determine pitch；Silk-screen coordinate is parsed, determines device size；B6, calibration, alignment are simultaneously placed.
- 7. the method for PCB devices encapsulation storehouse pin silk-screen mark according to claim 1, it is characterised in that if to be identified Device is more pin connectors, then the detailed process of silk-screen mark is as follows：C1, selection need the pad marked, extract pin sequence number sample, place corresponding character；C2, according to pin sequence number judge whether to need to separate letter and number；C3, the pad each to extract build sequence number, coordinate frame body；C4, user configuration place require, this require to include layer not, pitch, letter, numeral；C5, call Character mother plate and create silk-screen character, it is determined that placing.
- 8. the method for PCB devices encapsulation storehouse pin silk-screen mark according to claim 7, it is characterised in that the step C2 is specifically included：Numeral is separated with the pin sequence number of monogram as needed, building one according to coordinate value includes numeral Pin sequence number, alphabetical pin sequence number, pad x coordinate, the one-dimension array of pad y-coordinate.
- 9. the method for PCB devices encapsulation storehouse pin silk-screen mark according to claim 8, it is characterised in that the step C4 is specifically included：Pad pitch is extracted according to coordinate, may be selected to place No. 1 pin, the pin of 5 multiple, or all numerals are drawn Pin, or all alphabetical pins.
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| CN106294980A (en) * | 2016-08-08 | 2017-01-04 | 浪潮集团有限公司 | A kind of method of auto arrangement silk-screen in PCB |
| CN108268681B (en) * | 2016-12-30 | 2021-10-15 | 天芯互联科技有限公司 | PCB (printed Circuit Board) silk-screen adjustment system and method |
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| CN112597737B (en) * | 2020-12-20 | 2022-08-26 | 苏州浪潮智能科技有限公司 | Method, system and readable storage medium for creating PCB test point identification |
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| CN114158194B (en) * | 2021-11-29 | 2023-07-21 | 苏州浪潮智能科技有限公司 | Connector package design method, PCB board and equipment |
| CN117113923B (en) * | 2023-10-25 | 2024-01-23 | 苏州赛米德半导体科技有限公司 | Method, device and storage medium for optimizing generation of bonding pad coordinate file |
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| CN1700839A (en) * | 2004-05-18 | 2005-11-23 | 华为技术有限公司 | A printed wiring board and production method thereof |
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| CN100518441C (en) * | 2004-11-29 | 2009-07-22 | 华为技术有限公司 | Method for realizing reutilization in printed circuit board design |
| CN100377158C (en) * | 2004-12-31 | 2008-03-26 | 华为技术有限公司 | Method for creating library file |
| KR100654849B1 (en) * | 2005-04-14 | 2006-12-06 | 주식회사 대성미크론 | An angle adjusting and arraying apparatus of number of PCBs for a PCB surface mounting screen printer |
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